LM5085QMY/NOPB - Texas Instruments

LM5085

PGATE

ISEN

GND

VCC

ADJ

4.5V to 75V

Input

VIN

GND

SHUTDOWN

CIN

CVCC

CADJ

RADJ

Cff COUT

RFB2

RFB1

VOUT

GND

VIN

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

LM5085/-Q1 75-V Constant On-Time PFET Buck Switching Controller

1 Features 3 Description

The LM5085 is a high efficiency PFET switching

1• LM5085-Q1 is an Automotive Grade Product that regulator controller that can be used to quickly and

is AEC-Q100 Grade 1 Qualified (–40°C to 125°C easily develop a small, efficient buck regulator for a

Operating Junction Temperature) wide range of applications. This high voltage

• Wide 4.5-V to 75-V Input Voltage Range controller contains a PFET gate driver and a high

voltage bias regulator which operates over a wide

• Adjustable Current Limit Using RDS(ON) or a 4.5-V to 75-V input range. The constant on-time

Current Sense Resistor regulation principle requires no loop compensation,

• Programmable Switching Frequency to 1MHz simplifies circuit implementation, and results in

• No Loop Compensation Required ultrafast load transient response. The operating

• Ultra-Fast Transient Response frequency remains nearly constant with line and load

variations due to the inverse relationship between the

• Nearly Constant Operating Frequency with Line input voltage and the on-time. The PFET architecture

and Load Variations allows 100% duty cycle operation for a low dropout

• Adjustable Output Voltage from 1.25 V voltage. Either the RDS(ON) of the PFET or an external

• Precision ±2% Feedback Reference sense resistor can be used to sense current for over-

current detection.

• Capable of 100% Duty Cycle Operation

• Internal Soft-start Timer Device Information(1)

• Integrated High Voltage Bias Regulator PART NUMBER PACKAGE BODY SIZE (NOM)

• Thermal Shutdown VSSOP (8)

• Package: LM5085 HVSSOP (8) 3.00 mm x 3.00 mm

– HVSSOP-8 WSON (8)

LM5085-Q1 HVSSOP (8) 3.00 mm x 3.00 mm

– VSSOP-8

– WSON-8 (1) For all available packages, see the orderable addendum at

the end of the datasheet.

2 Applications

• Automotive Infotainment

• Battery/Super Capacitor Chargers

• LED Drivers

Typical Application, Basic Step Down Controller

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

Table of Contents

7.3 Feature Description................................................. 11

1 Features.................................................................. 17.4 Device Functional Modes........................................ 16

2 Applications ........................................................... 18 Application and Implementation ........................ 17

3 Description............................................................. 18.1 Application Information............................................ 17

4 Revision History..................................................... 28.2 Typical Application ................................................. 17

5 Pin Configuration and Functions......................... 39 Power Supply Recommendations...................... 23

6 Specifications......................................................... 310 Layout................................................................... 23

6.1 Absolute Maximum Ratings ...................................... 310.1 Layout Guidelines ................................................. 23

6.2 ESD Ratings: LM5085 .............................................. 410.2 Layout Example .................................................... 23

6.3 ESD Ratings: LM5085-Q1 ........................................ 411 Device and Documentation Support................. 24

6.4 Recommended Operating Conditions....................... 411.1 Related Links ........................................................ 24

6.5 Thermal Information.................................................. 411.2 Trademarks........................................................... 24

6.6 Electrical Characteristics........................................... 411.3 Electrostatic Discharge Caution............................ 24

6.7 Typical Characteristics.............................................. 611.4 Glossary................................................................ 24

7 Detailed Description............................................ 10 12 Mechanical, Packaging, and Orderable

7.1 Overview................................................................. 10 Information........................................................... 24

7.2 Functional Block Diagram....................................... 10

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (October 2014) to Revision I Page

• Moved the Storage temperature, Tstg to the Absolute Maximum Ratings.............................................................................. 3

• Changed "Handling Ratings" to ESD Ratings: LM5085 and ESD Ratings: LM5085-Q1 ....................................................... 4

• Added text "Figure 24 shows the required placement of this Schottky diode..." and Figure 24 to section VCC Regulator.14

Changes from Revision G (March 2013) to Revision H Page

• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device

Functional Modes,Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

Changes from Revision F (March 2013) to Revision G Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 23

Product Folder Links: LM5085 LM5085-Q1

Exposed Pad on Bottom

Connect to Ground

GND

ADJ

PGATE

ISEN

VCC

VIN

4 5

Exposed Pad on Bottom

Connect to Ground

FB PGATE

ISEN

GND

VCC

ADJ

VIN

4 5

FB PGATE

ISEN

GND

VCC

ADJ

VIN

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

5 Pin Configuration and Functions

8-Pins 8-Pins 8-Pins

HVSSOP Package WSON Package VSSOP Package

Top View Top View Top View

Pin Functions

PIN I/O DESCRIPTION APPLICATION INFORMATION

NAME NO.

ADJ 1 I Current Limit Adjust The current limit threshold is set by an external resistor from VIN to ADJ

in conjunction with the external sense resistor or the PFET’s RDS(ON).

RT 2 I On-Time Control and Shutdown An external resistor from VIN to RT sets the buck switch on-time and

switching frequency. Grounding this pin shuts down the controller.

FB 3 I Voltage Feedback From the Input to the regulation and over-voltage comparators. The regulation

Regulated Output level is 1.25V.

GND 4 - Circuit Ground Ground reference for all internal circuitry

ISEN 5 I Current Sense Input for Current limit Connect to the PFET drain when using RDS(ON) current sense. Connect

Detection. to the PFET source and the sense resistor when using a current sense

resistor.

PGATE 6 O Gate Driver Output Connect to the gate of the external PFET.

VCC 7 O Output of the gate driver bias Output of the negative voltage regulator (relative to VIN) that biases the

regulator PFET gate driver. A low ESR capacitor is required from VIN to VCC,

located as close as possible to the pins.

VIN 8 I Input Supply Voltage The operating input range is from 4.5V to 75V. A low ESR bypass

capacitor must be located as close as possible to the VIN and GND pins.

EP - Exposed Pad Exposed pad on the underside of the package (HVSSOP and WSON

only). This pad is to be soldered to the PC board ground plane to aid in

heat dissipation.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN MAX UNIT

VIN to GND –0.3 76 V

ISEN to GND –3 VIN + 0.3 V

ADJ to GND –0.3 VIN + 0.3 V

RT, FB to GND –0.3 7 V

VIN to VCC, VIN to PGATE –0.3 10 V

Storage temperature, Tstg –65 150 °C

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are

conditions under which operation of the device is intended to be functional. For specifications and test conditions, see the Electrical

Characteristics .

