CX77133-12 - Conexant Systems, Inc.

Data Sheet Preliminary Information 101537P6

Preliminary Information

This document contains information on a new product. The parametric information, although not

fully characterized, is the result of testing initial devices.

CX77133

Power Amplifier Module for CDMA PCS (1850–1910 MHz)

The CX77133 Power Amplifier Module (PAM) is a fully matched, 6-pin surface mount

module developed for Personal Communications Service (PCS) and wireless local

loop applications. This small and efficient Power Amplifier packs a full 1850–1910

MHz bandwidth coverage into a single compact package.

The CX77133 meets the stringent spectral linearity requirements of Code Division

Multiple Access (CDMA) PCS transmission with high power added efficiency for

power output of up to 28 dBm. A single Gallium Arsenide (GaAs) Microwave

Monolithic Integrated Circuit (MMIC) contains all the active circuitry in the module.

The MMIC contains on-board bias circuitry, as well as input and interstage matching

circuits. Output match is realized off-chip within the module package to optimize

efficiency and power performance into a 50 Ω load.

This device is manufactured with Conexant’s GaAs Heterojunction Bipolar Transistor

(HBT) process, which provides for all positive voltage DC supply operation while

maintaining high efficiency and good linearity. Primary bias to the CX77133 is

supplied directly from a three-cell nickel cadmium, a single-cell lithium ion, or other

suitable battery with an output in the 3–4 volt range. Power down is accomplished by

setting the voltage on the low current reference pin to zero volts. No external supply

side switch is needed as typical “off” leakage is a few microamperes with full primary

voltage supplied from the battery.

Functional Block Diagram

MMIC

MODULE

Output

(5)

Input

(2)

VCC1

(1)

(6, 7)

GND

VCC2

(4)

VREF

(3)

Driver

Stage Bias

Power

Stage Bias

Input

Match DA

Inter

Stage

Match

PA Output

Match

(6, 7)

GND

Distinguishing Features

• Low voltage positive bias supply

(3 to 4 Volts)

• Good linearity

• High efficiency

• Large dynamic range

• 6-pin package (6 x 6 x 1.5 mm)

• Power down control

Applications

• Personal communications

services (PCS)

• Wireless local loop (WLL)

Preliminary

Electrical Specifications CX77133

Power Amplifier Module for CDMA PCS (1850–1910 MHz)

2Conexant 101537P6

Preliminary Information March 27, 2002

Electrical Specifications

The following tables list the electrical characteristics of the CX77133 Power Amplifier. Table 1

lists the absolute maximum rating for continuous operation.

Table 2 lists the recommended operating conditions and Table 3 lists the electrical performance of

the CX77133 Power Amplifier for nominal operating conditions.

Table 1. Absolute Maximum Ratings(1)

Parameter Symbol Minimum Nominal Maximum Unit

RF Input Power PIN —4.07.0dBm

Supply Voltage VCC — 3.4 6.0 Volts

Reference Voltage VREF — 3.0 3.3 Volts

Case Operating Temperature TC–30 +25 +110 oC

Storage Temperature TSTG –55 — +125 oC

NOTE(S):

(1) No damage assuming only one parameter is set at limit at a time with all other parameters set at or below

nominal value.

Table 2. Recommended Operating Conditions

Parameter Symbol Min Nominal Max Unit

Supply Voltage VCC 3.2 3.4 4.2 Volts

Reference Voltage VREF 2.95 3.0 3.2 Volts

Operating Frequency FO1850.0 1880.0 1910.0 MHz

Case Operating Temperature TC–30 +25 +85 °C

Preliminary

CX77133 Electrical Specifications

Power Amplifier Module for CDMA PCS (1850–1910 MHz)

101537P6 Conexant 3

March 27, 2002 Preliminary Information

Table 3. Electrical Specification for Nominal Operating Conditions (1)

