NCP5230MNTWG - ON Semiconductor - Datasheet.Directory

May, 2012 − Rev. 0

1Publication Order Number:

NCP5230/D

NCP5230

Precise Low Voltage

Synchronous Buck

Controller with Power

Saving Mode

The NCP5230 is a simple single phase solution with differential

phase current sensing, power saving operation, and gate drivers to

provide accurately regulated power.

The adaptive non overlap gate drive and power saving operation

circuit provide a low switching loss and high efficiency solution for

server, notebook, and desktop systems. A high performance

operational error amplifier is provided to simplify compensation of the

system. The NCP5230 features also include soft−start sequence,

accurate overvoltage and over current protection, UVLO for VCC and

VCCP, and thermal shutdown.

Features

•High Performance Operational Error Amplifier

•Internal Soft−Start/Stop

•±0.5% Internal Voltage Accuracy, 0.8 V voltage reference

•OCP accuracy, Four Re−entry Times Before Latch

•“Lossless” Differential Inductor Current Sensing

•Internal High Precision Current Sensing Amplifier

•Oscillator Frequency Range of 100 kHz − 1000 kHz

•20 ns Adaptive FET Non−overlap Time of Internal Gate Driver

•5.0 V to 12 V Operation

•Support 1.5 V to 19 V Vin

•Vout from 0.8 V to 3.3 V (5 V with 12 VCC)

•Chip Enable through OSC pin

•Latched Over Voltage Protection (OVP)

•Internally Fixed OCP Threshold

•Guaranteed Startup Into Pre−Charged Loads

•Thermally Compensated Current Monitoring

•Thermal Shutdown Protection

•Integrated MOSFET Drivers

•Integrated BOOST Diode with internal Rbst = 2.2 W

•Automatic Power Saving Mode to Maximize Efficiency During Light

Load Operation

•Sync Function

•Remote Ground Sensing

•This is a Pb−Free Device*

Applications

•Desktop and Server Systems

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

http://onsemi.com

QFN16

CASE 485G

MARKING

DIAGRAMS

16 13

310

211

GNDUG

PGOOD

SYNC

COMP

VSEN

FBG

CSN/VO

BOOT

VCCP

VCC

ROSC/EN

CSP

PIN CONNECTIONS

5230

ALYWG

5230 = Specific Device Code

A = Assembly Location

L = Wafer Lot

Y = Year

W = Work Week

G= Pb−Free Package

(*Note: Microdot may be in either location)

Device Package Shipping

ORDERING INFORMATION

NCP5230MNTWG QFN16

(Pb−Free)

3000 / Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

(Top View)

NCP5230

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Figure 1. NCP5230 BLOCK DIAGRAM

BOOT

VCCP

GND

CSP

CSN/VO

COMP

Control Logic,

Protection,

RAMP

Generator and

PWM Logic

−

CDIFF

UVLO

Control

−

VREF*75%

VREF*125%

UVP

OVP

OSC

Error Amplifier

Current Sense

Amplifier

−

VREF*50%

OVP,

UNLATCHED

0.8V

VSEN

FBG

PGOOD

SYNC

ROSC/EN Programmable

OSC

VCC

1.24V

2.2 W

Over Current

Detector

PIN DESCRIPTIONS

Pin No. Symbol Description

1 VCCP Power supply for bottom gate MOSFET drivers

2 LG Bottom gate MOSFET driver pin

3 LX Switch node

4 BOOT Supply rail for the floating top gate driver

5 UG Top gate MOSFET driver pin

6 PGOOD Power Good. It is an open−drain output, set free after SS (with 3x clock delay) as long as the output

voltage monitored through VSEN is within specifications.

7 SYNC Synchronization Pin. The controller synchronizes on the falling edge of a square wave provided to

this pin. Short to GND if not used.

