ISD1110P - Nuvoton Technology Corporation of America

Publication Release Date: April 21, 2005

- 1 - Revision 1.1

ISD1100 SERIES

SINGLE-CHIP,

VOICE RECORD / PLAYBACK DEVICES

10- AND 12-SECOND DURATION

ISD1100 SERIES

- 2 -

1. GENERAL DESCRIPTION

Winbond’s ChipCorder® ISD1100 series provide high-quality, single-chip, Record/Playback solutions

to 10- and 12-second messaging applications. The CMOS devices include an on-chip oscillator,

microphone preamplifier, automatic gain control, anti-aliasing filter, smoothing filter, and speaker

amplifier. A minimum Record/Playback subsystem can be configured with a microphone, a speaker,

several passive components, two push buttons and a power source. Recordings are stored into on-

chip nonvolatile memory cells, providing zero-power message storage. This unique, single-chip

solution is made possible through Winbond’s patented Multi-Level Storage (MLS) technology. Voice

and audio signals are stored directly into memory in their natural form, providing high-quality, solid-

state voice reproduction.

2. FEATURES

• Single 5 volt power supply

• Single-Chip with 10 and 12 seconds duration

• Easy-to-use single-chip, voice record/playback solution

• Push-button interface

o Playback can be edge- or level-activated

• Fully addressable to handle multiple messages

• Automatic power-down

o Enters into standby mode automatically following a record or playback operation

o 0.5 µA Standby current (typical)

• Zero-power message storage

o Eliminates battery backup circuits

• High-quality, natural voice/audio reproduction

• On-chip oscillator

• No programmer or development system needed

• 100,000 record cycles (typical)

• 100-year message retention (typical)

• Available in die, PDIP, and SOIC

• Temperature: Commercial - Packaged unit : 0°C to 70°C, Die : 0°C to 50°C

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 3 - Revision 1.1

3. BLOCK DIAGRAM

Internal Clock Timing

Sampling Clock

64K Cell

Nonvolatile

Multilevel Storage

Array

Analog Transceivers

Decoders

Device ControlPower Conditioning

Automatic

Gain Control

(AGC)

5-Pole Active

Antialiasing Filter

5-Pole Active

Smoothing Filter Amp

Pre-

Amp

SP +

SP -

RECLEDPLAYLPLAYEREC

VCCA VSSA VSSD VCCD

AGC

MIC REF

MIC

XCLK

AmpANA IN

ANA OUT

Address Buffers

A0 A1 A2 A3 A4 A5 A6 A7

ISD1100 SERIES

- 4 -

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 2

3. BLOCK DIAGRAM .............................................................................................................................. 3

4. TABLE OF CONTENTS ...................................................................................................................... 4

5. PIN CONFIGURATION ....................................................................................................................... 5

6. PIN DESCRIPTION............................................................................................................................. 6

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10

7.1. Detailed Description.................................................................................................................... 10

8. TIMING DIAGRAMS.......................................................................................................................... 12

9. ABSOLUTE MAXIMUM RATINGS [1] ................................................................................................ 13

9.1 Operating Conditions ................................................................................................................... 14

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 15

10.1. Parameters For Packaged Parts .............................................................................................. 15

10.1.1. Typical Parameter Variation with Voltage and Temperature ............................................. 18

10.2. Parameters For DIE.................................................................................................................. 19

10.2.1. Typical Parameter Variation with Voltage and Temperature ............................................. 22

11. TYPICAL APPLICATION CIRCUIT.................................................................................................23

12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 26

12.1. 28-Lead 300mil Plastic Small Outline IC (SOIC)...................................................................... 26

12.2. 28-Lead 600mil Plastic Dual Inline Package (PDIP) ................................................................ 27

12.3. Die Physical Layout [1]............................................................................................................... 28

13. ORDERING INFORMATION........................................................................................................... 30

14. VERSION HISTORY ....................................................................................................................... 31

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 5 - Revision 1.1

5. PIN CONFIGURATION

SOIC / PDIP

VSSD

VSSA

SP+

REC

XCLK

RECLED

PLAYE

PLAYL

ANA OUT

ANA IN

AGC

MIC REF

MIC

VCCA

SP-

VCCD

ISD1100 SERIES

- 6 -

6. PIN DESCRIPTION

PIN NAME PIN NO. FUNCTION

A0-A7 1-6, 9, 10 Address Inputs: The address inputs have two functions,

depending on the level of the two Most Significant Bits (MSB)

of the address (A6 and A7).

