Product Standards
Schottky Barrier Diode
DB2X41400L
Absolute Maximum Ratings Ta = 25 C
Note: *1 For embedded alumina substrate
*2 50 Hz sine wave 1 cycle (Non-repetitive peak current)
Page
°C-55 to +125Storage temperature Tstg
-40 toTopr
Internal Connection
A
UnitParameter Symbol Rating
Repetitive peak reverse voltage VRRM 40 V
1of4
Unit: mm
2. Anode
Forward current (Average) IF(AV) = 2 A rectification is possible
Low forward voltage VF
Halogen-free / RoHS compliant
(EU RoHS / UL-94 V-0 / MSL:Level 1 compliant)
Marking Symbol:
DB2X41400L
Silicon epitaxial planar type
For high frequency rectification
Features
Code
1. Cathode
SOD-123
Panasonic Mini2-F4-B
JEITA SC-109D
4P
Packaging
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
VR 40
Non-repetitive peak forward surge current *2 IFSM
+85 °COperating ambient temperature
V
Forward current (Average) *1 IF(AV) 2 A
15
Reverse voltage
Junction temperature Tj 125 °C
1
2
3.5
1.6
0.8
2.6
0.55
0.13
1
2
Doc No.
TT4-EA-12043
Revision.
3
Established
:
2009-12-21
Revised
:
2013-04-26
Product Standards
Schottky Barrier Diode
DB2X41400L
Electrical Characteristics Ta = 25 C 3 C
Note
)
1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 Measuring methods for Diodes.
2. This product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on
the charge of a human body and the leakage of current from the operating equipment.
3. *1 trr test circuit
Page
IF = IR = 100 mA, Irr = 10 mA
pF
Reverse recovery time *1 trr 30 ns
RL = 100 Ω
Terminal capacitance Ct
μA200Reverse current IR VR = 40 V
VR = 10 V, f = 1 MHz
Parameter Symbol Conditions
0.42Forward voltage VF IF = 2A
Min UnitMax
2
70
of 4
Typ
0.49 V
Bias Application Unit (N-50BU)
90%
Pulse Generator
(PG-10N)
R
s
= 50 Ω
Wave Form Analyzer
(SAS-8130)
R
i
= 50 Ω
t
p
= 2 μs
t
r
= 0.35 ns
δ = 0.05
I
F
= 100 mA
I
R
= 100 mA
R
L
= 100 Ω
10%
I
rr
= 10 mA
t
r
t
p
t
rr
V
R
I
F
t
t
A
Input Pulse Output Pulse
Doc No.
TT4-EA-12043
Revision.
3
Established
:
2009-12-21
Revised
:
2013-04-26
Product Standards
Schottky Barrier Diode
DB2X41400L
Technical Data ( reference )
Page 3 of 4
IF - VF
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
0.0 0.1 0.2 0.3 0.4 0.5 0.6
Forward voltage VF (V)
Forward current IF (A)
Ta = 125 °C
85 °C
-40 °C
25 °C
IR - VR
1.E-08
1.E-07
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
1.E-01
0 10203040
Reverse voltage VR (V)
Reverse current IR (A)
Ta = 125 °C 85 °C
25 °C
-40 °C
Ct - VR
0
50
100
150
200
250
300
350
400
0 5 10 15 20 25 30 35 40
Reverse voltage VR (V)
Terminal capacitance Ct (pF)
Ta = 25 °C
f = 1 MHz
Rth - t
1
10
100
1000
0.001 0.01 0.1 1 10 100 1000
Time t (s)
Thermal resistance Rth (°C/W)
(1)
Rth(j-l) = 30 °C/W
(1) Non-heat sink
(2) Mounted on glass epoxy print board.
(3) Mounted on alumina print board.
Board size : 50 mm × 50 mm x 0.8 mm
Solder in : 2 mm x 2 mm
(2)
(3)
IF(AV) - Tl
0
0.5
1
1.5
2
2.5
0 25 50 75 100 125 150 175
Lead temperature Tl (°C)
Forward current (Average) IF(AV) (A)
DC
1/4
tp/T
1/2
Sine Wave
VR = 20 V
Tj = 125 °C
tp
T
IF
PF(AV) - IF(AV)
0
0.5
1
1.5
0 0.5 1 1.5 2 2.5
Forward current (Average) IF(AV) (A)
Forward power dissipation (Average) PF(AV) (W)
DC
1/4
1/2
Sine Wave
tp
T
IF
Doc No.
TT4-EA-12043
Revision.
3
Established
:
2009-12-21
Revised
:
2013-04-26
Product Standards
Schottky Barrier Diode
DB2X41400L
Unit: mm
Page
Mini2-F4-B
4
4of
Land Pattern (Reference) (Unit: mm)
3.5
±0.1
1.6
±0.1
2.6
±0.1
0.55
±0.10
0.13
+0.05
-0.02
0.45
±0.10
0 to 0.1
0.80
±0.05
0 to 0.3
(7°)
(7°)
1
2
0.80.8
1.1
3.1
Doc No.
TT4-EA-12043
Revision.
3
Established
:
2009-12-21
Revised
:
2013-04-26
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
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maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
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