MOS FET Relays Technical Information Introduction New models with a wider range of characteristics provide an array of solutions, meeting the needs of today's high performance applications. Our expanded range of MOS FET relays, Type G3VM, sets the benchmark in Solid State Relays (SSRs). Products are manufactured using the latest advances in automated production and include a variety of improved construction technologies within the areas of the input LED, PDA (Photo Diode Array used as a photocoupler) and MOS FET chips used in the load switching circuit. As a result, further reductions in package size and power requirements have been achieved. Combining the advantages of mechanical and solid state technology, the new G3VM range gives you unprecedented capability to design. All models featured include a double MOS FET load circuit, enabling the designer complete versatility since it makes no difference whether an AC or DC load in either direction is connected (Connection A). Thus, the MOS FET relay is a fully functional alternative to an electromechanical relay with minimal additional drive circuitry. The built-in Current Limit Function (CLR models) has many uses. Traditionally used to clamp excessive over current fault conditions in telecom equipment, this feature can also be used to good effect to resist transient and short circuit conditions. MOS FET relays are the ideal data and telecommunication solution for line seizing, line switching, hook switching, Data Access Arrangement (DAA) function, line transformer circuit control and other feature phone functions. Central office applications require high reliability and long life. Here the G3VM is ideal for use in the areas of Subscriber Line Interfaces (SLICs) Multiplexers and Routers. In addition, Local Area Networks (LANs) and Network Termination Units (NTUs) including Set-Top Boxes (STBs) and Remote Metering Systems (RMS) can take advantage of the G3VMs' small size and low ON resistance. Advances in performance and cost reduction enable MOS FET relays to be considered as good alternatives to Reed Relays in application areas such as security motion detectors (standard and antimask PIRs), and Automated Test Equipment (ATE) probe cards. Glossary Term LED forward current Repetitive peak LED forward current LED forward current reduction rate LED reverse voltage Connection temperature Load voltage (AC peak / DC) Continuous load current ON current reduction rate Symbol IF IFP Dielectric strength between input and output Operating temperature Storage temperature LED forward voltage LED reverse current Capacity between (LED) terminals Trigger LED forward current Maximum resistance with output ON Current leakage when the relay is open Output Capacitance Capacity between I/O terminals Insulation resistance Turn-ON time Description Rated current that can flow continuously in the forward direction of the LED Rated current that can flow momentarily in the forward direction of the LED <IF/C Rated change of forward current flowing through the LED relative to ambient temperature above 25C VR TJ VOFF IO <ION/C VI-O Rated reverse voltage that can be applied between the anode and the cathode Rated temperature that can be allowed in the junction of the LED, Photodetector or MOS FET(s) Rated voltage that can be applied between the MOS FET's output terminals in the OFF state Rated current that can flow between the MOS FET's output terminals in the ON state Rated change of load current flowing between MOS FET(s) output terminals relative to ambient temperature above 25C Isolation voltage between input and output terminals for a specified time Ta Tstg VF IR CT Ambient temperature range in which the relay may be operated without impairment Ambient temperature range in which the relay may be stored while not operating Voltage drop between the LED's anode and cathode at a certain forward current Leakage current flowing in the LED's reverse direction (between cathode and anode) Electrostatic capacitance between the anode and the cathode terminals of the LED IFT RON Minimum value of input current necessary to put the output MOS FET(s) in to the ON state Resistance between the MOS FET's output terminals specified with reference to ON state current ILEAK Leakage current flowing between the MOS FET's output terminals in the OFF state Coff CI-O Electrostatic capacitance between the output terminals in the OFF state Electrostatic capacitance between the input and output terminals of the relay RI-O tON Resistance between the input and output terminals at the specified voltage value Time required for the output waveform to change from 0 (100%) to 90 (10%) after input goes from OFF to ON state Time required for the output waveform to change from 0 (100%) to 90 (10%) after input goes from ON to OFF state Rated load voltage that can be applied between the MOS FET's output terminals Turn-OFF time tOFF Recommended Load Voltage (AC peak / DC) VDD MOS FET Relays Technical Information 1 Precautions Typical Relay Driving Circuit Examples !WARNING C-MOS Be sure to turn OFF the power when wiring the Relay, otherwise an electric shock may be received. Load !WARNING Do not touch the charged terminals of the SSR, otherwise an electric shock may be received. !CAUTION Do not apply overvoltage or overcurrent to the I/O circuits of the SSR, otherwise the SSR may malfunction or burn. !CAUTION Be sure to wire and solder the Relay under the proper soldering conditions, otherwise the Relay in operation may generate excessive heat and the Relay may burn. Transistor Load 10 to 100 k !CAUTION Electrostatic sensitive devices. Keep in original packaging until required to use. Avoid touching device terminals. Take static handling precautions during processing. Appearance Examples Use the following formula to obtain the LED current limiting resistance value to assure that the relay operates accurately. DIP (Dual Inline Package) R1 = OMRON logo Model name LOT No. 5 to 20 mA Use the following formula to obtain the LED forward voltage value to assure that the relay releases accurately. VF (OFF) = VCC - VOH < 0.8 V SOP (Small Outline Package) OMRON logo Model name LOT No. SSOP (Shrink Small Outline Package) 211 Model name 228 LOT No. OMRON mark Protection from Surge Voltage on the Input Terminals If any reversed surge voltage is imposed on the input terminals, insert a diode in parallel to the input terminals as shown in the following circuit diagram and do not impose a reversed voltage value of 3 V or more. Note: "G3VM" is not printed on the actual product. 