MRS1504T3G - ON SEMICONDUCTOR - Datasheet.Directory

July, 2012 − Rev. 6

1Publication Order Number:

MRS1504T3/D

MRS1504T3G,

NRVS1504T3G

Surface Mount Standard

Recovery Power Rectifier

SMB Power Surface Mount Package

Features mesa epitaxial construction with glass passivation. Ideally

suited for high frequency switching power supplies; free wheeling

diodes and polarity protection diodes.

Features

•Compact Package with J−Bend Leads Ideal for Automated Handling

•Stable, High Temperature, Glass Passivated Junction

•AEC−Q101 Qualified and PPAP Capable

•NRVS Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements

•All Packages are Pb-Free*

Mechanical Characteristics:

•Case: Molded Epoxy

•Epoxy Meets UL 94 V−0 @ 0.125 in

•Weight: 95 mg (Approximately)

•Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

•Maximum Temperature of 260°C / 10 Seconds for Soldering

•Polarity: Notch and/or Band in Plastic Body Indicates Cathode Lead

•ESD Ratings:

♦Machine Model = C

♦Human Body Model = 3A

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Device Package Shipping†

ORDERING INFORMATION

STANDARD RECOVERY

RECTIFIER

1.5 AMPERES, 400 VOLTS

SMB

CASE 403A

PLASTIC

MARKING DIAGRAM

http://onsemi.com

A = Assembly Location

Y = Year

WW = Work Week

RGG = Device Code

G= Pb−Free Package

(Note: Microdot may be in either location)

AYWW

RGG G

MRS1504T3G SMB

(Pb−Free)

2,500 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

NRVS1504T3G SMB

(Pb−Free)

2,500 /

Tape & Reel

MRS1504T3G, NRVS1504T3G

http://onsemi.com

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

400 V

Average Rectified Forward Current

(At Rated VR, TI = 118°C)

IO1.5

Peak Repetitive Forward Current

(Rated VR, Square Wave, 20 kHz, TI = 118°C)

IFRM 3.0

Non−Repetitive Peak Surge Current

(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)

IFSM 50

Storage/Operating Case Temperature Range Tstg, TC−55 to 150 °C

Operating Temperature Range TJ−55 to 150 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Thermal Resistance, Junction−to−Lead (Note 1) Rtjl 18 °C/W

Thermal Resistance, Junction−to−Ambient (on 1″ sq. Cu. PCB pattern) Rtja 79 °C/W

1. Minimum pad size.

ELECTRICAL CHARACTERISTICS

Rating Symbol TJ = 25_C TJ = 100_CUnit

Maximum Instantaneous Forward Voltage (Note 2), see Figure 2

(IF = 1.5 A)

(IF = 2.25 A)

VF1.04

1.10

0.96

1.02

Maximum Instantaneous Reverse Current, see Figure 4

(VR = 400 V)

(VR = 200 V)

IR1.0

0.5

340

180

2. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%

MRS1504T3G, NRVS1504T3G

http://onsemi.com

Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage

Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current

0.6

, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

100

1.0

, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

0.6

1.0

0.1

4000

VR, REVERSE VOLTAGE (VOLTS)

100E-6

10E-6

1.0E-6

100E-9

10E-9

1.0E-9

VR, REVERSE VOLTAGE (VOLTS)

IF, INSTANTANEOUS FORWARD CURRENT (AMPS)I

0.1

1.20.8 1.0 1.6 0.8 1.0 1.2 1.6

100

100 200 300

IF, INSTANTANEOUS FORWARD CURRENT (AMPS)

, REVERSE CURRENT (AMPS)

4000

10E-9

1.0E-3

100E-6

10E-6

1.0E-6

100E-9

100 200 300

, MAXIMUM REVERSE CURRENT (AMPS)

TJ = 150°C

TJ = 100°C

TJ = -40°C

TJ = 25°CTJ = 150°C

TJ = 100°C

TJ = 25°C

TJ = 150°C

TJ = 100°C

TJ = 25°C

100

1.4 1.4

10E-3

TJ = 150°C

TJ = 100°C

TJ = 25°C

SQUARE WAVE

Figure 5. Current Derating Figure 6. Forward Power Dissipation

20 600

TL, LEAD TEMPERATURE (°C)

2.5

2.0

1.5

1.0

0.5

IO, AVERAGE FORWARD CURRENT (AMPS)

0.50

2.5

2.0

1.5

0.5

2.040

, AVERAGE FORWARD CURRENT (AMPS)IO

80 120100 1.0 1.5 2.5

1.0

PFO, AVERAGE POWER DISSIPATION (WATTS)

160

Ipk/Io = p

Ipk/Io = 5

Ipk/Io = 10

Ipk/Io = 20

Ipk/Io = 10

Ipk/Io = 5

Ipk/Io = p

SQUARE WAVE

140

FREQ = 20 kHz

MRS1504T3G, NRVS1504T3G

http://onsemi.com

Figure 7. Capacitance

600

VR, REVERSE VOLTAGE (VOLTS)

100

1.0

C, CAPACITANCE (pF)

3010 20 40 50 70 80

TJ = 25°C

Figure 8. Thermal Response, Junction−to−Lead

Figure 9. Thermal Response, Junction−to−Ambient

1000.10.00001

T, TIME (s)

1.0

0.1

0.01

0.0001 0.001 0.01 1.0 10

0.001

, TRANSIENT THERMAL RESISTANCE (NORMALIZE

(T)

T, TIME (s)

1.0

0.1

0.01

0.001

, TRANSIENT THERMAL RESISTANCE (NORMALIZED)

(T)

Rtjl(t) = Rtjl*r(t)

50%

20%

10%

5.0%

2.0%

1.0%

1000.10.00001 1,0000.0001 0.001 0.01 1.0 10

Rtjl(t) = Rtjl*r(t)

50%

20%

10%

5.0%

2.0%

1.0%

MRS1504T3G, NRVS1504T3G

http://onsemi.com

PACKAGE DIMENSIONS

SMB

CASE 403A−03

ISSUE J

2.261

0.089

2.743

0.108

2.159

0.085 ǒmm

inchesǓ

SCALE 8:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.

DIM

MIN NOM MAX MIN

MILLIMETERS

1.95 2.30 2.47 0.077

INCHES

A1 0.05 0.10 0.20 0.002

b1.96 2.03 2.20 0.077

c0.15 0.23 0.31 0.006

D3.30 3.56 3.95 0.130

E4.06 4.32 4.60 0.160

L0.76 1.02 1.60 0.030

0.091 0.097

0.004 0.008

0.080 0.087

0.009 0.012

0.140 0.156

0.170 0.181

0.040 0.063

NOM MAX

5.21 5.44 5.60 0.205 0.214 0.220

0.51 REF 0.020 REF

POLARITY INDICATOR

OPTIONAL AS NEEDED

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copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC

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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MRS1504T3/D

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