1
MOSFET Driver
ASCT1B274E ’03.7
http://www.nais-e.com/
New
APV1,2
Pending
C-UL
Pending
UL
PHOTOVOLTAIC
MOSFET DRIVER
1
2
Control circuit
3
6
4
1
2
4
3
Control circuit
FEATURES
1. High-speed switching
Since release time is 0.1 ms, the
MOSFET can be turned off quickly in
urgent situations.
2. Space saving
With a built-in control circuit, an external
resistor is not needed. This contributes to
making substrates more compact.
3. High insulation
DIP type: 5,000 V
SOP type: 2,500 V
SSOP type: 1,500 V
4. Extensive product lineup
Products include the industry’s smallest
SSOP type, SOP4 type, and DIP 6 type.
TYPICAL APPLICATIONS
MOSFET driver
Power supply (Vcc) for electronic
circuits
TYPES
Notes: *1 SOP type is picked from 1/2-pin side, SSOP type is picked from 1/4-pin side
*2 SOP type is picked from 3/4-pin side, SSOP type is picked from 2/3-pin side
*3 Tape package is the standard packing style. Also available in tube.
(Part No. suffix “X” or “Y” is not needed when ordering; Tube: 100 pcs.; Case: 2,000 pcs.)
For space reasons, the initial letters of the product number “AP” and “S” are omitted on the product seal.
The package type indicator “X” and “Z” are omitted from the seal. (Ex. the label for product number APV1121SX is V1121).
*4 Tape package is the standard packing style.
For space reasons, the initial letters of the product number “AP” and “V” are omitted on the product seal.
The package type indicator “Y” and “W” are omitted from the seal. (Ex. the label for product number APV2111VY is V2111).
Type
Output rating Part No. Packing quantity
Drop-out
voltage
(Typ.)
Short circuit
current
(Typ.)
Through hole
terminal Surface-mount terminal
Tube packing
style Tube packing
style
Tape and reel packing style Tube Tape and
reel
Picked from
1/2/3-pin side*
1
Picked from
4/5/6-pin side*
2
DIP6pin 8.7V 14µA APV1122 APV1122A APV1122AX APV1122AZ 1 tube contains 50 pcs.
1 batch contains 500 pcs. 1,000 pcs.
SOP4pin 8.7V 14µA — — APV1121SX APV1121SZ 1 tube contains 50 pcs.
1 batch contains 500 pcs.
SOP4pin*
3
8.2V 8µA — — APV2121SX APV2121SZ
SSOP*4 8.2V 8µA — — APV2111VY APV2111VW —
RATING
1. Absolute maximum ratings
(Ambient temperature: 25
°
C 77
°
F)
Item Symbol APV1122(A) APV1121S APV2121S APV2111V Remarks
Input
LED forward current I
F
50mA
LED reverse voltage V
R
5V
Peak forward current I
FP
1A f = 100 Hz,
Duty Ratio = 0.1%
Power dissipation P
in
75mA
I/O isolation voltage V
iso
5,000V AC 2,500V AC 2,500V AC 1,500V AC
Temperature
limits Operating T
opr
–40
°
C to +85
°
C –40
°
F to +185
°
FNon-condensing at
low temperatures
Storage T
stg
–40
°
C to +100
°
C –40
°
F to +212
°
F
APV1,2
2
2. Electrical characteristics
(Ambient temperature: 25
°
C 77
°
F)
Note: Recommended LED forward current I
FT
: 10mA.
