24-Bit General Purpose
Digital Signal Processor
The DSP56001 is a member of MotorolaÕs family of
HCMOS, low-power, general purpose Digital Signal
Processors. The DSP56001 features 512 words of full
speed, on-chip program RAM (PRAM) memory, two
256 word data RAMs, two preprogrammed data
ROMs, and special on-chip bootstrap hardware to per-
mit convenient loading of user programs into the pro-
gram RAM. It is an off-the-shelf part since the program
DSP56001
Order this document
by DSP56001/D
This document contains information on a new product. Specifications and information herein are subject to change without notice.
ã
MOTOROLA INC., 1992
MOTOROLA
TECHNICAL DATA
SEMICONDUCTOR
memory is user programmable. The core of the processor consists of three execution units operating in parallel Ñ the data ALU,
the address generation unit, and the program controller. The DSP56001 has MCU-style on-chip peripherals, program and data
memory, as well as a memory expansion port. The MPU-style programming model and instruction set make writing efficient, com-
pact code, straightforward.
The high throughput of the DSP56001 makes it well-suited for communication, high-speed control, numeric processing, computer
and audio applications. The key features which facilitate this throughput are:
Pin Grid Array (PGA)
Available in an 88 pin ceramic
through-hole package.
Ceramic Quad Flat Pack (CQFP)
Available in a 132 pin, small footprint,
surface mount package.
¥
Speed
At 16.5 million instructions per second (MIPS) with a 33 MHz clock, the DSP56001 can execute
a 1024 point complex Fast Fourier Transform in1.98 milliseconds (66,240 clock cycles).
¥
Precision
The data paths are 24 bits wide thereby providing 144 dB of dynamic range; intermediate results
held in the 56-bit accumulators can range over 336 dB.
¥
Parallelism
The data ALU, address arithmetic units, and program controller operate in parallel so that an in-
struction prefetch, a 24x24-bit multiplication, a 56-bit addition, two data moves, and two address
pointer updates using one of three types of arithmetic (linear, modulo, or reverse carry) can be
executed in a single instruction cycle. This parallelism allows a four coefficient Infinite Impulse Re-
sponse (IIR) filter section to be executed in only four cycles, the theoretical minimum for a single
multiplier architecture.
¥
Integration
In addition to the three independent execution units, the DSP56001 has six on-chip memories,
three on-chip MCU style peripherals (Serial Communication Interface, Synchronous Serial Inter-
face, and Host Interface), a clock generator and seven buses (three address and four data), mak-
ing the overall system functionally complete and powerful, but also very low cost, low power, and
compact.
¥
Invisible Pipeline
The three-stage instruction pipeline is essentially invisible to the programmer thus allowing
straightforward program development in either assembly language or a high-level language such
as ANSI C.
¥
Instruction Set
The 62 instruction mnemonics are MCU-like making the transition from programming micropro-
cessors to programming the DSP56001 digital signal processor as easy as possible. The orthog-
onal syntax supports control of the parallel execution units. This syntax provides 12,808,830 dif-
ferent instruction variations using the 62 instruction mnemonics. The no-overhead DO instruction
and the REPEAT (REP) instruction make writing straight-line code obsolete.
¥
DSP56000/DSP56001
The DSP56001 is identical to the DSP56000 except that it has 512x24-bits of on-chip program
RAM instead of 3.75K of program ROM; a 32x24-bit bootstrap ROM for loading the program RAM
from either a byte-wide memory mapped ROM or via the Host Interface; and the on-chip X and Y
Data ROMs have been preprogrammed as positive Mu- and A-Law to linear expansion tables and
a full, four quadrant sine wave table, respectively.
¥
Low Power
As a CMOS part, the DSP56001 is inherently very low power; however, three other features can
reduce power consumption to an exceptionally low level.
Ñ The WAIT instruction shuts off the clock in the central processor portion of the DSP56001.
Ñ The STOP instruction halts the internal oscillator.
Ñ Power increases linearly (approximately) with frequency; thus, reducing the clock frequency
reduces power consumption.
Compatibility
Plastic Quad Flat Pack (PQFP)
Available in a 132 pin, small footprint,
surface mount package.
Rev. 3
September 10, 1998
2
DSP56001
MOTOROLA
15
9
PORT B
OR HOST
PORT C
AND/OR
SSI, SCI
ADDRESS
GENERATION
UNIT
ON-CHIP
PERIPHERALS:
HOST, SSI,
SCI, PI/O
INTERNAL DATA
BUS SWITCH
AND BIT
MANIPULATION
UNIT
CLOCK
GENERATOR
EXTAL XTAL
BOOTSTRAP
ROM
32X24
PROGRAM
RAM
512X24
X MEMORY
RAM
256X24
m
/A ROM
256X24
Y MEMORY
RAM
256X24
SINE ROM
256X24
PROGRAM
ADDRESS
GENERATOR
PROGRAM
DECODE
CONTROLLER
PROGRAM
INTERRUPT
CONTROLLER
YAB
XAB
PA B
YDB
XDB
PDB
GDB
MODB/IRQB
MODA/IRQA
RESET
DATA ALU
24X24+56
®
56-BIT MAC
TWO 56-BIT ACCUMULATORS
EXTERNAL
ADDRESS
BUS
SWITCH
BUS
CONTROL
EXTERNAL
DATA BUS
SWITCH
ADDRESS
7
DATA
16 BITS
24 BITS
PORT A
Figure 1. DSP56001 Block Diagram
In the USA:
For technical assistance call:
DSP Applications Helpline (512) 891-3230
For availability and literature call your local Motorola Sales OfÞce or Authorized Motorola Distributor.
For free application software and information call the Dr. BuB electronic bulletin board:
9600/4800/2400/1200/300 baud
(512) 891-3771
(8 data bits, no parity, 1 stop)
In Europe, Japan and Asia PaciÞc
Contact your regional sales ofÞce or Motorola distributor.
3
DSP56001 MOTOROLA
SIGNAL DESCRIPTION
The DSP56001 is available in 132 pin surface mount (CQFP and
PQFP) or an 88-pin pin-grid array packaging. Its input and output sig-
nals are organized into seven functional groups which are listed below
and shown in Figure 1.
Port A Address and Data Buses
Port A Bus Control
Interrupt and Mode Control
Power and Clock
Host Interface or Port B I/O
Serial Communications Interface or Port C I/O
Synchronous Serial Interface or Port C I/O
PORT A ADDRESS AND DATA BUS
Address Bus (A0-A15)
These three-state output pins specify the address for external program
and data memory accesses. To minimize power dissipation, A0-A15
do not change state when external memory spaces are not being ac-
cessed.
Data Bus (D0-D23)
These pins provide the bidirectional data bus for external program and
data memory accesses. D0-D23 are in the high-impedance state when
the bus grant signal is asserted.
PORT A BUS CONTROL
Program Memory Select (PS)
This three-state output is asserted only when external program mem-
ory is referenced. This pin is three-stated during RESET.
Data Memory Select (DS)
This three-state output is asserted only when external data memory is
referenced. This pin is three-stated during RESET.
X/Y Select (X/Y)
This three-state output selects which external data memory space (X
or Y) is referenced by data memory select (DS). This pin is three-stat-
ed during RESET.
Read Enable (RD)
This three-state output is asserted to read external memory on the
data bus D0-D23. This pin is three-stated during RESET.
Write Enable (WR)
This three-state output is asserted to write external memory on the
data bus D0-D23. This pin is three-stated during RESET.
Bus Request (BR/WT)
The bus request input BR allows another device such as a processor
or DMA controller to become the master of external data bus D0-D23
and external address bus A0-A15. When operating mode register
(OMR) bit 7 is clear and BR is asserted, the DSP56001 will always re-
lease the external data bus D0-D23, address bus A0-A15, and bus
control pins PS, DS, X/Y, RD, and WR (i. e., Port A), by placing these
pins in the high-impedance state after execution of the current instruc-
tion has been completed.
The BR pin should be pulled up when not
in use.
If OMR bit 7 is set, this pin is an input that allows an external device to
force wait states during an external Port A operation for as long as WT
is asserted.
Bus Grant (BG/BS)
If OMR bit 7 is clear, this output is asserted to acknowledge an external
bus request after Port A has been released. If OMR bit 7 is set, this pin
is bus strobe and is asserted when the DSP accesses Port A. This pin
is three-stated during RESET.
INTERRUPT AND MODE CONTROL
Mode Select A/External Interrupt Request A (MODA/IRQA),
Mode Select B/External Interrupt Request B (MODB/IRQB)
These two inputs have dual functions: 1) to select the initial chip oper-
ating mode and 2) to receive an interrupt request from an external
source. MODA and MODB are read and internally latched in the DSP
when the processor exits the RESET state. Therefore these two pins
should be forced into the proper state during reset. After leaving the
RESET state, the MODA and MODB pins automatically change to ex-
ternal interrupt requests IRQA and IRQB. After leaving the reset state
the chip operating mode can be changed by software. IRQA and IRQB
may be programmed to be level sensitive or negative edge triggered.
When edge triggered, triggering occurs at a voltage level and is not di-
rectly related to the fall time of the interrupt signal, however, the prob-
ability of noise on IRQA or IRQB generating multiple interrupts increas-
es with increasing fall time of the interrupt signal. These pins are inputs
during RESET.
Reset (RESET)
This Schmitt trigger input pin is used to reset the DSP56001. When
RESET is asserted, the DSP56001 is initialized and placed in the reset
state. When the RESET signal is deasserted, the initial chip operating
mode is latched from the MODA and MODB pins. When coming out of
reset, deassertion occurs at a voltage level and is not directly related
to the rise time of the reset signal; however, the probability of noise on
RESET generating multiple resets increases with increasing rise time
of the reset signal.
POWER AND CLOCK
Power (Vcc), Ground (GND)
There are five sets of power and ground pins used for the four groups
of logic on the chip, two pairs for internal logic, one power and two
ground for Port A address and control pins, one power and two ground
for Port A data pins, and one pair for peripherals. Refer to the pin as-
signments in the
LAYOUT PRACTICES
section.
PORT A
PORT B
PORT C
HOST CONTROL
RXD
TXD
SCLK
SC0
SC1
SCK
SRD
STD
A0-A15
D0-D23
PS
DS
RD
WR
X/Y
BR/WT
BG/BS
H0-H7
HA0
HA1
HA2
HR/W
HEN
HREQ
HACK
HOST DATA
BUS
VSS
VDD
XTAL
EXTAL
RESET
MODB/
IRQB
MODA/
IRQA
BUS
CONTROL
ADDRESS
DATA
DSP56001
Figure 2. Functional Signal Groups
SCI
SSI
4
DSP56001
MOTOROLA
External Clock/Crystal Input (EXTAL)
EXTAL may be used to interface the crystal oscillator input to an exter-
nal crystal or an external clock.
Crystal Output (XTAL)
This output connects the internal crystal oscillator output to an external
crystal. If an external clock is used, XTAL should not be connected.
HOST INTERFACE
Host Data Bus (H0-H7)
This bidirectional data bus is used to transfer data between the host
processor and the DSP56001. This bus is an input unless enabled by
a host processor read. H0-H7 may be programmed as general pur-
pose parallel I/O pins called PB0-PB7 when the Host Interface is not
being used. These pins are configured as a GPIO input pins during
hardware reset.
Host Address (HA0-HA2)
These inputs provide the address selection for each Host Interface
register. HA0-HA2 may be programmed as general purpose parallel
I/O pins called PB8-PB10 when the Host Interface is not being used.
These pins are configured as a GPIO input pins during hardware reset.
Host Read/Write (HR/W)
This input selects the direction of data transfer for each host processor
access. HR/W may be programmed as a general purpose I/O pin
called PB11 when the Host Interface is not being used. This pin is con-
figured as a GPIO input pins during hardware reset.
Host Enable (HEN)
This input enables a data transfer on the host data bus. When HEN is
asserted and HR/W is high, H0-H7 become outputs, and DSP56001
data may be read by the host processor, When HEN is asserted and
HR/W is low, H0-H7 become inputs and host data is latched inside the
DSP when HEN is deasserted. Normally a chip select signal, derived
from host address decoding and an enable clock, is used to generate
HEN. HEN may be programmed as a general purpose I/O pin called
PB12 when the Host Interface is not being used. This pin is configured
as a GPIO input pins during hardware reset.
Host Request (HREQ)
This open-drain output signal is used by the DSP56001 Host Interface
to request service from the host processor, DMA controller, or simple
external controller. HREQ may be programmed as a general purpose
I/O pin (not open-drain) called PB13 when the Host interface is not be-
ing used. HREQ should be pulled high when not in use. This pin is con-
figured as a GPIO input pins during hardware reset.
Host Acknowledge (HACK)
This input has two functions: 1) to receive a Host Acknowledge hand-
shake signal for DMA transfers and, 2) to receive a Host Interrupt Ac-
knowledge compatible with MC68000 Family processors. HACK may
be programmed as a general purpose I/O pin called PB14 when the
Host Interface is not being used. This pin is configured as a GPIO input
pins during hardware reset.
HACK should be pulled high when not
in use.
SERIAL COMMUNICATIONS INTERFACE (SCI)
Receive Data (RXD)
This input receives byte-oriented data into the SCI Receive Shift Reg-
ister. Input data is sampled on the positive edge of the Receive Clock.
RXD may be programmed as a general purpose I/O pin called PC0
when the SCI is not being used. This pin is configured as a GPIO input
pins during hardware reset.
Transmit Data (TXD)
This output transmits serial data from the SCI Transmit Shift Register.
Data changes on the negative edge of the transmit clock. This output
is stable on the positive edge of the transmit clock. TXD may be pro-
grammed as a general purpose I/O pin called PC1 when the SCI is not
being used. This pin is configured as a GPIO input pins during hard-
ware reset.
SCI Serial Clock (SCLK)
This bidirectional pin provides an input or output clock from which the
transmit and/or receive baud rate is derived in the asynchronous mode
and from which data is transferred in the synchronous mode. SCLK
may be programmed as a general purpose I/O pin called PC2 when
the SCI is not being used. This pin is configured as a GPIO input pins
during hardware reset.
SYNCHRONOUS SERIAL INTERFACE (SSI)
Serial Control Zero (SC0)
This bidirectional pin is used for control by the SSI. SC0 may be pro-
grammed as a general purpose I/O pin called PC3 when the SSI is not
being used. This pin is configured as a GPIO input pins during hard-
ware reset.
Serial Control One (SC1)
This bidirectional pin is used for control by the SSI. SC1 may be pro-
grammed as a general purpose I/O pin called PC4 when the SSI is not
being used. This pin is configured as a GPIO input pins during hard-
ware reset.
Serial Control Two (SC2)
This bidirectional pin is used for control by the SSI. SC2 may be pro-
grammed as a general purpose I/O pin called PC5 when the SSI is not
being used. This pin is configured as a GPIO input pins during hard-
ware reset.
SSI Serial Clock (SCK)
This bidirectional pin provides the serial bit rate clock for the SSI when
only one clock is used. SCK may be programmed as a general pur-
pose I/O pin called PC6 when the SSI is not being used. This pin is
configured as a GPIO input pins during hardware reset.
SSI Receive Data (SRD)
This input pin receives serial data into the SSI Receive Shift Register.
SRD may be programmed as a general purpose I/O pin called PC7
when the SSI is not being used. This pin is configured as a GPIO input
pins during hardware reset.