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

Product Folder Links: LM5085 LM5085-Q1

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

6.2 ESD Ratings: LM5085 VALUE UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000

V(ESD) Electrostatic discharge V

Charged device model (CDM), per JEDEC specification JESD22-C101, ±750

all pins(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings: LM5085-Q1 MIN VALUE UNIT

Human body model (HBM), per AEC Q100-002(1) ±2000

Corner pins (1, 4, 5, ±750

V(ESD) Electrostatic discharge V

Charged device model (CDM), per and 8)

AEC Q100-011 Other pins ±750

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.4 Recommended Operating Conditions MIN MAX UNIT

VIN Voltage 4.5 75 V

Junction Temperature –40 125 °C

6.5 Thermal Information LM5085 LM5085,

LM5085-Q1

THERMAL METRIC(1) UNIT

DGK NGQ DGN

8 PINS 8 PINS 8 PINS

θJA Junction-to-ambient thermal resistance 153 44.8 54.1

θJC(top) Junction-to-case (top) thermal resistance 52.5 39.4 49.1

θJB Junction-to-board thermal resistance 71.9 11.6 26.7 °C/W

ψJT Junction-to-top characterization parameter 4.6 0.3 1.3

ψJB Junction-to-board characterization parameter 70.8 11.6 26.5

θJC(bot) Junction-to-case (bottom) thermal resistance 29 5.0 3.6

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.6 Electrical Characteristics

Typical values correspond to TJ= 25°C. Minimum and maximum limits apply over –40°C to 125°C junction temperature range

unless otherwise stated. Unless otherwise stated the following conditions apply: VIN = 48 V, RT= 100kΩ.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VIN PIN

IIN Operating Current Non-Switching, FB = 1.4 V (1) 1.3 1.8 mA

IQShutdown Current RT = 0 V (1) 200 345 µA

VCC REGULATOR(2)

VCC(reg) VIN - VCC Vin = 9 V, FB = 1.4 V, ICC = 0 mA 6.9 7.7 8.5 V

Vin = 9 V, FB = 1.4 V, ICC = 20 mA 7.7 V

Vin = 75 V, FB = 1.4 V, ICC = 0 mA 7.7 V

UVLOVcc VCC Under-Voltage Lock-out VCC Increasing 3.8 V

Threshold

UVLOVcc Hysteresis VCC Decreasing 260 mV

VCC(CL) VCC Current Limit FB = 1.4 V 20 40 mA

(1) Operating current and shutdown current do not include the current in the RTresistor.

(2) VCC provides self bias for the internal gate drive.

Product Folder Links: LM5085 LM5085-Q1

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

Electrical Characteristics (continued)

Typical values correspond to TJ= 25°C. Minimum and maximum limits apply over –40°C to 125°C junction temperature range

unless otherwise stated. Unless otherwise stated the following conditions apply: VIN = 48 V, RT= 100kΩ.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

PGATE PIN

VPGATE(HI) PGATE High Voltage PGATE Pin = Open VIN -0.1 VIN V

VPGATE(LO) PGATE Low Voltage PGATE Pin = Open VCC VCC+0.1 V

VPGATE(HI)4.5 PGATE High Voltage at Vin = 4.5V PGATE Pin = Open VIN -0.1 VIN V

VPGATE(LO)4.5 PGATE Low Voltage at Vin = 4.5V PGATE Pin = Open VCC VCC+0.1 V

IPGATE Driver Output Source Current VIN = 12 V, PGATE = VIN - 3.5 V 1.75 A

Driver Output Sink Current VIN = 12 V, PGATE = VIN - 3.5 V 1.5 A

RPGATE Driver Output Resistance Source Current = 500 mA 2.3 Ω

Sink Current = 500 mA 2.3 Ω

CURRENT LIMIT DETECTION

IADJ ADJUST Pin Current Source VADJ = 46.5 V 32 40 48 µA

VCL OFFSET Current Limit Comparator Offset VADJ = 46.5 V, VADJ - VISEN -9 0 9 mV

RT PIN

RTSD Shutdown Threshold RT Pin Voltage Rising 0.73 V

RTHYS Shutdown Threshold Hysteresis 50 mV

ON-TIME

tON – 1 On-Time VIN = 4.5 V, RT= 100kΩ3.5 5 7.15 µs

tON – 2 VIN = 48 V, RT= 100kΩ276 360 435 ns

tON - 3 VIN = 75 V, RT= 100kΩ177 235 285 ns

tON - 4 Minimum On-Time in Current Limit VIN = 48 V, 25 mV Overdrive at ISEN 55 140 235 ns

(3)

OFF-TIME

tOFF(CL1) VIN = 12 V, VFB = 0 V 5.35 7.9 10.84 µs

tOFF(CL2) VIN = 12 V, VFB = 1 V 1.42 1.9 3.03 µs

Off-Time (Current Limit) (3)

tOFF(CL3) VIN = 48 V, VFB = 0 V 16 24 32.4 µs

tOFF(CL4) VIN = 48 V, VFB = 1 V 3.89 5.7 8.67 µs

REGULATION AND OVERVOLTAGE COMPARATORS (FB PIN)

VREF FB Regulation Threshold 1.225 1.25 1.275 V

VOV FB Over-Voltage Threshold Measured with Respect to VREF 350 mV

IFB FB Bias Current 10 nA

SOFT-START FUNCTION

tSS Soft-Start Time 1.4 2.5 4.3 ms

THERMAL SHUTDOWN

TSD Junction Shutdown Temperature Junction Temperature Rising 170 °C

THYS Junction Shutdown Hysteresis 20 °C

(3) The tolerance of the minimum on-time (tON-4) and the current limit off-times (tOFF(CL1) through (tOFF(CL4)) track each other over process

and temperature variations. A device which has an on-time at the high end of the range will have an off-time that is at the high end of its

range.

Product Folder Links: LM5085 LM5085-Q1

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

6.7 Typical Characteristics

Unless otherwise specified the following conditions apply: TJ= 25°C, VIN = 48V.

Figure 1. Efficiency (Circuit of Figure 25) Figure 2. Input Operating Current vs. VIN

Figure 3. Shutdown Current vs. VIN Figure 4. VCC vs. VIN

Figure 5. VCC vs. ICC Figure 6. On-Time vs. RTand VIN

Product Folder Links: LM5085 LM5085-Q1

0 10 20 30 40 50 60 70 80

VIN (V)

VOLTAGE AT THE RT PIN (V)

25 k:50 k:

100 k:

200 k:

300 k:

RT = 500 k:

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

Typical Characteristics (continued)

Unless otherwise specified the following conditions apply: TJ= 25°C, VIN = 48V.

Figure 7. Off-Time vs. VIN and VFB Figure 8. Voltage at the RT Pin

Figure 9. ADJ Pin Current vs. VIN Figure 10. Input Operating Current vs. Temperature

Figure 11. Shutdown Current vs. Temperature Figure 12. VCC vs. Temperature

Product Folder Links: LM5085 LM5085-Q1

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

Typical Characteristics (continued)

Unless otherwise specified the following conditions apply: TJ= 25°C, VIN = 48V.

Figure 13. On-Time vs. Temperature Figure 14. Minimum On-Time vs. Temperature

Figure 15. Off-Time vs. Temperature Figure 16. Current Limit Comparator Offset vs. Temperature

Figure 17. ADJ Pin Current vs. Temperature Figure 18. PGATE Driver Output Resistance vs.