Item Symbol APV1122(A) APV1121S APV2121S APV2111V Condition
Input
LED operate current Typical I
Fon
0.6mA 0.85mA V
OC
= 5V
Maximum 3mA
LED turn off current Minimum I
Foff
0.2mA V
OC
= 1V
Typical 0.5mA 0.75mA
LED dropout voltage Typical V
F
1.15V I
F
= 10mA
Maximum 1.5V
Output Drop-out voltage* Minimum V
OC
6V 5V I
F
= 10mA
Typical 8.7V 8.2V
Short circuit current** Minimum I
SC
5µA 3µA I
F
= 10mA
Typical 14µA 8µA
Transfer
characteristics
Turn on time*** Typical T
on
0.4ms 0.8ms I
F
= 10mA,
C
L
= 1,000pF
Turn off time*** Typical T
off
0.1ms I
F
= 10mA,
C
L
= 1,000pF
I/O capacitance Typical C
iso
0.8pF V
B
= 0V,
f = 1MHz
Maximum 1.5pF
Initial I/O isolation resistance Minimum R
iso
1,000M
Ω
500V DC
*Drop-out voltage measurement circuit
APV1122(A) APV1121S, APV2121S, APV2111V
**Short circuit current measurement circuit
APV1122(A) APV1121S, APV2121S, APV2111V
***Turn on/Turn off time measurement circuit
APV1122(A) APV1121S, APV2121S, APV2111V
***Turn on time
V
IF=10mA
RV=10MΩ
1
2
34
6
V
IF=10mA
RV=10MΩ
1
23
4
1
2
34
6
I
IF=10mA
RI=100Ω
1
23
4
I
IF=10mA
RI=100Ω
1
2
34
6VOUT
CL=1000pF
CL
IF=10mA 1
23
4VOUT
CL=1000pF
CL
IF=10mA
Input
Output
5V
1V
Ton Toff
APV1,2
3
DIMENSIONS
1. APV2111V
Terminal thickness: 0.15 .006
General tolerance:
±
0.1
±
.004
Recommended mounting pad
(T OP VIEW)
Tolerance:
±
0.1
±
.004
4.45
.175
2.65
.104
(4.85)
(.191)
1.8
.071
0.2
.008 0.2
.008 1.27
.050
0.4
.016 0.4
.016
0.7
.028
0.9
.035 1.27
.020
4.35
.171
mm inch
2. APV1121S, APV2121S
Terminal thickness: 0.15 .006
General tolerance:
±
0.1
±
.004
Recommended mounting pad
(T OP VIEW)
Tolerance:
±
0.1
±
.004
0.4
.016
2.54
.100
2.0±0.2
.079±.008
0.1
.004
4.3±0.2
.169±.008
0.4
.016
4.4±0.2
.173±.008 6.8±0.4
.268±.016
0.5
.020
0.5
.020
6.0
.236
1.2
.047
0.8
.031
2.54
.100
3. (1) APV1122
Terminal thickness: 0.25 .010
General tolerance:
±
0.1
±
.004
0.47
.019
2.54
.100
2.54
.100
3.9±0.2
.154±.008
8.8±0.05
.346±.002
0.47
.019
1.25
.049 1.25
.049
1.25
.049
3.4
.134
0.47
.019
6.4±0.05
.252±.002
3.0
.118
7.62±0.05
.300±.002
Max.10°
Max.10°
3. (2) APV1122A
Terminal thickness: 0.25 .010
General tolerance:
±
0.1
±
.004
3.4
.134
0.2+0.2
0
.008+.008
0
1.0
.039
7.6
.299
3.4
.134
Max.10°
8.8±0.05
.346±.002
6.4±0.05
.252±.002
2.54
.100
2.54
.100
1.25
.049
1.25
.049
1.25
.049
0.47
.019
0.47
.019
0.47
.019
PC board pattern (BOTTOM VIEW)
Tolerance:
±
0.1
±
.004
Recommended mounting pad (TOP VIEW)
Tolerance:
±
0.1
±
.004
2.54
.100
7.62
.300
2.54
.100
5.08
.200
6.4
.252
6-0.8 dia.
6-.031 dia.
