1. Product profile
1.1 General description
Passivated high commutation triac in a plastic envelope, suitable for surface mounting,
intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur.
These devices will commutate the full rated RMS current at the maximum rated junction
temperature, without the aid of a snubber.
1.2 Features
1.3 Quick reference data
2. Pinning information
[1] Connected to main terminal 2 (T2).
BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
Rev. 02 — 31 May 2005 Product data sheet
■High maximum junction temperature ■Surface mounting package
■High commutation capability ■Low thermal resistance
■VDRM ≤ 600 V (BTA208S-600B) ■IT(RMS) ≤ 8 A
■VDRM ≤ 800 V (BTA208S-800B) ■ITSM ≤ 65 A
Table 1: Pinning
Pin Description Simplified outline Symbol
1 main terminal 1 (T1)
SOT428 (DPAK)
2 main terminal 2 (T2)
3 gate (G)
mb mounting base [1]
3
2
mb
1
sym051
T1
G
T2
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 2 of 13
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
3. Ordering information
4. Limiting values
[1] Although not recommended, off-state voltages up to 800 V may be applied without damage, but the triac may switch to the on-state. The
rate of rise of current should not exceed 6 A/µs.
Table 2: Ordering information
Type number Package
Name Description Version
BTA208S-600B TO-252 plastic single-ended surface mounted package (DPAK);
3 leads (one lead cropped) SOT428
BTA208S-800B
Table 3: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state voltage
BTA208S-600B [1] - 600 V
BTA208S-800B - 800 V
IT(RMS) RMS on-state current full sine wave; Tmb ≤102 °C;
see Figure 4 and 5-8A
ITSM non-repetitive peak on-state current full sine wave; Tj = 25 °C prior to surge;
see Figure 2 and 3
t=20ms - 65 A
t = 16.7 ms - 71 A
I2tI
2t for fusing t = 10 ms - 21 A2s
dIT/dt rate of rise of on-state current ITM = 12 A; IG= 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs
IGM peak gate current -2A
VGM peak gate voltage -5V
PGM peak gate power -5W
PG(AV) average gate power over any 20 ms period - 0.5 W
Tstg storage temperature −40 +150 °C
Tjjunction temperature - 125 °C
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 3 of 13
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
α = conduction angle
Fig 1. On-state power dissipation as a function of RMS on-state current; maximum values
f = 50 Hz
Fig 2. Non-repetitive peak on-state current as a function of number of half cycles; sinusoidal currents; maximum
values
001aac659
4
8
12
Ptot
(W)
0
IT(RMS) (A)
0 108462
120
60
α = 180
α
α
Tmb(max)
(˚C)
101
105
109
113
117
121
125
90
30
001aac667
70
ITSM
(A)
0
number of half cycles
1 103
102
10
10
20
30
40
50 tp
Tj(init) = 25 °C max
ITITSM
t
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 4 of 13
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
tp≤ 20 ms
Fig 3. Non-repetitive peak on-state current as a function of pulse width; sinusoidal currents; maximum values
f = 50 Hz; Tmb ≤ 102 °C
Fig 4. RMS on-state current as a function of surge
duration; sinusoidal currents; maximum values Fig 5. RMS on-state current as a function of mounting
base temperature; maximum values
001aac663
tp (ms)
10−2102
1010−11
102
103
ITSM
(A)
10
dlT/dt limit
ITSM
t
IT
T
j(init)
= 25 °C max
T
surge duration (s)
10−210110−1
001aac665
10
15
5
20
25
IT(RMS)
(A)
0
Tmb (°C)
−50 150100050
001aac661
4
6
2
8
10
IT(RMS)
(A)
0
102 °C
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 5 of 13
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
5. Thermal characteristics
Table 4: Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance from junction
to mounting base full cycle; see Figure 6 - - 2.0 K/W
half cycle; see Figure 6 - - 2.4 K/W
Rth(j-a) thermal resistance from junction to
ambient printed-circuit board (FR4)
mounted; footprint as in Figure 14 - 75 - K/W
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width
001aac673
tp (s)
10−511010−1
10−2
10−410−3
1
10−1
10
Zth(j−mb)
(K/W)
10−2
unidirectional
bidirectional
tp
PD
t
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 6 of 13
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
6. Static characteristics
[1] Device does not trigger in the T2− G+ quadrant.
