1
FEATURES
VCCA
VCCB
OE
DIR2
B1
B2
GND
A1
A2
DIR1
85
94
10 3
1 2
6
7
DESCRIPTION/ORDERING INFORMATION
SN74AVC2T245
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...................................................................................................................................................................................................... SCES692 JUNE 2008
DUAL-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
Each Channel Has Independent Direction Latch-Up Performance Exceeds 100 mA PerControl JESD 78, Class IIControl Inputs V
IH
/V
IL
Levels Are Referenced to ESD Protection Exceeds JESD 22V
CCA
Voltage
5000-V Human-Body Model (A114-A)Fully Configurable Dual-Rail Design Allows
200-V Machine Model (A115-A)Each Port to Operate Over the Full 1.2-V to
1500-V Charged-Device Model (C101)3.6-V Power-Supply Range
RSW PACKAGEI/Os Are 4.6-V Tolerant
(TOP VIEW)I
off
Supports Partial-Power-Down ModeOperation
Typical Data Rates 500 Mbps (1.8-V to 3.3-V Translation) 320 Mbps ( < 1.8-V to 3.3-V Translation) 320 Mbps (Translate to 2.5 V or 1.8 V) 280 Mbps (Translate to 1.5 V) 240 Mbps (Translate to 1.2 V)
This dual-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port isdesigned to track V
CCA
. V
CCA
accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to trackV
CCB
. V
CCB
accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectionaltranslation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
40 ° C to 85 ° C QFN RSW Tape and reel SN74AVC2T245RSWR TLO
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging .(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com .
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
DIR1
A1
OE
B1
SN74AVC2T245
SCES692 JUNE 2008 ......................................................................................................................................................................................................
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The SN74AVC2T245 is designed for asynchronous communication between two data buses. The logic levels ofthe direction-control (DIR) input and the output-enable ( OE) activate either the B-port outputs or the A-portoutputs or place both output ports into the high-impedance mode . The device transmits data from the A bus tothe B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs areactivated. The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW levelapplied to prevent excess I
CC
and I
CCZ
.
The SN74AVC2T245 is designed so that the control pins (DIR1, DIR2, and OE) are supplied by V
CCA
.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
The V
CC
isolation feature ensures that if either V
CC
input is at GND, both ports are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE must be connected to V
CC
through apull-up resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(1)
(EACH TRANSCEIVER)
CONTROL INPUTS OUTPUT CIRCUITS
OPERATIONOE DIR1 A PORT B PORT
L L Enabled Hi-Z B data to A dataL H Hi-Z Enabled A data to B dataH X Hi-Z Hi-Z Isolation
(1) Input circuits of the data I/Os are always active.
LOGIC DIAGRAM (POSITIVE LOGIC)
(1)
(1) Shown for a single channel
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TYPICAL APPLICATION
1.8 V
1 kΩ
3.0 V
SN74AVC2T245
Processor
UART
Peripheral
OE
DIR1
A1
A2
Tx
Rx
Rx
Tx
VCCA VCCB
B1
B2
GND
DIR2
ABSOLUTE MAXIMUM RATINGS
(1)
SN74AVC2T245
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...................................................................................................................................................................................................... SCES692 JUNE 2008
Figure 1. Typical Application of the SN74AVC2T245
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CCA
Supply voltage range 0.5 4.6 VV
CCB
I/O ports (A port) 0.5 4.6V
I
Input voltage range
(2)
I/O ports (B port) 0.5 4.6 VControl inputs 0.5 4.6A port 0.5 4.6Voltage range applied to any output in the high-impedance orV
O
Vpower-off state
(2)
B port 0.5 4.6A port 0.5 V
CCA
+ 0.5V
O
Voltage range applied to any output in the high or low state
(2) (3)
VB port 0.5 V
CCB
+ 0.5I
IK
Input clamp current V
I
< 0 50 mAI
OK
Output clamp current V
O
< 0 50 mAI
O
Continuous output current ± 50 mAContinuous current through V
CCA
, V
CCB
, or GND ± 100 mAD package
(4)
73DB package
(4)
82θ
JA
Package thermal impedance DGV package
(4)
120 ° C/WPW package
(4)
108RGY package
(5)
39T
stg
Storage temperature range 65 150 ° C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3) The output positive-voltage rating may be exceeded up to 4.6 V maximum if the output current rating is observed.(4) The package thermal impedance is calculated in accordance with JESD 51-7.(5) The package thermal impedance is calculated in accordance with JESD 51-5.
