G3VM-61A - Omron - Datasheet.Directory

MOS FET Relays Technical Information 1

MOS FET Relays

Technical Information

Introduction

New models with a wider range of characteristics provide an array of

solutions, meeting the needs of today’s high performance applications

Our expanded range of MOS FET relays, Type G3VM, sets the

benchmark in Solid State Relays (SSRs). Products are manufactured

using the latest advances in automated production and include a

variety of improved construction technologies within the areas of the

input LED, PDA (Photo Diode Array used as a photocoupler) and

MOS FET chips used in the load switching circuit. As a result, further

reductions in package size and power requirements have been

achieved.

Combining the advantages of mechanical and solid state technology,

the new G3VM range gives you unprecedented capability to design.

All models featured include a double MOS FET load circuit, enabling

the designer complete versatility since it makes no difference

whether an AC or DC load in either direction is connected (Connec-

tion A). Thus, the MOS FET relay is a fully functional alternative to an

electromechanical relay with minimal additional drive circuitry.

The built-in Current Limit Function (CLR models) has many uses.

Traditionally used to clamp excessive over current fault conditions in

telecom equipment, this feature can also be used to good effect to

resist transient and short circuit conditions.

MOS FET relays are the ideal data and telecommunication solution

for line seizing, line switching, hook switching, Data Access Arrange-

ment (DAA) function, line transformer circuit control and other feature

phone functions. Central office applications require high reliability

and long life. Here the G3VM is ideal for use in the areas of Sub-

scriber Line Interfaces (SLICs) Multiplexers and Routers. In addition,

Local Area Networks (LANs) and Network Termination Units (NTUs)

including Set-Top Boxes (STBs) and Remote Metering Systems

(RMS) can take advantage of the G3VMs’ small size and low ON

resistance.

Advances in performance and cost reduction enable MOS FET

relays to be considered as good alternatives to Reed Relays in appli-

cation areas such as security motion detectors (standard and anti-

mask PIRs), and Automated Test Equipment (ATE) probe cards.

Glossary

Term Symbol Description

LED forward current IFRated current that can flow continuously in the forward direction of the LED

Repetitive peak LED forward

current

IFP Rated current that can flow momentarily in the forward direction of the LED

LED forward current

reduction rate

<IF/°C Rated change of forward current flowing through the LED relative to ambient temperature above 25°C

LED reverse voltage VRRated reverse voltage that can be applied between the anode and the cathode

Connection temperature TJRated temperature that can be allowed in the junction of the LED, Photodetector or MOS FET(s)

Load voltage (AC peak / DC) VOFF Rated voltage that can be applied between the MOS FET's output terminals in the OFF state

Continuous load current IORated current that can flow between the MOS FET's output terminals in the ON state

ON current reduction rate <ION/°C Rated change of load current flowing between MOS FET(s) output terminals relative to ambient tem-

perature above 25°C

Dielectric strength between

input and output

VI-O Isolation voltage between input and output terminals for a specified time

Operating temperature TaAmbient temperature range in which the relay may be operated without impairment

Storage temperature Tstg Ambient temperature range in which the relay may be stored while not operating

LED forward voltage VFVoltage drop between the LED's anode and cathode at a certain forward current

LED reverse current IRLeakage current flowing in the LED's reverse direction (between cathode and anode)

Capacity between (LED)

terminals

CTElectrostatic capacitance between the anode and the cathode terminals of the LED

Trigger LED forward current IFT Minimum value of input current necessary to put the output MOS FET(s) in to the ON state

Maximum resistance with

output ON

RON Resistance between the MOS FET's output terminals specified with reference to ON state current

Current leakage when the

relay is open

ILEAK Leakage current flowing between the MOS FET's output terminals in the OFF state

Output Capacitance Coff Electrostatic capacitance between the output terminals in the OFF state

Capacity between I/O

terminals

CI-O Electrostatic capacitance between the input and output terminals of the relay

Insulation resistance RI-O Resistance between the input and output terminals at the specified voltage value

Tur n - O N t i m e tON Time required for the output waveform to change from 0 (100%) to 90 (10%) after input goes from OFF

to ON state

Turn-OFF time tOFF Time required for the output waveform to change from 0 (100%) to 90 (10%) after input goes from ON

to OFF state

Recommended Load Voltage

(AC peak / DC)

VDD Rated load voltage that can be applied between the MOS FET's output terminals

2MOS FET Relays Technical Information

Precautions

!WARNING

Be sure to turn OFF the power when wiring the Relay, otherwise

an electric shock may be received.

!WARNING

Do not touch the charged terminals of the SSR, otherwise an elec-

tric shock may be received.

!CAUTION

Do not apply overvoltage or overcurrent to the I/O circuits of the

SSR, otherwise the SSR may malfunction or burn.

!CAUTION

Be sure to wire and solder the Relay under the proper soldering

conditions, otherwise the Relay in operation may generate exces-

sive heat and the Relay may burn.

!CAUTION

Electrostatic sensitive devices. Keep in original packaging until re-

quired to use. Avoid touching device terminals. Take static han-

dling precautions during processing.

Typical Relay Driving Circuit Examples

Use the following formula to obtain the LED current limiting resis-

tance value to assure that the relay operates accurately.

Use the following formula to obtain the LED forward voltage value to

assure that the relay releases accurately.

■

Protection from Surge Voltage on the

Input Terminals

If any reversed surge voltage is imposed on the input terminals,

insert a diode in parallel to the input terminals as shown in the follow-

ing circuit diagram and do not impose a reversed voltage value of 3 V

or more.