SSI Transmit Data (STD)
This output pin transmits serial data from the SSI Transmit Shift Reg-
ister. STD may be programmed as a general purpose I/O pin called
PC8 when the SSI is not being used. This pin is configured as a GPIO
input pins during hardware reset.
5
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
Electrical Specifications
The DSP is fabricated in high density CMOS with TTL compatible inputs and outputs.
Maximum Ratings (V
SS
= 0 Vdc)
Maximum Electrical Ratings
Thermal Characteristics - PGA Package
Thermal Characteristics - CQFP Package
Thermal Characteristics - PQFP Package
This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal
precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g., either Gnd or Vcc).
Rating Symbol Value Unit
Supply Voltage Vcc -0.3 to +7.0 V
All Input Voltages Vin VSS- 0.5 to Vcc + 0.5 V
Current Drain per Pin I 10 mA
excluding Vcc and VSS
Operating Temperature Range TJ-40 to +105 °C
Storage Temperature Tstg -55 to +150 °C
Characteristics Symbol Value Rating
Thermal Resistance - Ceramic
Junction to Ambient QJA 27 °C/W
Junction to Case (estimated) QJC 6.5 °C/W
Characteristics Symbol Value Rating
Thermal Resistance - Ceramic
Junction to Ambient QJA 40 °C/W
Junction to Case (estimated) QJC 7.0 °C/W
Characteristics Symbol Value Rating
Thermal Resistance - Plastic
Junction to Ambient QJA 38 °C/W
Junction to Case (estimated) QJC 13.0 °C/W
6
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
Power Considerations
The average chip-junction temperature, T
J
, in
°
C can be obtained from:
T
J
= T
A
+ (P
D
´
Q
JA
) (1)
Where:
T
A
= Ambient Temperature,
°
C
Q
JA
= Package Thermal Resistance, Junction-to-Ambient,
°
C/W
P
D
= P
INT
+ P
I/O
P
INT
= I
CC
´
Vcc, Watts - Chip Internal Power
P
I/O
= Power Dissipation on Input and Output Pins - User Determined
For most applications P
I/O
<< P
INT
and can be neglected; however, P
I/O
+ P
INT
must not
exceed Pd. An appropriate relationship
between PD and TJ (if PI/O is neglected) is:
PD = K/(TJ + 273° C) (2)
Solving equations (1) and (2) for K gives:
K = PD ´ (TA + 273° C) + QJA ´ PD2(3)
Where K is a constant pertaining to the particular part. K can be determined from equation (2) by measuring PD (at equilibrium) for a
known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any value of
TA. The total thermal resistance of a package (QJA) can be separated into two components, QJC and CA, representing the barrier to
heat flow from the semiconductor junction to the package (case) surface (QJC) and from the case to the outside ambient (CA). These
terms are related by the equation:
QJA = QJC + CA (4)
QJC is device related and cannot be influenced by the user. However, CA is user dependent and can be minimized by such thermal
management techniques as heat sinks, ambient air cooling, and thermal convection. Thus, good thermal management on the part of
the user can significantly reduce CA so that QJA approximately equals QJC. Substitution of QJC for QJA in equation (1) will result in a
lower semiconductor junction temperature. Values for thermal resistance presented in this document, unless estimated, were derived
using the procedure described in Motorola Reliability Report 7843, ÒThermal Resistance Measurement Method for MC68XX
Microcomponent DevicesÓ, and are provided for design purposes only. Thermal measurements are complex and dependent on
procedure and setup. User-derived values for thermal resistance may differ.
Layout Practices
Each Vcc pin on the DSP56001 should be provided with a low-impedance path to + 5 volts. Each GND pin should likewise be provided
with a low-impedance path to ground. The power supply pins drive four distinct groups of logic on chip. They are:
Power and Ground Connections for PGA
Power and Ground Connections for CQFP and PQFP
G12,C6 G11,B7 Internal Logic supply pins
L8 L6,L9 Address bus output buffer supply pins
G3 D3,J3 Data bus output buffer supply pins
C9 E11 Port B and C output buffer supply pins
Vcc GND Function
35, 36, 128, 129 33, 34, 130, 131 Internal Logic supply pins
63, 64 55, 56, 73, 74 Address bus output buffer supply pins
100, 101 90, 91, 111, 112 Data bus output buffer supply pins
12, 13 23, 24 Port B and C output buffer supply pins
Vcc GND Function
7
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
Power and Ground Connections
The Vcc power supply should be bypassed to ground using at least four 0.1 uF by- pass capacitors located either underneath the chip
or as close as possible to the four sides of the package. The capacitor leads and associated printed circuit traces connecting to chip
Vcc and Gnd should be kept to less than 1/2" per capacitor lead. A four-layer board is recommended, employing two inner layers as
Vcc and Gnd planes. All output pins on the DSP56001 have fast rise and fall times Ñ typically less than 3 ns. with a 10 pf. load. Printed
circuit (PC) trace interconnection length should be minimized in order to minimize undershoot and reflections caused by these fast
output switching times. This recommendation particularly applies to the address and data buses as well as the RD, WR, IRQA, IRQB,
and HEN pins. Maximum PC trace lengths on the order of 6" are recommended. Capacitance calculations should consider all device
loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes especially critical
in systems with higher capacitive loads because these loads create higher transient currents in the Vcc and GND circuits. Pull up/down
all unused inputs or signals that will be inputs during reset.
Signal Stability
When designing hardware to interface with the Host Interface, it is important to ensure that all signals be clean and free from noise.
Particular attention should be given to the quality of the Host Enable (HEN). All inputs to the port should be stable when HEN is
asserted and should remain stable until HEN has fully returned to the deasserted state. It is important to note that such phenomena
as ground-bounce and cross-talk can inadvertently cause HEN to temporarily rise above Vil max. Should this occur without completing
the full logic transition to Vih min, the DSP56001 Host Port may not correctly update the port status information which can result in
storing two or more copies of a single down loaded data word. Of course, if a full logic transition occurs, the part will complete a normal
data transfer operation.
8
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
DC Electrical Characteristics (Vcc = 5.0 Vdc + 10%; TJ = -40 to +105û C at 20.5 MHz and 27 MHz)
(Vcc = 5.0 Vdc + 5%; TJ = -40 to +105û C at 33 MHz)
Notes:
1. In order to obtain these results all inputs must be terminated (i.e., not allowed to float).
2. Periodically sampled and not 100% tested.
Characteristic Symbol Min Typ Max Unit
Supply Voltage 20, 27 MHz
33 MHz
Vcc 4.5
4.75
5.0 5.5
5.25
V
Input High Voltage
Except EXTAL, RESET, MODA/IRQA, MODB/IRQB
VIH 2.0 Ñ Vcc V
Input Low Voltage
Except EXTAL, MODA/IRQA, MODB/IRQB
VIL -0.5 Ñ 0.8 V
Input High Voltage EXTAL VIHC 4.0 Ñ Vcc V
Input Low Voltage EXTAL VILC -0.5 Ñ 0.6 V
Input High Voltage RESET VIHR 2.5 Ñ Vcc V
Input High Voltage MODA/IRQA and MODB/IRQB VIHM 3.5 Ñ Vcc V
Input Low Voltage MODA/IRQA and MODB/IRQB VILM -0.5 Ñ 2.0 V
Input Leakage Current
EXTAL, RESET, MODA/IRQA, MODB/IRQB, BR
Iin -1 Ñ 1 uA
Three-State (Off-State) Input Current
(@2.4 V/0.4 V)
ITSI -10 Ñ 10 uA
Output High Voltage (IOH = -0.4 mA) VOH 2.4 Ñ Ñ V
Output Low Voltage (IOL = 1.6 mA;
RD, WR IOL = 1.6 mA; Open Drain
HREQ IOL = 6.7 mA, TXD IOL = 6.7 mA)
VOL Ñ Ñ 0.4 V
Total Supply Current 5.25 V, 33 MHz
5. 5 V, 27 MHz
5. 5 V, 20 MHz
in WAIT Mode (see Note 1)
in STOP Mode (see Note 1)
IDD33
IDD27
IDD20
IDDW
IDDS
Ñ
Ñ
Ñ
Ñ
Ñ
160
130
100
10
100
185
155
115
25
2000
mA
mA
mA
mA
mA
Input Capacitance (see Note 2) Cin Ñ 10 Ñ pf
9
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
AC Electrical Characteristics
The timing waveforms in the AC Electrical Characteristics are tested with a VIL maximum of 0.5 V and a VIH minimum of 2.4 V for
all pins, except EXTAL, RESET, MODA, and MODB. These four pins are tested using the input levels set forth in the DC Electrical
Characteristics. AC timing specifications which are referenced to a device input signal are measured in production with respect to the
50% point of the respective input signalÕs transition. DSP56001 output levels are measured with the production test machine VOL and
VOH reference levels set at 0.8 V and 2.0 V respectively.
AC Electrical Characteristics - Clock Operation
The DSP56001 system clock may be derived from the on-chip crystal oscillator as shown in Clock Figure 1, or it may be externally
supplied. An externally supplied square wave voltage source should be connected to EXTAL, leaving XTAL physically unconnected
(see Clock Figure 2) to the board or socket. The rise and fall time of this external clock should be 5 ns maximum.
Notes:
1. External Clock Input High and External Clock Input Low are measured at 50% of the
input transition. tch and tcl are dependent on the duty cycle.
2. T = Icyc / 4 is used in the electrical characteristics. T represents an average which is
independent of the duty cycle.
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
Frequency of Operation (EXTAL Pin) 4.0 20.5 4.0 27.0 4.0 33.0 MHz
1External Clock Input High (tch) Ñ
EXTAL Pin (see Note 1 and 2)
22 150 17 150 13.5 150 ns
2External Clock Input Low (tcl) Ñ
EXTAL Pin (see Note 1 and 2)
22 150 17 150 13.5 150 ns
3Clock Cycle Time = cyc = 2T 48.75 250 37 250 30.33 250 ns
4Instruction Cycle Time = Icyc = 4T 97.5 500 74 500 60 500 ns
10
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
Suggested Component Values
For fosc = 4 MHz:
R = 680 KW + 10%
C = 20 pf + 20%
For fosc = 30 MHz:
R = 680 KW + 10%
C = 20 pf + 20%
Clock Figure 1. Crystal Oscillator Circuits
XTAL1
¥
¥
¥
¥
CC
R
Fundamental Frequency
Crystal Oscillator 3rd Overtone
Crystal Oscillator
Suggested Component Values
R1 = 470 KW + 10%
R2 = 330 W + 10%
C1 = 0.1 mf + 20%
C2 = 26 pf + 20%
C3 = 20 pf + 10%
L1 = 2.37 mH + 10%
XTAL =33 MHz, AT cut, 20 pf load,
50W max series resistance
¥
¥
¥
XTAL
EXTAL
¥
R1
C2 C3
XTAL1*
L1
C1
R2
EXTAL
XTAL
Notes:
(1) The suggested crystal source is ICM,
# 433163 - 4.00 (4MHz fundamental, 20
pf load) or # 436163 - 30.00 (30 MHz fun-
damental, 20 pf load).
Notes:
(1) *3rd overtone crystal.
(2) The suggested crystal source is ICM, # 471163 - 33.00 (33
MHz 3rd overtone, 20 pf load).
(3) R2 limits crystal current
(4) Reference Benjamin Parzen, The Design of Crystal and
Other Harmonic Oscillators, John Wiley& Sons, 1983
EXTAL
VILC
VIHC
Midpoint
1 2
3
4
Clock Figure 2. External Clock Timing
Note: The midpoint is VILC + 0.5 (VIHC - VILC).
11
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
9 Delay from RESET Assertion to
Address High Impedance (periodically
sampled and not 100% tested)
Ñ50Ñ38Ñ31ns
10 Minimum Stabilization Duration
Internal Osc. (see Note 1)
External Clock (see Note 2)
75000*cyc
25*cyc
Ñ
Ñ
75000*cyc
25*cyc
Ñ
Ñ
75000*cyc
25*cyc
Ñ
Ñ
ns
ns
11 Delay from Asynchronous RESET
Deassertion to First External Address
Output (Internal Reset Negation)
8*cyc 9*cyc+40 8*cyc 9*cyc+31 8*cyc 9*cyc+25 ns
12 Synchronous Reset Setup Time from
RESET Deassertion to Falling Edge of
External Clock
20 cyc-10 15 cyc-8 13 cyc-7 ns
13 Synchronous Reset Delay Time from
the Synchronous Falling Edge of
External Clock to the First External
Address Output
8*cyc+5
8*cyc+30 8*cyc+5 8*cyc+23 8*cyc+5 8*cyc+19 ns
14 Mode Select Setup Time 100 Ñ 77 Ñ 62 Ñ ns
15 Mode Select Hold Time 0 Ñ 0 0 ns
16
16a
Edge-Triggered Interrupt Request
assertion
deassertion
25
15
Ñ
Ñ
17
10
Ñ
Ñ
16
10
Ñ
Ñ
ns
ns
AC Electrical Characteristics - Reset, Stop, Mode Select and Interrupt Timing
(Vcc = 5.0 Vdc +10%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz)
(Vcc = 5.0 Vdc + 5%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 33 MHz)
(See Control Figure 1 through 8)
cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles
WS = Number of wait states (1 WS = 1 cyc = 2T) programmed into external bus access
using BCR (WS = 0 - 15)
tch = Clock high period
tcl = Clock low period
RESET
A0-A15
9
11
First Fetch
VIHR
Control Figure 1. Reset Timing
10
12
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
AC Electrical Characteristics - Reset, Stop, Mode Select, and Interrupt Timing
(Continued)
NOTE
When using fast interrupts and IRQA and IRQB are defined as level-sensitive, then timings 19 through 22 apply
to prevent multiple interrupt service. To avoid these timing restrictions, the negative edge-triggered mode is rec-
ommended when using fast interrupt. Long interrupts are recommended when using level-sensitive mode.
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
17 Delay from IRQA, IRQB Assertion to
External Memory Access Address Out
Valid Caused by First Interrupt
Instruction Fetch
Instruction Execution
5*cyc+tch
9*cyc+tch Ñ
Ñ
5*cyc+tch
9*cyc+tch
Ñ
Ñ
5*cyc+tch
9*cyc+tch
Ñ
Ñ
ns
ns
18 Delay from IRQA, IRQB Assertion to
General Purpose Transfer Output Valid
Caused by First Interrupt Instruction
Execution
11+cyc
+tch Ñ11
*cyc
+tch
Ñ11
*cyc
+tch
Ñns
19 Delay from Address Output Valid
Caused by First Interrupt Instruction
Execution to Interrupt Request
Deassertion for Level Sensitive Fast
Interrupts
Ñ2*cyc+tcl+
(cyc*WS)
-44
Ñ2
*cyc+tcl+
(cyc*WS)
-34
Ñ2
*cyc+tcl+
(cyc*WS)
-27
ns
20 Delay from RD Assertion to Interrupt
Request Deassertion for Level
Sensitive Fast Interrupts
Ñ
2*cyc+
(cyc*WS)
-40
Ñ
2*cyc+
(cyc*WS)
-31
Ñ
2*cyc+
(cyc*WS)
-25
ns
21 Delay from WR Assertion to WS=0
Interrupt Request Deassertion for
WS>0 Level Sensitive Fast Interrupts
Ñ
Ñ
2*cyc-40
cyc+tcl+
(cyc*WS)
-40
Ñ
Ñ
2*cyc-31
cyc+tcl+
(cyc*WS)
-31
Ñ
Ñ
2*cyc-25
cyc+tcl+
(cyc*WS)
-25
ns
ns
22 Delay from General-Purpose Output
Valid to Interrupt Request Deassertion
for Level Sensitive Fast Interrupts
- If Second Interrupt Instruction is:
Single Cycle
Two Cycle Ñ
Ñ
tcl-60
(2*cyc)+tcl
-60
Ñ
Ñ
tcl-46
(2*cyc)+tcl
-46
Ñ
Ñ
tcl-37
(2*cyc)+tcl
-37
ns
ns
13
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
AC Electrical Characteristics - Reset, Stop, Mode Select, and Interrupt Timing
(Continued)
Notes:
1. A clock stabilization delay is required when using the on-chip crystal oscillator in
two cases:
1) after power-on reset, and
2) when recovering from Stop mode.
