LM4804
LM4804 Low Voltage High Power Audio Power Amplifier
Literature Number: SNAS268B
LM4804
Low Voltage High Power Audio Power Amplifier
General Description
The LM4804 integrates a Boost Converter with an Audio
Power Amplifier to drive voice coil speakers in portable
applications. When powered by a 3V supply, it is capable of
creating 1.8W power dissipation in an 8bridge-tied-load
(BTL) with less than 1% THD+N.
Boomer audio power amplifiers were designed specifically to
provide high quality output power with a minimal amount of
external components. The LM4804 does not require boot-
strap capacitors, or snubber circuits. Therefore it is ideally
suited for portable applications requiring high output voltage
and minimal size.
The LM4804 features a micro-power shutdown mode. Addi-
tionally, the LM4804 features an internal thermal shutdown
protection mechanism.
The LM4804 contains advanced pop & click circuitry that
eliminates output transients which would otherwise occur
during power or shutdown cycles.
The LM4804 is unity-gain stable. Its closed-loop gain is
determined by the value of external, user selected resistors.
Key Specifications
jQuiescent Power Supply Current
(V
DD
= 4.2V, R
L
=8) 11mA (typ)
jBTL Output Power
(R
L
=8, 2% THD+N, V
DD
= 3V) 1.8W (typ)
jShutdown Current 2µA (max)
Features
nPop & click circuitry eliminates noise during turn-on and
turn-off transitions
nLow, 2µA (max) shutdown current
nLow, 11mA (typ) quiescent current (V
DD
= 4.2V, R
L
=
8)
n1.8W mono BTL output, R
L
=8,V
DD
=3V
nShort circuit protection
nUnity-gain stable
nExternal gain configuration capability
Applications
nCellphone
nPDA
Connection Diagrams
LM4804LQ (5x5) LQ Marking
20116784
Top View
Order Number LM4804LQ
See NS Package Number LQA28A
20116737
Top View
U = Wafer Fab Code
Z = Assembly Plant Code
XY = Date Code
TT = Die Run Code
Boomer®is a registered trademark of National Semiconductor Corporation.
June 2005
LM4804 Low Voltage High Power Audio Power Amplifier
© 2005 National Semiconductor Corporation DS201167 www.national.com
Typical Application
20116714
FIGURE 1. Typical LM4804 Audio Amplifier Application Circuit
LM4804
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Absolute Maximum Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
DD
) 6.5V
Supply Voltage (V
1
) 6.5V
Storage Temperature −65˚C to +150˚C
Input Voltage −0.3V to V
DD
+ 0.3V
Power Dissipation (Note 3) Internally limited
ESD Susceptibility (Note 4) 2000V
ESD Susceptibility (Note 5) 200V
Junction Temperature 125˚C
Thermal Resistance
θ
JA
(LLP) 59˚C/W
See AN-1187 ’Leadless Leadframe Packaging (LLP).’
Operating Ratings
Temperature Range
T
MIN
T
A
T
MAX
−40˚C T
A
+85˚C
Supply Voltage (V
DD
)3VV
DD
5V
Supply Voltage (V
1
) 2.7V V
1
6.1V
Electrical Characteristics V
DD
= 4.2V (Notes 1, 2)
The following specifications apply for V
DD
= 4.2V, V
1
= 6.0V, A
V-BTL
= 20dB, R
L
=8,f
IN
= 1kHz, C
B
= 1.0µF, R
1
= 301k,R
2
= 78.7kunless otherwise specified. Limits apply for T
A
= 25˚C. See Figure 1.