If either or both of the two MSBs are LOW, all inputs are

interpreted as address bits and are used as the start address

for the current record or playback cycle. The address pins are

inputs only and do not output internal address information as

the operation progresses. Address inputs are latched by the

falling edge of PLAYE , PLAYL , or REC .

If both A6 & A7 are HIGH, then the device is in a special

operational mode for looping. Please refer to looping

capability section for details.

A0, A1, A2, A3, A4 and A5 have internal pull-down resistors,

while A6 and A7 have internal pull-up resistors. They can be

floating if not used. Each of these internal pull-up or pull-down

devices have a value of 50 K Ω to 100 K Ω.

VSSA, VSSD 12, 13

Ground: Similar to VCCA and VCCD, separate analog and digital

ground rails provide independent analog and digital ground

buses internally to minimize noise. These pins should be tied

together as close as possible to the device.

SP+, SP- 14, 15 Speaker Outputs: The differential SP+ and SP- pins are

designed to drive a 16Ω speaker directly. Conversely, with

single-ended connection, a coupling capacitor is needed

between the SP pin and the speaker. Besides, the output

power is about a quarter of that from differential output. The

speaker outputs are in high-impedance state during recording

and at VSSA during power down.

VCCA, VCCD 16, 28

Supply Voltages: Separate analog and digital powers provide

power to internal analog and digital circuits respectively to

minimize internal noises. These power buses are brought out

to separate pads and should be tied together as close to the

supply source as possible. It is important that the power

supplies are decoupled as close to the device as possible.

MIC 17

Microphone: The microphone input transfers its signal to the

on-chip preamplifier. An on-chip Automatic Gain Control

(AGC) circuit controls the gain of this preamplifier from –15 to

24dB. An external microphone should be AC coupled to this

pin via a series capacitor. The capacitor value, together with

the internal 10 KΩ resistance on this pin, determines the low-

frequency cutoff for the device passband. See Winbond’s

Application Information for additional information on low-

frequency cutoff calculation.

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 7 - Revision 1.1

PIN NAME PIN NO. FUNCTION

MIC REF 18 Microphone Reference: The MIC REF input is the inverting

input to the microphone preamplifier. This provides a noise-

canceling or common-mode rejection input to the device when

connected to a differential microphone.

AGC 19

Automatic Gain Control (AGC): The AGC input dynamically

adjusts the gain of the preamplifier to compensate for the wide

range of microphone input levels. The AGC allows the full

range of sound, from whispers to loud sounds, to be recorded

with minimal distortion. The “attack” time is determined by the

time constant of a 5 KΩ internal resistance and an external

capacitor (C6 of Figure 5 in Section 11) connected from the

AGC pin to VSSA. The “release” time is determined by the time

constant of an external resistor (R5) and an external capacitor

(C6) connected in parallel between the AGC pin and VSSA pin.

Nominal values of 470 KΩ and 4.7 µF give satisfactory results

in most cases. Tying this to ground gives maximum gain,

while tying it to VCCA gives minimum gain for the AGC

amplifier.

ANA IN 20 Analog Input: The ANA IN transfers an input signal to the

chip for recording. For microphone usage, this ANA IN pin

should be connected via an external capacitor to the ANA

OUT pin. This capacitor value, together with the 3 KΩ input

impedance of ANA IN, is selected to give additional cutoff at

the low-frequency end of the voice passband. If the desired

input is derived from a source other than a microphone, the

signal can be capacitively coupled into the ANA IN pin directly.

ANA OUT 21 Analog Output: This pin provides the preamplifier output to

the user. The voltage gain of the preamplifier is determined by

the voltage level at the AGC pin.

PLAYL [2][3] 23 Playback, Level-Activated: When this input signal is held

LOW, a playback cycle is initiated, and playback continues

until PLAYL is pulled HIGH, or an EOM marker is detected.