During this stabilization period, T will not be constant. Since this stabilization period
varies, a delay of 150,000T is typically allowed to assure that the oscillator is stabilized
before executing programs. While it is possible to set OMR bit 6 = 1 when using
the internal crystal oscillator, it is not recommended and these specifications do not
guarantee timings for that case. See Section 8.5 in the DSP56000/DSP56001 UserÕs Manual for
additional information.
2. Circuit stabilization delay is required during reset when using an external clock in
two cases:
1) after power-on reset, and
2) when recovering from Stop mode.
3. For Revision B silicon, the min and max numbers are 12cyc+Tch+8 and 12cyc+Tch+30, respec-
tively.
4. The minimum is specified for the duration of an edge triggered IRQA interrupt required to recover
from the STOP state without having the IRQA interrupt accepted.
5. Timing #23 is for all IRQx interrupts while timing #24 is only when exiting WAIT.
6. Timing #23 triggers off T1 in the normal state and off T1/T3 when exiting the WAIT state.
7. The timings in the table are for Rev. C parts. The timings for Rev. C parts are shorter by 1 cyc than
the Rev. B parts when OMR6=0.
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
23 Synchronous Interrupt Setup Time
from IRQA, IRQB Assertion to the
Synchronous Rising Edge of External
Clock (see Notes 5, 6)
25 cyc-10 19 cyc-8 16 cyc-7 ns
24 Synchronous Interrupt Delay Time
from the Synchronous Rising Edge of
External Clock to the First External
Address Output Valid Caused by the
First Instruction Fetch after Coming out
of Wait State (see Notes 3, 5)
13*cyc+
tch+8
13*cyc+
tch+30
13*cyc+
tch+6
13*cyc+
tch+23
13*cyc+
tch+5
13*cyc+
tch+19
ns
25 Duration for IRQA Assertion to
Recover from Stop State (see Note 4) 25 Ñ 19 Ñ 16 Ñ ns
26 Delay from IRQA Assertion to Fetch of
First Instruction (for Stop) for
Internal Osc / OMR bit 6 = 0
External Clock / OMR bit 6 = 1
(see Notes 1, 2, and 7)
65545*cyc
17*cyc
Ñ
Ñ
65545*cyc
17*cyc
Ñ
Ñ
65545*cyc
17*cyc
Ñ
Ñ
ns
ns
27 Duration for Level Sensitive IRQA
Assertion to Fetch of First Interrupt
Instruction (for Stop) for
Internal Osc / OMR bit 6 = 0
External Clock / OMR bit 6 = 1
(see Notes 1, 2, and 7)
65533*cyc
+tcl
5*cyc+tcl
Ñ
Ñ
65533*cyc
+tcl
5*cyc+tcl
Ñ
Ñ
65533*cyc
+tcl
5*cyc+tcl
Ñ
Ñ
ns
ns
28 Delay from Level Sensitive IRQA
Assertion to Fetch of First Interrupt
Instruction (for Stop) for
Internal Osc / OMR bit 6 = 0
External Clock / OMR bit 6 = 1
(see Notes 1, 2, and 7)
65545*cyc
17*cyc
Ñ
Ñ
65545*cyc
17*cyc
Ñ
Ñ
65545*cyc
17*cyc
Ñ
Ñ
ns
ns
14
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
EXTAL
RESET
A0-A15,
DS, PS
X/Y
13
11
12
Control Figure 2. Synchronous Reset Timing
RESET
MODA, MODB
VIHR
IRQA, IRQB
VIHM
VILM
VIH
VIL
Control Figure 3. Operating Mode Select Timing
14
15
IRQA, IRQB
16
Control Figure 4. External Interrupt Timing (Negative Edge-Triggered)
16a
15
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
First Interrupt Instruction ExecutionA0-A15
RD
WR
IRQA
IRQB
20
21
1917
a) First Interrupt Instruction Execution
General
Purpose
I/O
IRQA
IRQB
18 22
b) General Purpose I/O
Control Figure 5. External Level-Sensitive Fast Interrupt Timing
16
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
EXTAL
IRQA, IRQB
A0-A15, DS
PS, X/Y
23
24
T0, T2 T1, T3
Control Figure 6. Synchronous Interrupt and Synchronous Wait State Timing
IRQA
A0-A15, DS,
PS, X/Y
25
26
Control Figure 7. Recovery from Stop State Using IRQA
First Instruction Fetch
IRQA
A0-A15, DS,
PS, X/Y First IRQA Interrupt
Instruction Fetch
27
28
Control Figure 8. Recovery from Stop State Using IRQA Interrupt Service
17
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
HOST PORT USAGE CONSIDERATIONS
Careful synchronization is required when reading multibit registers that are written by another asynchronous system. This is a common
problem when two asynchronous systems are connected. The situation exists in the Host port. The considerations for proper operation
are discussed below.
Host Programmer Considerations
1. Unsynchronized Reading of Receive Byte Registers
When reading receive byte registers, RXH, RXM, or RXL, the Host programmer should use interrupts or poll the RXDF flag which
indicates that data is available. This assures that the data in the receive byte registers will be stable.
2. Overwriting Transmit Byte Registers
The Host programmer should not write to the transmit byte registers, TXH, TXM, or TXL, unless the TXDE bit is set indicating that
the transmit byte registers are empty. This guarantees that the transmit byte registers will transfer valid data to the HRX register.
3. Synchronization of Status Bits from DSP to Host
HC, HREQ, DMA, HF3, HF2, TRDY, TXDE, and RXDF (refer to DSP56000/DSP56001 UserÕs Manual, I/O Interface section, Host/
DMA Interface Programming Model for descriptions of these status bits) status bits are set or cleared from inside the DSP and
read by the Host processor. The Host can read these status bits very quickly without regard to the clock rate used by the DSP,
but the possibility exists that the state of the bit could be changing during the read operation. This is generally not a system
problem, since the bit will be read correctly in the next pass of any Host polling routine.
However, if the Host asserts the HEN for more than timing number 31a (T31a), with a minimum cycle time of timing number 32a
(T32a), then the status is guaranteed to be stable.
A potential problem exists when reading status bits HF3 and HF2 as an encoded pair. If the DSP changes HF3 and HF2 from 00
to 11, there is a small probability that the Host could read the bits during the transition and receive 01 or 10 instead of 11. If the
combination of HF3 and HF2 has significance, the Host could read the wrong combination.
Solution:
a. Read the bits twice and check for consensus.
b. Assert HEN access for T31a so that status bit transitions are stabilized.
4. Overwriting the Host Vector
The Host programmer should change the Host Vector register only when the Host Command bit (HC) is clear. This change will
guarantee that the DSP interrupt control logic will receive a stable vector.
5. Cancelling a Pending Host Command Exception
The Host processor may elect to clear the HC bit to cancel the Host Command Exception request at any time before it is
recognized by the DSP. Because the Host does not know exactly when the exception will be recognized (due to exception
processing synchronization and pipeline delays), the DSP may execute the Host exception after the HC bit is cleared. For these
reasons, the HV bits must not be changed at the same time the HC bit is cleared.
DSP Programmer Considerations
1. Reading HF0 and HF1 as an Encoded Pair
DMA, HF1, HF0, and HCP, HTDE, and HRDF (refer to DSP56000/DSP56001 UserÕs Manual, I/O Interface section, Host/DMA
Interface Programming Model for descriptions of these status bits) status bits are set or cleared by the Host processor side of the
interface. These bits are individually synchronized to the DSP clock.
A potential problem exists when reading status bits HF1 and HF2 as an encoded pair, i.e., the four combinations 00, 01, 10, and
11 each have significance. A very small probability exists that the DSP will read the status bits synchronized during transition.
The solution to this potential problem is to read the bits twice for consensus.
18
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
AC Electrical Characteristics - Host I/O Timing
(Vcc = 5.0 Vdc + 10%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz)
(Vcc = 5.0 Vdc + 5%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 33 MHz)
(see Host Figures 1 through 6)
cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles
tHSDL = Host Synchronization Delay Time
Active low lines should be Òpulled upÓ in a manner consistent with the AC and DC specifications
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
30 Host Synchronous Delay (see Note 1) tcl cyc+tcl tcl cyc+tcl tcl cyc+tcl ns
31 HEN/HACK Assertion Width
(see Note 2)
a.CVR, ICR, ISR Read (see Note 4)
b.Read
c.Write
cyc+60
50
25
Ñ
Ñ
Ñ
cyc+46
39
19
Ñ
Ñ
Ñ
cyc+37
31
16
Ñ
Ñ
Ñ
ns
ns
ns
32 HEN/HACK Deassertion Width
(see Note 2 and 5)
25Ñ19Ñ1ns
32a Minimum Cycle Time Between Two
HEN Assertion for Consecutive CVR,
ICR, and ISR Reads (see Note 2)
2*cyc+60 Ñ 2*cyc+46 Ñ 2*cyc+37 Ñ ns
33 Host Data Input Setup Time Before
HEN/HACK Deassertion
5Ñ4Ñ4Ñns
34 Host Data Input Hold Time After HEN/
HACK Deassertion
5Ñ4Ñ4Ñns
35 HEN/HACK Assertion to Output Data
Active from High Impedance
0Ñ0Ñ0Ñns
36 HEN/HACK Assertion to Output Data
Valid (periodically sampled, and not
100% tested)
Ñ50Ñ39Ñ31ns
37 HEN/HACK Deassertion to Output
Data High Impedance
Ñ35Ñ27Ñ22ns
38 Output Data Hold Time After HEN/
HACK Deassertion
5Ñ4Ñ4Ñns
39 HR/W Low Setup Time Before HEN
Assertion
0Ñ0Ñ0Ñns
40 HR/W Low Hold Time After HEN
Deassertion
5Ñ4Ñ4Ñns
41 HR/W High Setup Time to HEN
Assertion
0Ñ0Ñ0Ñns
42 HR/W High Hold Time After HEN/
HACK Deassertion
5Ñ4Ñ4Ñns
43 HA0-HA2 Setup Time Before HEN
Assertion
0Ñ0Ñ0Ñns
44 HA0-HA2 Hold Time After HEN
Deassertion
5Ñ4Ñ4Ñns
45 DMA HACK Assertion to HREQ
Deassertion (see Note 3)
560446449ns
19
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
AC Electrical Characteristics - Host I/O Timing (Continued)
(Vcc = 5.0 Vdc + 10%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz
(Vcc = 5.0 Vdc + 5%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 33 MHz,
see Host Figures 1 through 6)
cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles
tHSDL = Host Synchronization Delay Time
Active low lines should be Òpulled upÓ in a manner consistent with the AC and DC specifications
Notes:
1. ÒHost synchronization delay (tHSDL)Ó is the time period required for the
DSP56001 to sample any external asynchronous input signal, determine
whether it is high or low, and synchronize it to the DSP56001 internal clock.
2. See HOST PORT USAGE CONSIDERATIONS.
3. HREQ is pulled up by a 1kW resistor.
4. This timing must be adhered to only if two consecutive reads from one of these registers are executed.
5. It is recommended that timing #32 be 2cyc+tch+10 minimum for 20.5 MHz, 2cyc+tch+7 minimum for 27 MHz,
and 2cyc+tch+6 minimum for 33 MHz if two consecutive writes to TXL are executed without polling TXDE or
HREQ.
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
46 DMA HACK Deassertion to HREQ
Assertion (see Note 3)
for DMA RXL Read
for DMA TXL Write
for All Other Cases
tHSDL+cyc
+tch+5
tHSDL+cyc+5
5
Ñ
Ñ
Ñ
tHSDL+cyc
+tch+4
tHSDL+cyc+4
4
Ñ
Ñ
Ñ
tHSDL+cyc
+tch+4
tHSDL+cyc+4
4
Ñ
Ñ
Ñ
ns
ns
ns
47 Delay from HEN Deassertion to HREQ
Assertion for RXL Read (see Note 3)
tHSDL+cyc
+tch+5
Ñ tHSDL+cyc
+tch+4
Ñ tHSDL+cyc
+tch+4
Ñns
48 Delay from HEN Deassertion to HREQ
Assertion for TXL Write (see Note 3)
tHSDL+cyc+5 Ñ tHSDL+cyc+4 Ñ tHSDL+cyc+4 Ñ ns
49 Delay from HEN Assertion to HREQ
Deassertion for RXL Read, TXL Write
(see Note 3)
575470465ns
EXTERNAL
INTERNAL
3030
Host Figure 1. Host Synchronization Delay
20
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
HREQ
(OUTPUT)
HACK
(INPUT)
HR/W
(INPUT)
H0-H7
(OUTPUT)
31 32
41 42
3736
35 38
Host Figure 2. Host Interrupt Vector Register (IVR) Read
Data Valid
21
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
HREQ
(OUTPUT)
HEN
(INPUT)
HA2-HA0
(INPUT)
HR/W
(INPUT)
H0-H7
(OUTPUT)
4749
31 32
43 44
41 42
36 37
35 38
RXM
Read
RXL
Read
RXH
Read
Address
Valid
Address
Valid
Address
Valid
Data
Valid
Data
Valid
Data
Valid
Host Figure 3. Host Read Cycle (Non-DMA Mode)
32A
22
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
Data
Valid
Data
Valid
Data
Valid
Host Figure 4. Host Write Cycle (Non-DMA Mode)
48
49
31 32
43 44
39 40
33 34
TXM
Write
TXL
Write
TXH
Write
Address
Valid
Address
Valid
Address
Valid
HREQ
(OUTPUT)
HEN
(INPUT)
HA2-HA0
(INPUT)
HR/W
(INPUT)
H0-H7
(INPUT)
Host Figure 5. Host DMA Read Cycle
31 32
45 46 46
36
35
37
38
Data
Valid
Data
Valid
Data
Valid
HREQ
(OUTPUT)
HACK
(INPUT)
H0-H7
(OUTPUT)
RXM
Read
RXL
Read
RXH
Read
46
23
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
Host Figure 6. Host DMA Write Cycle
HREQ
(OUTPUT)
HACK
(INPUT)
H0-H7
(INPUT)
31 32
45 46
33
34
Data
Valid
Data
Valid
Data
Valid
TXM
Write
TXL
Write
TXH
Write
46 46
24
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
AC Electrical Characteristics - SCI Timing
(Vcc = 5.0 Vdc + 10%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz,
Vcc = 5.0 Vdc + 5%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 33 MHz,
see SCI Figures 1 and 2)
cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles
tSCC = Synchronous Clock Cycle Time (for internal clock tSCC is determined by the SCI clock control register and Icyc.)