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RECOMMENDED OPERATING CONDITIONS
(1) (2) (3)
SN74AVC2T245
SCES692 JUNE 2008 ......................................................................................................................................................................................................
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V
CCI
V
CCO
MIN MAX UNIT
V
CCA
Supply voltage 1.2 3.6 VV
CCB
Supply voltage 1.2 3.6 V1.2 V to 1.95 V V
CCI
× 0.65High-level
V
IH
Data inputs
(4)
1.95 V to 2.7 V 1.6 Vinput voltage
2.7 V to 3.6 V 21.2 V to 1.95 V V
CCI
× 0.35Low-level
V
IL
Data inputs
(4)
1.95 V to 2.7 V 0.7 Vinput voltage
2.7 V to 3.6 V 0.81.2 V to 1.95 V V
CCA
× 0.65High-level DIRV
IH
1.95 V to 2.7 V 1.6 Vinput voltage (referenced to V
CCA
)
(5)
2.7 V to 3.6 V 21.2 V to 1.95 V V
CCA
× 0.35Low-level DIRV
IL
1.95 V to 2.7 V 0.7 Vinput voltage (referenced to V
CCA
)
(5)
2.7 V to 3.6 V 0.8V
I
Input voltage 0 3.6 VActive state 0 V
CCOV
O
Output voltage V3-state 0 3.61.1 V to 1.2 V 31.4 V to 1.6 V 6I
OH
High-level output current 1.65 V to 1.95 V 8 mA2.3 V to 2.7 V 93 V to 3.6 V 121.1 V to 1.2 V 31.4 V to 1.6 V 6I
OL
Low-level output current 1.65 V to 1.95 V 8 mA2.3 V to 2.7 V 93 V to 3.6 V 12
Δt/ Δv Input transition rise or fall rate 5 ns/VT
A
Operating free-air temperature 40 85 ° C
(1) V
CCI
is the V
CC
associated with the input port.(2) V
CCO
is the V
CC
associated with the output port.(3) All unused data inputs of the device must be held at V
CCI
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.(4) For V
CCI
values not specified in the data sheet, V
IH
min = V
CCI
× 0.7 V, V
IL
max = V
CCI
× 0.3 V(5) For V
CCI
values not specified in the data sheet, V
IH
min = V
CCA
× 0.7 V, V
IL
max = V
CCA
× 0.3 V
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ELECTRICAL CHARACTERISTICS
(1) (2)
SN74AVC2T245
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...................................................................................................................................................................................................... SCES692 JUNE 2008
over recommended operating free-air temperature range (unless otherwise noted)
T
A
= 25 ° C 40 ° C to 85 ° CPARAMETER TEST CONDITIONS V
CCA
V
CCB
UNITMIN TYP MAX MIN MAX
I
OH
= 100 µA 1.2 V to 3.6 V 1.2 V to 3.6 V V
CCO
0.2I
OH
= 3 mA 1.2 V 1.2 V 0.95I
OH
= 6 mA 1.4 V 1.4 V 1.05V
OH
V
I
= V
IH
VI
OH
= 8 mA 1.65 V 1.65 V 1.2I
OH
= 9 mA 2.3 V 2.3 V 1.75I
OH
= 12 mA 3 V 3 V 2.3I