The device automatically powers down and enters into

standby mode upon completion of a playback cycle. This pin

has an internal pull-up resistor.

PLAYE [2][3] 24 Playback, Edge-Activated: When a LOW-going transition is

detected on this pin, a playback cycle begins. Taking PLAYE

HIGH during a playback cycle will not terminate the current

cycle. Playback continues until an EOM is encountered. Upon

completion of a playback cycle, the device automatically

powers down and enters into standby mode. This pin has an

internal pull-up device.

ISD1100 SERIES

- 8 -

PIN NAME PIN NO. FUNCTION

RECLED 25 Record LED: The RECLED output is LOW during a record

cycle. It can be used to drive an LED to indicate a record cycle

is in progress. In addition, RECLED pulses LOW

momentarily when an end-of-message is encountered in a

playback operation.

XCLK 26

External Clock: The external clock input has an internal pull-

down resistor. The ISD1100 is configured at the factory with

an internal sampling clock frequency that guarantees its

minimum nominal record/playback time. For instance, an

ISD1110 operating within specification will be observed to

always have a minimum of 10 seconds of recording time. The

sampling frequency is then maintained to a variation of ±2.25

percent over the commercial temperature and operating

voltage ranges while still maintaining the minimum duration

specified. As a result some devices will have a few percent

more than nominal recording time. If greater precision is

required, the device can be clocked through the XCLK pin as

follows:

EXTERNAL CLOCK SAMPLE RATES

Part Number Sample Rate Required Clock

ISD1110 6.4 kHz 819.2 kHz

ISD1112 5.3 kHz 682.7 kHz

These recommended clock rates should not be varied

because the anti-aliasing and smoothing filters are fixed, and

aliasing problems can occur if the sample rate differs from the

one recommended. The duty cycle on the input clock is not

critical, as the clock is immediately divided by two. If the

XCLK is not used, this pin must be grounded. Please see

Application Information for the ISD1100 series for more details

on external clocking.

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 9 - Revision 1.1

PIN NAME PIN NO. FUNCTION

REC [1][3] 27 Record: The REC input is an active-LOW signal. The device

records whenever REC is LOW. This signal must remain

LOW for the duration of the recording. A record cycle is

completed when REC is pulled HIGH or the memory space

is filled up.

REC takes precedence over either playback ( PLAYE or

PLAYL ) signal. If REC is pulled LOW during a playback

cycle, the playback immediately ceases and recording begins.

An end-of-message (EOM) marker is internally recorded,

enabling a subsequent playback cycle to terminate

appropriately. The device automatically powers down into

standby mode when REC goes HIGH. This pin has an

internal pull-up resistor.

NC 11

NC: No connect

Notes:

[1] The REC signal is debounced for 50 ms on the rising edge to prevent a false retriggering from a push-

button switch.

[2] During playback, if either PLAYE or PLAYL is held LOW during EOM or OVF, the device will still

enter into standby mode and the internal oscillator and timing generator will stop. However, the rising

edge of PLAYE and PLAYL are not debounced and any subsequent falling edge (particularly switch

bounce) present on the input pins will initiate another playback.

[3] REC , PLAYL and PLAYE have internal pull-ups to VCC. Holding on these pins LOW wil increase

standby current consumption.

ISD1100 SERIES

- 10 -

7. FUNCTIONAL DESCRIPTION

7.1. DETAILED DESCRIPTION

Speech/Sound Quality

Winbond’s patented ChipCorder® technology provides natural audio record and playback. The

ISD1100 series include devices of 5.3 kHz and 6.4 kHz sampling frequencies, allowing the user a

choice of speech quality options. The input voice signals are stored directly into non-volatile EEPROM

cells and are reproduced without the synthetic effect often heard with digital solid-state speech

solutions. A complete sample is stored in a single cell, minimizing the memory necessary to store a

recording of a given duration.

Duration

The ISD1100 series offer single-chip solutions of 10 and 12 seconds duration.

TABLE 1: ISD1100 SERIES PRODUCT SUMMARY

Part Number Duration

(Seconds)

Input Sample

Rate (kHz)

Typical Filter Pass

Band* (kHz)

ISD1110 10 6.4 2.6

ISD1112 12 5.3 2.2

* 3dB roll-off-point….