SCI Synchronous Mode Timing
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
55 Synchronous Clock Cycle Ñ tSCC 8*cyc Ñ 8*cycÑ 8
*cyc Ñ ns
56 Clock Low Period 4*cyc-20 Ñ 4*cyc-15 Ñ 4*cyc-13 Ñ ns
57 Clock High Period 4*cyc-20 Ñ 4*cyc-15 Ñ 4*cyc-13 Ñ ns
59 Output Data Setup to Clock Falling
Edge (Internal Clock)
2*cyc
+tcl-50
Ñ2
*cyc
+tcl-39
Ñ2
*cyc
+tcl-31
Ñns
60 Output Data Hold After Clock Rising
Edge (Internal Clock)
2*cyc
-tcl-15
Ñ2
*cyc
-tcl-11
Ñ2
*cyc
-tcl-9
Ñns
61 Input Data Setup Time Before Clock
Rising Edge (Internal Clock)
2*cyc
+tcl+45
Ñ2
*cyc
+tcl+35
Ñ2
*cyc
+tcl+28
Ñns
62 Input Data Not Valid Before Clock Ris-
ing Edge (Internal Clock)
Ñ2
*cyc
+tcl-10
Ñ2
*cyc
+tcl-8
Ñ2
*cyc
+tcl-6
ns
63 Clock Falling Edge to Output Data
Valid (External Clock)
Ñ63Ñ48Ñ39ns
64 Output Data Hold After Clock Rising
Edge (External Clock)
cyc+12 Ñ cyc+9 Ñ cyc+8 Ñ ns
65 Input Data Setup Time Before Clock
Rising Edge (External Clock)
30Ñ23Ñ1ns
66 Input Data Hold Time After Clock Ris-
ing Edge (External Clock)
40Ñ31Ñ2ns
25
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
AC Electrical Characteristics - SCI Timing
(Vcc = 5.0 Vdc + 10%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz,
Vcc = 5.0 Vdc + 5%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 33 MHz,
see SCI Figures 1 and 2)
cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles
tACC = Asynchronous clock cycle time
tACC = Asynchronous Clock Cycle Time (for internal clock tACC is determined by the SCI clock control register and Icyc)
SCI Asynchronous Mode Timing - 1X Clock
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
67 Asynchronous Clock Cycle 64*cycÑ64
*cycÑ64
*cyc Ñ ns
68 Clock Low Period 32*cyc-20 Ñ 32*cyc-15 Ñ 32*cyc-13 Ñ ns
69 Clock High Period 32*cyc-20 Ñ 32*cyc-15 Ñ 32*cyc-13 Ñ ns
71 Output Data Setup to Clock Rising
Edge (Internal Clock)
32*cyc
-100
Ñ32
*cyc
-77
Ñ32
*cyc
-61
Ñns
72 Output Data Hold After Clock Rising
Edge (Internal Clock)
32*cyc
-100
Ñ32
*cyc
-77
Ñ32
*cyc
-61
Ñns
26
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
INTERNAL CLOCK
56
5758 58
55
6059
62
61
DATA VALID
DATA
VALID
EXTERNAL CLOCK
56
57
55
6463
6665
DATA VALID
DATA VALID
SCI Figure 1. SCI Synchronous Mode Timing
SCLK
(OUTPUT)
TXD
RXD
SCLK
(INPUT)
TXD
RXD
27
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
1X SCK
(OUTPUT)
TXD DATA VALID
SCI Figure 2. SCI Asynchronous Mode Timing
68
6970 70
67
71 72
Note: In the wire-OR mode, TXD can be pulled up by 1KW
28
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
AC Electrical Characteristics - SSI Timing
(Vcc = 5.0 Vdc + 10%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz,
Vcc = 5.0 Vdc + 5%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 33 MHz,
see SSI Figures 1 and 2)
cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles
tSSICC = SSI clock cycle time
TXC (SCK Pin) = Transmit Clock
RXC (SC0 or SCK Pin) = Receive Clock
FST (SC2 Pin) = Transmit Frame Sync
FSR (SC1 or SC2 Pin) = Receive Frame Sync
i ck = Internal Clock
x ck = External Clock
g ck = Gated Clock
i ck a = Internal Clock, Asynchronous Mode (Asynchronous implies that TXC and
RXC are two different clocks)
i ck s = Internal Clock, Synchronous Mode (Synchronous implies that TXC and
RXC are the same clock)
bl = bit length
wl = word length
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
80 Clock Cycle (see Note 1) 4*cycÑ4
*cycÑ4
*cyc Ñ ns
81 Clock High Period 2*cyc-20 Ñ 2*cyc-15 Ñ 2*cyc-13 Ñ ns
82 Clock High Period 2*cyc-20 Ñ 2*cyc-15 Ñ 2*cyc-13 Ñ ns
84 RXC Rising Edge to FSR Out (bl) High
x ck
i ck a
Ñ
Ñ
80
50
Ñ
Ñ
61
38
Ñ
Ñ
48
31
ns
ns
85 RXC Rising Edge to FSR Out (bl) Low
x ck
i ck a
Ñ
Ñ
70
40
Ñ
Ñ
54
31
Ñ
Ñ
43
25
ns
ns
86 RXC Rising Edge to FSR Out (wl) High
x ck
i ck a
Ñ
Ñ
70
40
Ñ
Ñ
54
31
Ñ
Ñ
43
25
ns
ns
87 RXC Rising Edge to FSR Out (wl) Low
x ck
i ck a
Ñ
Ñ
70
40
Ñ
Ñ
54
31
Ñ
Ñ
43
25
ns
ns
88 Data In Setup Time Before RXC (SCK
in Synchronous Mode) Falling Edge
x ck
i ck a
i ck s
15
35
25
Ñ
Ñ
Ñ
12
27
19
Ñ
Ñ
Ñ
10
22
16
Ñ
Ñ
Ñ
ns
ns
ns
89 Data In Hold Time After RXC Falling
Edge x ck
i ck a
35
5
Ñ
Ñ
27
4
Ñ
Ñ
22
4
Ñ
Ñ
ns
ns
90 FSR Input (bl) High Before RXC Falling
Edge x ck
i ck a
15
35
Ñ
Ñ
12
27
Ñ
Ñ
10
23
Ñ
Ñ
ns
ns
91 FSR Input (wl) High Before RXC
Falling Edge x ck
i ck a
20
55
Ñ
Ñ
15
42
Ñ
Ñ
13
34
Ñ
Ñ
ns
ns
92 FSR Input Hold Time After RXC Falling
Edge x ck
i ck a
35
5
Ñ
Ñ
27
4
Ñ
Ñ
22
4
Ñ
Ñ
ns
ns
29
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
AC Electrical Characteristics - SSI Timing (Continued)
Note:
1. For internal clock, External Clock Cycle is defined by Icyc and SSI control register.
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
93 Flags Input Setup Before RXC Falling
Edge x ck
i ck a
30
50
Ñ
Ñ
23
39
Ñ
Ñ
19
31
Ñ
Ñ
ns
nss
94 Flags Input Hold Time After RXC
Falling Edge x ck
i ck a
35
5
Ñ
Ñ
27
4
Ñ
Ñ
22
4
Ñ
Ñ
ns
ns
95 TXC Rising Edge to FST Out (bl) High
x ck
i ck a
Ñ
Ñ
70
30
Ñ
Ñ
54
23
Ñ
Ñ
43
19
ns
ns
96 TXC Rising Edge to FST Out (bl) Low
x ck
i ck a
Ñ
Ñ
65
35
Ñ
Ñ
50
27
Ñ
Ñ
40
22
ns
ns
97 TXC Rising Edge to FST Out (wl) High
x ck
i ck a
Ñ
Ñ
65
35
Ñ
Ñ
50
27
Ñ
Ñ
40
22
ns
ns
98 TXC Rising Edge to FST Out (wl) Low
x ck
i ck a
Ñ
Ñ
65
35
Ñ
Ñ
50
27
Ñ
Ñ
40
22
ns
ns
99 TXC Rising Edge to Data Out Enable
from High Impedance x ck
i ck a
Ñ
Ñ
65
40
Ñ
Ñ
50
31
Ñ
Ñ
40
25
ns
ns
100 TXC Rising Edge to Data Out Valid
x ck
i ck a
Ñ
Ñ
65
40
Ñ
Ñ
50
31
Ñ
Ñ
40
25
ns
ns
101 TXC Rising Edge to Data Out High
Impedance (periodically sampled, and
not 100% tested) x ck
i ck a
Ñ
Ñ
70
40
Ñ
Ñ
54
31
Ñ
Ñ
43
25
ns
ns
101a TXC Falling Edge to Data Out High
Impedance for Gated Clock Mode Only
g ck cyc+tch Ñ cyc+tch Ñ cyc+tch Ñ ns
102 FST Input (bl) Setup Time Before TXC
Falling Edge x ck
i ck a
15
35
Ñ
Ñ
12
27
Ñ
Ñ
10
23
Ñ
Ñ
ns
ns
103 FST Input (wl) to Data Out Enable from
High Impedance
Ñ60Ñ46Ñ37ns
104 FST Input (wl) Setup Time Before TXC
Falling Edge x ck
i ck a
20
55
Ñ
Ñ
15
42
Ñ
Ñ
13
34
Ñ
Ñ
ns
ns
105 FST Input Hold Time After TXC Falling
Edge x ck
i ck a
35
5
Ñ
Ñ
27
4
Ñ
Ñ
22
4
Ñ
Ñ
ns
ns
106 Flag Output Valid After TXC Rising
Edge x ck
i ck a
Ñ
Ñ
70
40
Ñ
Ñ
54
31
Ñ
Ñ
43
25
ns
ns
Note:
1. For internal clock, External Clock Cycle is defined by Icyc and SSI control register.
30
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
RXC
(Input/Output)
FSR (Bit)
OUT
FSR (Word)
OUT
DATA IN
FSR (Bit)
IN
FSR (Word)
IN
FLAGS IN
81
82
83
80
84 85
86 87
88 89
First Bit Last Bit
90 92
9291
9493
SSI Figure 1. SSI Receiver Timing
83
31
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
First Bit Last Bit
(See Note 1)
Note:
1. In the Network mode, output flag transitions can occur at the start of each time slot within
the frame. In the Normal mode, the output flag state is asserted for the entire frame
period.
SSI Figure 2. SSI Transmitter Timing
TXC
(Input/Output)
FST (Bit)
OUT
FST (Word)
OUT
DATA OUT
FST (Bit)
IN
FST (Word)
IN
FLAGS OUT
81
82
83
80
95 96
97 98
100100
99
105
102
103
104 105
106
101
83
101a
32
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
AC Electrical Characteristics Ñ
Capacitance Derating Ñ External Bus Asynchronous Timing
Vcc = 5.0 Vdc + 10%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 20.5 MHz and 27 MHz,
Vcc = 5.0 Vdc + 5%, TJ = -40 to +105û C, CL = 50 pf + 1 TTL Load at 33 MHz, see Bus Figures 1 and 2
cyc = Clock cycle = 1/2 instruction cycle = 2 T cycles
WS = Number of Wait States, Determined by BCR Register (WS = 0 to 15)
The DSP56001 External Bus Timing Specifications are designed and tested at the maximum capacitive load of 50 pf, including
stray capacitance. Typically, the drive capability of the External Bus pins (A0-A15, D0-D23, PS, DS, RD, WR, X/Y) derates
linearly at 1 ns per 12 pf of additional capacitance from 50 pf to 250 pf of loading. Port B and C pins derate linearly at 1 ns per
5 pf of additional capacitance from 50 pf to 250 pf of loading.
Active low inputs should be Òpulled upÓ in a manner consistent with the AC and DC specifications.
To conserve power, when an internal memory access follows an external memory access, the RD and WR strobes remain
deasserted and A0-A15 and X/Y do not change from their previous state. Both PS and DS will be deasserted (they do not
change between two external accesses to the same memory space) indicating that no external memory access is occurring.
If BR has been asserted, then the bus signals will be three-stated according to the timing information in this data sheet.
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
115 Delay from BR Assertion to BG
Assertion (see Note 1)
(see Note 2)
(see Note 3)
(see Note 4)
(see Note 5)
2*cyc+tch
cyc+tch
cyc+tch
Infinity
tch+4
4*cyc+tch+
20
4*cyc+tch+
cyc*WS+20
6*cyc+tch+
2*cyc*WS+
20
Ñ
cyc+tch+30
2*cyc+tch
cyc+tch
cyc+tch
Infinity
tch+3
4*cyc+tch+
15
4*cyc+tch+
cyc*WS+15
6*cyc+tch+
2*cyc*WS+
15
Ñ
cyc+tch+23
2*cyc+tch
cyc+tch
cyc+tch
Infinity
tch+3
4*cyc+tch+
13
4*cyc+tch+
cyc*WS+13
6*cyc+tch+
2*cyc*WS+
13
Ñ
cyc+tch+19
ns
ns
ns
ns
ns
116 Flags Input Hold Time After RXC
Falling Edge Deassertion
2*cyc 4*cyc+20 2*cyc 4*cyc+15 2*cyc 4*cyc+13 ns
117 BG Deassertion Duration 2*cyc-10 Ñ 2*cyc-8 Ñ 2*cyc-6 Ñ ns
118 Delay from Address, Data, and Control
Bus High Impedance to BG Assertion
0Ñ0Ñ0Ñns
119 Delay from BG Deassertion to
Address, Data, and Control Bus
Enabled
Ñ tch-10 Ñ tch-8 Ñ tch-6 ns
120 Address Valid to WR Assertion WS=0
WS>0
tcl-9
cyc-9
tcl+5
cyc+5
tcl-7
cyc-7
tcl+5
cyc+5
tcl-5.5
cyc-5.5
tcl+5
cyc+5
ns
ns
121 WR Assertion Width WS=0
WS>0
cyc-9
WS*cyc
+tcl-9
Ñ
Ñ
cyc-7
WS*cyc
+tcl-7
Ñ
Ñ
cyc-5.0
WS*cyc
+tcl-5.0
Ñ
Ñ
ns
ns
122 WR Deassertion to Address Not Valid tch-12 Ñ tch-9 Ñ tch-7.5 Ñ ns
123 WR Assertion to Data Out Valid WS=0
WS>0
tch-9
0
tch+10
10
tch-7
0
tch+8
8
tch-5.5
0
tch+6.5
6.5
ns
ns
124 Data Out Hold Time from WR
Deassertion (The maximum specifica-
tion is periodically sampled, and not
100% tested.)
tch-9 tch+7 tch-7 tch+6 tch-5.5 tch+4.5 ns
125 Data Out Setup Time to WR
Deassertion (see Note 6) WS=0
WS>0
tcl-5
WS*cyc
+tcl-5
Ñ
Ñ
tcl-5
WS*cyc
+tcl-5
Ñ
Ñ
tcl-5
WS*cyc
+tcl-5
Ñ
Ñ
ns
ns
126 RD Deassertion to Address Not Valid tch-9 Ñ tch-7 Ñ tch-5.5 Ñ ns
33
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
AC Electrical Characteristics - External Bus Asynchronous Timing
(Continued)
Notes:
1. With no external access from the DSP.
2. During external read or write access.
3. During external read-modify-write access.
4. During the STOP mode the external bus will not be released and BG will not go low. However,
if the bus is released (BG = 0) and the STOP instruction is executed while BG = 0 then the bus will remain
released while the DSP is in the stop state and BG will remain low.
