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FEATURES
DESCRIPTION
Enable
LogicGnd
5.6V
Reg
Thermal
Shutdown
Internal
Bias
Input A
Shutdown
InputB
Output A
PwrGndB
PwrGnd A
VIN
OutputB
UC1708
UC2708
UC3708
SLUS171B – MARCH 1997 – REVISED JULY 2006
Dual Non-Inverting Power Driver
•High-Speed, Power MOSFET Compatible•3.0A Peak Current Totem Pole Output •Efficient High Frequency Operation•5 to 35V Operation •Low Cross-Conduction Current Spike•25ns Rise and Fall Times •Enable and Shutdown Functions•25ns Propagation Delays •Wide Input Voltage Range•Thermal Shutdown and Under-Voltage •ESD Protection to 2kVProtection
The UC1708 family of power drivers is made with a high-speed, high-voltage, Schottky process to interfacecontrol functions and high-power switching devices – particularly power MOSFETs. Operating over a 5 to 35 voltsupply range, these devices contain two independent channels. The A and B inputs are compatible with TTL andCMOS logic families, but can withstand input voltages as high as V
IN
. Each output can source or sink up to 3Aas long as power dissipation limits are not exceeded.
Although each output can be activated independently with its own inputs, they can be forced low in commonthrough the action of either a digital high signal at the Shutdown terminal or by forcing the Enable terminal low.The Shutdown terminal will only force the outputs low, it will not effect the behavior of the rest of the device. TheEnable terminal effectively places the device in under-voltage lockout, reducing power consumption by as muchas 90%. During under-voltage and disable (Enable terminal forced low) conditions, the outputs are held in aself-biasing, low-voltage, state.
The UC3708 and UC2708 are available in plastic 8-pin MINI DIP and 16-pin bat-wing DIP packages forcommercial operation over a 0 °C to 70 °C temperature range and industrial temperature range of –25 °C to 85 °Crespectively. For operation over a –55 °C to 125 °C temperature range, the UC1708 is available in hermeticallysealed 8-pin MINI CDIP, 16 pin CDIP and 20 pin CLCC packages. Surface mount devices are also available.
BLOCK DIAGRAM
NOTE: Shutdown feature is not available in J or N packages only.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1997–2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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CONNECTION DIAGRAMS
Note: InJEpackagePin4islogicground. Pins5,12,
Enable
Input A
Gnd
InputB
NC
Output A
VIN
OutputB
DIL-8(TopView)
JOrNPackage SOIC-16(TopView)
DWPackage
NC
Input A
Enable
LogicGnd
NC
Shutdown
InputB
NC
PwrGnd A
Output A
NC
NC
VIN
OutputB
VIN
PwrGndB
DIL-16(TopView)
JEOrNEPackage
NC
Input A
Enable
LogicGnd
LogicGnd
Shutdown
InputB
NC
PwrGnd A
Output A
VIN
LogicGnd
LogicGnd
VIN
OutputB
PwrGndB
CLCC-20(TopView)
L Package
PWRGND A
NC
NC
INPUT A
OUTPUT A
ENABLE
LOGICGND
NC
NC
SHUTDOWN
4
5
6
7
8
9 10 11 12 13
INPUT B
NC
NC
PWRGNDB
OUTPUT B
14
15
16
17
18
1920123
VIN
NC
NC
NC
VIN
UC1708
UC2708
UC3708
SLUS171B – MARCH 1997 – REVISED JULY 2006
2
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ABSOLUTE MAXIMUM RATINGS
(1)
ELECTRICAL CHARACTERISTICS
UC1708
UC2708
UC3708
SLUS171B – MARCH 1997 – REVISED JULY 2006
VALUE UNIT
Supply Voltage, V
IN
35 VSteady-State 0.5 AOutput Current (Each Output, Source or Sink)
Peak Transient 3 AOuput Voltage –0.3 to (V
IN
+ 0.3) VEnable and Shutdown Inputs –0.3 to 6.2 VA and B Inputs –0.3 to (V
IN
+ 0.3) VOperating Junction Temperature
(2)
150 °CStorage Temperature Range –65 to 150 °CLead Temperature (Soldering, 10 Seconds) 300 °C
(1) All voltages are with respect to Logic Gnd pin. All currents are positive into, negative out of, device terminals.r(2) Consult Unitrode Integrated Circuits databook for information regarding thermal specifications and limitations of packages.