Symbol Parameter Conditions LM4804 Units
(Limits)
Typical
(Note 6)
Limit
(Notes 7, 8)
I
DD
Quiescent Power Supply Current V
IN
=0,R
LOAD
=11 22 mA (max)
I
SD
Shutdown Current V
SHUTDOWN
= GND (Notes 9, 10) 0.1 2 µA (max)
V
SDIH
Shutdown Voltage Input High SD1
SD2
0.7V
DD
1.4 V (min)
V
SDIL
Shutdown Voltage Input Low SD1
SD2
0.15V
DD
0.4 V (max)
T
WU
Wake-up Time C
B
= 1.0µF 70 msec
(max)
V
OS
Output Offset Voltage 4 40 mV (max)
TSD Thermal Shutdown Temperature 125 ˚C (min)
P
OUT
Output Power THD = 2% (max) 1.9 1.7 W (min)
THD+N Total Harmomic Distortion + Noise P
OUT
= 1.5W 0.13 0.5 %
e
OS
Output Noise A-Weighted Filter, V
IN
= 0V,
Input Referred
22 µV
PSRR Power Supply Rejection Ratio V
RIPPLE
= 200mV
p-p
f = 217Hz
f = 1kHz
72
67
dB (min)
V
FB
Feedback Pin Reference Voltage 1.24 1.2772
1.2028
V (max)
V (min)
Electrical Characteristics V
DD
= 3.0V (Notes 1, 2)
The following specifications apply for V
DD
= 3.0V, V
1
= 6.0V, A
V-BTL
= 20dB, R
L
=8,f
IN
= 1kHz, C
B
= 1.0µF, R
1
= 301k,R
2
= 78.7kunless otherwise specified. Limits apply for T
A
= 25˚C.
Symbol Parameter Conditions LM4804 Units
(Limits)
Typical
(Note 6)
Limit
(Notes 7, 8)
I
DD
Quiescent Power Supply Current V
DD
= 3.2V, V
IN
=0,R
LOAD
=19 33 mA (max)
I
SD
Shutdown Current V
SHUTDOWN
= GND (Notes 9, 10) 0.1 2 µA (max)
V
SDIH
Shutdown Voltage Input High SD1
SD2
0.7V
DD
1.4 V (min)
V
SDIL
Shutdown Voltage Input Low SD1
SD2
0.15V
DD
0.4 V (max)
T
WU
Wake-up Time C
B
= 1.0µF 70 msec
(max)
V
OS
Output Offset Voltage 3 40 mV (max)
LM4804
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Electrical Characteristics V
DD
= 3.0V (Notes 1, 2) (Continued)
The following specifications apply for V
DD
= 3.0V, V
1
= 6.0V, A
V-BTL
= 20dB, R
L
=8,f
IN
= 1kHz, C
B
= 1.0µF, R
1
= 301k,R
2
= 78.7kunless otherwise specified. Limits apply for T
A
= 25˚C.
Symbol Parameter Conditions LM4804 Units
(Limits)
Typical
(Note 6)
Limit
(Notes 7, 8)
TSD Thermal Shutdown Temperature 125 ˚C (min))
P
OUT
Output Power THD = 2% (max) 1.8 1.65 W (min)
THD+N Total Harmomic Distortion + Noise P
OUT
= 1.5W 0.15 0.5 %
e
OS
Output Noise A-Weighted Filter, V
IN
= 0V,
Input Referred
30 µV
PSRR Power Supply Rejection Ratio V
RIPPLE
= 200mV
p-p
f = 217Hz
f = 1kHz
73
66
dB (min)
V
FB
Feedback Pin Reference Voltage (Note 11) 1.24 1.2772
1.2028
V (max)
V (min)
Note 1: All voltages are measured with respect to the GND pin, unless otherwise specified.
Note 2: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given, however, the typical value is a good indication of device performance.
Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX,θJA, and the ambient temperature, TA. The maximum
allowable power dissipation is PDMAX =(T
JMAX −T
A)/θJA or the given in Absolute Maximum Ratings, whichever is lower.
Note 4: Human body model, 100pF discharged through a 1.5kresistor.
Note 5: Machine Model, 220pF 240pF discharged through all pins.
Note 6: Typicals are measured at 25˚C and represent the parametric norm.
Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: Datasheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 9: Shutdown current is measured in a normal room environment. The Shutdown pin should be driven as close as possible to Vin for minimum shutdown
current.
Note 10: Shutdown current is measured with components R1 and R2 removed.
Note 11: Feedback pin reference voltage is measured with the Audio Amplifier disconnected from the Boost converter (the Boost converter is unloaded).
