250
225
200
175
150
125
100
75
50
25
0
100
90
80
70
60
50
40
30
20
10
0
0.1 1 10 100 1000
I - Load Current - mA
O
Power Loss - mW
Efficiency - %
V = 3.6 V,
V = 1.8 V
I
O
Efficiency
PFM/PWM Operation
Power Loss
PFM/PWM Operation
VIN SW
FB
MODE
GND
EN
VOUT
1.8 V @ 600mA
CI
TPS82671SIP
L
VIN
2.3 V .. 4.8 V
CO
MODE
SELECTION
ENABLE
DC/DC Converter
GND
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
600-mA, HIGH-EFFICIENCY MicroSiP™ STEP-DOWN CONVERTER (PROFILE <1.0mm)
Check for Samples: TPS82670,TPS82671,TPS82672,TPS82673,TPS82674,TPS82675,TPS82676,TPS82677,TPS826711
1FEATURES DESCRIPTION
23• 90% Efficiency at 5.5MHz Operation The TPS8267x device is a complete 600mA, DC/DC
• 17μA Quiescent Current step-down power supply intended for low-power
applications. Included in the package are the
• Wide VIN Range From 2.3V to 4.8V switching regulator, inductor and input/output
• 5.5MHz Regulated Frequency Operation capacitors. No additional components are required to
• Spread Spectrum, PWM Frequency Dithering finish the design.
•Best in Class Load and Line Transient The TPS8267x is based on a high-frequency
• ±2% Total DC Voltage Accuracy synchronous step-down dc-dc converter optimized for
battery-powered portable applications. The
• Automatic PFM/PWM Mode Switching MicroSiPTM DC/DC converter operates at a regulated
• Low Ripple Light-Load PFM Mode 5.5-MHz switching frequency and enters the power-
•≥35dB VIN PSRR (1kHz to 10kHz) save mode operation at light load currents to maintain
• Internal Soft Start, 120-µs Start-Up Time high efficiency over the entire load current range.
• Integrated Active Power-Down Sequencing The PFM mode extends the battery life by reducing
(Optional) the quiescent current to 17μA (typ) during light load
operation. For noise-sensitive applications, the device
• Current Overload and Thermal Shutdown has PWM spread spectrum capability providing a
Protection lower noise regulated output, as well as low noise at
• Sub 1-mm Profile Solution the input. These features, combined with high PSRR
• Total Solution Size <6.7 mm2and AC load regulation performance, make this
device suitable to replace a linear regulator to obtain
better power conversion efficiency.
APPLICATIONS
• Cell Phones, Smart-Phones The TPS8267x is packaged in a compact (2.3mm x
2.9mm) and low profile (1.0mm) BGA package
• Digital TV, WLAN, GPS and Bluetooth™ suitable for automated assembly by standard surface
Applications mount equipment.
• POL Applications
Figure 1. Typical Application
Figure 2. Efficiency vs. Load Current
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2MicroSiP is a trademark of Texas Instruments.
3Bluetooth is a trademark of Bluetooth SIG, Inc.
UNLESS OTHERWISE NOTED this document contains Copyright © 2010–2012, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
PART OUTPUT DEVICE PACKAGE
TAORDERING(3)
NUMBER VOLTAGE(2) SPECIFIC FEATURE MARKING
PWM Spread Spectrum Modulation
TPS82670 1.86V Low PFM Output Ripple Voltage TPS82670SIP YK
Output Capacitor Discharge
PWM Spread Spectrum Modulation
TPS82671 1.8V TPS82671SIP RA
Low PFM Output Ripple Voltage
PWM Spread Spectrum Modulation
TPS826711 1.8V Low PFM Output Ripple Voltage TPS826711SIP YW
Output Capacitor Discharge
PWM Spread Spectrum Modulation
TPS82672 1.5V TPS82672SIP WD
Low PFM Output Ripple Voltage
PWM Spread Spectrum Modulation
TPS82673 1.26V Low PFM Output Ripple Voltage TPS82673SIP YL
-40°C to 85°C Output Capacitor Discharge
PWM Spread Spectrum Modulation
TPS82674 1.2V Low PFM Output Ripple Voltage TPS82674SIP SW
Output Capacitor Discharge
PWM Spread Spectrum Modulation
TPS82675 1.2V TPS82675SIP RB
Low PFM Output Ripple Voltage
PWM Spread Spectrum Modulation
TPS82676 1.1V Low PFM Output Ripple Voltage TPS82676SIP TU
Output Capacitor Discharge
TPS82677 1.2V Output Capacitor Discharge TPS82677SIP SK
PWM Spread Spectrum Modulation
TPS82678(4) 1.35V TPS82678SIP TN
Output Capacitor Discharge
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Internal tap points are available to facilitate output voltages in 25mV increments.
(3) The SIP package is available in tape and reel. Add a R suffix (e.g. TPS82671SIPR) to order quantities of 3000 parts. Add a T suffix (e.g.
TPS82671SIPT) to order quantities of 250 parts.