Temperature

Product Folder Links: LM5085 LM5085-Q1

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

Typical Characteristics (continued)

Unless otherwise specified the following conditions apply: TJ= 25°C, VIN = 48V.

Figure 19. Feedback Reference Voltage vs. Temperature Figure 20. Soft-Start Time vs. Temperature

Figure 21. RT Pin Shutdown Threshold vs. Temperature

Product Folder Links: LM5085 LM5085-Q1

Negative Bias

Regulator

Thermal

Shutdown

ON Time

One-Shot

Soft-Start Gate Driver

Control Logic

VCC

UVLO Gate

Driver

REGULATION

COMPARATOR

OVER-VOLTAGE

COMPARATOR

CURRENT

LIMIT

COMPARATOR

OFF Time

One-Shot

LM5085

PGATE

ISEN

GND

VCC

ADJ

4.5V to 75V

Input

VIN

GND

SHUTDOWN

CVCC

CADJ

RADJ

1.25V

RFB1

RFB2

CBYP

RSEN

VCC VOUT

COUT

R3 C1

1.6V

7.7V

40 PA

0.73V

VIN

CIN

VIN

Duty Cycle = tON

tON + tOFF

== tON x FS

VOUT

VIN

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

7 Detailed Description

7.1 Overview

The LM5085 is a PFET buck (step-down) DC-DC controller using the constant on-time (COT) control principle.

The input operating voltage range of the LM5085 is 4.5V to 75V. The use of a PFET in a buck regulator greatly

simplifies the gate drive requirements and allows for 100% duty cycle operation to extend the regulation range

when operating at low input voltage. However, PFET transistors typically have higher on-resistance and gate

charge when compared to similarly rated NFET transistors. Consideration of available PFETs, input voltage

range, gate drive capability of the LM5085, and thermal resistances indicate an upper limit of 10A for the load

current for LM5085 applications. Constant on-time control is implemented using an on-time one-shot that is

triggered by the feedback signal. During the off-time, when the PFET (Q1) is off, the load current is supplied by

the inductor and the output capacitor. As the output voltage falls, the voltage at the feedback comparator input

(FB) falls below the regulation threshold. When this occurs Q1 is turned on for the one-shot period which is

determined by the input voltage (VIN) and the RTresistor. During the on-time the increasing inductor current

increases the voltage at FB above the feedback comparator threshold. For a buck regulator the basic relationship

between the on-time, off-time, input voltage and output voltage is:

(1)

where Fs is the switching frequency. Equation 1 is valid only in continuous conduction mode (inductor current

does not reach zero). Since the LM5085 controls the on-time inversely proportional to VIN, the switching

frequency remains relatively constant as VIN is varied. If the input voltage falls to a level that is equal to or less

than the regulated output voltage Q1 is held on continuously (100% duty cycle) and VOUT is approximately equal

to VIN.

The COT control scheme, with the feedback signal applied to a comparator rather than an error amplifier,

requires no loop compensation, resulting in very fast load transient response.

The LM5085 is available in both an 8-pin HVSSOP package and an 8-pin WSON package with an exposed pad

to aid in heat dissipation. An 8-pin VSSOP package without an exposed pad is also available.

7.2 Functional Block Diagram

Sense resistor method shown for current limit detection.

Minimum output ripple configuration shown.

Product Folder Links: LM5085 LM5085-Q1

RT = VOUT x (VIN - 1.56V)

1.45 x 10-7 x VIN x FS - 1.4

tD x (VIN - 1.56V)

1.45 x 10-7

FS = VOUT x (VIN - 1.56V + RT/3167)

VIN x [(1.45 x 10-7 x (RT + 1.4)) + (tD x (VIN - 1.56V + RT/3167))]

tON = (VIN - 1.56V + RT/3167)

1.45 x 10-7 x (RT + 1.4) + 50 ns

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

7.3 Feature Description

7.3.1 Regulation Control Circuit

The LM5085 buck DC-DC controller employs a control scheme based on a comparator and a one-shot on-timer,

with the output voltage feedback compared to an internal reference voltage (1.25V). When the FB pin voltage

falls below the feedback reference, Q1 is switched on for a time period determined by the input voltage and a

programming resistor (RT). Following the on-time Q1 remains off until the FB voltage falls below the reference.

Q1 is then switched on for another on-time period. The output voltage is set by the feedback resistors (RFB1, RFB2

in the Block Diagram). The regulated output voltage is calculated as follows:

VOUT = 1.25V x (RFB2+ RFB1)/ RFB1 (2)

The feedback voltage supplied to the FB pin is applied to a comparator rather than a linear amplifier. For proper

operation sufficient ripple amplitude is necessary at the FB pin to switch the comparator at regular intervals with

minimum delay and noise susceptibility. This ripple is normally obtained from the output voltage ripple attenuated

through the feedback resistors. The output voltage ripple is a result of the inductor’s ripple current passing

through the output capacitor’s ESR, or through a resistor in series with the output capacitor. Multiple methods are

available to ensure sufficient ripple is supplied to the FB pin, and three different configurations are discussed in

the Typical Application section.

When in regulation, the LM5085 operates in continuous conduction mode at medium to heavy load currents and

discontinuous conduction mode at light load currents. In continuous conduction mode the inductor’s current is

always greater than zero, and the operating frequency remains relatively constant with load and line variations.

The minimum load current for continuous conduction mode is one-half the inductor’s ripple current amplitude. In

discontinuous conduction mode, where the inductor’s current reaches zero during the off-time, the operating

frequency is lower than in continuous conduction mode and varies with load current. Conversion efficiency is

maintained at light loads since the switching losses are reduced with the reduction in load and frequency.

If the voltage at the FB pin exceeds 1.6V due to a transient overshoot or excessive ripple at VOUT the internal

over-voltage comparator immediately switches off Q1. The next on-time period starts when the voltage at FB falls

below the feedback reference voltage.

7.3.2 On-Time Timer

The on-time of the PFET gate drive output (PGATE pin) is determined by the resistor (RT) and the input voltage

(VIN), and is calculated from:

(3)

where RTis in kΩ.

The minimum on-time, which occurs at maximum VIN, should not be set less than 150ns (see Current Limiting

section). The buck regulator effective on-time, measured at the SW node (junction of Q1, L1, and D1) is typically

longer than that calculated in Equation 3 due to the asymmetric delay of the PFET. The on-time difference

caused by the PFET switching delay can be estimated as the difference of the turn-off and turn-on delays listed

in the PFET data sheet. Measuring the difference between the on-time at the PGATE pin versus the SW node in

the actual application circuit is also recommended.