EEPROM Storage

One of the benefits of Winbond’s ChipCorder® technology is the use of on-chip non-volatile memory,

providing zero-power message storage. The message is retained for up to 100 years typically without

power. In addition, the device can be re-recorded typically over 100,000 times.

Basic Operation

The ISD1100 ChipCorder® series are controlled by a single signal, REC , or one of two playback

control signals, PLAYE (edge-activated playback), and PLAYL (level-activated playback). The

ISD1100 series parts are configured for simplicity of design in a single/multiple-message application.

Using the address lines will allow multiple message applications.

Automatic Power-Down Mode

At the end of a playback or record operation, the ISD1100 series automatically enters into a standby

mode, with typically 0.5 µA current. During a playback cycle, the device powers down automatically at

the end of the message. During a record cycle, the device powers down immediately after REC is

released HIGH.

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 11 - Revision 1.1

Addressing

In addition to single-message application, the ISD1100 series provides a full addressing capability for

multiple message application.

The memory array of ISD1100 series has 80 distinct addressable rows, providing the below

resolutions per row. See Application Information for address tables of ISD1100 series.

TABLE 2: DEVICE PLAYBACK/RECORD DURATIONS

Part Number Minimum Duration (per ROW)

ISD1110 125 msec

ISD1112 150 msec

Looping Capability

The ISD1100 series device has a built-in looping function enabling it to continuously repeat a single

message. This mode is accomplished by taking A3, A6 and A7 pins HIGH simultaneously to

continuously loop from the end of the message to the beginning of the message. Looping is initiated

by a negative transition on PLAYE pin with A3, A6 and A7 held HIGH, then PLAYE is brought back

to HIGH. Looping will continue indefinitely with all three control pins ( PLAYE ,PLAYL ,REC )

remaining HIGH, until PLAYL is pulsed to LOW, which ends the looping.

ISD1100 SERIES

- 12 -

8. TIMING DIAGRAMS

A0-A7

THOLD

TSET TSET THOLD

REC

TREC TREC

RECLED

TLED1 TLED2

MIC

ANA IN

TRPUD TRPDD

FIGURE 1: RECORD

REC

PLAYL

PLAYE

A0-A7

SP+/-

TPLAY

THOLD

TSET

TEOM

TPPUD

RECLED

TSET TSET

THOLD THOLD

TPPDD

TPPDD TPPUD

TEOM

[1]

[2]

[1] REC must be HIGH for the entire duration of a playback cycle.

[2] RECLED functions as an EOM playback.

FIGURE 2: PLAYBACK

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 13 - Revision 1.1

9. ABSOLUTE MAXIMUM RATINGS [1]

TABLE 3: ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)

CONDITIONS VALUES

Junction temperature 150°C

Storage temperature range -65°C to +150°C

Voltage applied to any pin (VSS – 0.3V) to (VCC + 0.3V)

Voltage applied to any pins (Input current limited to ±20 mA) (VSS – 1.0V) to (VCC + 1.0V)

Lead temperature (Soldering – 10sec) 300°C

VCC – VSS -0.3V to +7V

TABLE 4: ABSOLUTE MAXIMUM RATINGS (DIE)

CONDITIONS VALUES

Junction temperature 150°C

Storage temperature range -65°C to +150°C

Voltage applied to any pad (VSS – 0.3V) to (VCC + 0.3V)

Voltage applied to any pad (Input current limited to

±20mA)

(VSS – 1.0V) to (VCC + 1.0V)

VCC – VSS -0.3V to +7V

[1] Stresses above those listed may cause permanent damage to the device. Exposure to

the absolute maximum ratings may affect device reliability and performance. Functional

operation is not implied at these conditions.