LM4804
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Typical Performance Characteristics
THD+N vs Frequency
V
DD
= 4.2V, R
L
=8,P
OUT
= 1.5W
THD+N vs Frequency
V
DD
= 3.0V, R
L
=8,P
OUT
= 1.5W
20116723 20116724
THD+N vs Output Power
V
DD
= 4.2V, R
L
=8, f = 1kHz
THD+N vs Output Power
V
DD
= 3.0V, R
L
=8
20116721 20116722
PSRR vs Frequency
V
DD
= 3V, Input Referred
PSRR vs Frequency
V
DD
= 4.2V, Input Referred
20116725 20116726
LM4804
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Typical Performance Characteristics (Continued)
Power Supply Current
vs Power Supply Voltage
R
L
=8
Power Supply Current
vs Output Power
20116727 20116728
Output Power
vs Power Supply Voltage
R
L
=8
Amplifier Circuit Dissipation
vs Load Dissipation
20116729 20116730
Efficiency vs V
IN
V
OUT
= 5.0V
V
FB
vs Temperature
20116731 20116732
LM4804
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Typical Performance Characteristics (Continued)
Frequency vs V
IN
Maximum Start Up Voltage
vs Temperature
20116733 20116734
Typical R
DS(ON)
vs Temperature
Typical Current Limit
vs Temperature
20116735 20116736
LM4804
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Application Information
BRIDGE CONFIGURATION EXPLANATION
Audio Amplifier portion of the LM4804 has two operational
amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier’s gain is externally config-
urable, while the second amplifier is internally fixed in a
unity-gain, inverting configuration. The closed-loop gain of
the first amplifier is set by selecting the ratio of Rf to Ri while
the second amplifier’s gain is fixed by the two internal 20k
resistors. Figure 1 shows that the output of amplifier one
serves as the input to amplifier two which results in both
amplifiers producing signals identical in magnitude, but out
of phase by 180˚. Consequently, the differential gain for the
IC is
A
VD
= 2 *(Rf/Ri)
By driving the load differentially through outputs Vo1 and
Vo2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is
different from the classical single-ended amplifier configura-
tion where one side of the load is connected to ground.
A bridge amplifier design has a few distinct advantages over
the single-ended configuration, as it provides differential
drive to the load, thus doubling output swing for a specified
supply voltage. Four times the output power is possible as
compared to a single-ended amplifier under the same con-
ditions. This increase in attainable output power assumes
that the amplifier is not current limited or clipped. In order to
choose an amplifier’s closed-loop gain without causing ex-
cessive clipping, please refer to the Audio Power Amplifier
Design section.
A bridge configuration also creates a second advantage over
single-ended amplifiers. Since the differential outputs, Vo1
and Vo2, are biased at half-supply, no net DC voltage exists
across the load. This eliminates the need for an output
coupling capacitor which is required in a single supply,
single-ended amplifier configuration. Without an output cou-
pling capacitor, the half-supply bias across the load would
result in both increased internal IC power dissipation and
also possible loudspeaker damage.
AMPLIFIER POWER DISSIPATION
Power dissipation is a major concern when designing a
successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power
delivered to the load by a bridge amplifier is an increase in
internal power dissipation. Since the amplifier portion of the
LM4804 has two operational amplifiers, the maximum inter-
nal power dissipation is 4 times that of a single-ended am-
plifier. The maximum power dissipation for a given BTL
application can be derived from Equation 1.
P
DMAX(AMP)
= 4(V
DD
)
2
/(2π
2
R
L
) (1)
BOOST CONVERTER POWER DISSIPATION
At higher duty cycles, the increased ON time of the FET
means the maximum output current will be determined by
power dissipation within the LM2731 FET switch. The switch
power dissipation from ON-state conduction is calculated by
Equation 2.
P
DMAX(SWITCH)
=DCxI
IND
(AVE)
2
xR
DS
(ON) (2)
There will be some switching losses as well, so some derat-
ing needs to be applied when calculating IC power dissipa-
tion.
TOTAL POWER DISSIPATION
The total power dissipation for the LM4804 can be calculated
by adding Equation 1 and Equation 2 together to establish
Equation 3:
P
DMAX(TOTAL)
= [4*(V
DD
)
2
/
2π
2
R
L
]+[DCxI
IND
(AVE)
2
xR
DS
(ON)] (3)
The result from Equation 3 must not be greater than the
power dissipation that results from Equation 4:
P
DMAX
=(T
JMAX
-T
A
)/θJA (4)
For package LQA28A, θ
JA
= 59˚C/W. T
JMAX
= 125˚C for the
LM4804. Depending on the ambient temperature, T
A
,ofthe
system surroundings, Equation 4 can be used to find the
maximum internal power dissipation supported by the IC
packaging. If the result of Equation 3 is greater than that of
Equation 4, then either the supply voltage must be in-
creased, the load impedance increased or T
A
reduced. For
the typical application of a 3V power supply, with V1 set to
6.0V and 8load, the maximum ambient temperature pos-
sible without violating the maximum junction temperature is
approximately TBD˚C provided that device operation is
around the maximum power dissipation point. Thus, for typi-
cal applications, power dissipation is not an issue. Power
dissipation is a function of output power and thus, if typical
operation is not around the maximum power dissipation
point, the ambient temperature may be increased accord-
ingly. Refer to the Typical Performance Characteristics
curves for power dissipation information for lower output
levels.