5. During the WAIT mode the BR/BG circuits remain active.
6. Typical values at 5V are: at 20.5 MHz and WS=0, Min = tcl-4
at 20.5 MHz and WS>0, Min = WS*cyc+tcl-4
at 27 MHz and WS=0, Min = tcl-3
at 27 MHz and WS>0, Min = WS*cyc+tcl-3
at 33 MHz and WS=0, Min = tcl-2.5
at 33 MHz and WS>0, Min = WS*cyc+tcl-2.5
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
127 Address Valid to WS = 0
RD deassertion WS > 0
cyc+tcl-8
((WS+1)*
cyc)+tcl-8
Ñ
Ñ
cyc+tcl-6
((WS+1)*
cyc)+tcl-6
Ñ
Ñ
cyc+tcl-6
((WS+1)*
cyc)+tcl-6
Ñ
Ñ
ns
ns
128 Input Data Hold Time to RD
Deassertion
0Ñ0Ñ0Ñns
129 RD Assertion Width WS = 0
WS > 0
cyc-9
((WS+1)*
cyc)-9
Ñ
Ñ
cyc-7
((WS+1)*
cyc)-7
Ñ
Ñ
cyc-5.5
((WS+1)*
cyc)-5.5
Ñ
Ñ
ns
ns
130 Address Valid to WS = 0
Input Data Valid WS > 0
Ñ
Ñ
cyc+tcl-18
((WS+1)*
cyc)+tcl-18
Ñ
Ñ
cyc+tcl-14
((WS+1)*
cyc)+tcl-14
Ñ
Ñ
cyc+tcl-11
((WS+1)*
cyc)+tcl-11
ns
ns
131 Address Valid to RD Assertion tcl-9 tcl+5 tcl-7 tcl+5 tcl-5.5 tcl+5 ns
132 RD Assertion to WS=0
Input Data Valid WS>0
Ñ
Ñ
cyc-14
((WS+1)*
cyc)-14
Ñ
Ñ
cyc-11
((WS+1)*
cyc)-11
Ñ
Ñ
cyc-9
((WS+1)*
cyc)-9
ns
ns
133 WR Deassertion to RD Assertion cyc-15 Ñ cyc-12 Ñ cyc-10 Ñ ns
134 RD Deassertion to RD Assertion cyc-10 Ñ cyc-8 Ñ cyc-6.5 Ñ ns
135 WR Deassertion to WS=0
WR Assertion WS>0
cyc-15
cyc+tch-15
Ñ
Ñ
cyc-12
cyc+tch-12
Ñ
Ñ
cyc-10
cyc+tch-10
Ñ
Ñ
ns
ns
136 RD Deassertion to WS=0
WR Assertion WS>0
cyc-10
cyc+tch-10
Ñ
Ñ
cyc-8
cyc+tch-8
Ñ
Ñ
cyc-6.5
cyc+tch-
6.5
Ñ
Ñ
ns
ns
34
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
BR
BG
A0-A15, PS,
DS, X/Y,
RD, WR
D0-D23
115 116
117
118
119
Async. Bus Figure 1. Bus Request / Bus Grant Timing
A0-A15, DS,
PS, X/Y
(See Note 1)
RD
WR
D0-D23 DATA OUT DATA
IN
120
135 121
122
133
131 129
127 126
134
123
136
128
125 124
130
132
Note:
1. During Read-Modify-Write instructions and internal instructions,
the address lines do not change state.
Async. Bus Figure 2. External Bus Asynchronous Timing
35
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
AC Electrical Characteristics - External Bus Synchronous Timing
Vcc = 5.0 Vdc + 10%; TJ = -40 to 105û C at 20.5 MHz 27 MHz
Vcc = 5.0 Vdc + 5%; TJ = -40 to 105û C at 33 MHz
Notes:
1. AC timing specifications which are referenced to a device input signal are
measured in production with respect to the 50% point of the respective input
signalÕs transition.
2. WS are wait state values specified in the BCR.
3. Clk low to data-out invalid (spec. 146) and Clk low to address invalid (spec.
149) indicate the time after which data/address are no longer guaranteed to
be valid.
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
140 Clk Low Transition To Address Valid Ñ24Ñ19Ñ19ns
141 Clk High Transition To WR WS = 0
Assertion (see Note 2) WS > 0
0
0
19
tch+19
0
0
15
tch+15
0
0
17
tch+17
ns
ns
142 Clk High Transition To WR
Deassertion
521516513ns
143 Clk High Transition To RD Assertion 0 19 0 15 0 16 ns
144 Clk High Transition To RD Deassertion 5 17 5 13 4.5 10.5 ns
145 Clk Low Transition To Data-Out Valid Ñ 25 Ñ 19 Ñ 19 ns
146 Clk Low Transition To Data-Out Invalid
(see Note 3)
5Ñ4Ñ3.5Ñns
147 Data-In Valid To Clk High Transition
(Setup)
0Ñ0Ñ0Ñns
148 Clk High Transition To Data-In Invalid
(Hold)
12Ñ12Ñ1ns
ns
149 Clk Low To Address Invalid
(see Note 3)
3Ñ3Ñ3Ñns
36
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
Note: During Read-Modify-Write Instructions, the address lines do not change states.
T0 T1 T2 T3 T0 T1 T2 T3 T0
CLK in
A0-A15
DS,PS
X/Y
RD
WR
D0-D23 Data InData Out
140
Sync. Bus Figure 1. DSP56001 Synchronous Bus Timing
141 142
143 144
145 146
147
148
149
37
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
AC Electrical Characteristics - Bus Strobe / Wait Timing
Note:
1. AC timing specifications which are referenced to a device input signal are measured in production with
respect to the 50% point of the respective input signalÕs transition.
2. If wait states are also inserted using the BCR and if the number of wait states is greater than 2, then
specification numbers 156 and 157 can be increased accordingly.
3. BS deassertion to address invalid indicates the time after which the address are no longer guaranteed
to be valid.
4. The minimum number of wait states when using BS/WT is two (2).
5. For read-modify-write instructions, the address lines will not change states between the read and the
write cycle. However, BS will deassert before asserting again for the write cycle. If wait states are de-
sired for each of the read and write cycle, the WT pin must be asserted once for each cycle.
Num Characteristics 20.5 MHz 27 MHz 33 MHz Unit
Min Max Min Max Min Max
150 Clk Low Transition To BS Assertion 4 24 3 19 2.5 19 ns
151 WT Assertion To Clk Low Transition
(setup time)
4Ñ3Ñ2.5Ñns
ns
152 Clk Low Transition To WT Deassertion
For Minimum Timing
14 cyc-8 11 cyc-6 12 cyc-5 ns
153 WT Deassertion To Clk Low Transition
For Maximum Timing (2 wait states
8Ñ6Ñ5Ñns
154 Clk High Transition To BS Deassertion 5 26 4 20 3.5 19 ns
155 BS Assertion To Address Valid -2 10 -2 8 -2 6.5 ns
156 BS Assertion To WT Assertion
(see Note 2)
0 cyc-15 0 cyc-11 0 cyc-10 ns
157 BS Assertion To WT Deassertion
(See Note 2 and Note 4) WS < 2
WS > 2
cyc
(WS-1)
*cyc
2*cyc-15
WS*cyc
-15
cyc
(WS-1)
*cyc
2*cyc-11
WS*cyc
-11
cyc+4
(WS-1)
*cyc+4
2*cyc-10
WS*cyc
-10
ns
ns
158 WT Deassertion To BS Deassertion cyc+tcl 2*cyc+tcl
+23
cyc+tcl 2*cyc+tcl
+17
cyc+tcl 2*cyc+tcl
+15 ns
159 Minimum BS Deassertion Width For
Consecutive External Accesses
tch-7 Ñ tch-6 Ñ tch-4.5 Ñ ns
160 BS Deassertion To Address Invalid
(see Note 3)
tch-10 tch-8 tch-6.5
161 Data-In Valid to RD Deassertion
(Set Up)
16Ñ12Ñ1ns
38
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
Note: During Read-Modify-Write Instructions, the address lines do not change state.
However, BS will deassert before asserting again for the write cycle.
T0 T1 T2 Tw T2 Tw T2 T3 T0
EXTAL
A0-A15,
PS, DS,
X/Y
BS
WT
RD
D0-D23
WR
D0-D23
Bus Arbitration Figure 1. DSP56001 Synchronous BS / WT Timings
Data In
143
140 149
144
150
151
152
153
147
148
154
141 142
145 146
Data Out
39
DSP56001 MOTOROLA
DSP56001 Electrical Characteristics
Note: During Read-Modify-Write Instructions, the address lines will not change states.
However, BS will deassert before asserting again for the write cycle.
A0-A15,
PS, DS,
X/Y
BS
WT
RD
D0-D23
WR
D0-D23
Bus Arbitration Figure 2. DSP56001 Asynchronous BS / WT Timings
158
159
156
157
161
128
Data Out
131 126
125
124
120
155
122
160
Data In
123
40
MOTOROLA
DSP56001 Electrical Characteristics
DSP56001
A-1
DSP56001 MOTOROLA
ORDERING INFORMATION
DSP56001 SOCKET INFORMATION
PGA
Supplier Telephone Socket Type Part Number Comment
Advanced Interconnections
(401) 823-5200 Standard 88 Pin 4CS088-01TG2Includes Cutout in Center
AMP
(717) 564-0100 Standard 88 Pin 1-916223-3 Low Insertion Force
1-55283-9 ZIF Production
Standard 128 Pin 1-55383-4 ZIF Burn-In and Test
Robinson Nugent
(812) 945-0211 Custom Pinout PGA-088CM3P-S-TG3
PGA-088CHP3-SL-TG3High Temp, Longer Leads
Samtec
(812) 944-6733 Standard 120 Pin MVAS-120-ZSTT-131Includes Cutout in Center
Custom 88 Pin CPAS-88-ZSTT-13BF1No Cutout
NOTES:
1. Please specify wirewrap and plating options. The part numbers shown specify low profile solder tail pins having a tin contact
and tin shell.
2. Please specify wirewrap and plating options. The part number shown specifies gold contact and tin shell.
3. Cutout in the center, unused holes are plugged, solder tail.
CQFP
Supplier Telephone Socket Type Part Number Comment
AMP
(717)564-0100 Ñ 822054-21Converts CQFP to fit AMPÕs
132 position PQFP ÒMicro-Pitch
SocketÓ.
NOTES:
1. This part is not a socket. It is a converter that allows a CQFP part to be used in the PQFP socket described below.
PQFP
Supplier Telephone Socket Type Part Number Comment
AMP
(717)564-0100 132 Pin 821949-51Housing Sub-Assembly and
821942-11Cover for 132 position PQFP
ÒMicro-Pitch SocketÓ.
NOTES:
1. One housing sub-assembly and one cover are required for each socket.
DSP56001FE 33
20 = 20.5 MHz.
27 = 27 MHz
Frequency
Pack age Type
RC = Pin Grid Array
FE = Ceramic Quad
Flat Pack (CQFP)
DSP Type
56001 = RAM Part
FC = Plastic Quad
Flat Pack (PQFP)
33 = 33 MHz.
APPENDIX A
A-2 DSP56001MOTOROLA
N
D0 A14 A13 A12 A10 A8 A7 A6 A4 A2 A1 PS X/Y
M
D3 D1 A15 A11 A9 A5 A3 A0 DS WR
L
D4 D2 GND VCC GND RD BR
K
D6 D5 BG SC1
J
D8 D7 GND SRD STD
H
D9 SC2
G
D10 VCC GND VCC SCK
F
D11 D12 SC0 SCLK
E
D13 GND TXD
D
D14 D16 GND H0 RXD
C
D15 D18 VCC VCC H2 H1
B
D17 D20 D23 IRQA EXTAL GND HA0 HREQ H7 H4 H3
A
D19 D21 D22 IRQB RESET XTAL HA2 HA1 HACK HEN HR/W H6 H5
12345678910111213
BOTTOM VIEW
PIN ASSIGNMENT
G
G
ÐBÐ
ÐAÐ
RC SUFFIX
CERAMIC
CASE 789D-01 K
ÐTÐ ÐXÐ
CD 88 PL
N
M
L
K
J
H
G
F
E
D
C
B
A
12345678910111213
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 34.04 35.05 1.340 1.380
B 34.04 35.05 1.340 1.380
C 2.16 3.04 0.085 0.120
D 0.44 0.55 0.017 0.022
G 2.54 BSC 0.100 BSC
K 4.20 5.08 0.165 0.200
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M. 1982.
2. CONTROLLING DIMENSION: INCH.
O 0.76 (0.030) O T A S B S
O 0.25 (0.010) O X
MATRIX
PINS
Mechanical Specification Figure A-1. Pin Grid Array Mechanical Specification
A-3
DSP56001 MOTOROLA
PIN # FUNCTION PIN # FUNCTION PIN # FUNCTION PIN # FUNCTION
17 NO CONNECT 116 NO CONNECT 83 NO CONNECT 50 NO CONNECT
16 H4 115 D20 82 D1 49 DS
15 H5 114 D19 81 D0 48 X/Y
14 H6 113 D18 80 A15 47 RD
13 PERIPHERAL VCC 112 DATA BUS GND 79 A14 46 WR
12 PERIPHERAL VCC 111 DATA BUS GND 78 NO CONNECT 45 BR
11 H7 110 NO CONNECT 77 A13 44 NO CONNECT
10 HREQ 109 D17 76 A12 43 BG
9 HR/W 108 D16 75 A11 42 SRD
8 HEN 107 NO CONNECT 74 ADDRESS BUS GND 41 NO CONNECT
7 NO CONNECT 106 D15 73 ADDRESS BUS GND 40 SC1
6HACK 105 D14 72 NO CONNECT 39 STD
5 HA0 104 D13 71 A10 38 NO CONNECT
4 NO CONNECT 103 NO CONNECT 70 A9 37 SC2
3 NO CONNECT 102 D12 69 NO CONNECT 36 INTERNAL LOGIC VCC
2 HA1 101 DATA BUS VCC 68 A8 35 INTERNAL LOGIC VCC
1 HA2 100 DATA BUS VCC 67 A7 34 INTERNAL LOGIC GND
132 NO CONNECT 99 D11 66 NO CONNECT 33 INTERNAL LOGIC GND
131 INTERNAL LOGIC GND 98 NO CONNECT 65 A6 32 SCK
130 INTERNAL LOGIC GND 97 D10 64 ADDRESS BUS VCC 31 SC0
129 INTERNAL LOGIC VCC 96 D9 63 ADDRESS BUS VCC 30 NO CONNECT
128 INTERNAL LOGIC VCC 95 NO CONNECT 62 NO CONNECT 29 SCLK
127 EXTAL 94 D8 61 A5 28 TXD
126 XTAL 93 D7 60 A4 27 RXD
125 NO CONNECT 92 D6 59 NO CONNECT 26 NO CONNECT
124 RESET 91 DATA BUS GND 58 A3 25 H0
123 MODA/IRQA 90 DATA BUS GND 57 A2 24 PERIPHERAL GND
122 NO CONNECT 89 NO CONNECT 56 ADDRESS BUS GND 23 PERIPHERAL GND
121 NMI/MODB/IRQB 88 D5 55 ADDRESS BUS GND 22 H1
120 D23 87 D4 54 A1 21 NO CONNECT
119 D22 86 D3 53 A0 20 H2
118 D21 85 D2 52 PS 19 H3
117 NO CONNECT 84 NO CONNECT 51 NO CONNECT 18 NO CONNECT
Mechanical Specification Table A-1. CQFP and PQFP Pin Out
Note: Do not connect to ÒNO CONNECTÓ pins.