Surge Voltage Protection Circuit Example

Appearance Examples

SOP (Small Outline Package)

DIP (Dual Inline Package)

OMRON logo Model name

LOT No.

OMRON logo Model name

LOT No.

SSOP (Shrink Small Outline Package)

OMRON mark

Model name

LOT No.

211

228

Note: "G3VM" is not printed on the

actual product.

Load

C-MOS

Transistor

10 to 100 kΩLoad

R1 =VCC − VOL − VF (ON)

5 to 20 mA

VF (OFF) = VCC − VOH < 0.8 V

MOS FET Relays Technical Information 3

■

Protection from Spike Voltage on the

Output Terminals

If a spike voltage exceeding the absolute maximum rated value is

generated between the output terminals, insert a C-R snubber or

clamping diode in parallel to the load as shown in the following circuit

diagram to limit the spike voltage.

Spike Voltage Protection Circuit Example

■

Unused Terminals (6-pin models only)

Terminal 3 is connected to the internal circuit. Do not connect any-

thing to terminal 3 externally.

■

Pin Strength for Automatic Mounting

In order to maintain the characteristics of the relay, the force imposed

on any pin of the relay for automatic mounting must not exceed the

following.

In direction A: 1.96 N

In direction B: 1.96 N

■Load Connection

Do not short-circuit the input and output terminals while the relay is

operating or the relay may malfunction.

Guidelines for Mounting Devices on PCBs

■Cleaning

When ions in the flux enter into the product during soldering, fluctua-

tion in device performance or corrosion may occur. Be sure to wash

away any flux residue which contains Cl or Na ions.

The following types of solvents are recommended for cleaning the

flux:

•Asahi Clean AK-225AES

•Kao Cleanthru 750H

•Pine-Alpha ST-100S

Cleaning Conditions

Cleaning conditions and precautions may vary according to product

specifications.

General precautions for dip cleaning

Dipping time varies according to the solvent used.

However, as a general guideline, it is recommended that the dip

time be limited to three minutes.

General precautions for ultrasonic cleaning

When ultrasonic cleaning is conducted for an excessively long

time, contact between the product resin and the metal leads may

lessen. Also, excessive ultrasonic stress may cause cracks in the

pellet.

It is recommended that the applied stress be minimized.

Recommended conditions for standard ultrasonic cleaning

Frequency: 27kHz to 29kHz

Output: 0.25 W/cm2 or less

Time: 30 seconds or less

Temperature: 50°C (may vary according to the type of solvent used)

Cleaning must be conducted with the printed circuit board or device

floating on the solvent, so as to avoid direct contact between the PCB

or device and the ultrasonic vibrator.

Handling Precautions

Do not touch the device’s mark-bearing surface with your hand or

with a brush while cleaning or applying cleaning liquid to the device.

This may erase device markings. It is important to confirm that nei-

ther the solvent used for cleaning nor the cleaning conditions will

damage the device package.

−

−+

−

DC D

Or: Or:

Load

−

Load

AC Connection

DC Single Connection

DC Parallel Connection

4MOS FET Relays Technical Information

■Solder Mounting

Perform solder mounting under the following recommended conditions

to prevent the temperature of the relays from rising, causing possible

damage to the relays.

Flow Soldering

Through Hole Packages (Once only)

Note: It is recommended that the suitability of solder mounting be

verified under actual conditions

Reflow Soldering

Surface Mount Packages (Twice max.)

*Measured from the top surface of the relay package

Note: 1. It is recommended that the suitability of solder mounting be

verified under actual conditions

2. Tape cut SSOP’s are packaged without humidity resistance.

Use manual soldering to mount them.

Manual Soldering (Once only)

Manually solder at 350°C for 3s or less or at 260°C for 10s or less.

SSOP Handling Precautions

Humidity-resistant Packaging

Component cases can crack if surface-mounted components that

have absorbed moisture are subjected to thermal stress when

mounting. To prevent this, observe the following precautions.

1. Unopened components can be stored in the packaging at

5 to 30°C and a humidity of 90% max. However, they should

be used within 12 months.

2. After the packaging has been opened, components can be

stored at 5 to 30°C and a humidity of 70% max. However, they

should be mounted within 168 hours.

3. If, after opening the packaging, the humidity indicator turns

pink to the 30% mark or the expiration date is exceeded, then

bake the components while they are still on the taping reel

and use them within 72 hours. Do not bake the same compo-

nents more than once.

Baking conditions: 60 ± 5°C, 64 to 72 hours

4. If the same components are baked repeatedly, then the tape

detachment strength will change, causing potential problems

when mounting. Use caution when mounting under these

conditions.

5. When mounting using dehumidifying measures, always take

countermeasures against component damage from static

electricity.

6. Do not throw or drop the components. If the laminated pack-

aging material is damaged, airtightness will be lost.

7. Tape cut SSOP’s are packaged without humidity resistance.

Use manual soldering to mount them.

Solder type Preheating

Temperature

Solder

Temperature

Lead solder

(SnPb)

150°C,

60 to 120s

260°C,

10s max.

Lead-free solder

(SnAgCu)

150°C,

60 to 120s

260°C,

10s max.

Solder type Preheating

Temperature*

Soldering

Temperature*

Lead solder

(SnPb)

140 to 160°C,

60 to 120s

210°C,

30s max.

Peak,

240°C max.

Lead-free solder

(SnAgCu)

180 to 190°C,

60 to 120s

230°C,

30 to 50s

Peak,

260°C max.

MEMO

MOS FET Relays Technical Information

OMRON ON-LINE

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USA - http://www.components.omron.com

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OMRON ELECTRONIC

COMPONENTS LLC

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Schaumburg, IL 60173

847-882-2288

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