OL
= 100 µA 1.2 V to 3.6 V 1.2 V to 3.6 V 0.2I
OL
= 3 mA 1.2 V 1.2 V 0.25I
OL
= 6 mA 1.4 V 1.4 V 0.35V
OL
V
I
= V
IL
VI
OL
= 8 mA 1.65 V 1.65 V 0.45I
OL
= 9 mA 2.3 V 2.3 V 0.55I
OL
= 12 mA 3 V 3 V 0.7ControlI
I
V
I
= V
CCA
or GND 1.2 V to 3.6 V 1.2 V to 3.6 V ± 0.025 ± 0.25 ± 1 µAinputs
0 V 0 V to 3.6 V ± 0.1 ± 1 ± 5I
off
A or B port V
I
or V
O
= 0 to 3.6 V µA0 V to 3.6 V 0 V ± 0.1 ± 1 ± 5V
O
= V
CCO
or GND,I
OZ
A or B port 3.6 V 3.6 V ± 0.5 ± 2.5 ± 5 µAV
I
= V
CCI
or GND, OE = V
IH
1.2 V to 3.6 V 1.2 V to 3.6 V 8I
CCA
V
I
= V
CCI
or GND, I
O
= 0 0 V 0 V to 3.6 V 2 µA0 V to 3.6 V 0 V 81.2 V to 3.6 V 1.2 V to 3.6 V 8I
CCB
V
I
= V
CCI
or GND, I
O
= 0 0 V 0 V to 3.6 V 8 µA0 V to 3.6 V 0 V 2I
CCA
+ I
CCB
V
I
= V
CCI
or GND, I
O
= 0 1.2 V to 3.6 V 1.2 V to 3.6 V 16 µAControlC
i
V
I
= 3.3 V or GND 3.3 V 3.3 V 3.5 4.5 pFinputsC
io
A or B port V
O
= 3.3 V or GND 3.3 V 3.3 V 6 7 pF
(1) V
CCO
is the V
CC
associated with the output port.(2) V
CCI
is the V
CC
associated with the input port.
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SWITCHING CHARACTERISTICS
SWITCHING CHARACTERISTICS
SN74AVC2T245
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over recommended operating free-air temperature range, V
CCA
= 1.2 V (unless otherwise noted) (see Figure 2 )
V
CCB
= 1.5 V V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 VV
CCB
= 1.2 VFROM TO
± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 VPARAMETER UNIT(INPUT) (OUTPUT)
TYP TYP TYP TYP TYP
t
PLH
2.5 2.1 1.9 1.9 1.9A B nst
PHL
2.5 2.1 1.9 1.9 1.9t
PLH
2.5 2.2 2 1.8 1.7B A nst
PHL
2.5 2.2 2 1.8 1.7t
PZH
3.8 3.1 2.7 2.6 3OE A nst
PZL
3.8 3.1 2.7 2.6 3t
PZH
3.7 3.7 3.7 3.7 3.7OE B nst
PZL
3.7 3.7 3.7 3.7 3.7t
PHZ
4.4 3.6 3.5 3.3 4.1OE A nst
PLZ
4.4 3.6 3.5 3.3 4.1t
PHZ
4.2 4.2 4.3 4.1 4.2OE B nst
PLZ
4.2 4.2 4.3 4.1 4.2
over recommended operating free-air temperature range, V
CCA
= 1.5 V ± 0.1 V (see Figure 2 )
V
CCB
= 1.5 V V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 VV
CCB
= 1.2 VFROM TO
± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 VPARAMETER UNIT(INPUT) (OUTPUT)
TYP MIN MAX MIN MAX MIN MAX MIN MAX
t
PLH
2.2 0.3 4.4 0.2 3.9 0.1 3.6 0.1 3.9A B nst
PHL
2.2 0.3 4.4 0.2 3.9 0.1 3.6 0.1 3.9t
PLH
2 0.6 5.1 0.4 4.9 0.2 4.6 0.1 4.5B A nst
PHL
2 0.6 5.1 0.4 4.9 0.2 4.6 0.1 4.5t
PZH
3.4 1.1 7.1 0.9 6.2 0.7 5.5 0.1 6.4OE A nst
PZL
3.4 1.1 7.1 0.9 6.2 0.7 5.5 0.1 6.4t
PZH
2.5 1.1 8.2 1.1 8.2 1.1 8.2 1.1 8.2OE B nst
PZL
2.5 1.1 8.2 1.1 8.2 1.1 8.2 1.1 8.2t
PHZ
4.1 1.2 7.1 0.8 6.7 0.4 5.6 1 74OE A nst
PLZ
