IFX20002MB V33 - INFINEON TECHNOLOGIES AG

Standard Power

Data Sheet

Rev. 1.0, 2013-01-12

IFX20002

Low Dropout Voltage Regulator

IFX20002MBV33

IFX20002MBV50

Type Package Marking

IFX20002MBV33 PG-SCT595-5 E3

IFX20002MBV50 PG-SCT595-5 E5

PG-SCT595-5

Data Sheet 2 Rev. 1.0, 2013-01-12

Low Dropout Voltage Regulator

IFX20002

1Overview

Features

• Two versions: 3.3 V, 5.0 V

• Low drop voltage ≤300 mV over the full temperature range

• Output current: 30 mA

• Inhibit input

• Low quiescent current

• Stable with ceramic output capacitor

• Input voltage up to 45 V

• Wide temperature range: Tj = -40 °C to +125 °C

• Output protected against short circuit

• Over temperature protection

• Reverse polarity protection

• Very small and thermally enhanced SMD-Package PG-SCT595-5

• Green Product (RoHS compliant)

Applications

• Manufacturing Automation

• Appliances

• Network Routers

The IFX20002 is not qualified and manufactured according to the requirements of Infineon Technologies with

regards to automotive and/or transportation applications. For automotive applications please refer to the Infineon

TLx (TLE, TLS, TLF.....) voltage regulator products.

Description

The IFX20002 is a monolithic integrated low drop voltage regulator in a very small SMD package PG-SCT595-5.

It is designed to supply e.g. micro controller, sensors, etc or may serve as standby supply under severe conditions.

Therefore the device is equipped with additional protection functions against overload, short circuit and reverse

polarity. At over temperature the regulator is automatically turned off by the integrated thermal protection circuit.

Input voltages up to 40 V are regulated to VQ,nom = 3.3 V (V33 version) or 5.0 V (V50 version). The output is able

to drive a load of 30 mA while it regulates the output voltage within a 4% accuracy. To save energy the device can

be switched in stand-by mode via an inhibit input which causes the current consumption to drop below 5 μA.

IFX20002

Block Diagram

Data Sheet 3 Rev. 1.0, 2013-01-12

2 Block Diagram

Figure 1 Block Diagram

Data Sheet 4 Rev. 1.0, 2013-01-12

IFX20002

Pin Configuration

3 Pin Configuration

3.1 Pin Assignment

Figure 2 Pin Configuration (top view)

3.2 Pin Definitions and Functions

Pin Symbol Function

1INH Inhibit Input: high level to turn on the IC

2GND Ground: connected to pin 5

3I Input Voltage

4Q Output voltage: must be blocked with a ceramic capacitor CQ ≥ 3.3 µF, ESR ≤ 2 Ω

5GND Ground: Connected to pin 2

AEP02253

INH

GND

IFX20002

General Product Characteristics

Data Sheet 5 Rev. 1.0, 2013-01-12

4 General Product Characteristics

4.1 Absolute Maximum Ratings

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are

not designed for continuous repetitive operation.

Absolute Maximum Ratings 1)

Tj = -40 °C to +125 °C; all voltages with respect to ground, positive current flowing into pin

(unless otherwise specified)

1) Not subject to production test, specified by design.

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Max.

Input

4.1.1 Voltage VI-42 45 V –

Output

4.1.2 Voltage VQ-0.3 30 V –

Inhibit

4.1.3 Voltage VINH -42 45 V –

4.1.4 Current IINH -500 2)

2) Internally limited.

µA –

4.1.5 Current IINH -5 5 mA -0.3 V ≤ VI ≤ 45 V ;

tp < 1 ms

Temperatures

4.1.6 Junction Temperature Tj-40 150 °C–

4.1.7 Storage Temperature Tstg -50 150 °C–

ESD Susceptibility

4.1.8 ESD Resistivity to GND VESD -2 2 kV HBM3)

3) ESD susceptibility, HBM according to ANSI/ESDA/JEDEC JS-001 (1.5 kΩ, 100 pF).

Data Sheet 6 Rev. 1.0, 2013-01-12

IFX20002

General Product Characteristics

4.2 Functional Range

Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the Electrical Characteristics table.

4.3 Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go

to www.jedec.org.

Functional Range

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Max.

4.2.1 Input Voltage VI4.0 45 V IFX20002MBV33

4.2.2 5.5 45 V IFX20002MBV50

4.2.3 Inhibit Voltage VINH -0.3 40 V –

4.2.4 Junction Temperature Tj-40 125 °C–

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Typ. Max.

4.3.5 Junction to Ambient RthJA – 81 – K/W 2s2p board1)

1) Specified RthJA value is according to JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The product

(chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the package contacted the first inner copper layer.

4.3.1 – 217 – K/W Footprint only2)

2) Package mounted on PCB FR4; 80 x 80 x 1.5 mm; 35 µm Cu, 5 µm Sn; horizontal position; zero airflow.

Not subject to production test; specified by design.

4.3.2 – 117 – K/W 300 mm2 PCB

heatsink area2)

4.3.3 – 103 – K/W 600 mm2 PCB

heatsink area2)

4.3.4 Junction to Soldering Point RthJSP – 30 – K/W Pins 2, 5 fixed to TA

IFX20002

Electrical Characteristics

Data Sheet 7 Rev. 1.0, 2013-01-12

5 Electrical Characteristics

5.1 Electrical Characteristics Voltage Regulator

Electrical Characteristics

VI = 13.5 V; VINH > 2.5 V; Tj = -40 °C to +125 °C; all voltages with respect to ground (unless otherwise

specified)

Pos. Parameter Symbol Limit Values Unit Measuring Condition

Min. Typ. Max.

