03/2012
ALT6704
HELP4TM UMTS1700 (Band 3,4,9,10)
WCDMA/LTE/CDMA Mixed Mode PAM
Data Sheet - Rev 2.5
M45 Package
10 Pin 3 mm x 3 mm x 1 mm
Surface Mount Module
Figure 1: Block Diagram
FEATURES
• Mixed-ModeHSPA,EVDO,LTECompliant
• 4thGenerationHELPTMtechnology
• HighEfciency(R99waveform):
•39%@POUT=+28.6dBm
•35%@POUT=+17dBm
•22%@POUT=+13.5dBm
•27%@POUT=+9dBm
•13%@POUT=+3.5dBm
• LowQuiescentCurrent:2mA
• LowLeakageCurrentinShutdownMode:
<5 µA
• InternalVoltageRegulator
• Integrated“daisychainable”directionalcoupler
withCPLIN and CPLOUTport.
• InternalDCblocksonIN/OUTRFports
• Optimizedfora50ΩSystem
• 1.8VControlLogic
• RoHSCompliantPackage,260oC MSL-3
APPLICATIONS
• Band3,4,9,10WCDMA/HSPAWireless
Devices
• Band4LTEWirelessDevices
• AWS/KPCSCDMA/EVDOWirelessDevices
PRODUCT DESCRIPTION
The ALT6704 HELP4TMPAisa4thgenerationHELPTM
product for LTE and WCDMA devices operating in
UMTS1700(Band3,4,9,10)andforCDMAdevices
operatinginAWS/KPCSband.ThisPAincorporates
ANADIGICS’ HELP4TM technology to deliver
exceptional efciency at low power levels and low
quiescentcurrentwithouttheneedforexternalvoltage
regulatorsorconverters.Thedeviceismanufactured
using advanced InGaP-PlusTM HBT technology
offeringstate-of-the-artreliability,temperaturestability,
andruggedness.Three selectable bias modes that
optimizeefciencyfordifferentoutputpowerlevelsand
ashutdownmodewithlowleakagecurrentincrease
handset talk and standby time.A “daisy chainable”
directionalcouplerisintegratedinthemodule,thus
eliminating the need of an external coupler. The
self-contained3mmx3mmx1mmsurfacemount
packageincorporatesmatchingnetworksoptimizedfor
outputpower,efciency,andlinearityina50Ωsystem.
ALT6704
1
2
3
4
5
10
9
8
7
V
BATT
RF
IN
V
MODE2
V
MODE1
V
EN
CPL
OUT
GND
CPL
IN
RF
OUT
V
CC
Bias Control
Voltage Regulation
CPL
GND at Slug (pad)
8
7
6
5
4
3
2
110