4.1 1.2 7.1 0.8 6.7 0.4 5.6 1 7.4t
PHZ
3.3 0.3 7.4 0.2 5.7 0.3 5.6 0.3 5.6OE B nst
PLZ
3.3 0.3 7.4 0.2 5.7 0.3 5.6 0.3 5.6
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SWITCHING CHARACTERISTICS
SWITCHING CHARACTERISTICS
SN74AVC2T245
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...................................................................................................................................................................................................... SCES692 JUNE 2008
over recommended operating free-air temperature range, V
CCA
= 1.8 V ± 0.15 V (see Figure 2 )
V
CCB
= 1.5 V V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 VV
CCB
= 1.2 VFROM TO
± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 VPARAMETER UNIT(INPUT) (OUTPUT)
TYP MIN MAX MIN MAX MIN MAX MIN MAX
t
PLH
2 0.1 4.1 0.1 3.6 0.1 3.1 0.1 3.3A B nst
PHL
2 0.1 4.1 0.1 3.6 0.1 3.1 0.1 3.3t
PLH
1.9 0.4 4.3 0.1 4.1 0.1 3.8 0.1 3.7B A nst
PHL
1.9 0.4 4.3 0.1 4.1 0.1 3.8 0.1 3.7t
PZH
3.2 0.8 6.7 0.4 5.8 0.4 4.8 0.3 4.6OE A nst
PZL
3.2 0.8 6.7 0.4 5.8 0.4 4.8 0.3 4.6t
PZH
1.9 0.2 6.7 0.2 6.6 0.2 6.7 0.2 6.7OE B nst
PZL
1.9 0.2 6.7 0.2 6.6 0.2 6.7 0.2 6.7t
PHZ
3.8 0.7 6.2 0.3 6.5 0.1 5.2 0.8 6.5OE A nst
PLZ
3.8 0.7 6.2 0.3 6.5 0.1 5.2 0.8 6.5t
PHZ
3.4 0.1 6.8 0.1 6.8 0.1 6.7 0.1 6.7OE B nst
PLZ
3.4 0.1 6.8 0.1 6.8 0.1 6.7 0.1 6.7
over recommended operating free-air temperature range, V
CCA
= 2.5 V ± 0.2 V (see Figure 2 )
V
CCB
= 1.5 V V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 VV
CCB
= 1.2 VFROM TO
± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 VPARAMETER UNIT(INPUT) (OUTPUT)
TYP MIN MAX MIN MAX MIN MAX MIN MAX
t
PLH
1.9 0.1 3.8 0.1 3.2 0.1 2.7 0.1 2.6A B nst
PHL
1.9 0.1 3.8 0.1 3.2 0.1 2.7 0.1 2.6t
PLH
1.8 0.5 3.4 0.2 3.1 0.1 2.8 0.1 2.6B A nst
PHL
1.8 0.5 3.4 0.2 3.1 0.1 2.8 0.1 2.6t
PZH
3.1 0.7 6.2 0.5 5.2 0.3 4.1 0.3 3.6OE A nst
PZL
3.1 0.7 6.2 0.5 5.2 0.3 4.1 0.3 3.6t
PZH
1.4 0.4 4.5 0.4 4.5 0.4 4.5 0.4 4.5OE B nst
PZL
1.4 0.4 4.5 0.4 4.5 0.4 4.5 0.4 4.5t
PHZ
3.6 0.2 5.2 0.1 5.4 0.1 4.5 0.7 6OE A nst
PLZ
3.6 0.2 5.2 0.1 5.4 0.1 4.5 0.7 6t
PHZ
2.1 0.1 4.7 0.1 4.6 0.1 4.7 0.1 4.7OE B nst
PLZ
2.1 0.1 4.7 0.1 4.6 0.1 4.7 0.1 4.7
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SWITCHING CHARACTERISTICS
OPERATING CHARACTERISTICS
SN74AVC2T245
SCES692 JUNE 2008 ......................................................................................................................................................................................................