ISD1100 SERIES

- 14 -

9.1 OPERATING CONDITIONS

TABLE 5: OPERATING CONDITIONS (PACKAGED PARTS)

CONDITIONS VALUES

Commercial operating temperature range (Case temperature) 0°C to +70°C

Supply voltage (VCC) [1] +4.5V to +5.5V

Ground voltage (VSS) [2] 0V

TABLE 6: OPERATING CONDITIONS (DIE)

CONDITIONS VALUES

Commercial operating temperature range 0°C to +50°C

Supply voltage (VCC) [1] +4.5V to +6.5V

Ground voltage (VSS) [2] 0V

[1] VCC = VCCA = VCCD

[2] VSS = VSSA = VSSD

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 15 - Revision 1.1

10. ELECTRICAL CHARACTERISTICS

10.1. PARAMETERS FOR PACKAGED PARTS

TABLE 7: DC PARAMETERS

PARAMETERS SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS

Input Low Voltage VIL 0.8 V

Input High Voltage VIH 2.4 V

Output Low Voltage VOL 0.4 V IOL = 4.0 mA

Output High Voltage VOH 2.4 V IOH = -1.6 µA

VCC Current (Operating) ICC 15 30 mA VCC = 5.5V[3],

REXT = ∞

VCC Current (Standby) ISB 0.5 2 µA

[3] [4]

Input Leakage Current IIL

±1 µA

Input Current LOW w/ Pull

IILPU -130 µA Force VSS

[5]

Input Current HIGH w/ Pull

Down

IILPD 130 µA Force VCC

[6]

Output Load Impedance REXT 16 Ω Speaker Load

Preamp Input Resistance RMIC 10 KΩ Pins 17, 18

ANA IN Input Resistance RANA IN 3 KΩ

Preamp Gain 1 APRE1 24 dB AGC = 0.0V

Preamp Gain 2 APRE2 -45 -15 dB AGC = 2.5V

ANA IN to SP+/- Gain AARP 22 dB

AGC Output Resistance RAGC 5 KΩ

Preamp Out Source IPREH -2 mA @ VOUT = 1.0V

Preamp In Sink IPREL 0.5 mA @ VOUT = 2.0V

Notes:

[1] Typical values @ TA = 25° and VCC = 5.0V.

[2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all

specifications are 100 percent tested.

[3] VCCA and VCCD connected together.

[4] REC , PLAYL , and PLAYE must be at VCCD.

[5] XCLK pin only.

[6] A0-A5, XCLK.

ISD1100 SERIES

- 16 -

TABLE 8: AC PARAMETERS – Packaged parts

CHARACTERISTIC SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS

Sampling Frequency

ISD1110

ISD1112

6.4

5.3

kHz

[5]

Filter Pass Band

ISD1110

ISD1112

FCF

2.6

2.2

kHz

3 dB Roll-Off Point [3][6]

Record Duration

ISD1110

ISD1112

TREC

sec

Playback Duration

ISD1110

ISD1112

TPLAY

sec

[5]

RECLED ON Delay TLED1 5 µsec

RECLED OFF Delay

ISD1110

ISD1112

TLED2

48.5

58.3

100

105

msec

A0-A7 Setup Time TSET 300 nsec

A0-A7 Hold Time THOLD 0 nsec

Record Power-Up Delay

ISD1110

ISD1112

TRPUD

msec

Record Power-Down Delay

ISD1110

ISD1112

TRPDD

msec

Play Power-Up Delay

ISD1110

ISD1112

TPPUD

msec

Play Power-Down Delay

ISD1110

ISD1112

TPPDD

8.1

9.7

msec

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 17 - Revision 1.1

TABLE 8 (cont’d)

CHARACTERISTIC SYMBOL MIN[2] TYP[1] MAX[2] UNITS CONDITIONS

EOM Pulse Width

ISD1110

ISD1112

TEOM

15.625

18.75

msec

Total Harmonic Distortion THD 1 % @ 1 kHz

Speaker Output Power POUT 12.2 mW REXT = 16 Ω

Voltage Across Speaker Pins VOUT 1.25 2.5 mVp-p REXT = 600 Ω

MIC Input Voltage VIN1 20 mV Peak-to-Peak

[4]

ANA IN Input Voltage VIN2 50 mV Peak-to-Peak

Notes:

[1] Typical values @ TA = 25° and VCC = 5.0V.

[2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all

specifications are 100 percent tested.

[3] Low-frequency cutoff depends upon the value of external capacitors (see Pin Descriptions)

[4] With 5.1 KΩ series resistor at ANA IN.