(4) Product Preview
2Copyright © 2010–2012, Texas Instruments Incorporated
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VALUE UNIT
MIN MAX
Voltage at VIN(2)(3) –0.3 6 V
VIVoltage at VOUT(3) –0.3 3.6 V
Voltage at EN, MODE (3) –0.3 VIN + 0.3 V
Power dissipation Internally limited
TAOperating temperature range(4) –40 85 °C
TINT (max) Maximum internal operating temperature 125 °C
Tstg Storage temperature range –55 125 °C
Human body model 2 kV
ESD rating (5) Charge device model 1 kV
Machine model 200 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Operation above 4.8V input voltage for extended periods may affect device reliability.
(3) All voltage values are with respect to network ground terminal.
(4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating temperature (TINT(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (θJA), as given by the following equation: TA(max)= TJ(max)–(θJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum internal temperature of 105°C.
(5) The human body model is a 100-pF capacitor discharged through a 1.5-kΩresistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin.
THERMAL INFORMATION TPS8267xSIP
THERMAL METRIC(1)(2) SIP UNITS
8 PINS
θJA Junction-to-ambient (top) thermal resistance 125
Junction-to-ambient (bottom) thermal resistance 70
θJCtop Junction-to-case (top) thermal resistance
θJB Junction-to-board thermal resistance °C/W
ψJT Junction-to-top characterization parameter
ψJB Junction-to-board characterization parameter
θJCbot Junction-to-case (bottom) thermal resistance
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Thermal data have been measured using TI's 4-layer evaluation board.
RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT
VIN Input voltage range 2.3 4.8(1) V
IOOutput current range TPS82671 to TPS826711 0 600 mA
TPS82670 to TPS82676 0 2.5 µF
TPS826711
Additional output capacitance (PFM/PWM operation)(2)
TPS82677, TPS82678 0 4 µF
Additional output capacitance (PWM operation)(2) 0 7 µF
TAAmbient temperature –40 +85 °C
TJOperating junction temperature –40 +125 °C
(1) Operation above 4.8V input voltage for extended periods may affect device reliability.
(2) In certain applications larger capacitor values can be tolerable, see output capacitor selection section for more details.
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
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ELECTRICAL CHARACTERISTICS
Minimum and maximum values are at VIN = 2.3V to 5.5V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA= –40°C to 85°C;
Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, VOUT =
1.8V, EN = 1.8V, AUTO mode and TA= 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IO= 0mA. Device not switching 17 40 μA
IQOperating quiescent current IO= 0mA. PWM operation 5.8 mA
ISD Shutdown current EN = GND 0.5 5 μA
UVLO Undervoltage lockout threshold 2.05 2.1 V
PROTECTION
Thermal shutdown 140 °C
Thermal shutdown hysteresis 10 °C
ILIM Peak Input Current Limit 1100 mA
Input current limit under short-circuit
ISC VOshorted to ground 13.5 mA
conditions
ENABLE, MODE
VIH High-level input voltage 1.0 V
VIL Low-level input voltage 0.4 V
Ilkg Input leakage current Input connected to GND or VIN 0.01 1.5 μA
OSCILLATOR
fSW Oscillator frequency IO= 0mA. PWM operation 4.9 5.45 6.0 MHz
OUTPUT
TPS82670 2.5V ≤VI≤4.8V, 0mA ≤IO≤600 mA 0.98×VNOM VNOM 1.03×VNOM V
TPS82671 PFM/PWM operation
TPS826711 2.5V ≤VI≤5.5V, 0mA ≤IO≤600 mA
TPS82672 0.98×VNOM VNOM 1.04×VNOM V
PFM/PWM operation
TPS82673
TPS82674
TPS82675
Regulated DC 2.5V ≤VI≤5.5V, 0mA ≤IO≤600 mA
VOUT 0.98×VNOM VNOM 1.02×VNOM V
TPS82676
output voltage PWM operation
TPS82678
2.5V ≤VI≤4.8V, 0mA ≤IO≤600 mA 0.98×VNOM VNOM 1.04×VNOM V
PFM/PWM operation
TPS82677
TPS82678 2.5V ≤VI≤5.5V, 0mA ≤IO≤600 mA 0.98×VNOM VNOM 1.02×VNOM V
PWM operation
Line regulation VI= VO+ 0.5V (min 2.5V) to 5.5V, IO= 200 mA 0.23 %/V
Load regulation IO= 0mA to 600 mA. PWM operation –0.00085 %/mA
Feedback input resistance 480 kΩ
TPS82671 IO= 1mA, VO= 1.8V 19 mVPP
TPS82674 IO= 1mA, VO= 1.2V 16 mVPP
TPS82675
Power-save mode
ΔVOripple voltage TPS82676 IO= 1mA, VO= 1.1V 16 mVPP
TPS82677 IO= 1mA, VO= 1.2V 25 mVPP
TPS82678 IO= 1mA, VO= 1.35V TBD mVPP
TPS82671
Start-up time IO= 0mA, Time from active EN to VO120 μs
TPS826711
TPS82670
TPS826711
Discharge resistor TPS82673
rDIS for power-down TPS82674 Device featuring active discharge 70 150 Ω
sequence TPS82676
TPS82677
TPS82678
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Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
SIP-8
(TOP VIEW)
SIP-8
(BOTTOMVIEW)
A1
B1
C1
A2
B2
C2
GND
MODE
VOUT
GND
A3
C3
VIN
EN
A3
C3
A2
B2
C2
GND
EN
VIN
GND
C1
VOUT
MODE
A1
B1
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
PIN ASSIGNMENTS
PIN DESCRIPTIONS
PIN I/O DESCRIPTION
NAME NO.