EXPOSED-DAP PACKAGE PCB MOUNTING
CONSIDERATIONS
The LM4804’s exposed-DAP (die attach paddle) package
(LD) provides a low thermal resistance between the die and
the PCB to which the part is mounted and soldered. This
allows rapid heat transfer from the die to the surrounding
PCB copper traces, ground plane, and surrounding air. The
LD package should have its DAP soldered to a copper pad
on the PCB. The DAP’s PCB copper pad may be connected
to a large plane of continuous unbroken copper. This plane
forms a thermal mass, heat sink, and radiation area. Further
detailed and specific information concerning PCB layout,
fabrication, and mounting an LD (LLP) package is available
from National Semiconductor’s Package Engineering Group
under application note AN1187.
SHUTDOWN FUNCTION
In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry to provide a
quick, smooth transition into shutdown. Another solution is to
use a single-pole, single-throw switch, in conjunction with an
external pull-up resistor to drive both shutdown pins simul-
taneously. When the switch is closed, the shutdown pin is
connected to ground which disables the amplifier. If the
switch is open, then the external pull-up resistor to V
DD
will
enable the LM4804. This scheme guarantees that the shut-
down pins will not float thus preventing unwanted state
changes.
LM4804
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Application Information (Continued)
EXTERNAL COMPONENT SELECTION
Proper selection of external components in applications us-
ing integrated power amplifiers, and switching DC-DC con-
verters, is critical to optimize device and system perfor-
mance. Consideration to component values must be used to
maximize overall system quality.
The best capacitors for use with the switching converter
portion of the LM4804 are multi-layer ceramic capacitors.
They have the lowest ESR (equivalent series resistance)
and highest resonance frequency which makes them opti-
mum for use with high frequency switching converters.
When selecting a ceramic capacitor, only X5R and X7R
dielectric types should be used. Other types such as Z5U
and Y5F have such severe loss of capacitance due to effects
of temperature variation and applied voltage, they may pro-
vide as little as 20% of rated capacitance in many typical
applications. Always consult capacitor manufacturer’s data
curves before selecting a capacitor. High-quality ceramic
capacitors can be obtained from Taiyo-Yuden, AVX, and
Murata.
POWER SUPPLY BYPASSING
As with any amplifier, proper supply bypassing is critical for
low noise performance and high power supply rejection. The
capacitor location on both the bypass and power supply pins
should be as close to the device as possible.
SELECTING THE AUDIO AMPLIFIER’S INPUT
CAPACITOR
One of the major considerations is the closedloop bandwidth
of the amplifier. To a large extent, the bandwidth is dictated
by the choice of external components shown in Figure 1. The
input coupling capacitor, C
i
, forms a first order high pass filter
which limits low frequency response. This value should be
chosen based on needed frequency response for a few
distinct reasons.
Large input capacitors are both expensive and space hungry
for portable designs. Clearly, a certain sized capacitor is
needed to couple in low frequencies without severe attenu-
ation. But ceramic speakers used in portable systems,
whether internal or external, have little ability to reproduce
signals below 100Hz to 150Hz. Thus, using a large input
capacitor may not increase actual system performance.
In addition to system cost and size, click and pop perfor-
mance is effected by the size of the input coupling capacitor,
C
i
. A larger input coupling capacitor requires more charge to
reach its quiescent DC voltage (nominally 1/2 V
DD
). This
charge comes from the output via the feedback and is apt to
create pops upon device enable. Thus, by minimizing the
capacitor size based on necessary low frequency response,
turn-on pops can be minimized.
SELECTING THE AUDIO AMPLIFIER’S BYPASS
CAPACITOR
Besides minimizing the input capacitor size, careful consid-
eration should be paid to the bypass capacitor value. Bypass
capacitor, C
B
, is the most critical component to minimize
turn-on pops since it determines how fast the amplifer turns
on. The slower the amplifier’s outputs ramp to their quies-
cent DC voltage (nominally 1/2 V
DD
), the smaller the turn-on
pop. Choosing C
B
equal to 1.0µF along with a small value of
C
i
(in the range of 0.039µF to 0.39µF), should produce a
virtually clickless and popless shutdown function. While the
device will function properly, (no oscillations or motorboat-
ing), with C
B
equal to 0.1µF, the device will be much more
susceptible to turn-on clicks and pops. Thus, a value of C
B
equal to 1.0µF is recommended in all but the most cost
sensitive designs.
