BAT60AGEG - INFINEON TECHNOLOGIES AG

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BAT60J

January 2003 - Ed: 6A

SMALL SIGNAL SCHOTTKY DIODE

■VERY SMALL CONDUCTION LOSSES

■NEGLIGIBLE SWITCHING LOSSES

■LOW FORWARD VOLTAGE DROP

■EXTREMELY FAST SWITCHING

■SURFACE MOUNTED DEVICE

FEATURES AND BENEFITS

Schottky barrier diode encapsulated in a SOD-323

small SMD package.

This device is intended for use in portable

equipments. It is suited for DC to DC converters,

step-up conversion and power management.

DESCRIPTION

SOD-323

Symbol Parameter Value Unit

VRRM Repetitive peak reverse voltage 10 V

IFPeak forward current δ= 0.11 3 A

IFSM Surge non repetitive forward current tp=10ms 5 A

Ptot Power Dissipation Ta=25°C 310 mW

Tstg Storage temperature range - 65 to +150 °C

Tj Maximum operating junction temperature * 150 °C

TL Maximum temperature for soldering during 10s 260 °C

ABSOLUTE RATINGS (limiting values)

Symbol Parameter Value Unit

Rth (j-a) Junction to ambient (*) 400 °C/W

(*) Mounted on epoxy board with recommended pad layout.

THERMAL RESISTANCE

dPtot

dTj Rth j a

<−

()

thermal runaway condition for a diode on its own heatsink

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Symbol Tests Conditions Tests conditions Min. Typ. Max. Unit

VF* Forward voltage drop Tj = 25°C IF= 10 mA 0.28 0.32 V

IF= 100 mA 0.35 0.40

IF= 1 A 0.53 0.58

IR** Reverse leakage current Tj = 25°C VR=5V 1 3 µA

Tj = 25°C VR= 8 V 1.3 4

Tj = 25°C VR=10V 2 6

Tj = 25°C VR= 12 V 2.5 7.5

Tj = 80°C VR= 8 V 73 150

STATIC ELECTRICAL CHARACTERISTICS

Pulse test: * tp = 380µs, δ<2%

** tp = 5ms, δ<2%

To evaluate the conduction losses the following equation:

P=0.38xI

F(AV) + 0.17 IF2(RMS)

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0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

IF(av) (A)

PF(av)(W)

δ=tp/T tp

δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5

δ= 1

Fig. 1: Average forward power dissipation versus

average forward current.

0 25 50 75 100 125 150

0.0

0.4

0.8

1.2

1.6

2.0

2.4

2.8

3.2

Tamb(°C)

IF(A)

δ=tp/T tp

Fig. 2-1: Peak forward current versus ambient

temperature (δ= 0.11).

0 25 50 75 100 125 150

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0.55

0.60

Tamb(°C)

IF(av)(A)

δ=tp/T tp

Fig. 2-2: Average forward current versus ambient

temperature (δ= 0.5).

1E-3 1E-2 1E-1 1E+0

0.0

0.5

1.0

1.5

2.0

2.5

3.0

t(s)

IM(A)

Ta=25°C

Ta=50°C

Ta=75°C

δ=0.5

Fig. 3: Non repetitive surge peak forward current

versus overload duration (maximum values).

1E-4 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2

1E-3

1E-2

1E-1

1E+0

t(s)

Zth(j-a)/Rth(j-a)

δ= 0.5

δ= 0.2

δ= 0.1

Single pulse T

δ=tp/T tp

Fig. 4: Relative variation of thermal impedance junc-

tion to ambient versus pulse duration (Epoxy printed

circuit board FR4 with recommended pad layout).

012345678910

1E-4

1E-3

1E-2

1E-1

1E+0

1E+1

VR(V)

IR(mA)

Tj=80°C

Tj=25°C

Tj=150°C

Fig. 5: Reverse leackage current versus reverse

voltage applied (typical values).

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0 25 50 75 100 125 150

1E-1

1E+0

1E+1

1E+2

1E+3

1E+4

1E+5

Tj(°C)

IR[Tj] / IR[Tj=25°C ]

VR=8V

Fig. 6: Reverse leackage current versus junction

temperature (typical values).

110

100

VR(V)

C(pF)

F=1MHz

Tj=25°C

Fig. 7: Junction capacitance versus reverse voltage

applied (typical values).

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8

1E-1

1E+0

1E+1

VFM(V)

IFM(A)

Tj=150°C

(Typical values)

Tj=80°C

(Typical values)

Tj=25°C

(Maximum values)

Fig. 8-1: Forward voltage drop versus forward cur-

rent (High level).

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

VFM(V)

IFM(A)

Tj=150°C

(Typical values)

Tj=25°C

(Maximum values)

Tj=80°C

(Typical values)

Fig. 8-2: Forward voltage drop versus forward cur-

rent (Low level).

0 102030405060708090100

100

150

200

250

300

350

400

450

500

550

600

S(Cu) (mm²)

Rth(j-a) (°C/W)

IF=0.75A

Fig. 9: Thermal resistance junction to ambient ver-

sus copper surface (epoxy printed circuit board FR4,

copper thickness: 35µm).

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PACKAGE MECHANICAL DATA

SOD-323

REF.

DIMENSIONS

Millimeters Inches

Min. Max. Min. Max.

A 1.17 0.046

A1 0 0.1 0 0.004

b 0.25 0.44 0.01 0.017

c 0.1 0.25 0.004 0.01

D 1.52 1.8 0.06 0.071

E 1.11 1.45 0.044 0.057

H 2.3 2.7 0.09 0.106

L 0.1 0.46 0.004 0.02

Q1 0.1 0.41 0.004 0.016

Type Marking Package Weight Base qty Delivery mode

BAT60JFILM 60 SOD-323 0.005 g. 3000 Tape & reel

■Epoxy meets UL94V-0

MARKING