VOUT A1 O Power output pin. Apply output load between this pin and GND.
VIN A2, A3 I The VIN pins supply current to the TPS8267x internal regulator.
This is the enable pin of the device. Connect this pin to ground to force the converter into
EN B2 I shutdown mode. Pull this pin to VIto enable the device. This pin must not be left floating and
must be terminated.
This is the mode selection pin of the device. This pin must not be left floating and must be
terminated.
MODE = LOW: The device is operating in regulated frequency pulse width modulation mode
MODE B1 I (PWM) at high-load currents and in pulse frequency modulation mode (PFM) at light load
currents.
MODE = HIGH: Low-noise mode is enabled and regulated frequency PWM operation is forced.
GND C1, C2, C3 – Ground pin.
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
VIN SW
FB
MODE
GND
EN
CI
TPS8267XSIP
L
VIN
CO
MODE
SELECTION
ENABLE
DC/DC Converter
GND
VOUT
Gate Driver
Anti
Shoot-Through
Power Save Mode
Feedback Divider
+
-
Frequency
Control
R1
R2
L
GND
Soft-Start
EN VIN
Current Limit
Detect
Undervoltage
Lockout
Bias Supply
Bandgap
Thermal
Shutdown
Negative Inductor
Current Detect
VIN
MODE
V = 0.8 V
REF
VREF
CI
1µH
C
4.7µF
O
Switching
VOUT
DC/DC CONVERTER 2.2µF
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
PARAMETER MEASUREMENT INFORMATION
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TPS826711
100
90
80
70
60
50
40
30
20
10
00.1 1 10 100 1000
I - Load Current - mA
O
Efficiency - %
V = 1.8 V
O
V = 2.7 V
PFM/PWM Operation
I
V = 3.6 V
PFM/PWM Operation
I
V = 4.2 V
PFM/PWM Operation
IV = 3.6 V
Forced PWM Operation
I
100
90
80
70
60
50
40
30
20
10
00.1 1 10 100 1000
I - Load Current - mA
O
Efficiency - %
V = 1.2 V
OV = 2.7 V
PFM/PWM Operation
I
V = 3.6 V
PFM/PWM Operation
I
V = 4.2 V
PFM/PWM Operation
I
V = 3.6 V
Forced PWM Operation
I
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
vs Load current 3, 4
ηEfficiency vs Input voltage 5
Peak-to-peak output ripple voltage vs Load current 6, 7, 8
VODC output voltage vs Load current 9, 10, 11
Combined line/load transient 12, 13
response 14, 15, 16, 17
Load transient response 18, 19, 20
AC load transient response 21
22, 23, 24, 25
Load transient response 26, 27, 28
AC load transient response 29
PFM/PWM boundaries vs Input voltage 30, 31
IQQuiescent current vs Input voltage 32
fsPWM switching frequency vs Input voltage 33
Start-up 34, 35
PSRR Power supply rejection ratio vs. Frequency 36
Spurious output noise (PFM mode) vs. Frequency 37
Spurious output noise (PWM mode) vs. Frequency 38
Output spectral noise density vs. Frequency 39
EFFICIENCY EFFICIENCY
vs vs
LOAD CURRENT LOAD CURRENT
Figure 3. Figure 4.
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
0 25 50 75 100 125 150 175 200 225 250 275 300
I - Load Current - mA
O
0
5
10
15
20
25
30
35
40
45
V - Peak-to-Peak Output Ripple Voltage - mV
O
V = 2.7 V
I
V = 3.6 V
I
V = 4.5 V
I
V = 1.2 V (TPS82677)
O
26
24
22
20
18
16
14
12
10
8
6
4
2
0
0 20 40 60 80 100 120 140 160 180 200
I - Load Current - mA
O
V - Peak-to-Peak Output Ripple Voltage - mV
O
V = 2.7 V
I
V = 4.5 V
I
V = 3.6 V
I
PFM/PWM Operation
V = 1.2 V (TPS82675)
O
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
0 20 40 60 80 100 120 140 160 180 200
I - Load Current - mA
O
V - Peak-to-Peak Output Ripple Voltage - mV
O
V = 1.8 V (TPS82671)
O
V = 2.7 V
I
V = 4.5 V
I
V = 3.6 V
I
PFM/PWM Operation
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
EFFICIENCY PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE
vs vs
INPUT VOLTAGE LOAD CURRENT
Figure 5. Figure 6.
PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE
vs vs
LOAD CURRENT LOAD CURRENT
Figure 7. Figure 8.