2.54
.100
2.54
.100
1.5
.059
8.3
.327 1.9
.075
APV1,2
4
7. Turn off time vs. ambient temperature
characteristics
LED forward current: 10mA
Load capacity: 1,000pF; output voltage: 1V
8. Turn on time vs. LED forward current
characteristics
Load capacity: 1,000pF; output voltage: 5V
9. Turn off time vs. LED forward current
characteristics
Load capacity: 1,000pF; output voltage: 1V
0204060
8085
–40 –20
0
0.5
0.2
0.1
0.4
0.3
Turn off time, ms
Ambient temperature, °C
APV1122
APV1121S
APV2121S
APV2111V
30 40 50 6010020
0
0.5
1.5
1
2
Turn on time, ms
LED forward current, mA
APV1122
APV1121S APV2121S
APV2111V
30 40 50 6010020
0
0.3
0.05
0.1
0.2
0.15
0.25
Turn off time, ms
LED forward current, mA
APV1122
APV1121S
APV2121S
APV2111V
REFERENCE DATA
1. Drop-out voltage vs. ambient temperature
characteristics
Input current: 10mA
2. Short circuit current vs. ambient temperature
characteristics
Input current: 10mA
3. LED operate current vs. ambient
temperature characteristics
Drop-out voltage: 5V
Ambient temperature, °C
0204060
8085
–40 –20
4
Drop-out voltage, V
14
APV2121S
APV2111V
APV1122
APV1121S
6
10
8
12
0204060
8085
–40 –20
0
Short circuit current, µA
25
5
15
10
20
Ambient temperature, °C
APV2121S
APV2111V
APV1122
APV1121S
0204060
8085
–40 –20
0
3
0.5
2
1.5
1
2.5
LED operate current, mA
Ambient temperature, °C
APV1122
APV1121S
APV2121S
APV2111V
4. LED turn off current vs. ambient temperature
characteristics
Drop-out voltage: 1V
5. LED dropout voltage vs. ambient
temperature characteristics
LED forward current: 5 to 50mA
6. Turn on time vs. ambient temperature
characteristics
LED forward current: 10mA
Load capacity: 1,000pF; output voltage: 5V
0204060
8085
–40 –20
0
2
0.5
1.5
1
LED turn off current, mA
Ambient temperature, °C
APV1122
APV1121S
APV2121S
APV2111V
02040 8060 100–40 –20
1
1.5
1.1
1.3
1.2
1.4
LED dropout voltage, V
Ambient temperature, °C
10mA
20mA
30mA
50mA
0204060
8085
–40 –20
0
2
0.5
1.5
1
Turn on time, ms
Ambient temperature, °C
APV1122
APV1121S
APV2121S
APV2111V
APV1,2
5
SCHEMATIC AND WIRING DIAGRAMS
Notes: E
1
: Power source at input side; I
F
: LED forward current;
1. APV1122
Schematic
Power MOSFET drive wiring diagram
Example of each input power supply and current limit resistors
(I
F
= 10mA)
E
1
R
5V Approx. 380
Ω
15V Approx. 1.4k
Ω
24V Approx. 2.3k
Ω
1
2
Control circuit
3
6
4
1
2
34
6
IF
External
MOSFET VL (AC, DC)
4
6
External
MOSFET VL (DC)
E1
Load Load
1
2
34
6
IFR
E1
2. APV1121S, APV2121S, APV2111V
Schematic
Power MOSFET drive wiring diagram
Example of each input power supply and current limit resistors
(I
F
= 10mA)
E
1
R
5V Approx. 380
Ω
15V Approx. 1.4k
Ω
24V Approx. 2.3k
Ω
1
2
4
3
Control circuit
1
2
IF
E1
3
4
External
MOSFET VL (AC, DC)
3
4
External
MOSFET VL (DC)
Load Load
1
23
4
IFR
E1
CAUTIONS FOR USE
1. When two external MOSFETs are
connected with a common source
terminal, oscillation may occur when
operation is restored. Therefore,
please insert a 100 to 1,000 ohms
resistor between the gate terminal of
the first MOSFET and the gate terminal
of the second MOSFET.
A typical example of this is given in the
circuit below.
2. Deterioration and destruction
caused by discharge of static
electricity
This phenomenon is generally called
static electricity destruction, and occurs
when static electricity generated by
various factors is discharged while the
relay terminals are in contact, producing
internal destruction of the element.
To prevent problems from static electricity ,
the following precautions and measures
should be taken when using your device.
1) Employees handling relays should
wear anti-static clothing and should be
grounded through protective resistance of
500 k
Ω
to 1 M
Ω
.
2) A conductive metal sheet should be
placed over the work table. Measuring
instruments and jigs should be grounded.
3) When using soldering irons, either use
irons with low leakage current, or ground
the tip of the soldering iron. (Use of low-
voltage soldering irons is also
recommended.)