Unless otherwise stated, V
IN
=10V to 35V, and these specifications apply for: –55 °C<T
A
<125 °C for the UC1708,–25 °C<T
A
<85 °C for the UC2708, and 0 °C<T
A
<70 °C for the UC3708, T
A
= T
J
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Outputs low 18 26V
IN
Supply current Outputs high 14 18 mAEnable = 0 V 1 4A, B and shutdown inputs low level 0.8 VA, B and shutdown inputs high level 2.0 VA, B Input current low V
A,B
= 0.4V –1 –0.6 mAA, B Input current high V
A,B
= 2.4V –200 50 µAA, B Input leakage current high V
A,B
= 35.3V 200 µAShutdown input current low V
SHUTDOWN
= 0.4V 20 100 µAV
SHUTDOWN
= 2.4V 170 500 µAShutdown input current high
V
SHUTDOWN
= 6.2V 0.6 1.5 mAEnable input current low V
ENABLE
= 0V –600 –460 200 µAEnable input current high V
ENABLE
= 6.2V 200 µAEnable threshold rising 2.8 3.6 VEnable threshold falling 1.0 2.4 3.4 VV
IN
– I
OUT
= –50mA 2.0 VOutput High SaturationV
OUT
I
OUT
= –500mA 2.5 VI
OUT
= 50mA 0.5 VV
OUT
Output Low Saturation
I
OUT
= 500mA 2.5 VThermal Shutdown 155 °C
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SWITCHING CHARACTERISTICS (see Figure 1 )
SWITCHING CHARACTERISTICS (see Figure 1 )
UC1708
UC2708
UC3708
SLUS171B – MARCH 1997 – REVISED JULY 2006
(VIN = 20V, delays measured to 10% output change.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
FROM A,B INPUT TO OUTPUT:
CL = 0pF 25 40 nsUC1708 25 45CL = 1000pF nsRise Time Delay (TPLH) UC2708/UC3708 25 40UC1708 25 50CL = 2200pF nsUC2708/UC3708 25 45CL = 0pF 55 75 nsUC1708 25 80CL = 1000pF
(1)
ns10% to 90% Rise (TTLH) UC2708/UC3708 25 50UC1708 40 85CL = 2200pF nsUC2708/UC3708 40 55CL = 0pF 25 40Fall Time Delay (TPHL) CL = 1000pF
(1)
25 45 nsCL = 2200pF 35 50CL = 0pF 15 2090% to 10% Fall (TTHL) CL = 1000pF
(1)
25 45 nsCL = 2200pF 40 55
(1) These parameters, specified at 1000pF, although ensured over recommended operating conditions, are not tested in production.
(VIN = 20V, delays measured to 10% output change.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
FROM SHUTDOWN INPUT TO OUTPUT:
CL = 0pF 25 75 nsUC1708 30 80CL = 1000pF
(1)
nsRise Time Delay (TPLH) UC2708/UC3708 30 75UC1708 35 85CL = 2200pF nsUC2708/UC3708 35 75CL = 0pF 50 75 nsUC1708 25 80CL = 1000pF
(1)
ns10% to 90% Rise (TTLH) UC2708/UC3708 25 50UC1708 40 85CL = 2200pF nsUC2708/UC3708 40 55CL = 0pF 25 45Fall Time Delay (TPHL) CL = 1000pF
(1)
30 50 nsCL = 2200pF 35 55CL = 0pF 25 2090% to 10% Fall (TTHL) CL = 1000pF
(1)
25 45 nsCL = 2200pF 40 55F = 200kHz, 50% duty cycle, both channels; CL = 0pF 23 25Total Supply Current mAF = 200kHz, 50% duty cycle, both channels; CL = 2200pF 38 45
(1) These parameters, specified at 1000pF, although ensured over recommended operating conditions, are not tested in production.
4
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ACInput
12V
MPF
6660
50 W
LH0063
50 W
47 W
Input
20V
10 Fm47 Fm
UC1708
PWR
GND
Logic
Gnd
CL
Output
200kHz
tr 0.5V/RS
tf 0.5/RS
DutyCycle-50%
³
³
4.3V
OUTPUT
0V
20V
INPUT
0V
TPHL
TTLH
TPLH
TTHL
50% 50%
90% 90%
10%
10%
5.6V
8kW
A/B
Input Shutdown
500 W10kW
10kW
2.5pF
5.6V
5.6V
To A/B
Output
Enable VIN
450 Am
5.6V
Internal
Bias
Under
Voltage
Lockout
To A/B
Output
UC1708
UC2708
UC3708
SLUS171B – MARCH 1997 – REVISED JULY 2006
Figure 1. AC Test Circuit and Switching Time Waveforms
NOTE: Shutdown feature available only in JE, NE or DW Packages.
Figure 2. Equivalent Input Circuits
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-0051401Q2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-0051401QEA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
5962-0051401QPA ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
5962-0051401V2A ACTIVE LCCC FK 20 1 TBD Call TI N / A for Pkg Type
5962-0051401VEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type
5962-0051401VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1708J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UC1708J883B ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UC1708JE ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
UC1708JE883B ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
UC1708L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC2708D OBSOLETE UTR TBD Call TI Call TI
UC2708DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2708DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2708DWTR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2708DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2708J OBSOLETE UTR TBD Call TI Call TI
UC2708JE OBSOLETE UTR TBD Call TI Call TI
UC2708N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2708NE ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2708NEG4 ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2708NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2708Q OBSOLETE UTR TBD Call TI Call TI
UC3708DW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3708DWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3708DWTR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3708DWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3708J ACTIVE CDIP JG 8 1 TBD A42 SNPB N / A for Pkg Type
UC3708JE ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
UC3708N ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3708NE ACTIVE PDIP N 16 25 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3708NEG4 ACTIVE PDIP N 16 25 Green (RoHS & CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 5-Feb-2007
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
UC3708NG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3708Q OBSOLETE UTR TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 5-Feb-2007
Addendum-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE
8
4
0.015 (0,38)
Gage Plane
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
MAX
0.430 (10,92)
4040082/D 05/98
0.200 (5,08) MAX
0.125 (3,18) MIN
5
0.355 (9,02)
0.020 (0,51) MIN
0.070 (1,78) MAX
0.240 (6,10)
0.260 (6,60)
0.400 (10,60)
1
0.015 (0,38)
0.021 (0,53)
Seating Plane
M
0.010 (0,25)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
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