OPERATING PRINCIPLE
The LM4804 includes step-up DC-DC voltage regulation for
battery-powered and low-input voltage systems. It combines
a step-up switching regulator, N-channel power MOSFET,
built-in current limit, thermal limit, and voltage reference. The
switching DC-DC regulator boosts an input voltage between
.8V and 14V to a regulated output voltage between 1.24V
and 14V. The LM4804 starts from a low 1.1V input and
remains operational down to below .8V.
This device is optimized for use in cellular phones and other
applications requiring a small size, low profile, as well as low
quiescent current for maximum battery life during stand-by
and shutdown.
Additional features include a built-in peak switch current
limit, a high-efficiency gated-oscillator topology that offers an
output of up to 2A at low output voltages, and thermal
protection circuitry.
LM4804
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Application Information (Continued)
GATED OSCILLATOR CONTROL SCHEME
The on/off regulation mode of the LM4804, along with its
ultra-low quiescent current, results in good efficiency over a
very wide load range. The internal oscillator frequency can
be programmed using an external resistor to be constant or
vary with the battery voltage. Adding a capacitor to program
the frequency allows the designer to adjust the duty cycle
and optimize it for the application. Adding a resistor in addi-
tion to the capacitor allows the duty cycle to dynamically
compensate for changes to the input/output voltage ratio.
We call this a Ratio Adaptive Gated Oscillator circuit. Using
the correct RC components to adjust the oscillator allows the
part to run with low ripple and high efficiency over a wide
range of loads and input/output voltages.
201167C0
FIGURE 2. Functional Diagram of the LM4804’s Regulator
201167C1
FIGURE 3. Typical Step-Up Regulator Waveforms
LM4804
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Application Information (Continued)
PULSE FREQUENCY MODULATION (PFM)
Pulse Frequency Modulation is typically accomplished by
switching continuously until the voltage limit is reached and
skipping cycles after that to just maintain it. This results in a
somewhat hysteretic mode of operation. The coil stores
more energy each cycle as the current ramps up to high
levels. When the voltage limit is reached, the system usually
overshoots to a higher voltage than required, due to the
stored energy in the coil (see Figure 3). The system will also
undershoot somewhat when it starts switching again be-
cause it has depleted all the stored energy in the coil and
needs to store more energy to reach equilibrium with the
load. Larger output capacitors and smaller inductors reduce
the ripple in these situations. The frequency being filtered,
however, is not the basic switching frequency. It is a lower
frequency determined by the load, the input/output voltage
and the circuit parameters. This mode of operation is useful
in situations where the load variation is significant. Power
managed computer systems, for instance, may vary from
zero to full load while the system is on and this is usually the
preferred regulation mode for such systems.
CYCLE TO CYCLE PFM
When the load doesn’t vary over a wide range (like zero to
full load), ratio adaptive circuit techniques can be used to
achieve cycle to cycle PFM regulation and lower ripple (or
smaller output capacitors). The key to success here is
matching the duty cycle of the circuit closely to what is
required by the input to output voltage ratio. This ratio then
needs to be dynamically adjusted for input voltage changes
(usually caused by batteries running down). The chosen
ratio should allow most of the energy in each switching cycle
to be delivered to the load and only a small amount to be
stored. When the regulation limit is reached, the overshoot
will be small and the system will settle at an equilibrium point
where it adjusts the off time in each switching cycle to meet
the current requirements of the load. The off time adjustment
is done by exceeding the regulation limit during each switch-
ing cycle and waiting until the voltage drops below the limit
again to start the next switching cycle. The current in the coil
never goes to zero like it frequently does in the hysteretic
operating mode of circuits with wide load variations or duty
cycles that aren’t matched to the input/output voltage ratio.
Optimizing the duty cycle for a given set of input/output
voltages conditions can be done by using the circuit values
in the Application Notes.
LOW VOLTAGE START-UP
The LM4804 can start-up from voltages as low as 1.1 volts.