ÒNO CONNECTÓ pins are reserved for future enhancements.
A-4 DSP56001MOTOROLA
Mechanical Specification Figure A-2. Ceramic Quad Flat Pack
A-5
DSP56001 MOTOROLA
Mechanical Specification Figure A-2. Ceramic Quad Flat Pack (Continued)
A-6 DSP56001MOTOROLA
Mechanical Specification Figure A-3. Plastic Quad Flat Pack
A-7
DSP56001 MOTOROLA
Mechanical Specification Figure A-3. Plastic Quad Flat Pack (Continued)
A-8 DSP56001MOTOROLA
B-1
DSP56001 MOTOROLA
The lowest cost DSP56001 based system is shown in Figure B-
1. It uses no run time external memory and requires only two
chips, the DSP56001 and a low cost EPROM. The EPROM read
access time should be less than 780 nanoseconds when the
DSP56001 is operating at a clock rate of 20.5 MHz.
A system with external data RAM memory requires no glue logic
to select the external EPROM from bootstrap mode. PS is used
to enable the EPROM and DS is used to enable the high speed
data memories as shown in Figure B-2.
APPENDIX B
APPLICATION EXAMPLES
DSP56001
D23
MODA/IRQA
RESET
MODB/IRQB
11
8
MBD301*
MBD301*
15K 15K 15K 15K
+5 V +5 V
CE
A0-A10
D0-D7
FROM OPEN
COLLECTOR
BUFFER
FROM
RESET
FUNCTION
FROM OPEN
COLLECTOR
BUFFER
2716
PS
A0-A10
D0-D7
DSP56001
D23
MODA/IRQA
RESET
MODB/IRQB 24
8
MBD301*
MBD301*
15K 15K 15K
15K
+5 V
+5 V
FROM OPEN
COLLECTOR
BUFFER
FROM
RESET
FUNCTION
FROM OPEN
COLLECTOR
BUFFER
A0-A10
D0-D7
A0-A9 A10 CS WE OE
RD
PS
X/Y
DS
WR
CE A0-A10
2716
D0-D23
11 10
2018-55 (3)
D0-D23
Figure B-1. No Glue Logic, Low Cost Memory Port Bootstrap Ñ Mode 1
Figure B-2. Port A Bootstrap with External Data RAM Ñ Mode 1
15K 15K
BR
HACK
15K
+5 V
BR
HACK
15K
+5 V
Note: When in RESET,
IRQA and IRQB must
be deasserted by external
peripherals.
Note *: These diodes must be Schottky diodes.
Note *: These diodes must be Schottky diodes.
B-2 DSP56001MOTOROLA
Figure B-3 shows the DSP56001 bootstrapping via the Host Port
from an MC68000.
Systems with external program memory can load the on-chip
PRAM without using the bootstrap mode. In Figure B-4, the
DSP56001 is operated in mode 2 with external program memory
at location $E000. The programmer can overlay the high speed
on-chip PRAM with DSP algorithms by using the MOVEM in-
struction.
DSP56001
MODA/IRQA
RESET
MODB/IRQB
24
MBD301*
MBD301*
15K 15K 15K
+5 V
FROM OPEN
COLLECTOR
BUFFER
FROM
RESET
FUNCTION
FROM OPEN
COLLECTOR
BUFFER
A0-A14
A0-A14 CS OE
RD
PS
D0-D23
15
2756-30 (3)
D0-D23
DSP56001
MODA/IRQA
RESET
MODB/IRQB
MBD301*
MBD301*
15K 15K 15K
+5 V
FROM OPEN
COLLECTOR
BUFFER
FROM
RESET
FUNCTION
FROM OPEN
COLLECTOR
BUFFER
HR/W
HEN
H0-H7
F32
F32
F32
F32
LS09
ADDRESS
DECODE
1K
+5 V
HA0-HA2
LDS
AS
DTACK
A1-A3
D0-D7
R/W
A4-A23
8
3
D23
15K
MC68000
(12.5MHz)
Figure B-4. 32K Words of External Program ROM Ñ Mode 2
Figure B-3. DSP56001 Host Bootstrap Example Ñ Mode 1
15 KW
+5V
15 KW
+5V
HACK
BR
15K 15K
BR
HACK
Note *: These diodes must be Schottky diodes.
Note *: These diodes must be Schottky diodes.
B-3
DSP56001 MOTOROLA
330 W
470KW
20.5
MHz
10 pf10 pf
¥
¥
¥
XTAL
EXTAL
¥
Figure B-5. Alternative Clock Circuit from the Graphic Equalizer (APR2)
Figure B-5 shows an alternative clock oscillator circuit used in
the Graphic Equalizer application note (APR2). The 330W resis-
tor provides additional current limiting in the crystal. Figure B-6
shows a circuit which waits until Vcc on the DSP is at least 4.5 V
before initiating a 3.75 ms minimum (150,000T) oscillator stabili-
zation delay required for the on-chip oscillator (only 50T is re-
quired for an external oscillator). This insures that the DSP is op-
erational and stable before releasing the reset signal.
¥
¥
RESET
¥
1.2 Vref
+
-
¥¥
¥
+5V
¥
MC34064
¥
¥
¥
U1
MC33064
2 (2)
3 (4)
1 (1)
CDLY
R
tDLY = RCDLY In
1
1 - Vth
Vin - Vol
tDLY = 150,000T min.
Vin = 5 V
R = 8.2K + 5%
fosc = 20.5 MHz
Vth = 2.5 V
Vol = 0.4 V
CDLY = 1 mf + 20%
T = 25 ns
Where:
Figure B-6. Reset Circuit Using MC34064/MC33064
2. MODA and MODB
Notes: 1. IRQA and IRQB must
be hardwired.
must be hard wired.
LOGIC
RESET
¥
B-4 DSP56001MOTOROLA
Figure 7 illustrates how to connect a 20 ns static RAM with a 33
MHz. DSP56001. The important parameters are TDW < 10 ns,
TDOE < 10 ns, and TAA = 20 ns maximum. A 7.5 ns PLD is used
to minimize decoding delays. This example maps the static RAM
into the ranges X:$1000-1FFF and Y:$1000-1FFF. The PLD
equation is:
RAM_ENABLE = PS & !DS & !A15 & !A14 & !A13 & !A12
16L8-7
7.5ns PLD
DATA
ADDRESS
OE
WR
CS
DATA
ADDRESS
DS
PS
RD
WR
MCM6264D
(8K X 8) 20 ns
DSP56001
27 MHZ
Figure B-7. 27 MHz DSP56001 with 20 ns SRAM
A12
A13
A14
A15
4
5
6
7
8
9DS
PS
12 E
RAM_ENABLE
B-5
DSP56001 MOTOROLA
Figure B-8 shows the DSP56001 connected to the bus of an
IBM-PC computer. The PAL equations and other details of this
circuit are available in ÒAn ISA BUS INTERFACE FOR THE
DSP56001Ó which is provided on request by the Motorola DSP
Marketing Department (512-891-2030).
Figure B-8. DSP56001-to-ISA Bus Interface Schematic
HA0
HA1
HA2
HEN
HR/W
MODA/IRQA
MODB/IRQB
RESET
D23
BR
HREQ
HACK
B11
D01
D02
D03
D04
D05
D06
A02
A01
A00
D07
A10
A11
B5
A4
A9
A521
23 L13
B10
13
B4
D00
A09
A08
A07
A06
A05
A04
A03
A02
A29
A30
A31
1
5
14
2
616
22
8
4
17
7
3
9
OSC
A04
A05
A06
A07
A08
A09
A14
A17
A22
A23
A24
A25
A26
A27
B30
MC74ACT245 PAL22V10
NOTE:
CONNECTOR is J1 of ISA BUS
H7
H6
H5
H4
H3
H2
H1
H0
All Series Resistors 15K OHMS
+5v
10
11
AEN
IOR
IOW
B13
B14
A11 15
DSP56001
A12
B12
A13
B13
C12
C13
D12
9
8
6
7
5
4
3
2
B8
A8
A7
11
12
14
13
15
16
17
18
19 1
OE DIR
IRQB
IRQA
B-6 DSP56001MOTOROLA
C-1 DSP56001MOTOROLA
ORG X:$100
;
M_00 DC $7D7C00 ; 8031
M_01 DC $797C00 ; 7775
M_02 DC $757C00 ; 7519
M_03 DC $717C00 ; 7263
M_04 DC $6D7C00 ; 7007
M_05 DC $697C00 ; 6751
M_06 DC $657C00 ; 6495
M_07 DC $617C00 ; 6239
M_08 DC $5D7C00 ; 5983
M_09 DC $597C00 ; 5727
M_0A DC $557C00 ; 5471
M_0B DC $517C00 ; 5215
M_0C DC $4D7C00 ; 4959
M_0D DC $497C00 ; 4703
M_0E DC $457C00 ; 4447
M_0F DC $417C00 ; 4191
M_10 DC $3E7C00 ; 3999
M_11 DC $3C7C00 ; 3871
M_12 DC $3A7C00 ; 3743
M_13 DC $387C00 ; 3615
M_14 DC $367C00 ; 3487
M_15 DC $347C00 ; 3359
M_16 DC $327C00 ; 3231
M_17 DC $307C00 ; 3103
M_18 DC $2E7C00 ; 2975
M_19 DC $2C7C00 ; 2847
M_1A DC $2A7C00 ; 2719
M_1B DC $287C00 ; 2591
M_1C DC $267C00 ; 2463
M_1D DC $247C00 ; 2335
M_1E DC $227C00 ; 2207
M_1F DC $207C00 ; 2079
M_20 DC $1EFC00 ; 1983
M_21 DC $1DFC00 ; 1919
M_22 DC $1CFC00 ; 1855
M_23 DC $1BFC00 ; 1791
M_24 DC $1AFC00 ; 1727
M_25 DC $19FC00 ; 1663
M_26 DC $18FC00 ; 1599
M_27 DC $17FC00 ; 1535
M_28 DC $16FC00 ; 1471
M_29 DC $15FC00 ; 1407
M_2A DC $14FC00 ; 1343
M_2B DC $13FC00 ; 1279
M_2C DC $12FC00 ; 1215
M_2D DC $11FC00 ; 1151
M_2E DC $10FC00 ; 1087
M_2F DC $0FFC00 ; 1023
M_30 DC $0F3C00 ; 975
M_31 DC $0EBC00 ; 943
M_32 DC $0E3C00 ; 911
M_33 DC $0DBC00 ; 879
M_34 DC $0D3C00 ; 847
M_35 DC $0CBC00 ; 815
M_36 DC $0C3C00 ; 783
M_37 DC $0BBC00 ; 751
M_38 DC $0B3C00 ; 719
M_39 DC $0ABC00 ; 687
M_3A DC $0A3C00 ; 655
M_3B DC $09BC00 ; 623
M_3C DC $093C00 ; 591
M_3D DC $08BC00 ; 559
M_3E DC $083C00 ; 527
M_3F DC $07BC00 ; 495
M_40 DC $075C00 ; 471
M_41 DC $071C00 ; 455
M_42 DC $06DC00 ; 439
M_43 DC $069C00 ; 423
M_44 DC $065C00 ; 407
M_45 DC $061C00 ; 391
M_46 DC $05DC00 ; 375
M_47 DC $059C00 ; 359
M_48 DC $055C00 ; 343
M_49 DC $051C00 ; 327
M_4A DC $04DC00 ; 311
M_4B DC $049C00 ; 295
M_4C DC $045C00 ; 279
M_4D DC $041C00 ; 263
M_4E DC $03DC00 ; 247
M_4F DC $039C00 ; 231
M_50 DC $036C00 ; 219
M_51 DC $034C00 ; 211
M_52 DC $032C00 ; 203
M_53 DC $030C00 ; 195
M_54 DC $02EC00 ; 187
M_55 DC $02CC00 ; 179
M_56 DC $02AC00 ; 171
M_57 DC $028C00 ; 163
M_58 DC $026C00 ; 155
M_59 DC $024C00 ; 147
M_5A DC $022C00 ; 139
M_5B DC $020C00 ; 131
M_5C DC $01EC00 ; 123
M_5D DC $01CC00 ; 115
M_5E DC $01AC00 ; 107
M_5F DC $018C00 ; 99
M_60 DC $017400 ; 93
M_61 DC $016400 ; 89
M_62 DC $015400 ; 85
M_63 DC $014400 ; 81
M_64 DC $013400 ; 77
M_65 DC $012400 ; 73
M_66 DC $011400 ; 69
M_67 DC $010400 ; 65
M_68 DC $00F400 ; 61
M_69 DC $00E400 ; 57
M_6A DC $00D400 ; 53
M_6B DC $00C400 ; 49
M_6C DC $00B400 ; 45
M_6D DC $00A400 ; 41
M_6E DC $009400 ; 37
M_6F DC $008400 ; 33
M_70 DC $007800 ; 30
M_71 DC $007000 ; 28
M_72 DC $006800 ; 26
M_73 DC $006000 ; 24
M_74 DC $005800 ; 22
M_75 DC $005000 ; 20
M_76 DC $004800 ; 18
M_77 DC $004000 ; 16
M_78 DC $003800 ; 14
M_79 DC $003000 ; 12
M_7A DC $002800 ; 10
M_7B DC $002000 ; 8
M_7C DC $001800 ; 6
M_7D DC $001000 ; 4
M_7E DC $000800 ; 2
M_7F DC $000000 ; 0
APPENDIX C
MU-LAW / A-LAW EXPANSION TABLES
Figure C-1. Mu-Law/A-Law Expansion Table Contents (Sheet 1 of 2)
C-2
DSP56001 MOTOROLA
A_80 DC $158000 ; 688
A_81 DC $148000 ; 656
A_82 DC $178000 ; 752
A_83 DC $168000 ; 720
A_84 DC $118000 ; 560
A_85 DC $108000 ; 528
A_86 DC $138000 ; 624
A_87 DC $128000 ; 592
A_88 DC $1D8000 ; 944
A_89 DC $1C8000 ; 912
A_8A DC $1F8000 ; 1008
A_8B DC $1E8000 ; 976
A_8C DC $198000 ; 816
A_8D DC $188000 ; 784
A_8E DC $1B8000 ; 880
A_8F DC $1A8000 ; 848
A_90 DC $0AC000 ; 344
A_91 DC $0A4000 ; 328
A_92 DC $0BC000 ; 376
A_93 DC $0B4000 ; 360
A_94 DC $08C000 ; 280
A_95 DC $084000 ; 264
A_96 DC $09C000 ; 312
A_97 DC $094000 ; 296
A_98 DC $0EC000 ; 472
A_99 DC $0E4000 ; 456
A_9A DC $0FC000 ; 504
A_9B DC $0F4000 ; 488
A_9C DC $0CC000 ; 408
A_9D DC $0C4000 ; 392
A_9E DC $0DC000 ; 440
A_9F DC $0D4000 ; 424
A_A0 DC $560000 ; 2752
A_A1 DC $520000 ; 2624
A_A2 DC $5E0000 ; 3008
A_A3 DC $5A0000 ; 2880
A_A4 DC $460000 ; 2240
A_A5 DC $420000 ; 2112
A_A6 DC $4E0000 ; 2496
A_A7 DC $4A0000 ; 2368
A_A8 DC $760000 ; 3776
A_A9 DC $720000 ; 3648
A_AA DC $7E0000 ; 4032
A_AB DC $7A0000 ; 3904
A_AC DC $660000 ; 3264
A_AD DC $620000 ; 3136
A_AE DC $6E0000 ; 3520
A_AF DC $6A0000 ; 3392
A_B0 DC $2B0000 ; 1376
A_B1 DC $290000 ; 1312
A_B2 DC $2F0000 ; 1504
A_B3 DC $2D0000 ; 1440
A_B4 DC $230000 ; 1120
A_B5 DC $210000 ; 1056
A_B6 DC $270000 ; 1248
A_B7 DC $250000 ; 1184
A_B8 DC $3B0000 ; 1888
A_B9 DC $390000 ; 1824
A_BA DC $3F0000 ; 2016
A_BB DC $3D0000 ; 1952
A_BC DC $330000 ; 1632
A_BD DC $310000 ; 1568
A_BE DC $370000 ; 1760
A_BF DC $350000 ; 1696
A_C0 DC $015800 ; 43
A_C1 DC $014800 ; 41
A_C2 DC $017800 ; 47
A_C3 DC $016800 ; 45
A_C4 DC $011800 ; 35
A_C5 DC $010800 ; 33
A_C6 DC $013800 ; 39
A_C7 DC $012800 ; 37
A_C8 DC $01D800 ; 59
A_C9 DC $01C800 ; 57
A_CA DC $01F800 ; 63
A_CB DC $01E800 ; 61
A_CC DC $019800 ; 51
A_CD DC $018800 ; 49
A_CE DC $01B800 ; 55
A_CF DC $01A800 ; 53
A_D0 DC $005800 ; 11
A_D1 DC $004800 ; 9
A_D2 DC $007800 ; 15
A_D3 DC $006800 ; 13
A_D4 DC $001800 ; 3
A_D5 DC $000800 ; 1
A_D6 DC $003800 ; 7
A_D7 DC $002800 ; 5
A_D8 DC $00D800 ; 27
A_D9 DC $00C800 ; 25
A_DA DC $00F800 ; 31
A_DB DC $00E800 ; 29
A_DC DC $009800 ; 19
A_DD DC $008800 ; 17
A_DE DC $00B800 ; 23
A_DF DC $00A800 ; 21
A_E0 DC $056000 ; 172
A_E1 DC $052000 ; 164
A_E2 DC $05E000 ; 188
A_E3 DC $05A000 ; 180
A_E4 DC $046000 ; 140
A_E5 DC $042000 ; 132
A_E6 DC $04E000 ; 156
A_E7 DC $04A000 ; 148
A_E8 DC $076000 ; 236
A_E9 DC $072000 ; 228
A_EA DC $07E000 ; 252
A_EB DC $07A000 ; 244
A_EC DC $066000 ; 204
A_ED DC $062000 ; 196
A_EE DC $06E000 ; 220
A_EF DC $06A000 ; 212
A_F0 DC $02B000 ; 86
A_F1 DC $029000 ; 82
A_F2 DC $02F000 ; 94
A_F3 DC $02D000 ; 90
A_F4 DC $023000 ; 70
A_F5 DC $021000 ; 66
A_F6 DC $027000 ; 78
A_F7 DC $025000 ; 74
A_F8 DC $03B000 ; 118
A_F9 DC $039000 ; 114
A_FA DC $03F000 ; 126
A_FB DC $03D000 ; 122
A_FC DC $033000 ; 102
A_FD DC $031000 ; 98
A_FE DC $037000 ; 110
A_FF DC $035000 ; 106
Figure C-1. Mu-Law/A-Law Expansion Table Contents (Sheet 2 of 2)
D-1 DSP56001MOTOROLA
This sine wave table is normally used by FFT routines which use bit reversed address pointers. This table can be used as it is for up
to 512 point FFTs; however, for larger FFTs, the table must be copied to a different memory location to allow the reverse-carry address-
ing mode to be used (see Section 5.3.2.3 REVERSE-CARRY MODIFIER (Mn=$0000) in the DSP56000/DSP56001 Digital Signal
Processor UserÕs Manual for additional information).