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Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
1.176
1.188
1.2
1.212
1.224
0.1 1 10 100 1000
I - Load Current - mA
O
V - Output Voltage - V
O
V = 1.2 V (TPS82677)
PFM/PWM Operation
O
V = 4.5 V
I
V = 3.6 V
I
V = 2.7 V
I
3.3V to 3.9V Line Step
V = 1.8 V (TPS82671)
O
MODE = Low
30 to 300 mA Load Step
1.764
0.1
I - Load Current - mA
O
V = 1.8 V (TPS82671)
PFM/PWM Operation
O
V = 2.7 V
I
V = 4.5 V
I
V = 3.6 V
I
1 10 100 1000
1.782
1.800
1.818
1.836
V - Output Voltage - V
O
1.176
0.1
I - Load Current - mA
O
V = 1.2 V (TPS82675)
PFM/PWM Operation
O
V = 2.7 V
I
V = 4.5 V
I
V = 3.6 V
I
1 10 100 1000
1.188
1.2
1.212
1.224
V - Output Voltage - V
O
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
TYPICAL CHARACTERISTICS (continued)
DC OUTPUT VOLTAGE DC OUTPUT VOLTAGE
vs vs
LOAD CURRENT LOAD CURRENT
Figure 9. Figure 10.
DC OUTPUT VOLTAGE
vs
LOAD CURRENT COMBINED LINE/LOAD TRANSIENT RESPONSE
Figure 11. Figure 12.
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Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
MODE = Low
50 to 350 mA Load Step
V = 3.6 V,
V = 1.8 V (TPS82671)
I
O
MODE = Low
50 to 350 mA Load Step
V = 2.7 V,
V = 1.8 V (TPS82671)
I
O
MODE = Low
30 to 150 mA Load Step
2.7V to 3.3V Line Step
V = 1.8 V (TPS82671)
O
MODE = Low
5 to 150 mA Load Step
V = 3.6 V,
V = 1.8 V (TPS82671)
I
O
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
LOAD TRANSIENT RESPONSE IN
COMBINED LINE/LOAD TRANSIENT RESPONSE PFM/PWM OPERATION
Figure 13. Figure 14.
LOAD TRANSIENT RESPONSE IN LOAD TRANSIENT RESPONSE IN
PFM/PWM OPERATION PFM/PWM OPERATION
Figure 15. Figure 16.
10 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
MODE = Low
150 to 500 mA Load Step
V = 2.7 V,
V = 1.8 V (TPS82671)
I
O
MODE = Low
150 to 500 mA Load Step
V = 4.5 V,
V = 1.8 V (TPS82671)
I
O
MODE = Low
50 to 350 mA Load Step
V = 4.5 V,
V = 1.8 V (TPS82671)
I
O
MODE = Low
V = 3.6 V,
V = 1.8 V (TPS82671)
I
O150 to 500 mA Load Step
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
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SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
TYPICAL CHARACTERISTICS (continued)
LOAD TRANSIENT RESPONSE IN LOAD TRANSIENT RESPONSE IN
PFM/PWM OPERATION PFM/PWM OPERATION
Figure 17. Figure 18.
LOAD TRANSIENT RESPONSE IN LOAD TRANSIENT RESPONSE
PFM/PWM OPERATION IN PFM/PWM OPERATION
Figure 19. Figure 20.
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Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
MODE = Low
V = 3.6 V,
V = 1.2 V
I
O50 to 350 mA Load Step
MODE = Low
V = 2.7 V,
V = 1.2 V
I
O50 to 350 mA Load Step
MODE = Low
V = 3.6 V,
V = 1.8 V (TPS82671)
I
O
5 to 300 mA Load Sweep
MODE = Low
V = 3.6 V,
V = 1.2 V
I
O
5 to 150 mA Load Step
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
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TYPICAL CHARACTERISTICS (continued)
LOAD TRANSIENT RESPONSE
AC LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION
Figure 21. Figure 22.
LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION IN PFM/PWM OPERATION
Figure 23. Figure 24.
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TPS826711
MODE = Low
V = 2.7 V,
V = 1.2 V
I
O150 to 500 mA Load Step
MODE = Low
V = 4.5 V,
V = 1.2 V
I
O150 to 500 mA Load Step
MODE = Low
50 to 350 mA Load Step
MODE = Low
V = 3.6 V,
V = 1.2 V
I
O150 to 500 mA Load Step
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
TYPICAL CHARACTERISTICS (continued)
LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION IN PFM/PWM OPERATION
Figure 25. Figure 26.
LOAD TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE
IN PFM/PWM OPERATION IN PFM/PWM OPERATION
Figure 27. Figure 28.