[5] Sampling Frequency and playback Duration can vary as much as ±2.25 percent over the commercial

temperature and voltage ranges. All devices will meet the maximum sampling frequency and minimum

playback duration parameters. For greater stability, an external clock can be utilized (see Pin

Descriptions)

[6] Filter specification applies to the antialiasing filter and the smoothing filter. Typical Parameter Variation

with Voltage and Temperature. This parameter is not checked during production testing and may vary

due to process variations and other factors. Therefore, the customer should not rely upon this value for

testing purposes.

ISD1100 SERIES

- 18 -

10.1.1. Typical Parameter Variation with Voltage and Temperature

-40 25 70 85

Temperature (C)

5.5 Volts 4.5 Volts

Percent Change (%)

-2.5

-2.0

-1.5

-1.0

-0.5

0.5

Chart 4: Oscillator Stability

-40 25 70 85

Temperature (C)

5.5 Volts 4.5 Volts

Operating Current (mA)

Chart 1: Record Mode Operating

Current (ICC)

-40 25 70 85

Temperature (C)

5.5 Volts 4.5 Volts

Percent Distortion (%)

0.05

0.10

0.15

0.20

0.25

Chart 2: Total Harmonic Distortion

-40 25 70 85

Temperature (C)

5.5 Volts 4.5 Volts

Standby Current (mA)

0.10

0.15

0.20

0.25

0.30

Chart 3: Standby Current (ISB)

0.35

0.40

0.30

0.35

0.40

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 19 - Revision 1.1

10.2. PARAMETERS FOR DIE

TABLE 9: DC PARAMETERS

PARAMETERS SYMBOLS MIN[2] TYP[1] MAX[2] UNITS CONDITIONS

Input Low Voltage VIL 0.8 V

Input High Voltage VIH 2.4 V

Output Low Voltage VOL 0.4 V IOL = 4.0 mA

Output High Voltage VOH 2.4 V IOH = -1.6 µA

VCC Current (Operating) ICC 15 30 mA VCC = 5.5V [3],

REXT = ∞

VCC Current (Standby) ISB 0.5 2 µA

[3][4]

Input Leakage Current IIL

±1 µA

Input Current HIGH w/ Pull

IILPU -130 µA Force VCC

[5]

Input Current HIGH w/ Pull

Down

IILPD 130 µA Force VCC

[6]

Output Load Impedance REXT 16 Ω Speaker Load

Preamp Input Resistance RMIC 10 KΩ Pads 17,18

ANA IN Input Resistance RANA IN 3 KΩ

Preamp Gain 1 APRE1 24 dB AGC = 0.0V

Preamp Gain 2 APRE2 -45 -15 dB AGC = 2.5V

ANA IN to SP+/- Gain AARP 22 dB

AGC Output Resistance RAGC 5 KΩ

Preamp Out Source IPREH -2 mA @ VOUT = 1.0V

Preamp In Sink IPREL 0.5 mA @ VOUT = 2.0V

Notes:

[1] Typical values @ TA = 25° and VCC = 5.0V.

[2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all

specifications are 100 percent tested.

[3] VCCA and VCCD connected together.

[4] REC , PLAYL , and PLAYE must be at VCCD.

[5] XCLK pin only.

[6] A0-A5, XCLK.

ISD1100 SERIES

- 20 -

TABLE 10: AC PARAMETERS

CHARACTERISTIC SYMBOL MIN[2] TYP[1] MAX[2] UNITS CONDITIONS

Sampling Frequency

ISD1110

ISD1112

6.4

5.3

kHz

[5]

Filter Pass Band

ISD1110

ISD1112

FCF

2.6

2.2

kHz

3 dB Roll-Off Point [3][6]

Record Duration

ISD1110

ISD1112

TREC

sec

Playback Duration

ISD1110

ISD1112

TPLAY

sec

[5]

RECLED ON Delay TLED1 5 µsec

RECLED OFF Delay

ISD1110

ISD1112

TLED2

48.5

58.3

100

105

msec

Address Setup Time TSET 300 nsec

Address Hold Time THOLD 0 nsec

Power-Up Delay

ISD1110

ISD1112

TRPUD

msec

PD Pulse Width (Record)