In continuous conduction mode, the inverse relationship of tON with VIN results in a nearly constant switching

frequency as VIN is varied. The operating frequency can be calculated from:

(4)

where RTis in kΩ, and tDis equal to 50ns plus the PFET’s delay difference. To set a specific continuous

conduction mode switching frequency (FS), the RTresistor is determined from the following:

(5)

where RTis in kΩ. A simplified version of Equation 5 at VIN = 12V, and tD= 100ns, is:

Product Folder Links: LM5085 LM5085-Q1

Input

Voltage

STOP

RUN

LM5085

VIN

RT = VOUT x 6.67 x 106

FS - 33.4

RT = VOUT x 6 x 106

FS - 8.6

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

Feature Description (continued)

(6)

For VIN = 48V and tD= 100ns, the simplified equation is:

(7)

7.3.3 Shutdown

The LM5085 can be shutdown by grounding the RT pin (see Figure 22). In this mode the PFET is held off, and

the VCC regulator is disabled. The internal operating current is reduced to the value shown in the graph

“Shutdown current vs. VIN”. The shutdown threshold at the RT pin is ≊0.73V, with ≊50mV of hysteresis.

Releasing the pin enables normal operation. The RT pin must not be forced high during normal operation.

Figure 22. Shutdown Implementation

7.3.4 Current Limiting

The LM5085 current limiting operates by sensing the voltage across either the RDS(ON) of Q1, or a sense resistor,

during the on-time and comparing it to the voltage across the resistor RADJ (see Figure 23). The current limit

function is much more accurate and stable over temperature when a sense resistor is used. The RDS(ON) of a

MOSFET has a wide process variation and a large temperature coefficient.

If the voltage across RDS(ON) of Q1, or the sense resistor, is greater than the voltage across RADJ, the current limit

comparator switches to turn off Q1. Current sensing is disabled for a blanking time of ≊100ns at the beginning of

the on-time to prevent false triggering of the current limit comparator due to leading edge current spikes.

Because of the blanking time and the turn-on and turn-off delays created by the PFET, the on-time at the PGATE

pin should not be set less than 150ns. An on-time shorter than that may prevent the current limit detection circuit

from properly detecting an over-current condition. The duration of the subsequent forced off-time is a function of

the input voltage and the voltage at the FB pin, as shown in the graph “Off-time vs. VIN and VFB”. The longer-

than-normal forced off-time allows the inductor current to decrease to a low level before the next on-time. This

cycle-by-cycle monitoring, followed by a forced off-time, provides effective protection from output load faults over

a wide range of operating conditions.

The voltage across the RADJ resistor is set by an internal 40µA current sink at the ADJ pin. When using Q1’s

RDS(ON) for sensing, the current at which the current limit comparator switches is calculated from:

ICL = 40µA x RADJ/RDS(ON) (8)

When using a sense resistor (RSEN) the threshold of the current limit comparator is calculated from:

ICL = 40µA x RADJ/RSEN (9)

When using Equation 8 or Equation 9, the tolerances for the ADJ pin current sink and the offset of the current

limit comparator should be included to ensure the resulting minimum current limit is not less than the required

maximum switch current. Simultaneously increasing the values of RADJ and RSEN decreases the effects of the

current limit comparator offset, but at the expense of higher power dissipation. When using a sense resistor, the

RSEN resistor value should be chosen within the practical limitations of power dissipation and physical size. For

example, for a 10A current limit, setting RSEN = 0.005Ωresults in a power dissipation as high as 0.5W. Current

sense connections to the RSEN resistor, or to Q1, must be Kelvin connections to ensure accuracy.

Product Folder Links: LM5085 LM5085-Q1

VIN x tON

tOFF

VFD + VESR t

'I = (VOUT + VFD + VESR) x tOFF

'I = (VIN - VOUT) x tON

tOFF(CL) = (VFB x 0.93) + 0.28V

4.1 x 10-6 x ((VIN/31) + 0.15)

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

Feature Description (continued)

The CADJ capacitor filters noise from the ADJ pin, and helps prevent unintended switching of the current limit

comparator due to input voltage transients. The recommended value for CADJ is 1000pF.

7.3.5 Current Limit Off-Time

When the current through Q1 exceeds the current limit threshold, the LM5085 forces an off-time longer than the

normal off-time defined by Equation 1. See the graph “Off-Time vs. VIN and VFB”, or calculate the current limit off-

time from the following equation:

(10)

where VIN is the input voltage, and VFB is the voltage at the FB pin at the time current limit was detected. This

feature is necessary to allow the inductor current to decrease sufficiently to offset the current increase which

occurred during the on-time. During the on-time, the inductor current increases an amount equal to:

(11)

During the off-time the inductor current decreases due to the reverse voltage applied across the inductor by the

output voltage, the freewheeling diode’s forward voltage (VFD), and the voltage drop due to the inductor’s series

resistance (VESR). The current decrease is equal to:

(12)

The on-time in Equation 11 is shorter than the normal on-time since the PFET is shut off when the current limit

threshold is crossed. If the off-time is not long enough, such that the current decrease (Equation 12) is less than

the current increase (Equation 11), the current levels are higher at the start of the next on-time. This results in a

further decrease in on-time, since the current limit threshold is crossed sooner. A balance is reached when the

current changes in Equation 11 and Equation 12 are equal. The worst case situation is that of a direct short

circuit at the output terminals, where VOUT = 0V, as that results in the largest current increase during the on-time,

and the smallest decrease during the off-time. The sum of the diode’s forward voltage and the inductor’s ESR

voltage must be sufficient to ensure current runaway does not occur. Using Equation 11 and Equation 12, this

requirement can be stated as:

(13)

For tON in Equation 13, use the minimum on-time at the SW node. To determine this time period add the

“Minimum On-Time in Current Limit” specified in the Electrical Characteristics (tON-4) to the difference of the turn-

off and turn-on delays of the PFET. For tOFF use the value in the graph “Off-Time vs. VIN and VFB”, or use

Equation 10, where VFB is equal to zero volts. When using the minimum or maximum limits of those

specifications to determine worst case situations, the tolerance of the minimum on-time (tON-4) and the current

limit off-times (tOFF(CL1) through tOFF(CL4)) track each other over the process and temperature variations. A device

which has an on-time at the high end of the range will have an off-time that is at the high end of its range.

Product Folder Links: LM5085 LM5085-Q1

LM5085

PGATE

ISEN

GND

VCC

ADJ

4.5V to 75V

Input

VIN

GND

SHUTDOWN

CIN

CVCC

CADJ

RADJ

Cff COUT

RFB2

RFB1

VOUT

GND

VIN

(Optional)

LM5085

PGATE

ISEN

VCC

ADJ

CADJ

RADJ

LM5085

CURRENT LIMIT

COMPARATOR

GATE

DRIVER

40 PAADJ RADJ

CADJ

40 PA

Q1 L1

GATE

DRIVER

CURRENT LIMIT

COMPARATOR

ISEN

PGATE

VCC

RSEN

USING Q1 RDS(ON) USING SENSE RESISTOR RSEN

VIN

VIN VIN

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

Feature Description (continued)

Figure 23. Current Limit Sensing

7.3.6 VCC Regulator

The VCC regulator provides a regulated voltage between the VIN and the VCC pins to provide the bias and gate

current for the PFET gate driver. The 0.47µF capacitor at the VCC pin must be a low ESR capacitor, preferably

ceramic as it provides the high surge current for the PFET’s gate at each turn-on. The capacitor must be located

as close as possible to the VIN and VCC pins to minimize inductance in the PC board traces.