Characteristics Condition Symbol Minimum Typical Maximum Unit

Quiescent Current Nominal Iq70.0 120.0 130.0 mA

Leakage Current VREF = 0 V

VCC = 3.4 V

Ilk ——7.0µA

Gain PO = 0 dBm

PO = 28 dBm

25.5

27.0

26.5

28.5

28.0

30.0

Power Added Efficiency PO = 28 dBm PAEd 28 32.0 36.0 — %

Adjacent Channel Power PO ≤ 28 dBm (2) ACP — –50.0 –48.5 dBc

Harmonic Suppression

Second

Third

PO ≤ 28 dBm

DFO2

DFO3

—

–38.0

–44.0

–32.0

–37.5

dBc

Noise Power in RX Band

1930-1990 MHz

PO ≤ 28 dBm RXBN — –135.0 –133.0 dBm/Hz

Noise Figure — NF — 4.0 5.5 dB

Input Voltage Standing Wave Ratio — VSWR — 1.2 1.4 —

Stability (spurious output) 5:1 VSWR

All Phases

S — — –60.0 dBc

Ruggedness – No damage PO ≤ 28 dBm Ru 10:1 — — VSWR

NOTE(S):

(1) VCC = +3.4 V, VREF = +3.0 V, Freq. = 1880 MHz, TC = 25 oC, unless otherwise specified.

(2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW

Preliminary

Electrical Specifications CX77133

Power Amplifier Module for CDMA PCS (1850–1910 MHz)

4Conexant 101537P6

Preliminary Information March 27, 2002

Table 4. Electrical Specification Limits for Recommended Operating Conditions (1)

Characteristics Condition Symbol Minimum Maximum Unit

Quiescent Current Nominal Iq—180.0mA

Gain PO = 0 dBm

PO = 28 dBm

24.0

23.0

29.5

32.5

Power Added Efficiency VCC = 3.4 V

PO = 28 dBm

PAEd 28 31.5 — %

Adjacent Channel Power(2) PO ≤ 28 dBm ACP — –44.0 dBc

Harmonic Suppression

Second

Third

PO ≤ 28 dBm

DFO2

DFO3

—–30.0

–35.0

dBc

Noise Power in RX Band

1930-1990 MHz

PO ≤ 28 dBm RXBN — –131.0 dBm/Hz

Noise Figure — NF — 8.0 dB

Input Voltage Standing Wave Ratio — VSWR — 2.0 —

Stability (spurious output) 5:1 VSWR

All Phases

S — –60.0 dBc

Ruggedness–No damage PO ≤ 28 dBm Ru 10:1 — VSWR

NOTE(S):

(1) Per Table 2, unless otherwise specified.

(2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.

Worst case ACPR is –43dBc at +85 °C, Vcc = 3.2 V.

Preliminary

CX77133 Evaluation Board Description

Power Amplifier Module for CDMA PCS (1850–1910 MHz)

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March 27, 2002 Preliminary Information

Evaluation Board Description

The evaluation board is a platform for testing and interfacing design circuitry. To accommodate the

interface testing of the CX77133, the evaluation board schematic and diagrams are included for

preliminary analysis and design. Figure 1 shows the basic schematic of the board for the

1850 MHz to 1910 MHz range. Figure 2 illustrates the board layout.

Figure 1. Evaluation Board Schematic

Figure 2. Evaluation Board Assembly Diagram

101537_003

VCC1

RFIN

VREF

GND

RFOUT RFOUT

VCC2

VCC

330 pF

1000 pF

220 pF

4.7 µF

101537_002

Vref

GND

Vcc

RF OUTRF IN

CONEXANT

6x6_ENG_EVAL_BD

Preliminary

Package Dimensions and Pin Descriptions CX77133

Power Amplifier Module for CDMA PCS (1850–1910 MHz)

6Conexant 101537P6

Preliminary Information March 27, 2002

Package Dimensions and Pin Descriptions

The CX77133 is a multi-layer laminate base, overmold encapsulated modular package designed for

surface-mounted solder attachment to a printed circuit board.