ISD1110

ISD1112

TRPDD

msec

Play Power-Up Delay

ISD1110

ISD1112

TPPUD

msec

Play Power-Down Delay

ISD1110

ISD1112

TPPDD

8.1

9.7

msec

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 21 - Revision 1.1

TABLE 10 (cont’d)

CHARACTERISTIC SYMBOL MIN[2] TYP[1] MAX[2] UNITS CONDITIONS

EOM Pulse Width

ISD1110

ISD1112

TEOM

16.625

18.75

msec

Total Harmonic Distortion THD 1 % @ 1 kHz

Speaker Output Power POUT 12.2 mW REXT = 16 Ω [4]

Voltage Across Speaker Pins VOUT 1.25 2.5 mVp-p REXT = 600 Ω

MIC Input Voltage VIN1 20 mV Peak-to-Peak

[4]

ANA IN Input Voltage VIN2 50 mV Peak-to-Peak

Notes:

[1] Typical values @ TA = 25° and VCC = 5.0V.

[2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all

specifications are 100 percent tested.

[3] Low-frequency cutoff depends upon the value of external capacitors (see Pin Descriptions)

[4] With 5.1 KΩ series resistor at ANA IN.

[5] Sampling Frequency and playback Duration can vary as much as ±2.25 percent over the commercial

temperature and voltage ranges. All devices will meet the maximum sampling frequency and minimum

playback duration parameters. For greater stability, an external clock can be utilized (see Pin

Descriptions)

[6] Filter specification applies to the antialiasing filter and the smoothing filter. Typical Parameter Variation

with Voltage and Temperature. This parameter is not checked during production testing and may vary

due to process variations and other factors. Therefore, the customer should not rely upon this value for

testing purposes.

ISD1100 SERIES

- 22 -

10.2.1. Typical Parameter Variation with Voltage and Temperature

02550

Temperature (C)

Percent Change (%)

-2.0

-1.5

-1.0

-0.5

0.5

1.0

Chart 8: Oscillator Stability

6.5 Volts 5.5 Volts 4.5 Volts

02550

Temperature (C)

Percent Distortion (%)

0.1

0.2

0.3

0.4

0.5

Chart 6: Total Harmonic Distortion

6.5 Volts 5.5 Volts 4.5 Volts

02550

Temperature (C)

Operating Current (mA)

Chart 5: Record Mode Operating

Current (ICC)

6.5 Volts 5.5 Volts 4.5 Volts

02550

Temperature (C)

Standby Current (mA)

Chart 7: Standby Current (ISB)

6.5 Volts 5.5 Volts 4.5 Volts

0.1

0.2

0.3

0.4

0.5

0.6

1.5

2.0

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 23 - Revision 1.1

11. TYPICAL APPLICATION CIRCUIT

VCCD

VCCA

VSSD

VSSA

SP+

SP-

MIC REF

MIC

AGC

ANA IN

ANA OUTPLAYL

PLAYE

REC

RECLED

XCLK

PLAYL

PLAYE

RECORD

0.1 F

5.1 K

Ω

4.7 F

470 KΩ

220 F

10 KΩ

ELECTRET

MICROPHONE

VCC

0.1 F

0.001 F

1 KΩ

28 1KΩ

SPEAKER

16 Ω

10 KΩ

0.1 F

REC

LED

ISD1100

FIGURE 5: APPLICATION EXAMPLE

ISD1100 SERIES

- 24 -

Functional Description Example

The following operating sequence example demonstrates the functionality of the ISD1100 series.

1. Record a message:

Pulling the REC signal LOW initiates a record cycle from current location. When REC is

held LOW, the recording continues. Until the memory array is filled up or when REC is

pulled HIGH, recording ceases. An EOM marker is written at the end of message. Then the

device will automatically power down.

2. Edge-activated playback:

Pulling the PLAYE signal LOW initiates a playback cycle from the beginning of the message

until the entire message is played. The rising edge of PLAYE has no effect on operation.

When the EOM marker is encountered, the device automatically powers down. A subsequent

falling edge on PLAYE initiates a new playback operation from the beginning of the

message.