5.1.1 Output Voltage

IFX20002MBV33

VQ3.17 3.3 3.43 V 1 mA ≤ IQ ≤30 mA

5.1.2 3.17 3.3 3.43 V IQ = 10 mA ;

4.3 V ≤ VI ≤40 V

5.1.1 Output Voltage

IFX20002MBV50

VQ4.80 5.00 5.20 V 1 mA ≤ IQ ≤30 mA

5.1.2 4.80 5.00 5.20 V IQ = 10 mA ;

6V ≤ VI ≤40 V

5.1.3 Output Current Limitation IQ30 – – mA 1)

1) Measured when the output voltage VQ has dropped 100 mV from the nominal value.

5.1.4 Dropout Voltage 1) Vdr – 250 300 mV IQ=20mA

5.1.5 Output capacitor CQ3.3 – – μF ESR ≤2Ω at 10 kHz

5.1.6 Current Consumption

Iq=II–IQ

Iq–2 5.2mAIQ<30mA

5.1.7 – 130 170 μAIQ< 0.1 mA ; Tj < 85 °C

5.1.8 Quiescent Current (stand-by)

Iq=II–IQ

Iq–– 1 μAVINH =0.4V ; Tj < 85 °C

5.1.9 – – 5 μAVINH =0.4V

5.1.10 Load Regulation ∆VQ–1750mV1mA < IQ<25mA ;

Tj=25°C ;

IFX20002MBV50

5.1.11 – 14 40 mV 1 mA < IQ<25mA ;

Tj=25°C ;

IFX20002MBV33

5.1.12 Line Regulation ∆VQ–1025mVVI=(VQ,nom + 0.5 V)

to 36 V ;

IQ= 1 mA ; Tj=25°C

5.1.13 Power Supply Ripple

Rejection

PSRR – 60 – dB fr=100kHz ; Vr = 0.5 Vpp

Logic Inhibit Input

5.1.14 Inhibit, Turn-on voltage VINH,high –– 2.2VVQ>0.95*VQ,nom

5.1.15 Inhibit, Turn-off voltage VINH,low 0.4 – – V VQ<0.1V

5.1.16 H-input current IINH,high –8 12μAVINH =5V

5.1.17 L-input current IINH,low -2 – 2 μAVINH =0V

Data Sheet 8 Rev. 1.0, 2013-01-12

IFX20002

Electrical Characteristics

5.2 Typical Performance Characteristics Voltage Regulator

Output Voltage VQ vs.

Input Voltage VI

Current Consumption Iq vs.

Input Voltage VI

AED03349.VSD

246810

INH

= 5 V

= 1 k

V33

V50

AED03347.VSD

10 20 30 40 50

200

400

600

800

1000

µA

VINH = 5 V

RL = 1 kΩ

RL = 5 kΩ

IFX20002

Application Information

Data Sheet 9 Rev. 1.0, 2013-01-12

6 Application Information

Note: The following information is given as a hint for the implementation of the device only and shall not be

regarded as a description or warranty of a certain functionality, condition or quality of the device.

Figure 3 Application Diagram

The output voltage of the IFX20002 is divided and compared to an internal reference of 2.5 V typical. A regulation

loop controls the output to achieve a stabilized output voltage.

Figure 3 shows a typical application circuit. In order to maintain the stability of the control loop the IFX20002

output requires an output capacitor CQ of at least 3.3 μF with a maximum permissible ESR of 2 Ω. It is

recommended to use a multi layer ceramic capacitor for CQ, e.g. the TDK C3216X7R1C475M with a nominal

capacitance of 4.7 μF. Aluminum electrolytic as well as tantalum capacitors do not cover the required ESR range

over the full operating temperature range of Tj = -40 °C to +125 °C.

At the input of the regulator an input capacitor is necessary for compensating line influences (100 nF ceramic

capacitor recommended). A resistor of approx. 1 Ω in series with CI can dampen oscillations that could occur due

to the input inductivity and the input capacitor. If the regulator is sourced via long input lines of several meters it is

recommended to place an additional electrolytic capacitor ≥ 47 μF at the input.

GND

INH

IFX20002

4.7µF100nF

Inhibit

Data Sheet 10 Rev. 1.0, 2013-01-12

IFX20002

Package Outlines

7 Package Outlines

Figure 4 PG-SCT595-5 (Plastic Small Outline)

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products and to be compliant with

government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e

Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).

GPW05997

1.1 MAX.

0.1 MAX.

(2.2)

(0.3)

(1.45)

(0.4)1)

(0.23)

(0.13)

1) Contour of slot depends on profile

of gull-wing lead form

1.2 -0.05

+0.1

±0.2

2.9 B

0.3 -0.05

+0.1

0.6 -0.05

0.95

1.9

0.25

±0.1

10˚ MAX.

1.6

10˚ MAX.

±0.1

0.25

±0.1

2.5

0.15 -0.06

+0.1

0.2 MA

For further information on alternative packages, please visit our website:

http://www.infineon.com/packages.Dimensions in mm

IFX20002

Revision History

Data Sheet 11 Rev. 1.0, 2013-01-12

8 Revision History

Revision Date Changes

Rev. 1.0 2013-01-12 Data Sheet – Initial Release

Edition 2013-01-12

Published by

Infineon Technologies AG

81726 Munich, Germany

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any

information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties

and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights

of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the types in

question, please contact the nearest Infineon Technologies Office.

The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems

and/or automotive, aviation and aerospace applications or systems only with the express written approval of

Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-

support automotive, aviation and aerospace device or system or to affect the safety or effectiveness of that device

or system. Life support devices or systems are intended to be implanted in the human body or to support and/or

maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user

or other persons may be endangered.