On start-up, the control circuitry switches the N-channel
MOSFET continuously until the output reaches 3 volts. After
this output voltage is reached, the normal step-up regulator
feedback and gated oscillator control scheme take over.
Once the device is in regulation, it can operate down to
below .8V input, since the internal power for the IC can be
boot-strapped from the output using the Vdd pin.
SHUT DOWN
The LM4804 features a shutdown mode that reduces the
quiescent current to less than a guaranteed 2.5uA over
temperature. This extends the life of the battery in battery
powered applications. During shutdown, all feedback and
control circuitry is turned off. The regulator’s output voltage
drops to one diode drop below the input voltage. Entry into
the shutdown mode is controlled by the active-low logic input
pin S/D1 (pin 26). When the logic input to this pin is pulled
below 0.15V
DD
, the device goes into shutdown mode. The
logic input to this pin should be above 0.7V
DD
for the device
to work in normal step-up mode.
SELECTING OUTPUT CAPACITOR (C
O
) FOR BOOST
CONVERTER
A single ceramic capacitor of value 4.7µF to 10µF will pro-
vide sufficient output capacitance for most applications. If
larger amounts of capacitance are desired for improved line
support and transient response, tantalum capacitors can be
used. Aluminum electrolytics with ultra low ESR such as
Sanyo Oscon can be used, but are usually prohibitively
expensive. Typical AI electrolytic capacitors are not suitable
for switching frequencies above 500 kHz due to significant
ringing and temperature rise due to self-heating from ripple
current. An output capacitor with excessive ESR can also
reduce phase margin and cause instability.
In general, if electrolytics are used, it is recommended that
they be paralleled with ceramic capacitors to reduce ringing,
switching losses, and output voltage ripple.
INTERNAL CURRENT LIMIT AND THERMAL
PROTECTION
An internal cycle-by-cycle current limit serves as a protection
feature. This is set high enough (2.85A typical, approxi-
mately 4A maximum) so as not to come into effect during
normal operating conditions. An internal thermal protection
circuit disables the MOSFET power switch when the junction
temperature (T
J
) exceeds about 160˚C. The switch is re-
enabled when T
J
drops below approximately 135˚C.
NON-LINEAR EFFECT
The LM4804 takes advantage of a non-linear effect that
allows for the duty cycle to be programmable. The C3 ca-
pacitor is used to dump charge on the FREQ pin in order to
manipulate the duty cycle of the internal oscillator. The part
is being tricked to behave in a certain manner, in the effort to
make this Pulse Frequency Modulated (PFM) boost switch-
ing regulator behave as a Pulse Width Modulated (PWM)
boost switching regulator.
CHOOSING THE CORRECT C3 CAPACITOR
The C3 capacitor allows for the duty cycle of the internal
oscillator to be programmable. Choosing the correct C3
capacitor to get the appropriate duty cycle for a particular
application circuit is a trial and error process. The non-linear
effect that C3 produces is dependent on the input voltage
and output voltage values. The correct C3 capacitor for
particular input and output voltage values cannot be calcu-
lated. Choosing the correct C3 capacitance is best done by
trial and error, in conjunction with the checking of the induc-
tor peak current to make sure your not too close to the
current limit of the device. As the C3 capacitor value in-
creases, so does the duty cycle. And conversely as the C3
capacitor value decreases, the duty cycle decreases. An
incorrect choice of the C3 capacitor can result in the part
prematurely tripping the current limit and/or double pulsing,
which could lead to the output voltage not being stable.
SETTING THE OUTPUT VOLTAGE
The output voltage of the step-up regulator can be set by
connecting a feedback resistive divider made of R
F1
and
R
F2
. The resistor values are selected as follows:
R
1
=R
2
[(V
OUT
/1.24) −1]
LM4804
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Application Information (Continued)
A value of 50k to 100k is suggested for R
2
. Then, R
1
can be
selected using the above equation.
V
DD
SUPPLY
The Vdd supply must be between 3 to 5 volts for the
LM4804. This voltage can be bootstrapped from a much
lower input voltage by simply connecting the V
DD
pin to
V
OUT
. In the event that the V
DD
supply voltage is not a low
ripple voltage source (less than 200 millivolts), it may be
advisable to use an RC filter to clean it up. Excessive ripple
on V
DD
may reduce the efficiency.