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Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
V -InputVoltage-V
I
I -QuiescentCurrent- A
Qm
0
2
4
6
8
10
12
14
16
18
20
22
24
26
28
2.7 3 3.3 3.6 3.9 4.2 4.5 4.8
T =85°C
A
T =25°C
A
T =-40°C
A
2.7 3 3.3 3.6 3.9 4.2 4.5 4.8
0
20
40
60
80
100
120
140
I - Load Current - mA
O
V - Input Voltage - V
I
The switching mode changes
at these borders
Always PWM
Always PFM
PWM to PFM
Mode Change
PFM to PWM
Mode Change
V = 1.2 V (TPS82674)
O
2.7 3 3.3 3.6 3.9 4.2 4.5 4.8
0
20
40
60
80
100
120
140
I - Load Current - mA
O
V - Input Voltage - V
I
The switching mode
changes at these
borders
Always PWM
Always PFM
PWM to PFM
Mode Change
PFM to PWM
Mode Change
V = 1.8 V (TPS82671)
O
MODE = Low
V = 3.6 V,
V = 1.2 V
I
O5 to 300 mA Load Sweep
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
AC LOAD TRANSIENT RESPONSE PFM/PWM BOUNDARIES
Figure 29. Figure 30.
QUIESCENT CURRENT
vs
PFM/PWM BOUNDARIES INPUT VOLTAGE
Figure 31. Figure 32.
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TPS826711
0.01 0.1 1 10 100 1000
f - Frequency - kHz
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
PSRR - Power Supply Rejection Ratio - dB
I = 10 mA
PFM Operation
O
I = 400 mA
PWM Operation
O
I = 150 mA
PWM Operation
O
V = 3.6 V,
V = 1.8 V (TPS82671)
I
O
MODE = Low
V = 3.6 V,
V = 1.8 V (TPS82671),
I
O
R = 100
LΩ
6
5.5
5
4.5
4
3.5
3
2.5
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5
V - Input Voltage - V
I
f - Switching Frequency - MHz
S
I = 150 mA
O
I = 500 mA
O
I = 400 mA
O
I = 300 mA
O
V = 1.8 V
O
MODE = Low
V = 3.6 V,
V = 1.8 V (TPS82671),
I
O
I = 0 mA
O
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
TYPICAL CHARACTERISTICS (continued)
PWM SWITCHING FREQUENCY
vs
INPUT VOLTAGE START-UP
Figure 33. Figure 34.
POWER SUPPLY REJECTION RATIO
vs
START-UP FREQUENCY
Figure 35. Figure 36.
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TPS826711
10
1
0.1
0.01
0.001
0.1 1 10 100 1000
f - Frequency - kHz
V = 3.6 V
IN
V = 1.8 V (TPS82671)
OUT
I = 10 mA (PFM Mode)
OUT
I = 150 mA (PWM Mode)
OUT
Output Spectral Noise Density - HzµV/V
0 10
3.5 m
3 m
2.5 m
2 m
1.5 m
1 m
500 m
50 n
Spurious Output Noise (PFM Mode) - V
f - Frequency - MHz
Span = 1 MHz
5 m
4.5 m
5 m
V = 1.8 V (TPS82671),
R = 150
O
LΩ
V = 3.6 V
I
V = 2.7 V
I
V = 4.2 V
I
0 40
300 m
250 m
200 m
150 m
100 m
50 m
5 n
Spurious Output Noise (PWM Mode) - V
f - Frequency - MHz
Span = 4 MHz
350 m
400 m
450 m
V = 1.8 V (TPS82671),
R = 12
O
LΩ
500 m
V = 2.7 V
I
V = 4.2 V
I
V = 3.6 V
I
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
SPURIOUS OUTPUT NOISE (PFM MODE) SPURIOUS OUTPUT NOISE (PWM MODE)
vs vs
FREQUENCY FREQUENCY
Figure 37. Figure 38.
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
Figure 39.
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Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
PFMModeatLightLoad
PFMRipple
PWMModeatHeavyLoad
NominalDCOutputVoltage
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
DETAILED DESCRIPTION
OPERATION
The TPS8267x is a stand-alone, synchronous, step-down converter. The converter operates at a regulated 5.5-
MHz frequency pulse width modulation (PWM) at moderate to heavy load currents. At light load currents, the
TPS8267x converter operates in power-save mode with pulse frequency modulation (PFM).
The converter uses a unique frequency-locked ring-oscillating modulator to achieve best-in-class load and line
response. One key advantage of the non-linear architecture is that there is no traditional feed-back loop. The
loop response to change in VOis essentially instantaneous, which explains the transient response. Although this
type of operation normally results in a switching frequency that varies with input voltage and load current, an
internal frequency lock loop (FLL) holds the switching frequency constant over a large range of operating
conditions.
Combined with best-in-class load and line-transient response characteristics, the low quiescent current of the
device (approximately 17μA) helps to maintain high efficiency at light load while that current preserves a fast
transient response for applications that require tight output regulation.
The TPS8267x integrates an input current limit to protect the device against heavy load or short circuits and
features an undervoltage lockout circuit to prevent the device from misoperation at low input voltages. Fully
functional operation is permitted down to 2.1V input voltage.
POWER-SAVE MODE
If the load current decreases, the converter enters power-save mode automatically. During power-save mode,
the converter operates in discontinuous current, (DCM) single-pulse PFM mode, which produces a low output
ripple compared with other PFM architectures.
When in power-save mode, the converter resumes its operation when the output voltage falls below the nominal
voltage. The converter ramps up the output voltage with a minimum of one pulse and goes into power-save
mode when the output voltage is within its regulation limits.