Referring to Figure 4 “VCC vs. VIN”, the voltage across the VCC regulator (VIN – VCC) is equal to VIN until VIN

reaches approximately 8.5V. At higher values of VIN, the voltage at the VCC pin is regulated at approximately

7.7V below VIN. If VIN drops below about 8V due to voltage transients, the VCC pin can be pulled down below

GND. To prevent the negative VCC voltage from disturbing the internal circuit and causing abnormal operation,

Figure 24 shows the required placement of this Schottky diode between the VCC pin and GND pin. The Schottky

diode should be placed as close as possible to the VCC pin. The VCC regulator has a maximum current

capability of at least 20mA. The regulator is disabled when the LM5085 is shutdown using the RT pin, or when

the thermal shutdown is activated.

Figure 24. Schottky Diode at VCC Pin During VIN Negative Transients (VIN < 8 V)

7.3.7 PGATE Driver Output

The PGATE pin output swings between VIN (Q1 off) and the VCC pin voltage (Q1 on). The rise and fall times

depend on the PFET gate capacitance and the source and sink currents provided by the internal gate driver. See

the Electrical Characteristics for the current capability of the driver.

Product Folder Links: LM5085 LM5085-Q1

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

Feature Description (continued)

7.3.8 P-Channel MOSFET Selection

The PFET must be rated for the maximum input voltage, with some margin above that to allow for transients and

ringing which can occur on the supply line and the switching node. The gate-to-source voltage (VGS) normally

provided to the PFET is 7.7V for VIN greater than 8.5V. However, if the circuit is to be operated at lower values

of VIN, the selected PFET must be able to fully turn-on with a VGS voltage equal to VIN. The minimum input

operating voltage for the LM5085 is 4.5V.

Similar to NFETs, the case or exposed thermal pad for a PFET is electrically connected to the drain terminal.

When designing a PFET buck regulator the drain terminal is connected to the switching node. This situation

requires a trade-off between thermal and EMI performance since increasing the PC board area of the switching

node to aid the PFET power dissipation also increases radiated noise, possibly disrupting the circuit operation.

Typically the switching node area is kept to a reasonable minimum and the PFET peak current is derated to stay

within the recommended temperature rating of the PFET. The RDS(ON) of the PFET determines a portion of the

power dissipation in the PFET. However, PFETs with very low RDS(ON) usually have large values of gate charge.

A PFET with a higher gate charge has a corresponding slower switching speed, leading to higher switching

losses and affecting the PFET power dissipation.

If the PFET RDS(ON) is used for current limit detection, note that it typically has a positive temperature coefficient.

At 100°C the RDS(ON) may be as much as 50% higher than the value at 25°C which could result in incorrect

current limiting if not accounted for when determining the value of the RADJ resistor. The PFET Total Gate

Charge determines most of the power dissipation in the LM5085 due to the repetitive charge and discharge of

the PFET’s gate capacitance by the gate driver (powered from the VCC regulator). The LM5085’s internal power

dissipation can be calculated from the following:

PDISS = VIN x ((QGx FS)+IIN) (14)

where QGis the PFET's Total Gate Charge obtained from its datasheet, FSis the switching frequency, and IIN is

the LM5085's operating current obtained from the graph "Input Operating Current vs. VIN". Using the Thermal

Resistance specifications in the Electrical Characteristics table, the approximate junction temperature can be

determined. If the calculated junction temperature is near the maximum operating temperature of 125°C, either

the switching frequency must be reduced, or a PFET with a smaller Total Gate Charge must be used.

7.3.9 Soft-Start

The internal soft-start feature of the LM5085 allows the regulator to gradually reach a steady state operating

point at power up, thereby reducing startup stresses and current surges. Upon turn-on, when Vcc reaches its

under-voltage lockout threshold, the internal soft-start circuit ramps the feedback reference voltage from 0V to

1.25V, causing VOUT to ramp up in a proportional manner. The soft-start ramp time is typically 2.5ms.

In addition to controlling the initial power up cycle, the soft-start circuit also activates when the LM5085 is

enabled by releasing the RT pin, and when the circuit is shutdown and restarted by the internal Thermal

Shutdown circuit.

If the voltage at FB is below the regulation threshold value due to an over-current condition or a short circuit at

VOUT, the internal reference voltage provided by the soft-start circuit to the regulation comparator is reduced

along with FB. When the over-current or short circuit condition is removed, VOUT returns to the regulated value at

a rate determined by the soft-start ramp. This feature helps prevent the output voltage from overshooting

following an overload event.

7.3.10 Thermal Shutdown

The LM5085 should be operated such that the junction temperature does not exceed 125°C. If the junction

temperature increases above that, an internal Thermal Shutdown circuit activates at 170°C (typical) to disable

the VCC regulator and the gate driver, and discharge the soft-start capacitor. This feature helps prevent

catastrophic failures from accidental device overheating. When the junction temperature falls below 150°C

(typical hysteresis = 20°C), the gate driver is enabled, the soft-start circuit is released, and normal operation

resumes.

Product Folder Links: LM5085 LM5085-Q1

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

7.4 Device Functional Modes

7.4.1 Standby Mode with VIN <4.5 V

The LM5085 is intended to operate with input voltages above 4.5 V. The minimum operating input voltage is

determined by the VCC undervoltage lockout threshold of 3.8 V (typ). If VIN is too low to support a VCC voltage

greater than the VCC UVLO threshold, the controller switches to the standby mode with the PFET buck switch in

the off state.

7.4.2 RT Shutdown Mode

The LM5085 is in shutdown mode when the RT pin is pulled below 0.73 V (typ). In this mode, the PFET gate

driver is held off and the VCC regulator is disabled.

Product Folder Links: LM5085 LM5085-Q1

7V to 55V

Input

VIN

GND

SHUTDOWN

CIN

33 PF

CBYP

1 PF

90.9 k:

GND FB

PGATE

ISEN

ADJ

VCC

CVCC

0.47 PF

CADJ 1000 pF

RADJ

2.1 k:

RSEN

0.01:

L1 15 PH

VOUT

COUT

GND

3300 pF

0.1 PF

66.5 k:

100 PF

RFB1

3.4 k:

RFB2

10 k:

VIN

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM5085/LM5085-Q1 devices are step-down DC-DC converters. The devices are typically used to convert a

higher DC voltage to a lower DC voltage. Use the following design procedure to select component values.

Alternately, use the WEBENCH®software to generate a complete design. The WEBENCH software uses an

iterative design procedure and accesses a comprehensive database of components when generating a design.

This section presents a simplified discussion of the design process.

8.2 Typical Application

The final circuit is shown in Figure 25, and its performance is presented in Figure 29 through Figure 32.

Figure 25. Example Circuit

8.2.1 Design Requirements

Referring to Functional Block Diagram , the circuit is to be configured for the following specifications:

• VOUT = 5V

• VIN = 7V to 55V, 12V Nominal

• Maximum load current (IOUT(max)) = 5A

• Minimum load current (IOUT(min)) = 600mA (for continuous conduction mode)

• Switching Frequency (FSW) = 300kHz

• Maximum allowable output ripple (VOS) = 5mVp-p

• Selected PFET: Vishay Si7465

8.2.2 Detailed Design Procedure

8.2.2.1 External Components

The procedure for calculating the external components is illustrated with the following design example.