Table 5: Static characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
IGT gate trigger current VD= 12 V; IT= 0.1 A; see Figure 8 [1]
T2+ G+ 2 18 50 mA
T2+ G−2 2150mA
T2− G−2 3450mA
ILlatching current VD= 12 V; IGT = 0.1 A; see Figure 10
T2+ G+ - 31 60 mA
T2+ G−- 3490mA
T2− G−- 3060mA
IHholding current VD= 12 V; IGT = 0.1 A; see Figure 11 - 3160mA
VTon-state voltage IT= 10 A; see Figure 9 - 1.3 1.65 V
VGT gate trigger voltage VD= 12 V; IT= 0.1 A; see Figure 7 - 0.7 1.5 V
VD= 400 V; IT= 0.1 A; Tj= 125 °C 0.25 0.4 - V
IDoff-state current VD=V
DRM(max); Tj= 125 °C - 0.1 0.5 mA
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 7 of 13
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
7. Dynamic characteristics
Table 6: Dynamic characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
dVD/dt rate of rise of off-state voltage VDM = 0.67VDRM(max); Tj= 125 °C;
exponential waveform; gate open circuit 1000 4000 - V/µs
dIcom/dt rate of rise of commutating
current VDM = 400 V; Tj= 125 °C; IT(RMS) =8A;
without snubber; gate open circuit;
see Figure 12
- 14 - A/ms
tgt gate-controlled turn-on time ITM = 12 A; VD=V
DRM(max); IG= 0.1 A;
dIG/dt = 5 A/µs-2-µs
(1) T2− G−
(2) T2+ G−
(3) T2+ G+
Fig 7. Normalized gate trigger voltage as a function of
junction temperature Fig 8. Normalized gate trigger current as a function of
junction temperature
Tj (°C)
−50 150100500
001aac334
0.8
1.2
1.6
VGT (Tj)
0.4
VGT (25°C)
Tj (°C)
−50 150100050
001aac669
1
2
3
0
(1)
(2)
(3)
IGT (Tj)
IGT (25°C)
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 8 of 13
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
8. Package information
Plastic meets UL94 V-0 at 1⁄8 inch.
VO = 1.264 V; RS = 37.8 mΩ
(1) Tj = 125 °C; typical values
(2) Tj = 25 °C; maximum values
(3) Tj = 125 °C; maximum values
Fig 9. On-state characteristic Fig 10. Normalized latching current as a function of
junction temperature
Fig 11. Normalized holding current as a function of
junction temperature Fig 12. Rate of rise of commutating current as a
function of junction temperature; typical values
001aac670
VT (V)
0321
10
15
5
20
25
IT
(A)
0
(1) (3)(2)
Tj (°C)
−50 150100500
001aac336
1
2
3
IL(Tj)
0
IL(25°C)
Tj (°C)
−50 150100500
001aac337
1
2
3
IH(Tj)
0
IH(25°C)
001aac675
Tj (°C)
20 14010060
102
10
103
dlcom/dt
(A/ms)
1
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 9 of 13
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
9. Package outline
Fig 13. Package outline SOT428 (TO-252)
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
SOT428 SC-63
TO-252
SOT428
05-02-09
05-02-11
DIMENSIONS (mm are the original dimensions)
Plastic single-ended surface mounted package (DPAK); 3 leads (one lead cropped)
A
2
13
E1
D2
D1HD
LL1
L2
e1
e
mounting
base
wA
M
b
E
b2
b1c
A1
y
0 5 10 mm
scale
UNIT
mm 0.93
0.73 5.46
5.00 0.56
0.20 6.22
5.98 6.73
6.47 10.4
9.6 2.95
2.55
A1
2.38
2.22
Ab
2
1.1
0.9
b1e1
0.89
0.71
bcD
1
0.9
0.5
L2
Ee
2.285 4.57
4.0
D2
min
4.45
E1
min
0.5
L1
min
HDLw
0.2
y
max
0.2
A
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 10 of 13
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
10. Mounting
Dimensions in mm
Fig 14. SOT428: minimum pad sizes for surface mounting
SOT428
6.15
5.80
5.90
1.80
7.00
1.30
1.50 1.40
1.65
4.57
6.00
6.125
4.725
6.50
0.30
1.00
1.15
5.65
2.302.40
2.45
3.60
6.00
5.75
4.60
solder lands
solder resist
occupied area
solder paste
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 11 of 13
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
11. Revision history
Table 7: Revision history
Document ID Release date Data sheet status Change
notice Doc. number Supersedes
BTA208S_SER_B_2 20050531 Product data sheet - 9397 750 14861 BTA208S_SERIES_B_1
Modifications: •The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors.
•500 V types removed.
•Alternative pinning types removed.
BTA208S_SERIES_B_1 19970901 Product specification - - -
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
9397 750 14861 © Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet Rev. 02 — 31 May 2005 12 of 13
12. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
13. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
14. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
15. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
16. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
Level Data sheet status[1] Product status[2] [3] Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights. Date of release: 31 May 2005
Document number: 9397 750 14861
Published in The Netherlands
Philips Semiconductors BTA208S-600B; BTA208S-800B
Three-quadrant triacs high commutation
17. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
8 Package information . . . . . . . . . . . . . . . . . . . . . 8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
10 Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
12 Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 12
13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
16 Contact information . . . . . . . . . . . . . . . . . . . . 12
