Integrated Silicon Solution, Inc. — www.issi.com 1
Rev. D
06/19/2013
Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be ex-
pected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon
Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
IS62WV25616DALL/DBLL, IS65WV25616DBLL
256K x 16 LOW VOLTAGE,
ULTRA LOW POWER CMOS STATIC SRAM
FEATURES
• High-speed access time: 35, 45, 55 ns
• CMOSlowpoweroperation
30 mW (typical) operating
6µW(typical)CMOSstandby
• TTLcompatibleinterfacelevels
• Singlepowersupply
1.65V--2.2V Vdd (IS62WV25616DALL)
2.5V--3.6V Vdd (IS62/65WV25616DBLL)
• Fullystaticoperation:noclockorrefresh
required
• Threestateoutputs
• Datacontrolforupperandlowerbytes
• IndustrialandAutomotivetemperaturesupport
• Lead-freeavailable
• 2CSoptionavailable
DESCRIPTION
TheISSIIS62WV25616DALLandIS62/65WV25616DBLL
arehigh-speed,lowpower,4MbitSRAMsorganizedas
256K words by 16 bits. It is fabricated using ISSI's high-
performanceCMOStechnology.Thishighlyreliableprocess
coupled with innovative circuit design techniques, yields
high-performance and low power consumption devices.
When CS1 is HIGH (deselected) or when CS2 is LOW
(deselcted) or when CS1isLOW,CS2isHIGHandboth
LB and UB are HIGH, the device assumes a standby mode
at which the power dissipation can be reduced down with
CMOSinputlevels.
Easy memory expansion is provided by using Chip Enable
andOutputEnableinputs.TheactiveLOWWriteEnable(WE)
controls both writing and reading of the memory. A data byte
allows Upper Byte (UB)andLowerByte(LB) access.
TheIS62WV25616DALLandIS62/65WV25616DBLLare
packaged in the JEDEC standard 44-PinTSOP(TYPEII)
and 48-pin mini BGA (6mmx8mm).
FUNCTIONAL BLOCK DIAGRAM
JUNE 2013
A0-A17
CS1
CS2
OE
WE
256K x 16
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
GND
V
DD
I/O
DATA
CIRCUIT
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
UB
LB