APPENDIX D
SINE WAVE TABLE
ORG Y:$100
;
S_00 DC $000000 ; +0.0000000000
S_01 DC $03242B ; +0.0245412998
S_02 DC $0647D9 ; +0.0490676016
S_03 DC $096A90 ; +0.0735644996
S_04 DC $0C8BD3 ; +0.0980170965
S_05 DC $0FAB27 ; +0.1224106997
S_06 DC $12C810 ; +0.1467303932
S_07 DC $15E214 ; +0.1709619015
S_08 DC $18F8B8 ; +0.1950902939
S_09 DC $1C0B82 ; +0.2191012055
S_0A DC $1F19F9 ; +0.2429800928
S_0B DC $2223A5 ; +0.2667128146
S_0C DC $25280C ; +0.2902846038
S_0D DC $2826B9 ; +0.3136816919
S_0E DC $2B1F35 ; +0.3368898928
S_0F DC $2E110A ; +0.3598949909
S_10 DC $30FBC5 ; +0.3826833963
S_11 DC $33DEF3 ; +0.4052414000
S_12 DC $36BA20 ; +0.4275551140
S_13 DC $398CDD ; +0.4496113062
S_14 DC $3C56BA ; +0.4713967144
S_15 DC $3F174A ; +0.4928981960
S_16 DC $41CE1E ; +0.5141026974
S_17 DC $447ACD ; +0.5349975824
S_18 DC $471CED ; +0.5555701852
S_19 DC $49B415 ; +0.5758082271
S_1A DC $4C3FE0 ; +0.5956993103
S_1B DC $4EBFE9 ; +0.6152315736
S_1C DC $5133CD ; +0.6343932748
S_1D DC $539B2B ; +0.6531729102
S_1E DC $55F5A5 ; +0.6715589762
S_1F DC $5842DD ; +0.6895405054
S_20 DC $5A827A ; +0.7071068287
S_21 DC $5CB421 ; +0.7242470980
S_22 DC $5ED77D ; +0.7409511805
S_23 DC $60EC38 ; +0.7572088242
S_24 DC $62F202 ; +0.7730104923
S_25 DC $64E889 ; +0.7883464098
S_26 DC $66CF81 ; +0.8032075167
S_27 DC $68A69F ; +0.8175848722
S_28 DC $6A6D99 ; +0.8314697146
S_29 DC $6C2429 ; +0.8448535204
S_2A DC $6DCA0D ; +0.8577286005
S_2B DC $6F5F03 ; +0.8700870275
S_2C DC $70E2CC ; +0.8819212914
S_2D DC $72552D ; +0.8932244182
S_2E DC $73B5EC ; +0.9039893150
S_2F DC $7504D3 ; +0.9142097235
S_30 DC $7641AF ; +0.9238795042
S_31 DC $776C4F ; +0.9329928160
S_32 DC $788484 ; +0.9415441155
S_33 DC $798A24 ; +0.9495282173
S_34 DC $7A7D05 ; +0.9569402933
S_35 DC $7B5D04 ; +0.9637761116
S_36 DC $7C29FC ; +0.9700313210
S_37 DC $7CE3CF ; +0.9757022262
S_38 DC $7D8A5F ; +0.9807853103
S_39 DC $7E1D94 ; +0.9852777123
S_3A DC $7E9D56 ; +0.9891765118
S_3B DC $7F0992 ; +0.9924796224
S_3C DC $7F6237 ; +0.9951847792
S_3D DC $7FA737 ; +0.9972904921
S_3E DC $7FD888 ; +0.9987955093
S_3F DC $7FF622 ; +0.9996988773
S_40 DC $7FFFFF ; +0.9999998808
S_41 DC $7FF622 ; +0.9996988773
S_42 DC $7FD888 ; +0.9987955093
S_43 DC $7FA737 ; +0.9972904921
S_44 DC $7F6237 ; +0.9951847792
S_45 DC $7F0992 ; +0.9924796224
S_46 DC $7E9D56 ; +0.9891765118
S_47 DC $7E1D94 ; +0.9852777123
S_48 DC $7D8A5F ; +0.9807853103
S_49 DC $7CE3CF ; +0.9757022262
S_4A DC $7C29FC ; +0.9700313210
S_4B DC $7B5D04 ; +0.9637761116
S_4C DC $7A7D05 ; +0.9569402933
S_4D DC $798A24 ; +0.9495282173
S_4E DC $788484 ; +0.9415441155
S_4F DC $776C4F ; +0.9329928160
S_50 DC $7641AF ; +0.9238795042
S_51 DC $7504D3 ; +0.9142097235
S_52 DC $73B5EC ; +0.9039893150
S_53 DC $72552D ; +0.8932244182
S_54 DC $70E2CC ; +0.8819212914
S_55 DC $6F5F03 ; +0.8700870275
S_56 DC $6DCA0D ; +0.8577286005
S_57 DC $6C2429 ; +0.8448535204
S_58 DC $6A6D99 ; +0.8314697146
S_59 DC $68A69F ; +0.8175848722
S_5A DC $66CF81 ; +0.8032075167
S_5B DC $64E889 ; +0.7883464098
S_5C DC $62F202 ; +0.7730104923
S_5D DC $60EC38 ; +0.7572088242
S_5E DC $5ED77D ; +0.7409511805
S_5F DC $5CB421 ; +0.7242470980
S_60 DC $5A827A ; +0.7071068287
S_61 DC $5842DD ; +0.6895405054
S_62 DC $55F5A5 ; +0.6715589762
S_63 DC $539B2B ; +0.6531729102
S_64 DC $5133CD ; +0.6343932748
S_65 DC $4EBFE9 ; +0.6152315736
S_66 DC $4C3FE0 ; +0.5956993103
S_67 DC $49B415 ; +0.5758082271
S_68 DC $471CED ; +0.5555701852
S_69 DC $447ACD ; +0.5349975824
S_6A DC $41CE1E ; +0.5141026974
S_6B DC $3F174A ; +0.4928981960
S_6C DC $3C56BA ; +0.4713967144
S_6D DC $398CDD ; +0.4496113062
S_6E DC $36BA20 ; +0.4275551140
S_6F DC $33DEF3 ; +0.4052414000
S_70 DC $30FBC5 ; +0.3826833963
S_71 DC $2E110A ; +0.3598949909
S_72 DC $2B1F35 ; +0.3368898928
Figure D-1. Sine Wave Table Contents (Sheet 1 of 3)
D-2
DSP56001 MOTOROLA
S_73 DC $2826B9 ; +0.3136816919
S_74 DC $25280C ; +0.2902846038
S_75 DC $2223A5 ; +0.2667128146
S_76 DC $1F19F9 ; +0.2429800928
S_77 DC $1C0B82 ; +0.2191012055
S_78 DC $18F8B8 ; +0.1950902939
S_79 DC $15E214 ; +0.1709619015
S_7A DC $12C810 ; +0.1467303932
S_7B DC $0FAB27 ; +0.1224106997
S_7C DC $0C8BD3 ; +0.0980170965
S_7D DC $096A90 ; +0.0735644996
S_7E DC $0647D9 ; +0.0490676016
S_7F DC $03242B ; +0.0245412998
S_80 DC $000000 ; +0.0000000000
S_81 DC $FCDBD5 ; -0.0245412998
S_82 DC $F9B827 ; -0.0490676016
S_83 DC $F69570 ; -0.0735644996
S_84 DC $F3742D ; -0.0980170965
S_85 DC $F054D9 ; -0.1224106997
S_86 DC $ED37F0 ; -0.1467303932
S_87 DC $EA1DEC ; -0.1709619015
S_88 DC $E70748 ; -0.1950902939
S_89 DC $E3F47E ; -0.2191012055
S_8A DC $E0E607 ; -0.2429800928
S_8B DC $DDDC5B ; -0.2667128146
S_8C DC $DAD7F4 ; -0.2902846038
S_8D DC $D7D947 ; -0.3136816919
S_8E DC $D4E0CB ; -0.3368898928
S_8F DC $D1EEF6 ; -0.3598949909
S_90 DC $CF043B ; -0.3826833963
S_91 DC $CC210D ; -0.4052414000
S_92 DC $C945E0 ; -0.4275551140
S_93 DC $C67323 ; -0.4496113062
S_94 DC $C3A946 ; -0.4713967144
S_95 DC $C0E8B6 ; -0.4928981960
S_96 DC $BE31E2 ; -0.5141026974
S_97 DC $BB8533 ; -0.5349975824
S_98 DC $B8E313 ; -0.5555701852
S_99 DC $B64BEB ; -0.5758082271
S_9A DC $B3C020 ; -0.5956993103
S_9B DC $B14017 ; -0.6152315736
S_9C DC $AECC33 ; -0.6343932748
S_9D DC $AC64D5 ; -0.6531729102
S_9E DC $AA0A5B ; -0.6715589762
S_9F DC $A7BD23 ; -0.6895405054
S_A0 DC $A57D86 ; -0.7071068287
S_A1 DC $A34BDF ; -0.7242470980
S_A2 DC $A12883 ; -0.7409511805
S_A3 DC $9F13C8 ; -0.7572088242
S_A4 DC $9D0DFE ; -0.7730104923
S_A5 DC $9B1777 ; -0.7883464098
S_A6 DC $99307F ; -0.8032075167
S_A7 DC $975961 ; -0.8175848722
S_A8 DC $959267 ; -0.8314697146
S_A9 DC $93DBD7 ; -0.8448535204
S_AA DC $9235F3 ; -0.8577286005
S_AB DC $90A0FD ; -0.8700870275
S_AC DC $8F1D34 ; -0.8819212914
S_AD DC $8DAAD3 ; -0.8932244182
S_AE DC $8C4A14 ; -0.9039893150
S_AF DC $8AFB2D ; -0.9142097235
S_B0 DC $89BE51 ; -0.9238795042
S_B1 DC $8893B1 ; -0.9329928160
S_B2 DC $877B7C ; -0.9415441155
S_B3 DC $8675DC ; -0.9495282173
S_B4 DC $8582FB ; -0.9569402933
S_B5 DC $84A2FC ; -0.9637761116
S_B6 DC $83D604 ; -0.9700313210
S_B7 DC $831C31 ; -0.9757022262
S_B8 DC $8275A1 ; -0.9807853103
S_B9 DC $81E26C ; -0.9852777123
S_BA DC $8162AA ; -0.9891765118
S_BB DC $80F66E ; -0.9924796224
S_BC DC $809DC9 ; -0.9951847792
S_BD DC $8058C9 ; -0.9972904921
S_BE DC $802778 ; -0.9987955093
S_BF DC $8009DE ; -0.9996988773
S_C0 DC $800000 ; -1.0000000000
S_C1 DC $8009DE ; -0.9996988773
S_C2 DC $802778 ; -0.9987955093
S_C3 DC $8058C9 ; -0.9972904921
S_C4 DC $809DC9 ; -0.9951847792
S_C5 DC $80F66E ; -0.9924796224
S_C6 DC $8162AA ; -0.9891765118
S_C7 DC $81E26C ; -0.9852777123
S_C8 DC $8275A1 ; -0.9807853103
S_C9 DC $831C31 ; -0.9757022262
S_CA DC $83D604 ; -0.9700313210
S_CB DC $84A2FC ; -0.9637761116
S_CC DC $8582FB ; -0.9569402933
S_CD DC $8675DC ; -0.9495282173
S_CE DC $877B7C ; -0.9415441155
S_CF DC $8893B1 ; -0.9329928160
S_D0 DC $89BE51 ; -0.9238795042
S_D1 DC $8AFB2D ; -0.9142097235
S_D2 DC $8C4A14 ; -0.9039893150
S_D3 DC $8DAAD3 ; -0.8932244182
S_D4 DC $8F1D34 ; -0.8819212914
S_D5 DC $90A0FD ; -0.8700870275
S_D6 DC $9235F3 ; -0.8577286005
S_D7 DC $93DBD7 ; -0.8448535204
S_D8 DC $959267 ; -0.8314697146
S_D9 DC $975961 ; -0.8175848722
S_DA DC $99307F ; -0.8032075167
S_DB DC $9B1777 ; -0.7883464098
S_DC DC $9D0DFE ; -0.7730104923
S_DD DC $9F13C8 ; -0.7572088242
S_DE DC $A12883 ; -0.7409511805
S_DF DC $A34BDF ; -0.7242470980
S_E0 DC $A57D86 ; -0.7071068287
S_E1 DC $A7BD23 ; -0.6895405054
S_E2 DC $AA0A5B ; -0.6715589762
S_E3 DC $AC64D5 ; -0.6531729102
S_E4 DC $AECC33 ; -0.6343932748
S_E5 DC $B14017 ; -0.6152315736
S_E6 DC $B3C020 ; -0.5956993103
S_E7 DC $B64BEB ; -0.5758082271
S_E8 DC $B8E313 ; -0.5555701852
S_E9 DC $BB8533 ; -0.5349975824
S_EA DC $BE31E2 ; -0.5141026974
S_EB DC $C0E8B6 ; -0.4928981960
S_EC DC $C3A946 ; -0.4713967144
S_ED DC $C67323 ; -0.4496113062
S_EE DC $C945E0 ; -0.4275551140
S_EF DC $CC210D ; -0.4052414000
S_F0 DC $CF043B ; -0.3826833963
S_F1 DC $D1EEF6 ; -0.3598949909
S_F2 DC $D4E0CB ; -0.3368898928
S_F3 DC $D7D947 ; -0.3136816919
S_F4 DC $DAD7F4 ; -0.2902846038
Figure D-1. Sine Wave Table Contents (Sheet 2 of 3)
D-3 DSP56001MOTOROLA
S_F5 DC $DDDC5B ; -0.2667128146
S_F6 DC $E0E607 ; -0.2429800928
S_F7 DC $E3F47E ; -0.2191012055
S_F8 DC $E70748 ; -0.1950902939
S_F9 DC $EA1DEC ; -0.1709619015
S_FA DC $ED37F0 ; -0.1467303932
S_FB DC $F054D9 ; -0.1224106997
S_FC DC $F3742D ; -0.0980170965
S_FD DC $F69570 ; -0.0735644996
S_FE DC $F9B827 ; -0.0490676016
S_FF DC $FCDBD5 ; -0.0245412998
Figure D-1. Sine Wave Table Contents (Sheet 3 of 3)
D-4
DSP56001 MOTOROLA
E-1 DSP56001MOTOROLA
The bootstrap feature of the DSP56001 consists of four special
on-chip modules: the 512 words of PRAM, a 32-word bootstrap
ROM, the bootstrap control logic, and the bootstrap firmware
program.