Figure 3 is a mechanical drawing of the pad layout for this package and Figure 4 illustrates typical

case markings. The pin numbering convention starts with pin 1 in the upper left, as indicated in

Figure 3, and increments counter-clockwise around the package. Table 5 describes each pin

function.

Figure 3. CX77133 Package Dimensions

Table 5. Pin Description

Pin #123456GND PAD

Function VCC1(1) RF Input VREF VCC2(1) RF Output GND GND(2)

NOTE(S):

(1) All supply pins may be connected together at the supply.

(2) Package underside is GND.

101537_007

TOP VIEWS

FRONT VIEW

Notes: Solder mask pattern pad layout as viewed

from top looking through package.

All dimensions are in millimeters.

1.258

2.88

5.50

0.759 ±0.05 (6x)

0.50

0.09 ±0.05 (6x)

0.14

2.62

2.50

6.04

±0.05

6.04 ±0.05

0.14 (6x)

1.50 ±0.10

0.48 ±0.07

Ground Pad

PIN 1 INDICATOR

Preliminary

CX77133 Package Handling Information

Power Amplifier Module for CDMA PCS (1850–1910 MHz)

101537P6 Conexant 7

March 27, 2002 Preliminary Information

Package Handling Information

Because this device package is sensitive to moisture absorption, it is baked and vacuum packed

prior to shipment. Instructions on the shipping container label regarding exposure to moisture after

the container seal is broken must be followed. Otherwise, problems related to moisture absorption

may occur when the part is subjected to high temperature during solder assembly. If the part is

attached in a reflow oven, the temperature ramp rate should not exceed 5 °C per second. Maximum

temperature should not exceed 225 °C and the time spent at a temperature exceeding 210 °C should

be limited to less than 10 seconds. If the part is manually attached, precaution should be taken to

insure that the part is not subjected to a temperature exceeding 300 °C for more than 10 seconds.

Care must be taken when attaching this product, whether it is done manually or in a production

solder reflow environment. For additional details on both attachment techniques, precautions, and

handling procedures recommended by Conexant, please refer to Application Note: Solder Reflow,

Document Number 101536.

Production quantities of this product are shipped in the standard tape-and-reel format. For

packaging details, refer to Application Note: Tape and Reel, Document Number 101568.

Figure 4. Typical Case Markings

101537_006

CONEXANT

CX77133-NN

NXXXXX.XX

YYWW MEX

Manufacturing Part Number-Revision Number

Mark Pin 1

Identifier Lot Number

YY = Manufacture Year

WW = Week Package

Sealed

MEX = Country Code

Preliminary

Package Handling Information CX77133

Power Amplifier Module for CDMA PCS (1850–1910 MHz)

8Conexant 101537P6

Preliminary Information March 27, 2002

Preliminary

Information in this document is provided in connection with Conexant Systems, Inc. (“Conexant”) products. These materials are

provided by Conexant as a service to its customers and may be used for informational purposes only. Conexant assumes no

responsibility for errors or omissions in these materials. Conexant may make changes to specifications and product descriptions at

any time, without notice. Conexant makes no commitment to update the information and shall have no responsibility whatsoever for

conflicts or incompatibilities arising from future changes to its specifications and product descriptions.

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Ordering Information

Revision History

References

Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752

Application Note: Tape and Reel, Document Number 101568

Model Number Manufacturing

Part Number Product Revision Package Operating Temperature

CX77133 CX77133–12 12 6x6LM-6 –30 °C to +85 °C

Revision Level Date Description

P1 March 2001 Preliminary Information

P2 July 2001 Revise: Table 1, Figures 1, 2, 4.

Add: Table 4

Remove: Table 5, Figure 5

P3 August 2001 Revise: Table 3

P4 October 2001 Revise: Figure 3

P5 March 8, 2002 Revise: Tables 3, 4, and 5; Figure 3.

P6 March 27, 2002 Revise: Table 4 footnotes; Figure 3.

Preliminary

Offi

ces

www.conexant.com

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Headquarters - Newport Beach

4311 Jamboree Rd. P.O. Box C

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Headquarters - Newport Beach

Preliminary