8 COMP Output of the error amplifier

9 FB Inverting input to the error amplifier

10 VSEN Output Voltage Sense

11 FBG Remote Ground Sense

12 CSN/VO Inductor differential sense inverting input

13 CSP Inductor differential sense non−inverting input

14 ROSC/EN Programs the switching frequency; EN: Pull−low to disable the device

15 VCC Supply rail for the controller internal circuitry

16 GND Ground reference

THERMAL PAD Connects with the silicon substrate for good thermal contact with the PCB. Connect to GND plane.

NCP5230

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RF1

JP3

ETCH

CH1

RVFB1

RFB2

RSEN1

RNTC1

RISO1

RFB3

CF1

ENABLE

VCCP

RS4

ROSC1

VOUT

CSEN1

CFB2

RS3

LOUT1

VIN

CBOOT1

+COUT1

VCC

R2 R1

NCP5230

BOOT 4

COMP

LG 2

LX 3

GND

UG 5

VCC 15

CSP

CSN/VO

VCCP 1

ROSC/EN

PGOOD

SYNC

FBG

VSEN

SYNC

PGOOD

Figure 2. Typical Application Circuit

ABSOLUTE MAXIMUM RATINGS

Rating Symbol VMAX VMIN Unit

Controller Power Supply Voltages to GND VCC, VCCP 15 −0.3 V

Boost Supply Voltage Input BOOT 35V wrt/GND

40 V <100 ns

wrt/GND

15 wrt/LX

−0.3 V

High−Side Driver Output

(Top Gate)

UG 35

40 V ≤ 50 ns

wrt/GND

15 wrt/LX

−0.3 wrt/LX

−5 V < 200 ns

Switching Node

(Bootstrap Supply Return)

LX 35

40 < 100 ns

−5

−10 V < 200 ns

Low−Side Driver Output

(Bottom Gate)

LG 15 −0.3

−5 V < 200 ns

All Other Pins 6−0.3, −1 V < 1 msV

PGOOD PGOOD 7 −0.3, −1 V < 1 msV

SYNC SYNC 7 −0.3, −1 V < 1 msV

Current Sense Amplifier CSP, CSN/VO with

VCC = 12 V

10 −0.3, −1 V < 1 msV

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

*All signals referenced to GND unless noted otherwise.

NCP5230

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THERMAL INFORMATION

Rating Symbol Typ Unit

Thermal Resistance, Junction−to−Ambient RqJA 60 °C/W

Thermal Resistance, Junction−to−Case RqJC 18 °C/W

Operating Junction Temperature Range TJ0 to 125 °C

Operating Ambient Temperature Range TA0 to 85 °C

Maximum Storage Temperature Range TSTG −55 to +150 °C

Moisture Sensitivity Level QFN Package MSL 1 −

ELECTRICAL CHARACTERISTICS Unless otherwise stated: 0°C < TA < 85°C; 4.5 V < VCC < 13.2 V; CVCC = 0.1 mF