The IC exits PFM mode and enters PWM mode when the output current can no longer be supported in PFM
mode. As a consequence, the DC output voltage is typically positioned approximately 0.5% above the nominal
output voltage. The transition between PFM and PWM is seamless.
Figure 40. Operation in PFM Mode and Transfer to PWM Mode
MODE SELECTION
The MODE pin selects the operating mode of the device. Connecting the MODE pin to GND enables the
automatic PWM and power-save mode operation. The converter operates in regulated frequency PWM mode at
moderate to heavy loads, and operates in PFM mode during light loads. This type of operation maintains high
efficiency over a wide load current range.
Pulling the MODE pin high forces the converter to operate in PWM mode even at light-load currents. The
advantage is that the converter modulates its switching frequency according to a spread spectrum PWM
modulation technique that allows simple filtering of the switching harmonics in noise-sensitive applications. In this
mode, the efficiency is lower when compared to the power-save mode during light loads.
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Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
c
c
ƒ
=ƒ
D
d
c
ƒ
m
δ ƒ
m = ƒ
´
( )
( )
hmfB
ffmfB
fmh
mcfm
×+××=
+D×=+××=
12
)(212
( ) )(212 mcfm ffmfB +D×=+××=
0dBV
0dBVref
F1
FENV,PEAK Dfc Dfc Non-modulatedharmonic
Side-bandharmonics
windowaftermodulation
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
www.ti.com
For additional flexibility, it is possible to switch from power-save mode to PWM mode during operation. This type
of operation allows efficient power management by adjusting the operation of the converter to the specific system
requirements.
SPREAD SPECTRUM, PWM FREQUENCY DITHERING
The goal of spread spectrum architecture is to spread out the emitted RF energy over a larger frequency range
so that any resulting electromagnetic interference (EMI) is similar to white noise. The end result is a spectrum
that is continuous and lower in peak amplitude. Spread spectrum makes it easier to comply with EMI standards.
It also makes it easier to comply with the power supply ripple requirements in cellular and non-cellular wireless
applications. Radio receivers are typically susceptible to narrowband noise that is focused on specific
frequencies.
Switching regulators can be particularly troublesome in applications where electromagnetic interference (EMI) is
a concern. Switching regulators operate on a cycle-by-cycle basis to transfer power to an output. In most cases,
the frequency of operation is either fixed or regulated, based on the output load. This method of conversion
creates large components of noise at the frequency of operation (fundamental) and multiples of the operating
frequency (harmonics).
The spread spectrum architecture varies the switching frequency by approximately ±10% of the nominal
switching frequency, thereby significantly reduces the peak radiated and conducting noise on both the input and
output supplies. The frequency dithering scheme is modulated with a triangle profile and a modulation frequency
fm.
Figure 41. Spectrum of a Frequency Modulated Figure 42. Spread Bands of Harmonics in
Sin. Wave with Sinusoidal Variation in Time Modulated Square Signals (1)
Figure 41 and Figure 42 show that after modulation the sideband harmonic is attenuated when compared to the
non-modulated harmonic, and when the harmonic energy is spread into a certain frequency band. The higher the
modulation index (mf) the larger the attenuation.
(1)
With:
fcis the carrier frequency (i.e. nominal switching frequency)
fmis the modulating frequency (approx. 0.016*fc)
δis the modulation ratio (approx 0.1)
(2)
(1) Spectrum illustrations and formulae (Figure 41 and Figure 42) copyright IEEE TRANSACTIONS ON ELECTROMAGNETIC
COMPATIBILITY, VOL. 47, NO.3, AUGUST 2005. See REFERENCES Section for full citation.
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TPS826711
( ) ( )
m c m
B = 2 1 + m = 2 +
¦
´ ¦ ´ ´ D¦ ¦
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
The maximum switching frequency is limited by the process and by the parameter modulation ratio (δ), together
with fm, which is the bandwidth of the side-band harmonics around the carrier frequency fc. The bandwidth of a
frequency modulated waveform is approximately given by the Carson’s rule and can be summarized as:
(3)
fm< RBW: The receiver is not able to distinguish individual side-band harmonics; so, several harmonics are
added in the input filter and the measured value is higher than expected in theoretical calculations.
fm> RBW: The receiver is able to properly measure each individual side-band harmonic separately, so that the
measurements match the theoretical calculations.
SOFT START
The TPS8267x has an internal soft-start circuit that limits the in-rush current during start-up. This circuit limits
input voltage drop when a battery or a high-impedance power source is connected to the input of the MicroSiP™
DC/DC converter.
The soft-start system progressively increases the switching on-time from a minimum pulse-width of 35ns as a
function of the output voltage. This mode of operation continues for approximately 100μs after the enable. If the
output voltage does not reach its target value within the soft-start time, the soft-start transitions to a second mode
of operation.
If the output voltage rises above approximately 0.5V, the converter increases the input current limit and thus
enables the power supply to come up properly. The start-up time mainly depends on the capacitance present at
the output node and the load current.
ENABLE
The TPS8267x device starts operation when EN is set high and starts up with the soft start as previously
described. For proper operation, the EN pin must be terminated and must not be left floating.