Selected PFET: Vishay Si7465

RFB1 and RFB2:These resistors set the output voltage. The ratio of these resistors is calculated from:

RFB2/RFB1 = (VOUT/1.25V) - 1 (15)

Product Folder Links: LM5085 LM5085-Q1

RADJ = 32 PA

6.5A x 0.01: = 2.03 k:

SW Node

IPK

Inductor Current

IOUT

IOR

1/FS

L1 = tON(min) x (VIN(max) - VOUT)

IOR(max) = 14.9 PH

RT = 5 x (12 - 1.56V)

1.45 x 10-7 x 12 x 300 kHz - 1.4= 90.9

(50 ns + 57 ns) x (12 - 1.56V)

1.45 x 10-7

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

Typical Application (continued)

For this example, RFB2/RFB1 = 3. Typically, RFB1 and RFB2 should be chosen from standard value resistors in the

range of 1kΩto 20kΩwhich satisfy the above ratio. For this example, RFB2 = 10kΩ, and RFB1 = 3.4kΩ.

RT, PFET: Before selecting the RTresistor, the PFET must be selected as its turn-on and turn-off delays affect

the calculated value of RT. For the Vishay Si7465 PFET, the difference of its typical turn-off and turn-on delays is

57ns. Using Equation 5 at nominal input voltage, RTcalculates to be:

(16)

A standard value 90.9kΩresistor is selected. Using Equation 3, the minimum on-time at the PGATE pin, which

occurs at maximum input voltage (55V), is calculated to be 300ns. This minimum one-shot period is sufficiently

longer than the minimum recommended value of 150ns. The minimum on-time at the SW node (junction of Q1,

D1, L1) is longer due to the delay added by the PFET (57ns). Therefore the minimum SW node on-time is 357ns

at 55V. The maximum on-time at the SW node is calculated to be 2.55µs at 7V.

L1: The main parameter controlled by the inductor value is the current ripple amplitude (IOR). See Figure 26. The

minimum load current for continuous conduction mode is used to determine the maximum allowable ripple such

that the inductor current valley does not fall to zero. Continuous conduction mode operation at minimum load

current is not a requirement of the LM5085, but serves as a guideline for selecting L1. For this example, the

maximum ripple current is:

IOR(max) = 2 x IOUT(min) = 1.2 Amp (17)

If the minimum load current of the application is zero, a good initial estimate for the maximum ripple current

(IOR(max)) is 20% of the maximum load current. The ripple calculated in Equation 17 is then used in the following

equation to calculate L1:

(18)

A standard value 15µH inductor is selected. Using this inductance value, the maximum ripple current amplitude,

which occurs at maximum input voltage, is calculated to be 1.19 Ap-p. The peak current (IPK) at maximum load

current is 5.6A. However, the current rating of the selected inductor must be based on the maximum current limit

value calculated below.

Figure 26. Inductor Current Waveform

RSEN, RADJ:To achieve good current limit accuracy and avoid over designing the power stage components, the

sense resistor method is used for current limiting in this example. A standard value 10mΩresistor is selected for

RSEN, resulting in a 50mV drop at maximum load current, and a maximum 0.25W power dissipation in the

resistor. Since the LM5085 uses peak current detection, the minimum value for the current limit threshold must

be equal to the maximum load current (5A) plus half the maximum ripple amplitude calculated above:

ICL(min) = 5A + 1.19A/2 = 5.6A (19)

At this current level the voltage across RSEN is 56mV. Adding the current limit comparator offset of 9mV (max)

increases the required current limit threshold to 6.5A. Using Equation 9 with the minimum value for the ADJ pin

current (32µA), the required RADJ resistor is calculated to be:

(20)

Product Folder Links: LM5085 LM5085-Q1

R3 x C1 = (7V - 4.81V) x 2.55 Ps

0.025V = 2.23 x 10-4

R3 x C1 = (VIN(min) - VA) x tON

COUT = 1.19A

8 x 300 kHz x 0.005V = 99.2 PF

COUT = IOR(max)

8 x FS x VRIPPLE

ICL(min) = 0.01:

(2.1 k: x 32 PA) - 9 mV = 5.82A

ICL(max) = 0.01:

(2.1 k: x 48 PA) + 9 mV = 11A

ICL(nom) = 0.01:

(2.1 k: x 40 PA) = 8.4A

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

Typical Application (continued)

A standard value 2.1kΩresistor is selected. The nominal current limit threshold is:

(21)

Using the tolerances for the ADJ pin current and the current limit comparator offset, the maximum current limit

threshold is calculated to be:

(22)

The minimum current limit threshold is:

(23)

The load current in each case is equal to the current limit threshold minus half the current ripple amplitude. The

recommended value of 1000pF for CADJ is used in this example.

COUT:Since the maximum allowed output ripple voltage is very low in this example (5 mVp-p), the minimum

ripple configuration (R3, C1, and C2 in the Block Diagram) must be used. The resulting ripple at VOUT is then due

to the inductor’s ripple current passing through COUT. This capacitor’s value can be selected based on the

maximum allowable ripple voltage at VOUT, or based on transient response requirements. The following

calculation, based on ripple voltage, provides a first order result for the value of COUT:

(24)

where IOR(max) is the maximum ripple current calculated above, and VRIPPLE is the allowable ripple at VOUT.

(25)

A 100µF capacitor is selected. Typically the ripple amplitude will be higher than the calculations indicate due to

the capacitor’s ESR.

R3, C1, C2: The minimum ripple configuration uses these three components to generate the ripple voltage

required at the FB pin since there is insufficient ripple at VOUT. A minimum of 25 mVp-p must be applied to the

FB pin to obtain stable constant frequency operation. R3 and C1 are selected to generate a sawtooth waveform

at their junction, and that waveform is AC coupled to the FB pin via C2. The values of the three components are

determined using the following procedure:

Calculate VA= VOUT - (VSW x (1 – (VOUT/VIN(min)))) (26)

where VSW is the absolute value of the voltage at the SW node during the off-time, typically 0.5V to 1V

depending on the diode D1. Using a typical value of 0.65V, VAcalculates to 4.81V. VAis the nominal DC voltage

at the R3/C1 junction, and is used in the next equation to calculate the R3-C3 product:

(27)

where tON is the maximum on-time (at minimum input voltage), and ΔV is the desired ripple amplitude at the R3-

C1 junction. For ripple voltage of 25 mVp-p:

(28)

R3 and C1 are then selected from standard value components to produce the product calculated above. Typical

values for C1 are 3000pF to 10,000pF, and R3 is typically from 10kΩto 300kΩ. C2 is then chosen large

compared to C1, typically 0.1µF. For this example, 3300pF is chosen for C1, requiring R3 to be 67.7kΩ. A

standard value 66.5kΩresistor is selected.