BOOTSTRAP ROM
This 32-word on-chip ROM has been factory programmed to per-
form the actual bootstrap operation from the memory expansion
port (Port A) or from the Host Interface. You have no access to
the bootstrap ROM other than through the bootstrap process.
Control logic will disable the bootstrap ROM during normal oper-
ations.
BOOTSTRAP CONTROL LOGIC
The bootstrap mode control logic is activated when the
DSP56001 is placed in Operating Mode 1. The control logic
maps the bootstrap ROM into program memory space as long as
the DSP56001 remains in Operating Mode 1. The bootstrap firm-
ware changes operating modes when the bootstrap load is com-
pleted. When the DSP56001 exits the reset state in Mode 1, the
following actions occur.
1. The control logic maps the bootstrap ROM into the inter-
nal DSP program memory space starting at location
$0000. This P: space is read-only.
2. The control logic forces the entire P: space to be write-
only memory during the bootstrap loading process. At-
tempts to read from this space will result in fetches from
the read-only bootstrap ROM.
3. Program execution begins at location $0000 in the boot-
strap ROM. The bootstrap ROM program is able to per-
form the PRAM load through either the memory expan-
sion port from a byte-wide external memory, or through
the Host Interface.
4. The bootstrap ROM program executes the following se-
quence to end the bootstrap operation and begin your
program execution.
A. Enter Operating Mode 2 by writing to the OMR.
This action will be timed to remove the bootstrap
ROM from the program memory map and re-en-
able read/write access to the PRAM.
B. The change to Mode 2 is timed exactly to allow
the boot program to execute a single cycle in-
struction then a JMP #00 and begin execution of
the program at location $0000.
You may also select the bootstrap mode by writing Operating
Mode 1 into the OMR. This initiates a timed operation to map the
bootstrap ROM into the program address space after a delay to
allow execution of a single cycle instruction and then a JMP
#<00 (e.g., see Bootstrap code for DSP56001) to begin the boot-
strap process as described above in steps 1-4. This technique
allows the DSP56001 user to reboot the system (with a different
program if desired).
BOOTSTRAP FIRMWARE PROGRAM
Bootstrap ROM contains the bootstrap firmware program that
performs initial loading of the DSP56001 PRAM. The program is
written in DSP56000/DSP56001 assembly language. It contains
two separate methods of initializing the PRAM: loading from a
byte-wide memory starting at location P:$C000 or loading
through the Host Interface. The particular method used is select-
ed by the level of program memory location $C000, bit 23. If lo-
cation P:$C000, bit 23 is read as a one, the external bus version
of the bootstrap program will be selected. Typically, a byte wide
EPROM will be connected to the DSP56001 Address and Data
Bus as shown in Figure B-1 of the applications examples given
in APPENDIX B APPLICATIONS EXAMPLES. The data con-
tents of the EPROM must be organized as shown below.
Address of External Contents Loaded
Byte Wide P Memory to Internal PRAM at:
P:$C000 P:$0000 low byte
P:$C001 P:$0000 mid byte
P:$C002 P:$0000 high byte
¥¥
¥¥
¥¥
P:$C5FD P:$01FF low byte
P:$C5FE P:$01FF mid byte
P:$C5FF P:$01FF high byte
If location P:$C000, bit 23 is read as a zero, the Host Interface
version of the bootstrap program will be selected. Typically a
host microprocessor will be connected to the DSP56001 Host In-
terface. The host microprocessor must write the Host Interface
registers THX, TXM, and then TSL with the desired contents of
PRAM from location P:$0000 up to P:$01FF. If less than 512
words are to be loaded, the host programmer can exit the boot-
strap program and force the DSP56001 to begin executing at lo-
cation P:$0000 by setting HF0=1 in the Host Interface during the
bootstrap load. In most systems, the DSP56001 responds so
fast that handshaking between the DSP56001 and the host is not
necessary.
The bootstrap program is shown in flowchart form in Figure E-1
and in assembler listing format in Figure E-2.
APPENDIX E
BOOTSTRAP MODE Ñ OPERATING MODE 1
E-2
DSP56001 MOTOROLA
INITIALIZE ADDRESS
REGISTERS
R0=0
R1=$C000
R2=$FFE9
GET P:$C000 BIT 23
AND PUT IT IN THE
CARRY FLAG
WAS
P:$C000 BIT 23
=0?
SET L FLAG = 1
(INDICATES A BOOT
FROM EXTERNAL
MEMORY WAS
SELECTED)
START DO
LOOP, 512
ITERATIONS
DO 3 TIMES
(GET 8-BIT DATA
AND SHIFT INTO
24-BIT WORD)
IS
L FLAG
=0?
GET 8-BIT DATA
FROM P MEMORY
PUT I N A2,
INCREMENT R1
SHIFT 8 BITS
FROM A3 INTO
ACCUMULATOR
A1ÕS 8 MSBS
MOVE A1 INTO
NEXT INTERNAL
P MEMORY LOCATION.
INCREMENT R0
POINTER.
SET OPERATING
MODE TO
MODE 2
ENABLE
HOST INTERFACE
LOGIC
IS
HOST FLAG 0
=0?
IS THE
HOST RECEIVE
FLAG = 0?
PUT DATA FROM
HOST RECEIVE
DATA REGISTER
INTO
ACCUMULATOR A1
JUMP TO P:0
ENDDO
FINISHED
512 LOOPS?
CLEAR
STATUS
REGISTER
FINISHED
3 LOOPS?
Y
Y
Y
Y
Y
Y
N
N
N
N
N
N
HOST
INTERFACE
REPEAT UNTIL
512 PROGRAM WORDS
HAVE BEEN LOADED
LOAD FROM
EXTERNAL
LOAD FROM
HOST
STOP BOOT
LOAD
DATA AVAILABLE
CONTINUE
LOADING
WAIT FOR
REPEAT UNTIL
24-BIT DATA IS IN A1
EXTERNAL
MEMORY
HOST TO FILL
INPUT REGISTER
INTERFACE
MEMORY
Figure E-1. Bootstrap Program Flowchart
START
E-3 DSP56001MOTOROLA
Motorola DSP56000 Macro Cross Assembler Version 2.00 87-08-23 09:57:46 bootcode.asm Page 1
1 PAGE 132,50,0,10
2 ; BOOTSTRAP SOURCE CODE FOR DSP56001 - (C) Copyright 1986 Motorola Inc.
4 ; Host algorithm / AND / external bus method
6 ; This is the Bootstrap source code contained in the DSP56001 32 word boot ROM.
7 ; This program can load the internal program memory from one of two external sources.
8 ; The program reads P:$C000 bit 23 to decide which external source to access. If
9 ; P:$C000 bit 23 = 0 then it loads internal PRAM from H0-H7, using the Host Interface
10 ; logic. If P:$C000 bit 23 = 1 then it loads from 1,536 consecutive byte-wide P:
11 ; memory locations (starting at P:$C000).
13 0000C000 BOOT EQU $C000 ; The location in P: memory
14 ; where the external byte-wide
15 ; EPROM is expected to be mapped.
16
17 p:0000 ORG PL:$0 ; Bootstrap code starts at P:$0
18
19 P:0000 62F400 START MOVE #$FFE9,R2 ; R2 = address of the Host
00FFE9
20 ; Interface status register.
21 P:0002 61F400 MOVE #BOOT,R1 ; R1 = starting P: address of
00C000
22 ; external bootstrap byte-wide ROM.
23 P:0004 300000 MOVE #0,R0 ; R0 = starting P: address of
24 ; internal memory where program
25 ; will begin loading.
26
27 P:0005 07E18C MOVE P:(R1),Al ; Get the data at P:$C000
28 P:0006 200037 ROL A ; Shift bit 23 into the Carry flag
29 P:0007 0E0009 JCC <INLOOP ; Perform load from Host Interface
30 ; if carry is zero.
31
32 ; IMPORTANT NOTE: This routine assumes that the L bit has been cleared before entering
33 ; this program and that M0 and M1 have been preloaded with $FFFF (linear addressing).
34 ; This would be the case after a reset. If this program is entered by changing the OMR
Figure E-2. Assembler Listing for Bootstrap Program (Sheet 1 of 3)
E-4
DSP56001 MOTOROLA
Motorola DSP56000 Macro Cross Assembler Version 2.00 87-08-23 09:57:46 bootcode.asm Page 2
35 ; to bootstrap operating mode, make certain that the L bit is cleared and registers M0
36 ; and M1have been set to $FFFF. Also, make sure the BCR is set to $xxFx since
37 ; EPROMS are slow and BCR is set to $FFFF after a reset. If the L bit was set before
38 ; changing modes, the program will load from external program memory.
39
40 P:0008 0040F9 ORI #$40,CCR ; Set the L bit to indicate
41 ; that the bootstrap program
42 ; is being loaded from the
43 ; external P: space.
44
45 ; The first routine will load 1,536 bytes from the external P: memory space beginning
46 ; at P:$C000 (bits 7-0). These will be packed into 512 24-bit words and stored in
47 ; contiguous internal PRAM memory locations starting at P:$0.
48
49 ; The shifter moves the 8-bit input data from register A2 into register A1 eight bits
50 ; at a time. After assembling one 24-bit word (this takes three loops) it stores the
51 ; result in internal PRAM and continues until internal PRAM is filled. Note that the
52 ; first routine loads data starting with the least significant byte of P:$0 first.
53
54 ; The second routine loads the internal PRAM using the Host Interface logic.
55 ; If the host only wants to load a portion of the PRAM, the Host Interface bootstrap
56 ; load program can be aborted and execution of the loaded program started, by setting
57 ; the Host Flag (HF0) = 1 at any time during the load from the Host Processor.
58
59 P:0009 060082 INLOOP D0 #512,_LOOP1 ; Load 512 instruction words.
00001B
60
61 ; This is the context switch
62
63 P:000B 0E6012 JLC < _HOSTLD ; Load from the Host Interface
64 ; if the Limit flag is clear.
65
66 ; This is the first routine. It loads from external P: memory.
67
68 P:000C 060380 DO #3, _LOOP2 ; Each instruction has 3 bytes.
000010
Figure E-2. Assembler Listing for Bootstrap Program (Sheet 2 of 3)
E-5 DSP56001MOTOROLA
Motorola DSP56000 Macro Cross Assembler Version 2.00 87-08-23 09:57:46 bootcode.asm Page 3
69 P:000E 07D98A MOVE P:(R1)+,A2 ; Get the 8 LSB from external
70 ; P: memory.
71 P:000F 0608A0 REP #8 ; Shift 8 bit data into A1
72 P:0010 200022 ASR A
73 _LOOP2 ; Get another byte
74 P:0011 0C001B JMP < _STORE ; then put the word in PRAM.
75
76 ; This is the second routine. It loads from the Host Interface pins.
77
78 P:0012 0AA020 _HOSTLD BSET #0,X:$FFE0 ; Configure Port B as Host Interface
79 P:0013 0AA983 _LBLA JCLR #3,X:$FFE9, _LBLB ; If HF0=1, stop loading data.
000017
80 P:0015 00008C ENDDO ; Must terminate the DO loop
81 P:0016 0C001C JMP <_BOOTEND
82
83 P:0017 0A6280 _LBLB JCLR #0,X:(R2), _LBLA ; Wait for HRDF to go high
000013
84 ; (meaning 24-bit data is present)
85 P:0019 54F000 MOVE X:$FFEB,A1 ; Put 24-bit host data in A1
00FFEB
86
87 P:001B 07588C _STORE MOVE A1,P:(R0)+ ; Store 24-bit result in PRAM.
88
89 _LOOP1 ; and return for another 24-bit word
90
91 ; This is the exit handler that returns execution to normal expanded mode
92 ; and jumps to the RESET location.
93
94 P:001C 0502BA _BOOTEND MOVEC #2,0MR ; Set the operating mode to 2
95 ; (and trigger an exit from
96 ; bootstrap mode).
97 P:001D 0000B9 ANDI #$0,CCR ; Clear SR as if RESET and
98 ; introduce delay needed for
99 ; Op. Mode change.
100 P:001E 0C0000 JMP <$0 ; Start fetching from PRAM P:$0000
101
Motorola DSP56000 Macro Cross Assembler Version 2.00 87-08-23 09:57:46 bootcode.asm Page 4
0 Errors
0 Warnings
Figure E-2. Assembler Listing for Bootstrap Program (Sheet 3 of 3)
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