Pulling the EN pin low forces the device into shutdown. In this mode, all internal circuits are turned off and the
VIN current reduces to the device leakage current, which is typically a few hundred nanoamps.
The TPS8267x device can actively discharge the output capacitor when it turns off. The integrated discharge
resistor has a typical resistance of 100 Ω. The required time to ramp down the output voltage depends on the
load current and the capacitance present at the output node.
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Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
www.ti.com
APPLICATION INFORMATION
INPUT CAPACITOR SELECTION
Because of the pulsating input current nature of the buck converter, a low ESR input capacitor is required to
prevent large voltage transients that can cause misbehavior of the device or interference in other circuits in the
system.
For most applications, the input capacitor that is integrated into the TPS8267x should be sufficient. If the
application exhibits a noisy or erratic switching frequency, experiment with additional input ceramic capacitance
to find a remedy.
The TPS8267x uses a tiny ceramic input capacitor. When a ceramic capacitor is combined with trace or cable
inductance, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing
can couple to the output and be mistaken as loop instability or can even damage the part. In this circumstance,
additional "bulk" capacitance, such as electrolytic or tantalum, should be placed between the input of the
converter and the power source lead to reduce ringing that can occur between the inductance of the power
source leads and CI.
OUTPUT CAPACITOR SELECTION
The advanced, fast-response, voltage mode, control scheme of the TPS8267x allows the use of a tiny ceramic
output capacitor (CO). For most applications, the output capacitor integrated in the TPS8267x is sufficient.
At nominal load current, the device operates in PWM mode; the overall output voltage ripple is the sum of the
voltage step that is caused by the output capacitor ESL and the ripple current that flows through the output
capacitor impedance. At light loads, the output capacitor limits the output ripple voltage and provides holdup
during large load transitions.
The TPS8267x is designed as a Point-Of-Load (POL) regulator, to operate stand-alone without requiring any
additional capacitance. Adding a 2.2μF ceramic output capacitor (X7R or X5R dielectric) generally works from a
converter stability point of view, but does not necessarily help to minimize the output ripple voltage.
For best operation (i.e. optimum efficiency over the entire load current range, proper PFM/PWM auto transition),
the TPS8267xSIP requires a minimum output ripple voltage in PFM mode. The typical output voltage ripple is ca.
1% of the nominal output voltage VO. The PFM pulses are time controlled resulting in a PFM output voltage
ripple and PFM frequency that depends (first order) on the capacitance seen at the MicroSiPTM DC/DC
converter's output.
In applications requiring additional output bypass capacitors located close to the load, care should be taken to
ensure proper operation. If the converter exhibits marginal stability or erratic switching frequency, experiment
with additional low value series resistance (e.g. 50 to 100mΩ) in the output path to find a remedy.
Because the damping factor in the output path is directly related to several resistive parameters (e.g. inductor
DCR, power-stage rDS(on), PWB DC resistance, load switches rDS(on) …) that are temperature dependant, the
converter small and large signal behavior must be checked over the input voltage range, load current range and
temperature range.
The easiest sanity test is to evaluate, directly at the converter’s output, the following aspects:
• PFM/PWM efficiency
• PFM/PWM and forced PWM load transient response
During the recovery time from a load transient, the output voltage can be monitored for settling time, overshoot or
ringing that helps judge the converter’s stability. Without any ringing, the loop has usually more than 45° of phase
margin.
20 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
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TPS826711
Copper Trace Width
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Solder Mask Thickness
M0200-01
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
LAYOUT CONSIDERATION
In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 43 shows the appropriate diameters for a MicroSiPTM
layout.
Figure 43. Recommended Land Pattern Image and Dimensions
SOLDER PAD SOLDER MASK (5) COPPER STENCIL (6)
COPPER PAD STENCIL THICKNESS
DEFINITIONS(1)(2)(3)(4) OPENING THICKNESS OPENING
Non-solder-mask 0.30mm 0.360mm 1oz max (0.032mm) 0.34mm diameter 0.1mm thick
defined (NSMD)
(1) Circuit traces from non-solder-mask defined PWB lands should be 75μm to 100μm wide in the exposed area inside the solder mask
opening. Wider trace widths reduce device stand off and affect reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
(3) Recommend solder paste is Type 3 or Type 4.
(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5mm to avoid a reduction in thermal fatigue
performance.
(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.
(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste
volume control.
SURFACE MOUNT INFORMATION
The TPS8267x MicroSiP™ DC/DC converter uses an open frame construction that is designed for a fully
automated assembly process and that features a large surface area for pick and place operations. See the "Pick
Area" in the package drawings.
Package height and weight have been kept to a minimum thereby to allow the MicroSiP™ device to be handled
similarly to a 0805 component.
See JEDEC/IPC standard J-STD-20b for reflow recommendations.
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Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
C2
B2
A2
C1
B1
D
E
A1
C3
A3
TOP VIEW BOTTOM VIEW
YML
A1
LSB
CC
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
www.ti.com
THERMAL INFORMATION
The die temperature of the TPS8267x must be lower than the maximum rating of 125°C, so care should be taken
in the layout of the circuit to ensure good heat sinking of the TPS8267x.