Product Folder Links: LM5085 LM5085-Q1

R4 = 25 mV

IOR(min)

CIN + CBYP = IOUT(max) x tON(max)

'V= 25.5 PF

5A x 2.55 Ps

0.5V

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

Typical Application (continued)

CIN, CBYP:These capacitors limit the voltage ripple at VIN by supplying most of the switch current during the on-

time. At maximum load current, when Q1 is switched on, the current through Q1 suddenly increases to the lower

peak of the inductor’s ripple current, then ramps up to the upper peak, and then drops to zero at turn-off. The

average current during the on-time is the load current. For a worst case calculation, these capacitors must supply

this average load current during the maximum on-time, while limiting the voltage drop at VIN. For this example,

0.5V is selected as the maximum allowable droop at VIN. The minimum input capacitance is calculated from:

(29)

A 33µF electrolytic capacitor is selected for CIN, and a 1µF ceramic capacitor is selected for CBYP. Due to the

ESR of CIN, the ripple at VIN will likely be higher than the calculation indicates, and therefore it may be desirable

to increase CIN to 47µF or 68µF. CBYP must be located as close as possible to the VIN and GND pins of the

LM5085. The voltage rating for both capacitors must be at least 55V. The RMS ripple current rating for the input

capacitors must also be considered. A good approximation for the required ripple current rating is IRMS > IOUT/2.

D1: A Schottky diode is recommended. Ultra-fast recovery diodes are not recommended as the high speed

transitions at the SW node may affect the regulator’s operation due to the diode’s reverse recovery transients.

The diode must be rated for the maximum input voltage, and the worst case current limit level. The average

power dissipation in the diode is calculated from:

PD1 = VFx IOUT x (1-D) (30)

where VFis the diode’s forward voltage drop, and D is the on-time duty cycle. Using Equation 1, the minimum

duty cycle occurs at maximum input voltage, and is calculated to be ≊9.1% in this example. The diode power

dissipation calculates to be:

PD1 = 0.65V x 5A x (1- 0.091) = 2.95W (31)

CVCC:The capacitor at the VCC pin (from VIN to VCC) provides not only noise filtering and stability for the VCC

regulator, but also provides the surge current for the PFET gate drive. The typical recommended value for CVCC

is 0.47µF. A good quality, low ESR, ceramic capacitor is recommended. CVCC must be located as close as

possible to the VIN and VCC pins. If the selected PFET has a Total Gate Charge specification of 100nC or

larger, or if the circuit is required to operate at input voltages below 7V, a larger capacitor may be required. The

maximum recommended value for CVCC is 1µF.

IC Power Dissipation: The maximum power dissipated in the LM5085 package is calculated using Equation 14

at the maximum input voltage. The Total Gate Charge for the Si7465 PFET is specified to be 40nC (max) in its

data sheet. Therefore the total power dissipation within the LM5085 is calculated to be:

PDISS = 55V x ((40nC x 300kHz) + 1.4mA) = 737mW (32)

Using an HVSSOP package with a θJA of 46°C/W produces a temperature rise of 34°C from junction to ambient.

8.2.2.2 Alternate Output Ripple Configurations

The minimum ripple configuration employing C1, C2, and R3 in Figure 25 results in a low ripple amplitude at

VOUT determined mainly by the characteristics of the output capacitor and the ripple current in L1. This

configuration allows multiple ceramic capacitors to be used for VOUT if the output voltage is provided to several

places on the PC board. However, if a slightly higher level of ripple at VOUT is acceptable in the application, and

distributed capacitance is not used, the ripple required for the FB comparator pin can be generated with fewer

external components using the circuits shown below.

a) Reduced ripple configuration: In Figure 27, R3, C1 and C2 are removed (compared to Figure 25). A low

value resistor (R4) is added in series with COUT, and a capacitor (Cff) is added across RFB2. Ripple is generated

at VOUT by the inductor ripple current flowing through R4, and that ripple voltage is passed to the FB pin via Cff.

The ripple at VOUT can be set as low as 25 mVp-p since it is not attenuated by RFB2 and RFB1. The minimum

value for R4 is calculated from:

(33)

where IOR(min) is the minimum ripple current, which occurs at minimum input voltage. The minimum value for Cff

is determined from:

Product Folder Links: LM5085 LM5085-Q1

LM5085

PGATE

GND

Q1 L1

COUT

RFB2

RFB1

VOUT

GND

D1 R4

R4 = VRIP(min)

IOR(min)

LM5085

PGATE

GND

Q1 L1

Cff

COUT

RFB2

RFB1

VOUT

GND

D1 R4

Cff = 3 x tON(max)

(RFB1//RFB2)

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

Typical Application (continued)

(34)

where tON(max) is the maximum on-time, which occurs at minimum VIN. The next larger standard value capacitor

should be used for Cff.

Figure 27. Reduced Ripple Configuration

b) Lowest cost configuration: This configuration, shown in Figure 28, is the same as Figure 27 except Cff is

removed. Since the ripple voltage at VOUT is attenuated by RFB2 and RFB1, the minimum ripple required at VOUT is

equal to:

VRIP(min) = 25mV x (RFB2 + RFB1)/RFB1 (35)

The minimum value for R4 is calculated from:

(36)

where IOR(min) is the minimum ripple current, which occurs at minimum input voltage.

Figure 28. Lowest Cost Ripple Generating Configuration

Product Folder Links: LM5085 LM5085-Q1

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

Typical Application (continued)

8.2.3 Application Curves

Figure 29. Efficiency vs. Load Current and VIN Figure 30. Frequency vs. VIN

(Circuit of Figure 25) (Circuit of Figure 25)

Figure 31. Current Limit vs. VIN Figure 32. LM5085 Power Dissipation

(Circuit of Figure 25) (Circuit of Figure 25)

Product Folder Links: LM5085 LM5085-Q1

4 5

Exposed Pad on Bottom

Connect to Ground

FB PGATE

ISEN

GND

VCC

ADJ

VIN

RSEN

RT and ADJ

Connections

(Tap to CIN)

CIN

CVCC

COUT

VIN

GND

RFB1

Keep

CIN, D1, Q1

Loop Small

VOUT

LM5085

LM5085-Q1

www.ti.com

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

9 Power Supply Recommendations

The devices are designed to operate from an input voltage supply range between 4.5 V and 75 V. This input

supply must be well regulated. If the input supply is located more than a few inches from the device, additional

bulk capacitance may be required at the input terminals of the converter in addition to the calculated values to

limit the inductive spikes due to the input cables or wires.

10 Layout

10.1 Layout Guidelines

In most applications, the heat sink pad or tab of Q1 is connected to the switch node, i.e. the junction of Q1, L1

and D1. While it is common to extend the PC board pad from under these devices to aid in heat dissipation, the

pad size should be limited to minimize EMI radiation from this switching node. If the PC board layout allows, a

similarly sized copper pad can be placed on the underside of the PC board, and connected with as many vias as

possible to aid in heat dissipation.