Parameter Test Conditions Min Typ Max Unit

SUPPLY OPERATING CONDITIONS

VCC Voltage Range 4.5 13.2 V

VCCP Voltage Range 4.5 13.2 V

dV/dt on VCC (Note 1) −10 10 V/ms

dV/dt on VCCP (Note 1) −10 10 V/ms

VCC AND BOOT INPUT SUPPLY CURRENT

VCC Operating Current VCC = 5 V, EN = High

VCC = 12 V, EN = High

5.0 mA

VCC Supply Current VCC = 5 V, EN = Low

VCC = 12 V, EN = Low

400 uA

VCCP INPUT SUPPLY CURRENT

VCCP Operating Current

UG and LG Open

VCCP = 5 V, EN = High

VCCP = 12 V, EN = High 3.5 5.0

VCCP Supply Current VCCP = 5 V, EN = Low

VCCP = 12 V, EN = Low

200 mA

VCC SUPPLY VOLTAGE

VCC UVLO Start Threshold VCC Rising 4.50 V

VCC UVLO Hysteresis VCC Rising or Falling 300 mV

VCCP SUPPLY VOLTAGE

VCCP UVLO Start Threshold 4.2 V

VCCP UVLO Hysteresis 200 mV

ERROR AMPLIFIER COMP

Open Loop DC Gain (Note 1) 120 dB

Open Loop Unity Gain Bandwidth (Note 1) 15 18 MHz

Slew Rate (Note 1) COMP pin to GND with 100 pF load 8.0 V/ms

VREF

Internal Reference Voltage 0.800 V

Output Voltage Accuracy Vout to FBG excluding external resistor divider

tolerance

−0.5 0.5 %

CURRENT SENSE AMPLIFIERS

Common Mode Input Voltage Range

(Note 1, GNG, output within 10mV)

VCC ≤ 7.5 V −0.3 3.5 V

Common Mode Input Voltage Range

(Note 1, GNG, output within 10 mV)

VCC > 7.5 V −0.3 5.5 V

1. Guaranteed by design.

2. For propagation delays, ”tpdh” refers to the specified signal going high ”tpdl” refers to it going low. Reference Gate Timing Diagram.

NCP5230

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ELECTRICAL CHARACTERISTICS Unless otherwise stated: 0°C < TA < 85°C; 4.5 V < VCC < 13.2 V; CVCC = 0.1 mF

Parameter UnitMaxTypMinTest Conditions

OSCILLATOR (with no ROSC Resistor Defaults to 200 kHz)

Switching Frequency Accuracy ROSC open −10 10 %

OSC Gain (Note 1) 10 kHz /

Disable threshold ROSC/EN pin, Vdis_th 0.75 V

MODULATORS (PWM Comparators)

Minimum Pulse Width Fsw = 200 kHz, OSC open 90 ns

Minimum Turn Off Time (LG on) Fsw = 200 kHz, OSC open 250 350 450 ns

Magnitude of the PWM Ramp VIN = 5 V or 12 V 1.50 V

Maximum Duty Cycle OSC/EN = OPEN 80 95 %

Minimum Skip mode frequency In light load, maximum time for LG to turn on

after HG turns off

30 kHz

SOFT−START

Soft Start Time @ 200 kHz 1024 clock cycles, OSC/EN open 5.12 ms

SOFT−OFF

Soft OFF bleeding resistor Rdis 120 W

OVER CURRENT PROTECTION

First Over Current Threshold CSP−CSN, 4xMasking 17 20 23 mV

Second Over Current Threshold CSP−CSN, Immediate action 30 mV

SYNC PIN

Synchronization Input VIL, square wave 1.0 V

Synchronization Input VIH, square wave 2.5 V

PROTECTION AND PGOOD

Output Voltage Logic Low, Sinking 4 mA 0.4 V

OVP Threshold VSEN rising above 1.25 * Vref 117 125 130 %

UVP Threshold VSEN falling below 0.75 * Vref 70 75 80 %

Unlatched Overvoltage Threshold Vth_disoff with respect to 0.5 Vref 40 50 60 %

Power Good High Delay (Note 1) 50 ms

Power Good Low Delay (Note 1) 1ms

ZERO CURRENT DETECTION (LX Pin)

Blanking Time before Zero Current

Detection (Note 1)

Blanking Time after LG is < 1.0 V 40 ns

Capture Time for LX Voltage (Note 1) Time to capture LX voltage once LG is < 1.0 V

(must be within dead time limits)

20 ns

Negative LX detection voltage Vbdls 150 300 450 mV

Positive LX detection voltage Vbdhs 0.2 0.5 1.0 V

Time for Vth adjustment and settling time

(Note 1)

300 kHz 3.0 3.7 ms

Initial Negative Current Detection

Threshold Voltage Set Point (Note 1)

LX−GND, Includes ± 2 mV Offset Range 1.0 mV

Vth adjustable Range (Note 1) −16 0 15 mV

1. Guaranteed by design.

2. For propagation delays, ”tpdh” refers to the specified signal going high ”tpdl” refers to it going low. Reference Gate Timing Diagram.

