Connectivity and Integration
Delphi Mini USB Connectors
www.delphi.com/connect
Connection Systems
19200 Asheville Highway
P. O. Box 519, Landrum, SC 29356 U.S.A.
Tel: [1] 864.457.3824
Fax: [1] 864.457.2535
Description –
Board mount I/O connectors for the industry
standard USB (Universal Serial Bus) interface used to connect
high speed peripheral devices to computers. Mini USBs are
ideal for applications that require small, lightweight connectors.
Ty pical Applications –
Desktop and notebook computers Digital cameras
PDAs, cell phones External disk drives
Portable music recorders/players
Benefits/Features:
Industry Standard . .Meets the speed requirements of USB 2.0.
. . . . . . . . . . . . . .Meets preliminary requirements of USB
. . . . . . . . . . . . . .OTG (On-The-Go).
Flexible System . . .SMT and through hole mounting styles are
. . . . . . . . . . . . . .available.
. . . . . . . . . . . . . .Allows for hot plugging of multiple devices.
Ruggedness
and Reliability . . . .Full metal shields help protect contacts from
. . . . . . . . . . . . . .physical and ESD (Electro Static Discharge)
. . . . . . . . . . . . . .damage.
. . . . . . . . . . . . . .High cycle life versions are available.
Product Type Mini B USB receptacles
To t al No. of Positions 5
Centerline Spacing 0.8 mm [.0315 in.]
Orientation Horizontal
Mounting Style DIP or SMT
Operating Voltage 30 VAC RMS
PCB Thickness SMT: N/A, TH: 0.8 mm [.0315 in.]
Contact Style Formed
Contact Area Plating Gold plated (see product print for thickness)
Height Above Board 4 mm [.16 in.]
Shell (Shield) Material Brass
Housing Color Black
Packaging Type SMT: tape and reel, Through hole: tray
Housing Material Nylon GF
Applicable Soldering Process IR, vapor phase, wave
Contact Base Material Phosphor bronze
Insulation Resistance 100 MΩinitial
Withstanding Voltage 100 VAC RMS
Current Rating 1 amp max. per contact
Contact Resistance 30 mΩ
Temperature Range -25°C to +70°C
Normal Force 30 g min. (controlled by cable connector)
Durability (Mating Cycles) 5000 cycles
Mating Force 35 N [7.9 lbf] max.
Unmating Force 7 N [1.6 lbf] min. initial
Plating (Contact Area) Gold (thickness varies per Delphi spec.)
over nickel underplating
Plating (Soldering End) 2.03 µm [80 µin.] min. tin-lead over nickel
underplating
Plating (Shield) 2.03 µm [80 µin.] min. tin-lead over nickel
underplating
Underplating 1.27 µm [50 µin.] nickel
Standards Universal Serial Bus Revision 2.0 Specification
USB 2.0 Specification ECN #1: Mini B
Connector
Approvals and Certification UL approved
Selectable Features
Other Properties
Printed on Recycled Paper © 2004 Delphi. All rights reserved. DP-04-E-066 802/GBS • U803/3W • U1104/3W
Delphi Mini USB Connectors
Ordering Nomenclature 1543 0262 – 1 0 0
Selective Plating:
Gold plated on contact area and 2.54 µm [100
µin.] min. tin-lead plated on soldering end over
1.27 µm [50 µin.] min. nickel underplating
1= Gold Flash
2= 0.381 µm [15 µin.]
3= 0.762 µm [30 µin.]
Surface Mount . . 1543 0262
Through Hole . . . 1543 0384
Dimensions are in millimeters and [inches].
SMT
Through
Hole