The voltage regulation, over-voltage, and current limit comparators are very fast and can respond to short

duration noise pulses. Layout considerations are therefore critical for optimum performance. The layout must be

as neat and compact as possible with all the components as close as possible to their associated pins. Two

major current loops conduct currents which switch very fast, requiring the loops to be as small as possible to

minimize conducted and radiated EMI. The first loop is that formed by CIN, Q1, L1, COUT, and back to CIN. The

second loop is that formed by D1, L1, COUT, and back to D1. The connection from the anode of D1 to the ground

end of CIN must be short and direct. CIN must be as close as possible to the VIN and GND pins, and CVCC must

be as close as possible to the VIN and VCC pins.

If the anticipated internal power dissipation of the LM5085 will produce excessive junction temperatures during

normal operation, a package option with an exposed pad must be used (HVSSOP-8 or WSON-8). Effective use

of the PC board ground plane can help dissipate heat. Additionally, the use of wide PC board traces, where

possible, helps conduct heat away from the IC. Judicious positioning of the PC board within the end product,

along with the use of any available air flow (forced or natural convection) also helps reduce the junction

temperature.

10.2 Layout Example

Figure 33. LM5085 Buck Converter Layout Example

Product Folder Links: LM5085 LM5085-Q1

LM5085

LM5085-Q1

SNVS565I –NOVEMBER 2008–REVISED AUGUST 2015

www.ti.com

11 Device and Documentation Support

11.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 1. Related Links

TECHNICAL TOOLS & SUPPORT &

PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

LM5085 Click here Click here Click here Click here Click here

LM5085-Q1 Click here Click here Click here Click here Click here

11.2 Trademarks

WEBENCH is a registered trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: LM5085 LM5085-Q1

PACKAGE OPTION ADDENDUM

www.ti.com 20-Jan-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM5085MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SSTB

LM5085MME/NOPB ACTIVE VSSOP DGK 8 250 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SSTB

LM5085MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SSTB

LM5085MY/NOPB ACTIVE MSOP-

PowerPAD DGN 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SSSB

LM5085MYE/NOPB ACTIVE MSOP-

PowerPAD DGN 8 250 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SSSB

LM5085MYX/NOPB ACTIVE MSOP-

PowerPAD DGN 8 3500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SSSB

LM5085QMY/NOPB ACTIVE MSOP-

PowerPAD DGN 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SYCB

LM5085QMYE/NOPB ACTIVE MSOP-

PowerPAD DGN 8 250 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SYCB

LM5085QMYX/NOPB ACTIVE MSOP-

PowerPAD DGN 8 3500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 SYCB

LM5085SD/NOPB ACTIVE WSON NGQ 8 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L245B

LM5085SDE/NOPB ACTIVE WSON NGQ 8 250 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L245B

LM5085SDX/NOPB ACTIVE WSON NGQ 8 4500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L245B

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

PACKAGE OPTION ADDENDUM

www.ti.com 20-Jan-2017

Addendum-Page 2

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF LM5085, LM5085-Q1 :

•Catalog: LM5085

•Automotive: LM5085-Q1

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM5085MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM5085MME/NOPB VSSOP DGK 8 250 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM5085MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM5085MY/NOPB MSOP-

Power

PAD

DGN 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM5085MYE/NOPB MSOP-

Power

PAD

DGN 8 250 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM5085MYX/NOPB MSOP-

Power

PAD

DGN 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM5085QMY/NOPB MSOP-

Power

PAD

DGN 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM5085QMYE/NOPB MSOP-

Power

PAD

DGN 8 250 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM5085QMYX/NOPB MSOP-

Power

PAD

DGN 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM5085SD/NOPB WSON NGQ 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 10-Aug-2015

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM5085SDE/NOPB WSON NGQ 8 250 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

LM5085SDX/NOPB WSON NGQ 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM5085MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0

LM5085MME/NOPB VSSOP DGK 8 250 210.0 185.0 35.0

LM5085MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LM5085MY/NOPB MSOP-PowerPAD DGN 8 1000 210.0 185.0 35.0

LM5085MYE/NOPB MSOP-PowerPAD DGN 8 250 210.0 185.0 35.0

LM5085MYX/NOPB MSOP-PowerPAD DGN 8 3500 367.0 367.0 35.0

LM5085QMY/NOPB MSOP-PowerPAD DGN 8 1000 210.0 185.0 35.0

LM5085QMYE/NOPB MSOP-PowerPAD DGN 8 250 210.0 185.0 35.0

LM5085QMYX/NOPB MSOP-PowerPAD DGN 8 3500 367.0 367.0 35.0

LM5085SD/NOPB WSON NGQ 8 1000 210.0 185.0 35.0

LM5085SDE/NOPB WSON NGQ 8 250 210.0 185.0 35.0

LM5085SDX/NOPB WSON NGQ 8 4500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 10-Aug-2015

Pack Materials-Page 2

MECHANICAL DATA

DGN0008A

www.ti.com

MUY08A (Rev A)

BOTTOM VIEW

www.ti.com

PACKAGE OUTLINE

8X 0.3

0.2

2 0.1

8X 0.5

0.3

1.5

1.6 0.1

6X 0.5

0.8

0.7

0.05

0.00

B3.1

2.9 A

3.1

2.9

(0.1) TYP

WSON - 0.8 mm max heightNGQ0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214922/A 03/2018

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

PIN 1 ID 0.1 C A B

0.05 C

THERMAL PAD

EXPOSED

SYMM

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 4.000

www.ti.com

EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

(1.6)

6X (0.5)

(2.8)

8X (0.25)

8X (0.6)

(2)

(R0.05) TYP ( 0.2) VIA

TYP

(0.75)

WSON - 0.8 mm max heightNGQ0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214922/A 03/2018

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:20X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

EXPOSED METAL

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)

EXPOSED METAL

www.ti.com

EXAMPLE STENCIL DESIGN

8X (0.25)

8X (0.6)

6X (0.5)

(1.79)

(1.47)

(2.8)

(R0.05) TYP

WSON - 0.8 mm max heightNGQ0008A

PLASTIC SMALL OUTLINE - NO LEAD

4214922/A 03/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

EXPOSED PAD 9:

82% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:20X

SYMM

METAL

TYP

IMPORTANT NOTICE

Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its

semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers

should obtain the latest relevant information before placing orders and should verify that such information is current and complete.

TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated

circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and

services.

Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is

accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced

documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements

different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the

associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers

remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have

full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products

used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with

respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous

consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and

take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will

thoroughly test such applications and the functionality of such TI products as used in such applications.

TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,

including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to

assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any

way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource

solely for this purpose and subject to the terms of this Notice.

TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI

products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,

enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically

described in the published documentation for a particular TI Resource.

Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that

include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE

TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY

RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or

endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR

REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO

ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF

MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL

PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,

INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF

PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,

DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN

CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN

ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949

and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.

Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such

products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards

and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must

ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in

life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.

Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all

medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).

Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications

and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory

requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-

compliance with the terms and provisions of this Notice.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

LM5085QMY/NOPB LM5085QMYE/NOPB LM5085QMYX/NOPB