NCP5230

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ELECTRICAL CHARACTERISTICS Unless otherwise stated: 0°C < TA < 85°C; 4.5 V < VCC < 13.2 V; CVCC = 0.1 mF

Parameter UnitMaxTypMinTest Conditions

HIGH SIDE DRIVER UG

RH_TG Output Resistance, Sourcing VBOOT − VLX = 12 V, Cload = 3 nF 2.5 5 W

RH_TG Output Resistance, Sinking VBOOT − VLX = 12V 2.0 2.5 W

TrDRVH Transition Time CLOAD = 2 nF 16 ns

TfDRVH Transition Time CLOAD = 2 nF 11

TpdhDRVH Propagation Delay (Notes 1, 2) Driving High, CLOAD = 3 nF,

VCC = 12 V, VCCP =12 V

15 30 ns

UG Internal Resistor to LX Unbiased, BOOT − LX = 0 45 kW

LOW SIDE DRIVER LG

RH_BG Output Resistance, Sourcing VLX = GND, Cload = 3 nF 2.0 3.0 W

RL_BG Output Resistance, Sinking VLX = VCC 1.0 1.5 W

TrDRVL Transition Time CLOAD = 3 nF 16 ns

TfDRVL Transition Time CLOAD = 3 nF 11

TpdhDRVL Propagation Delay (Notes 1, 2) Driving High, CLOAD = 3 nF, VCCP = 12 V, VCCP

= 12 V

10 20 35 ns

LX Internal Resistor to GND 45 kW

THERMAL SHUTDOWN

Tsd Thermal Shutdown (Note 1) 150 180 °C

Tsdhys Thermal Shutdown Hysteresis

(Note 1) 50 °C

1. Guaranteed by design.

2. For propagation delays, ”tpdh” refers to the specified signal going high ”tpdl” refers to it going low. Reference Gate Timing Diagram.

NCP5230

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Figure 3. Gate Timing Diagram

Switching Frequency

Connecting a resistor from ROSC/EN to an external

voltage source Vpu will configure the switching frequency.

Normal range would be 100 kHz to 1 MHz. With no resistor

connected to the pin, the oscillator frequency is 200 kHz.

The switching frequency will follow the relationship:

FSW +200 kHz *

Vpu *1.240

ROSC

@10 kHz

mA(eq. 1)

When Rosc = infinity (no resistor connected), Fsw =

200 kHz; when Vpu = ground, the frequency programmed

will be higher than 200 kHz. Pulling Rosc/EN pin to ground

solidly with a less than 10 kW resistor will result in the part

being disabled.

Soft−Start

Soft−Start will begin if VCC, VCCP are both above their

UVLO thresholds and EN pin is set free. IC initially waits

a fixed delay time and then ramps the reference in 5.12 ms

(1024 clock cycles when Rosc open) in closed−loop

regulation. After soft−start, PGOOD signal will be released

with 3 clock cycles delay.

Protection active during soft−start:

•Overvoltage Protection always enabled;

•Undervoltage Protection is enabled after reference

voltage ramps up to 80% of the final value. During

soft−start, a UVP fault will initiate a complete soft

restart.

Synchronization Function

Synchronize through the SYNC pin. Synchronization

function allows different converters to share the same input

filter reducing the resulting RMS current and reducing the

need for total caps to sustain the load. Synchronized systems

also exhibit higher EMI noise immunity and better

regulation.

The device synchronizes to the Falling edge of the SYNC

pin external input signal (eg. high side gate signal, switch

node signal, distribution clock signal), and locks the phase

of an internal ramp signal correspondingly with a fixed

delay time. The external signal has to sit within a 0-40%

frequency window above the local frequency configured by

the Rosc resistor to allow the synchronization function

working properly.