4) Devices and equipment used in
assembly should also be grounded.
5) When packing printed circuit boards
and equipment, av oid using high-polymer
materials such as foam styrene, plastic,
and other materials which carry an
electrostatic charge.
6) When storing or transporting relays, the
environment should not be conducive to
static electricity (for instance, the humidity
should be between 45 and 60%), and
relays should be protected using
conductive packing materials.
3. Unused terminals
The No . 3 terminal is used with the circuit
inside the relay . Therefore, do not connect
it to the external circuitry. (DIP 6-pin type)
4. Short across terminals
Do not short circuit between terminals
when relay is energized, since there is
possibility of breaking of the internal IC.
5. Ripple in the input power supply
1) For LED operate current at E
min
,
maintain min. 10 mA
2) Keep the LED operate current at 50 mA
or less at E
max
.
6. Soldering
1) When soldering PC board terminals,
keep soldering time less than 10 s at
260
°
C 500
°
F.
2) When soldering surface-mount
terminals, the following conditions are
recommended.
(1) IR (Infrared reflow) soldering method
(2) Vapor phase soldering method
(3) Double wave soldering method
(4) Soldering iron method
Tip temperature: 280 to 300
°
C 536 to
572
°
F
Wattage: 30 to 60 W
Soldering time: within 5 s
1
2
34
6
Emin. Emax.
T1
T2
T3
T1 = 155 to 165°C 311 to 329°F
T2 = 180°C 200°C 356 to 392°F
T3 = 245°C 473°F or less
t1 = 120 s or less
t2 = 30 s or less
t1t2
T2
T1
t1t2
T1 = 180 to 200°C 366 to 392°F
T2 = 215°C 419°F or less
t1 = 40 s
t2 = 90 s or less (40 s: SOP type)
T2
T1
t1t2t3
T1 = 155 to 165°C 311 to 329°F
T2 = 260°C 500°F or less
t1 = 60 s or less
t2+t3 = 5 s or less
APV1,2
6
(5) Others
Check mounting conditions before using
other soldering methods (hot-air, hot
plate, pulse heater, etc.)
7. Important Notes for Mounting
1) Temperature rise in the lead portion is
highly dependent on package size. If
multiple different packages are mounted
on the same board, please check your
board beforehand in an actual product,
ensuring that the temperature conditions
of the phototriac coupler fall within the
parameters listed above.
8. Cleaning
The phototriac coupler forms an optical
path by coupling a light-emitting diode
(LED) and photodiode via transparent
silicon resin. For this reason, unlike other
directory element molded resin products
(e.g., MOS transistors and bipolar
transistors), avoid ultrasonic cleansing if
at all possible. We recommend cleaning
with an organic solvent. If you cannot
avoid using ultrasonic cleansing, please
ensure that the following conditions are
met, and check beforehand for defects.
• Frequency: 27 to 29 kHz
• Ultrasonic output:
No greater than 0.25 W/cm
2
• Cleaning time:
No longer than 30 s
• Cleanser used: Asahiklin AK-225
• Other: Submerge in solvent in order to
prevent the PCB and elements from
being contacted directly by the
ultrasonic vibrations.
Note: Applies to unit area ultrasonic output for
ultrasonic baths.
9. Storage
SSOP package (APV2111V) and SO
package (APV1121S, APV2121S) are
sensitive to moisture and come in sealed
moisture-proof packages. Observe the
following cautions on storage.
• After the moisture-proof package is
unsealed, take the devices out of
storage as soon as possible (within 1
month at the most).
• If the devices are to be left in storage f or
a considerable period after the moisture-
proof package has been unsealed, it is
recommended to keep them in another
moisture-proof bag containing silica gel
(within 3 months at the most).
Note: When thermal stress is applied when
solder mounting under moist conditions,
water will evaporate, dilation will occur,
the stress inside of the package will
increase, and swelling and cracking
might occur on the package surface.
Therefore, please be careful while
following the soldering conditions given
on the next page.
10. Transportation and storage
1) Extreme vibration during transport will
warp the lead or damage the relay.
Handle the outer and inner boxes with
care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
• Temperature: 0 to 45
°
C 32 to 113
°
F
• Humidity: Less than 70% R.H.
• Atomosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
11. The following shows the packaging format
mm inch
1) Tape and reel
Type Tape dimensions Dimensions of paper tape reel
SSOP
4-pin
type
(1) When picked from 1/4-pin side: Part No. APV
❍❍❍
VY (Shown adove)
(2) When picked from 2/3-pin side: Part No. APV
❍❍❍
VW
SO
package
4-pin
type
(1) When picked from 1/2-pin side: Part No. APV
❍❍❍
SX (Shown adove)
(2) When picked from 3/4-pin side: Part No. APV
❍❍❍
SZ
DIP
6-pin
type
(1) When picked from 1/2/3-pin side: Part No. APV
❍❍❍
AX (Shown above)
(2) When picked from 4/6-pin side: Part No. APV
❍❍❍
Z
0.3±0.05
.012±.002 3.0±0.1
.118±.004
4.0±0.1
.157±.004
4.0±0.1
.157±.004 1.75±0.1
.069±.004
5.5±0.1
.217±.004
5.1±0.2
.201±.008
1.50+0.5
−0 dia.
.059+.020
−0 dia.
1.50+0.1
−0 dia.
.059+.004
−0 dia.
Tractor feed holes
2.7±0.3
.106±.012
Device mounted
on tape
Direction of
picking
12.0±0.3
.472±.012
21±0.8
.827±.03180±1 dia.
3.150±.039 dia.
2±0.5
.079±.020
13±0.5 dia.
.512±.020 dia. 14±1.5
.551±.059 2±0.5
.079±.020
250±2 dia.
9.843±.079 dia.
80±1 dia.
3.150±.039 dia.
0.3±0.05
.012±.002
Tractor feed holes Direction of picking
7.2±0.1
.284±.004 1.75±0.1
.069±.004
1.55±0.05 dia.
.061±.002 dia.
2.8±0.3
.110±.012
Device mounted
on tape
5.5
±
0.1
.217
±
.004
4.7
±
0.1
.185
±
.004
12±0.1
.472±.004
1.55±0.1 dia.
.061±.004 dia.
4±0.1
.157±.004
2±0.1
.079±.004
12±0.3
.472±.012
1.5
Tractor feed holes
dia. Direction of picking
+0.1
–0
.059 dia.
+.004
–0
Device mounted
on tape
4±0.1
.079±.004
2±0.1
.079±.004
12±0.1
.472±.004
10.1±0.1
.398±.004 1.75±0.1
.069±.004
9.2±0.1
.362±.004
1.6±0.1 dia.
.063±.004 dia.
0.3±0.05
.012±.002
4.5±0.3
.177±.012
16±0.3
.630±.012
7.5±0.1
.295±.004
21±0.8
.827±.031
17.5±1.5
.689±.059 2±0.2
.079±.008
80±1 dia.
3.150±.039 dia.
13±0.5 dia.
.512±.020 dia.
2±0.5
.079±.020 300±2 dia.
11.811±.079 dia.
80±1 dia.
3.150±.039 dia.
APV1,2
2) Tube
(1) MOSFET driver is pac kaged in a tube
so pin No. 1 is on the stopper B side.
Observe correct orientation when
mounting them on PC boards.
(SOP type)
(DIP type)
12. Applying stress that exceeds the
absolute maximum rating
If the voltage or current value for any of
the terminals exceeds the absolute
maximum rating, internal elements will
deteriorate. In e xtreme cases, wiring ma y
melt, or silicon P/N junctions may be
destroyed.
As a result, the design should ensure that
the absolute maximum ratings will never
be exceeded, even momentarily.
StopperB (green) StopperA (gray)
StopperB StopperA
ASCT1B274E 200307-0YT
Please contact ..........
Specifications are subject to change without notice. Printed in Japan.
Automation Controls Company
Head Office: 1048, Kadoma, Kadoma-shi, Osaka 571-8686, Japan
Telephone: Japan (81) Osaka (06) 6908-1050
Facsimile: Japan (81) Osaka (06) 6908-5781
http://www.nais-e.com/
COPYRIGHT © 2003 All Rights Reserved
Matsushita Electric Works, Ltd.
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