2 MOS FET Relays VCC - VOL - VF (ON) Technical Information Surge Voltage Protection Circuit Example Protection from Spike Voltage on the Output Terminals If a spike voltage exceeding the absolute maximum rated value is generated between the output terminals, insert a C-R snubber or clamping diode in parallel to the load as shown in the following circuit diagram to limit the spike voltage. Load Connection Do not short-circuit the input and output terminals while the relay is operating or the relay may malfunction. AC Connection + - Spike Voltage Protection Circuit Example 1 6 2 5 3 4 Or: Load AC Or: + DC - - DC + DC Single Connection + 1 6 - 2 5 3 4 1 6 2 5 3 4 + - Unused Terminals (6-pin models only) Load Load + DC - - DC + DC Parallel Connection Terminal 3 is connected to the internal circuit. Do not connect anything to terminal 3 externally. + 1 6 - 2 5 3 4 Load + DC - Pin Strength for Automatic Mounting In order to maintain the characteristics of the relay, the force imposed on any pin of the relay for automatic mounting must not exceed the following. In direction A: 1.96 N In direction B: 1.96 N Guidelines for Mounting Devices on PCBs Cleaning When ions in the flux enter into the product during soldering, fluctuation in device performance or corrosion may occur. Be sure to wash away any flux residue which contains Cl or Na ions. The following types of solvents are recommended for cleaning the flux: Recommended conditions for standard ultrasonic cleaning Frequency: Output: Time: 27kHz to 29kHz 0.25 W/cm2 or less 30 seconds or less Temperature: 50C (may vary according to the type of solvent used) * Asahi Clean AK-225AES * Kao Cleanthru 750H * Pine-Alpha ST-100S Cleaning must be conducted with the printed circuit board or device floating on the solvent, so as to avoid direct contact between the PCB or device and the ultrasonic vibrator. Cleaning Conditions Handling Precautions Cleaning conditions and precautions may vary according to product specifications. General precautions for dip cleaning Dipping time varies according to the solvent used. However, as a general guideline, it is recommended that the dip time be limited to three minutes. Do not touch the device's mark-bearing surface with your hand or with a brush while cleaning or applying cleaning liquid to the device. This may erase device markings. It is important to confirm that neither the solvent used for cleaning nor the cleaning conditions will damage the device package. General precautions for ultrasonic cleaning When ultrasonic cleaning is conducted for an excessively long time, contact between the product resin and the metal leads may lessen. Also, excessive ultrasonic stress may cause cracks in the pellet. It is recommended that the applied stress be minimized. MOS FET Relays Technical Information 3 Solder Mounting Perform solder mounting under the following recommended conditions to prevent the temperature of the relays from rising, causing possible damage to the relays. Through Hole Packages (Once only) Lead solder (SnPb) Preheating Temperature Solder Temperature 150C, 60 to 120s 260C, 10s max. Lead-free solder 150C, (SnAgCu) 60 to 120s 260C, 10s max. Note: It is recommended that the suitability of solder mounting be verified under actual conditions Reflow Soldering Surface Mount Packages (Twice max.) Solder type Lead solder (SnPb) Preheating Temperature* Humidity-resistant Packaging Component cases can crack if surface-mounted components that have absorbed moisture are subjected to thermal stress when mounting. To prevent this, observe the following precautions. Flow Soldering Solder type SSOP Handling Precautions Soldering Temperature* 140 to 160C, 60 to 120s 210C, 30s max. Peak, 240C max. Lead-free solder 180 to 190C, (SnAgCu) 60 to 120s 230C, 30 to 50s Peak, 260C max. 1. Unopened components can be stored in the packaging at 5 to 30C and a humidity of 90% max. However, they should be used within 12 months. 2. After the packaging has been opened, components can be stored at 5 to 30C and a humidity of 70% max. However, they should be mounted within 168 hours. 3. If, after opening the packaging, the humidity indicator turns pink to the 30% mark or the expiration date is exceeded, then bake the components while they are still on the taping reel and use them within 72 hours. Do not bake the same components more than once. Baking conditions: 60 5C, 64 to 72 hours 4. If the same components are baked repeatedly, then the tape detachment strength will change, causing potential problems when mounting. Use caution when mounting under these conditions. 5. When mounting using dehumidifying measures, always take countermeasures against component damage from static electricity. 6. Do not throw or drop the components. If the laminated packaging material is damaged, airtightness will be lost. 7. Tape cut SSOP's are packaged without humidity resistance. Use manual soldering to mount them. *Measured from the top surface of the relay package Note: 1. It is recommended that the suitability of solder mounting be verified under actual conditions 2. Tape cut SSOP's are packaged without humidity resistance. Use manual soldering to mount them. Manual Soldering (Once only) Manually solder at 350C for 3s or less or at 260C for 10s or less. 4 MOS FET Relays Technical Information MEMO All sales are subject to Omron Electronic Components LLC standard terms and conditions of sale, which can be found at http://www.components.omron.com/components/web/webfiles.nsf/sales_terms.html ALL DIMENSIONS SHOWN ARE IN MILLIMETERS. To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527. OMRON ON-LINE OMRON ELECTRONIC COMPONENTS LLC Global - http://www.omron.com USA - http://www.components.omron.com 55 E. Commerce Drive, Suite B Schaumburg, IL 60173 847-882-2288 Cat. No. X302-E-1 MOS FET Relays 12/10 Specifications subject to change without notice Technical Information Printed in USA