Power Good

The PGOOD pin is an open drain connection with no

internal pullup resistor. An active high output signals the

normal operation of the converter. PGOOD is pulled low

during soft-start cycle, and if there is an overvoltage or

undervoltage fault. If the voltage on the VSEN pin is within

±10% of Vref (0.8 V) then the PGOOD pin will not be pulled

low.

Overvoltage Protection (OV)

If the voltage on the VSEN pin exceeds the overvoltage

threshold (1000 mV or 125% Vref), the NCP5230 will latch

an overvoltage fault. During an overvoltage fault event the

UG pin will be pulled low, and the LG pin will stay high until

the voltage on the VSEN pin goes below 400 mV or 50%

Vref, then a soft-bleeding resistor will be connected from

switch node to ground to continuously discharge the output

voltage softly. To clear the overvoltage fault, toggling VCC

or EN is needed.

Undervoltage Protection (UV)

If the voltage on the FB pin falls below the undervoltage

threshold after the softstart cycle completes, the NCP5230

will latch an undervoltage fault. During an undervoltage

fault, both the UG and LG pins will be pulled low. Toggling

VCC power or EN will reset the undervoltage protection.

PreOVP Protection

If the NCP5230 is powered on but not enabled, the VSEN

pin will be monitored for preOVP condition. If the VSEN

exceeds the preset threshold, the device will force LG pin

high to protect the load. The PreOVP function will be

disabled when the device is enabled and the normal OV

function will operate instead.

NCP5230

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VSEN

VTH

BUFFER

VPU

Figure 4. PreOVP circuit

Vin Detection

During the soft start after the VSEN pin exceeds 80% Vref,

UV protection will be enabled; If a UV fault is triggered in

the softstart, it will restart SS after a fixed delay. The UV

protection is to avoid IC to startup without Vin or with

insufficient Vin voltage.

Overcurrent Protection

NCP5230 measures the differential current sensing signal

through CSP and CSN/VO pin. There are two current

protection levels: OCP1 and OCP2. If the differential

voltage across pin CSP and CSN/VO is over 20 mV (but

below 30 mV) for four consecutive cycles, OCP1 will be

tripped. Both UG and LG will be forced to low to turn off the

high side and low side FETs, it is a latched condition; If the

differential voltage across pin CSP and CSN is over 30 mV,

OCP2 will be tripped, the UG and LG will be pulled low and

latched immediately. Toggling VCC power or EN will reset

the Overcurrent protection.

The current sensing R/C network should be selected to

match the inductor time constant as below,

(RCS1ńńRCS2) @C+L

DCR

(Notes: the actual RC network time constant may be

slightly higher)

Thus, OCP1 and OCP2 levels can be configured as,

OCP1 +20 mV

DCR @RCS1 )RCS2

RCS2

OCP2 +30 mV

DCR @RCS1 )RCS2

RCS2

NCP5230

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L DCR

RS1

RS2

CSP CSN/VO

Figure 5. Differential Current Sense Network

Light Load Operation

In the light load condition, NCP5230 will work in a diode

emulation mode with bottom gate turning off if the inductor

current is below zero. The system therefore works in

discontinuous conduction mode (DCM). The zero current

detection is done by sensing switch node and automatically

adjusted to minimize the low side FET body diode

conduction time (right after LG turns off) in diode emulation

mode.

If the load reduces further, COMP signal will be close or

below the internal ramp bottom triggering minimum on time

operation, the system will start skipping pulses, working in

a reduced frequency range. NCP5230 has an internal

ultrasonic timer to keep the device from working in an audio

frequency and below. This timer initiates after high side gate

off signal and expires after ~30 ms.

Normally high side gate signal will reset this ultrasonic

timer repeatedly before it expires. In a very light load or load

release, if there is no high side gate pulses until the timer

expires, the low side MOSFET(s) will be forced to turn on

to discharge the output. Through properly compensated

network the comp signal will climb up to generate next burst

of switching pulses and the converter will regulate the

output voltage to its target level. This can last a few cycles

or continuously depending on the system load level.