SETTING THE SWITCHING FREQUENCY
The switching frequency of the oscillator is selected by
choosing an external resistor (R3) connected between V
IN
and the FREQ pin. See the graph titled "Frequency vs V
IN
“in
the Typical Performance Characteristics section of the data
sheet for choosing the R3 value to achieve the desired
switching frequency. A high switching frequency allows the
use of very small surface mount inductors and capacitors
and results in a very small solution size. A switching fre-
quency between 300kHz and 2MHz is recommended.
OUTPUT DIODE SELECTION
A Schottky diode should be used for the output diode. The
forward current rating of the diode should be higher than the
peak input current, and the reverse voltage rating must be
higher than the output voltage. Do not use ordinary rectifier
diodes, since slow switching speeds and long recovery times
cause the efficiency and the load regulation to suffer. Table 1
shows a list of the diode manufacturers.
LLP PACKAGE DEVICES
The LM4804 is offered in the 14 lead LLP surface mount
package to allow for increased power dissipation compared
to the MSOP-8. For details of the thermal performance as
well as mounting and soldering specifications, refer to Ap-
plication Note AN-1187.
RECOMMENDED PRINTED CIRCUIT BOARD LAYOUT
Figure 5 through Figure 10 show the recommended four-
layer PC board layout that is optimized for the LQ-packaged,
3V 1.7W LM4804 mono-BTL audio amplifier and its associ-
ated external components. This circuit is designed for use
with an external 3V to 4.2V supply and speakers with 4or
higher impedance (8nominal).
The LM4804 circuit board is easy to use. Apply between 3V
and 4.2V (equivalent to, respectfully, a discharged or a fully
charged Li-ion or NMH battery) and ground to JP2’s V
DD
and
GND pins, respectively. Connect a speaker with an imped-
ance of 4or greater (8nominal) between the board’s
VO1 (-) and VO2 (+) pins. An audio signal is applied to JP1
between the V
IN
(+) and GND (-) pins.
The circuit board is configured for a gain of 20 or 26dB (VO2
-VO1 with respect to VIN). An inverting gain of -10 at VO1 is
set by Rf (200k) versus Ri (20k). The extra gain of 2 is a
product of the BTL output (VO2 - VO1). Gain can be modi-
fied by changing Rf’s value with respect to Ri.
TABLE 1. Suggested Manufacturers List
Inductors Capacitors Diodes
Coilcraft
Tel: (800) 322-2645
Fax: (708) 639-1469
Sprague/ Vishay
Tel: (207) 324-4140
Fax: (207) 324-7223
Motorola
Tel: (800) 521-6274
Fax: (602) 244-6609
Coiltronics
Tel: (407) 241-7876
Fax: (407) 241-9339
Kemet
Tel: (864) 963-6300
Fax: (864) 963-6521
International Rectifier (IR)
Tel: (310) 322-3331
Fax: (310) 322-3332
Pulse Engineering
Tel: (619) 674-8100
Fax: (619) 674-8262
Nichicon
Tel: (847) 843-7500
Fax: (847) 843-2798
General Semiconductor
Tel: (516) 847-3222
Fax: (516) 847-3150
LM4804
www.national.com 12
Application Information (Continued)
20116714
FIGURE 4. Demo Board Reference Schematic
LM4804
www.national.com13
Demonstration Board Layout
20116720
FIGURE 5. Top Trace Layer Silkscreen
20116718
FIGURE 6. Top Layer Silkscreen
20116719
FIGURE 7. Top Trace Layer
20116716
FIGURE 8. Upper Internal GND Layer
LM4804
www.national.com 14
Demonstration Board Layout (Continued)
20116717
FIGURE 9. Lower Internal V
DD
Layer
20116715
FIGURE 10. Bottom Trace Layer with GND Plane
LM4804
www.national.com15
Revision History
Rev Date Description
1.0 6/14/05 Under SHUTDOWN (Apps section), changed EN to
S/D1 and (pin– 2) into pin 26, then re-released D/S to
the WEB.
LM4804
www.national.com 16
Physical Dimensions inches (millimeters)
unless otherwise noted
LQ Package
Order Number LM4804LQ
NS Package Number LQA28A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
Leadfree products are RoHS compliant.
National Semiconductor
Americas Customer
Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
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Français Tel: +33 (0) 1 41 91 8790
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Support Center
Email: ap.support@nsc.com
National Semiconductor
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Fax: 81-3-5639-7507
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
www.national.com
LM4804 Low Voltage High Power Audio Power Amplifier
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