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over recommended operating free-air temperature range, V
CCA
= 3.3 V ± 0.3 V (see Figure 2 )
V
CCB
= 1.5 V V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 VV
CCB
= 1.2 VFROM TO
± 0.1 V ± 0.15 V ± 0.2 V ± 0.3 VPARAMETER UNIT(INPUT) (OUTPUT)
TYP MIN MAX MIN MAX MIN MAX MIN MAX
t
PLH
1.8 0.1 3.6 0.1 3 0.1 2.6 0.1 2.4A B nst
PHL
1.8 0.1 3.6 0.1 3 0.1 2.6 0.1 2.4t
PLH
1.9 0.5 3.4 0.2 2.9 0.1 2.5 0.1 2.3B A nst
PHL
1.9 0.5 3.4 0.2 2.9 0.1 2.5 0.1 2.3t
PZH
3.1 0.9 5.9 0.5 5 0.3 3.8 0.3 3.3OE A nst
PZL
3.1 0.9 5.9 0.5 5 0.3 3.8 0.3 3.3t
PZH
1.2 0.4 3.6 0.4 3.6 0.4 3.6 0.4 3.6OE B nst
PZL
1.2 0.4 3.6 0.4 3.6 0.4 3.6 0.4 3.6t
PHZ
3.4 0.1 4.6 0.1 4.7 0.3 4.8 0.7 4.5OE A nst
PLZ
3.4 0.1 4.6 0.1 4.7 0.3 4.8 0.7 4.5t
PHZ
2.9 0.1 5.4 0.1 5.3 0.1 5.3 0.1 5.3OE B nst
PLZ
2.9 0.1 5.4 0.1 5.3 0.1 5.3 0.1 5.3
T
A
= 25 ° C
V
CCA
= V
CCA
= V
CCA
= V
CCA
= V
CCA
=TEST
V
CCB
= 1.2 V V
CCB
= 1.5 V V
CCB
= 1.8 V V
CCB
= 2.5 V V
CCB
= 3.3 VPARAMETER UNITCONDITIONS
TYP TYP TYP TYP TYP
Outputs
3 3 3 3 4enabledA to B
Outputs
1 1 1 2 2C
L
= 0,disabledC
pdA
(1)
f = 10 MHz, pFOutputs
t
r
= t
f
= 1 ns
12 13 13 15 15enabledB to A
Outputs
1 2 2 2 2disabled
Outputs
12 13 13 14 16enabledA to B
Outputs
1 2 2 2 2C
L
= 0,disabledC
pdB
(1)
f = 10 MHz, pFOutputs
t
r
= t
f
= 1 ns
3 3 3 4 4enabledB to A
Outputs
1 1 1 2 2disabled
(1) Power dissipation capacitance per transceiver
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PARAMETER MEASUREMENT INFORMATION
VOH
VOL
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1
2 × VCCO
Open
GND
RL
RL
tPLH tPHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCCO
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
VCCA/2VCCA/2
VCCI/2 VCCI/2 VCCI
0 V
VCCO/2 VCCO/2VOH
VOL
0 V
VCCO/2 VOL + VTP
VCCO/2 VOH − VTP
0 V
VCCI
0 V
VCCI/2 VCCI/2
tw
Input
VCCA
VCCO
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
Input
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCCO
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, ZO = 50 , dv/dt 1 V/ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. VCCI is the VCC associated with the input port.
I. VCCO is the VCC associated with the output port.
1.2 V
1.5 V ± 0.1 V
1.8 V ± 0.15 V
2.5 V ± 0.2 V
3.3 V ± 0.3 V
2 k
2 k
2 k
2 k
2 k
VCCO RL0.1 V
0.1 V
0.15 V
0.15 V
0.3 V
VTP
CL
15 pF
15 pF
15 pF
15 pF
15 pF
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...................................................................................................................................................................................................... SCES692 JUNE 2008
Figure 2. Load and Circuit and Voltage Waveforms
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74AVC2T245RSWR ACTIVE QFN RSW 10 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 4-Jun-2008
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74AVC2T245RSWR QFN RSW 10 3000 179.0 8.4 1.7 2.1 0.7 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Jun-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AVC2T245RSWR QFN RSW 10 3000 220.0 205.0 50.0
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Jun-2008
Pack Materials-Page 2
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