In light load operation, if synchronization is enabled,

NCP5230 will also check the SYNC pin input signal cycle

by cycle. If the external sync signal is within the

synchronization frequency range, the NCP5230 will

interleave its switching pulses with it after a proper delay. In

this way, the ripple variation during transition between the

discontinuous and continuous current mode can be

minimized.

Voltage Feedback

The NCP5230 allow the output voltage to be adjusted

from 0.8 V to 5 V via an external resistor divider network

(R1, R2). The controller will regulate the output voltage to

maintain the FB pin voltage to 0.8 V reference voltage. The

relation between the resistor divider network and the output

voltage is as below;

R2 +R1 @ǒ0.8 V

Vout *0.8 VǓ

VOUT

VFB

Figure 6. Feedback Voltage

NCP5230

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Vin

VCC

OSC/EN

Vout.

LG (Stays Low

until first PWM

pulse except in

case of a Fault)

SoftStart Normal

UV monitor

OCP/

Normal

shutdown

Vth_disoff

(50%Vref)

UVLO_VCCPOR_VCC

Vref = 0.8 V

OVP

(125%Vref)

Softstop

~5ms@200kHzz

80% Vrer

1024cycle

0.75V

1.24V

Pre-OVP valid

Figure 7. Start Up and Shutdown Timing Diagram

NCP5230

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VCC> POR &

VCCDR> UVLO_ VCCDR

BOOT >UVLO_ BOOT

Soft Start ,

Normal Operation

OCP, OVP, UVP detection

OVP OCP

TG OFF, BG ON

PGOOD=0

TG OFF, BG

OFF

Vout < Vth_disoff

Vo discharge

mode

Yes

Vcc<UVLO_Vcc, Or

EN<Vdis_th Or

Boot<UVLO_Boot

PWR

Fosc detection

OVP

Yes

4 times

reentry

UVP

UV (after Vout reaches UV

threshold in softstart )

TG OFF, BG

OFF

PGOOD=0

After 4 times reentry for

1st threshod

or immediately over 2nd

threshold

PreOVP detection

VCC> POR &

VCCDR > UVLO _VCCDR (16−

pin)

Yes

BG on

VSEN >OV Vth

EN>Vdis_th

Figure 8. State Diagram

NCP5230

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PACKAGE DIMENSIONS

ÇÇÇ

QFN16 3x3, 0.5P

CASE 485G

ISSUE F

16X

SEATING

PLANE

0.10 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30 MM FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

0.10 CTOP VIEW

SIDE VIEW

BOTTOM VIEW

PIN 1

LOCATION

0.05 C

(A3)

NOTE 4

16X

0.10 C

0.05 C

A B

NOTE 3

16X

DETAIL A

ALTERNATE TERMINAL

CONSTRUCTIONS

ÉÉ

ÇÇ

ÉÉ

DETAIL B

MOLD CMPDEXPOSED Cu

ALTERNATE

CONSTRUCTIONS

DETAIL A

DETAIL B

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

RECOMMENDED

0.50

PITCH

1.84 3.30

DIMENSIONS: MILLIMETERS

0.58

16X

0.30

16X

OUTLINE

PACKAGE

0.10 C A B

e/2

SOLDERING FOOTPRINT*

DIM MIN NOM MAX

MILLIMETERS

A0.80 0.90 1.00

A1 0.00 0.03 0.05

A3 0.20 REF

b0.18 0.24 0.30

D3.00 BSC

D2 1.65 1.75 1.85

E3.00 BSC

E2 1.65 1.75 1.85

e0.50 BSC

K0.18 TYP

L0.30 0.40 0.50

L1 0.00 0.08 0.15

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

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Phone: 81−3−5817−1050

NCP5230/D

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