To estimate the junction temperature, approximate the power dissipation within the TPS8267x by applying the
typical efficiency stated in this datasheet to the desired output power; or, by taking a power measurement if you
have an actual TPS8267x device and TPS82671EVM evaluation module. Then calculate the internal temperature
rise of the TPS8267x above the surface of the printed circuit board by multiplying the TPS8267x power
dissipation by the thermal resistance.
The actual thermal resistance of the TPS8267x to the printed circuit board depends on the layout of the circuit
board, but the thermal resistance given in the Thermal Information Table can be used as a guide.
Three basic approaches for enhancing thermal performance are listed below:
• Improve the power dissipation capability of the PCB design.
• Improve the thermal coupling of the component to the PCB.
• Introduce airflow into the system.
PACKAGE SUMMARY
SIP PACKAGE
Code:
• CC — Customer Code (device/voltage specific)
• YML — Y: Year, M: Month, L: Lot trace code
• LSB — L: Lot trace code, S: Site code, B: Board locator
MicroSiPTM DC/DC MODULE PACKAGE DIMENSIONS
The TPS8267x device is available in an 8-bump ball grid array (BGA) package. The package dimensions are:
• D = 2.30 ±0.05 mm
• E = 2.90 ±0.05 mm
REFERENCES
"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE
TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by
Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago.
22 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
TPS82670, TPS82671, TPS82672, TPS82673
TPS82674, TPS82675, TPS82676, TPS82677, TPS826711
www.ti.com
SLVSAI0D –OCTOBER 2010–REVISED APRIL 2012
REVISION HISTORY
Note: Page numbers of current version may differ form previous versions.
Changes from Original (October 2010) to Revision A Page
• Added devices TPS82677 and TPS82678 to Header info ................................................................................................... 1
• Added TPS82678 to Ordering Info table and removed "Product Preview" attribute from TPS82677 .................................. 2
• Changed graph for Figure 8 .................................................................................................................................................. 8
• Changed graph for Figure 11 ................................................................................................................................................ 9
• Added copyright attribution for spectrum illustrations ......................................................................................................... 18
Changes from Revision A (April 2011) to Revision B Page
• Added TPS82676 part number to the data sheet header ..................................................................................................... 1
• Deleted product preview attribute fromTPS82676 device in the Ordering Information table. .............................................. 2
Changes from Revision B (August 2011) to Revision C Page
• Added device TPS82672 to Header info .............................................................................................................................. 1
• Deleted Product Preview annotation from device TPS82672 in Ordering Info table ............................................................ 2
Changes from Revision C (November 2011) to Revision D Page
• Added devices TPS82670, TPS82673, and TPS82674 to Header ...................................................................................... 1
• Changed the TPS82678SIP Package Marking From: TT To: TN in the Ordering Information table ................................... 2
Copyright © 2010–2012, Texas Instruments Incorporated Submit Documentation Feedback 23
Product Folder Link(s): TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
TPS82670SIPR ACTIVE uSiP SIP 8 3000 TBD Call TI Call TI -40 to 85 YK
TXI670
TPS82670SIPT ACTIVE uSiP SIP 8 250 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 YK
TXI670
TPS826711SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 YW
TXI671
TPS826711SIPT ACTIVE uSiP SIP 8 250 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 YW
TXI671
TPS82671SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 RA
TXI671
TPS82671SIPT ACTIVE uSiP SIP 8 250 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 RA
TXI671
TPS82672SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 WD
TXI672
TPS82672SIPT ACTIVE uSiP SIP 8 250 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 WD
TXI672
TPS82673SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 YL
TXI673
TPS82673SIPT ACTIVE uSiP SIP 8 250 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 YL
TXI673
TPS82675SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 RB
TXI675
TPS82675SIPT ACTIVE uSiP SIP 8 250 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 RB
TXI675
TPS82676SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 TU
TXI676
TPS82676SIPT ACTIVE uSiP SIP 8 250 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 TU
TXI676
TPS82677SIPR ACTIVE uSiP SIP 8 3000 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 SK
TXI677
TPS82677SIPT ACTIVE uSiP SIP 8 250 Green (RoHS
& no Sb/Br) Call TI Level-2-260C-1 YEAR -40 to 85 SK
TXI677
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 2
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS826711SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2
TPS82671SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2
TPS82672SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2
TPS82673SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2
TPS82675SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2
TPS82676SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2
TPS82677SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Mar-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS826711SIPR uSiP SIP 8 3000 223.0 194.0 35.0
TPS82671SIPR uSiP SIP 8 3000 223.0 194.0 35.0
TPS82672SIPR uSiP SIP 8 3000 223.0 194.0 35.0
TPS82673SIPR uSiP SIP 8 3000 223.0 194.0 35.0
TPS82675SIPR uSiP SIP 8 3000 223.0 194.0 35.0
TPS82676SIPR uSiP SIP 8 3000 223.0 194.0 35.0
TPS82677SIPR uSiP SIP 8 3000 223.0 194.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Mar-2013
Pack Materials-Page 2
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