Technical Data 4149 Effective November 2015
Supersedes March 2007
Product description
• Octagonal shape utilizes board space
• Shielded drum core
• Inductance range from 1.1 uH to 100 uH
• Current range from 0.44 A to 4.8 A
• 5.7 mm x 5.2 mm footprint surface mount
package in a 3.0 mm height
• Ferrite core material
• Halogen free, lead free, RoHS compliant
Applications
• Desktop computers
• Notebook and laptop regulators
• LED and White LED drivers
• Digital cameras, media devices
• Battery power systems
Environmental Data
• Storage temperature range (component):
-40 °C to +125 °C
• Operating temperature range: -40 °C to +125 °C
(Ambient plus self temperature rise)
• Solder reflow temperature: J-STD-020D
compliant
Pb
HALOGEN
HF
FREE
SD53
Low profile shielded power inductors
2
Technical Data 4149
Effective November 2015
SD53
Low profile shielded power inductors
www.eaton.com/elx
Product Specifications
Part Number5OCL1 (μH) ±20% Part marking
Irms
2
(A)
Isat
3
(A)
DCR (Ω) typical
@ 20 °C
DCR (Ω) maximum @
20 °C K-factor4
SD53-1R1-R 1.10 A 3.25 4.80 0.017 0.020 48
SD53-2R0-R 2.00 B 2.64 3.30 0.023 0.027 35
SD53-3R3-R 3.30 C 2.26 2.60 0.029 0.034 28
SD53-4R7-R 4.70 D 2.01 2.10 0.039 0.045 21
SD53-6R8-R 6.80 E 1.65 1.85 0.059 0.068 20
SD53-100-R 10.0 F 1.41 1.40 0.077 0.090 15
SD53-150-R 15.0 G 1.10 1.10 0.122 0.142 12
SD53-220-R 22.0 H 0.81 0.94 0.179 0.208 10
SD53-330-R 33.0 I 0.75 0.76 0.221 0.257 8
SD53-470-R 47.0 J 0.64 0.64 0.303 0.352 7
SD53-680-R 68.0 K 0.52 0.58 0.452 0.525 6
SD53-101-R 100 L 0.44 0.45 0.689 0.801 5
1. 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc.
2. Irms: DC current for an approximate ∆T of 40 °C without core loss. Derating is necessary for AC currents. PCB layout,
trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature
rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating conditions
verified in the end application
3. lsat: Peak current for approximately 30% rolloff @ 25 °C.
4. K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I, B p-p(mT), K: (K factor from table),
L: (Inductance in uH), ∆I (Peak to peak ripple current in Amps).
5. Part Number Definition: SD53-xxx-R
SD53 = Product code and size; -xxx = Inductance value in uH; R = decimal point;
If no R is present then third character equals the number of zeros.
-R suffix = RoHS compliant.
Dimensions (mm)
Packaging information (mm)
Parts packaged on 13” diameter reel, 2,600 parts per reel.
Part Marking: Line 1: (1st digit= inductance value per Part Marking Designator); (2nd digit= Bi-weekly production date code); (3rd digit= Last
digit of the year produced), (4th digit= Internal manufacturing code). Line 2: 53=product size code)
Do not route traces or vias underneath the inductor
53
3
Technical Data 4149
Effective November 2015
SD53
Low profile shielded power inductors
www.eaton.com/elx
Core loss vs. Bp-p
Temperature rise vs. total loss
Inductance characteristics
1MHz
500kHz
300kHz
200kHz
100kHz
0.000001
0.0000 1
0.0001
0.001
0.01
0.1
1
10
1001011 000
Bp-p (mT)
CoreLoss(W)
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Publication No. 4149
November 2015
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
SD53
Low profile shielded power inductors
Technical Data 4149
Effective November 2015
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm) 235°C 220°C
≥2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C