3. Level-activated playback:

Holding the PLAYL signal LOW initiates a playback cycle from the beginning of the

message, until PLAYL is pulled HIGH or when the EOM marker is encountered, playback

operation stops and the device automatically powers down.

4. Record (interrupting playback).

The REC signal takes precedence over playback operation. Holding REC LOW initiates a

new record operation from current location, regardless of any current operation in progress.

5. RECLED operation.

During record, the RECLED output pin provides an active-LOW signal, which can be used to

drive an LED as a “record-in-progress” indicator. It returns to a HIGH state when the REC

pin is pulled HIGH or when the recording is completed due to the memory being filled.

However, during playback, this pin also pulses LOW to indicate an EOM at the end of a

message.

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 25 - Revision 1.1

Applications Note

Some users may experience an unexpected recording taking place when their circuit is powered up,

or the batteries are changed, and VCC rises faster than REC . This undesired recording prevents

playback of the previously recorded message. A spurious EOM marker appears at the very beginning

of the memory, preventing access to the original message, and nothing is played.

To prevent this occurrence, install a capacitor (approx. 0.001 µF) between the REC and VCC pins.

This pulls the control pin voltage up with VCC as it rises. Once the voltage is HIGH, the pull-up device

will keep the pin HIGH until intentionally pulled LOW, preventing the false EOM marker.

Since this condition is dependent upon factors such as the capacitance of the user’s printed circuit

board, not all circuit designs will exhibit the spurious marker. It is recommended, however, that the

capacitor is included for design reliability. A more detailed explanation and resolution of this

occurrence is described in Application Information.

ISD1100 SERIES

- 26 -

12. PACKAGE DRAWING AND DIMENSIONS

12.1. 28-LEAD 300MIL PLASTIC SMALL OUTLINE IC (SOIC)

28 27 26 25 24 23 22 21 20 19 18 17 16 15

12345 67891011 12 13 14

INCHES MILLIMETERS

Min Nom Max Min Nom Max

A 0.701 0.706 0.711 17.81 17.93 18.06

B 0.097 0.101 0.104 2.46 2.56 2.64

C 0.292 0.296 0.299 7.42 7.52 7.59

D 0.005 0.009 0.0115 0.127 0.22 0.29

E 0.014 0.016 0.019 0.35 0.41 0.48

F 0.050 1.27

G 0.400 0.406 0.410 10.16 10.31 10.41

H 0.024 0.032 0.040 0.61 0.81 1.02

Note: Lead coplanarity to be within 0.004 inch.

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 27 - Revision 1.1

12.2. 28-LEAD 600MIL PLASTIC DUAL INLINE PACKAGE (PDIP)

INCHES MILLIMETERS

Min Nom Max Min Nom Max

A 1.445 1.450 1.455 36.70 36.83 36.96

B1 0.150 3.81

B2 0.065 0.070 0.075 1.65 1.78 1.91

C1 0.600 0.625 15.24 15.88

C2 0.530 0.540 0.550 13.46 13.72 13.97

D 0.19 4.83

D1 0.015 0.38

E 0.125 0.135 3.18 3.43

F 0.015 0.018 0.022 0.38 0.46 0.56

G 0.055 0.060 0.065 1.40 1.52 1.62

H 0.100 2.54

J 0.008 0.010 0.012 0.20 0.25 0.30

S 0.070 0.075 0.080 1.78 1.91 2.03

q 0° 15° 0° 15°

Note: Lead coplanarity to be within 0.005 inch.

ISD1100 SERIES

- 28 -

12.3. DIE PHYSICAL LAYOUT [1]

ISD1100X

o Die Dimensions

X: 172.2

± 1 mils

Y: 138.2

± 1 mils

o Die Thickness

[2]

17.5

± .1 mils

o Pad Opening

88 x 112 microns

3.46 x 4.41 mils

Notes:

[1] The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or

damage may occur.

[2] Die thickness is subject to change, please contact Winbond factory for status.

ISD1100X

VCCD

REC

XCLK

RECLED

PLAYE

PLAYL

ANA OUT

ANA IN

AGC

MIC REF

MICSP-

SP+

VSSD

VSSA

VCCA

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 29 - Revision 1.1

ISD1100 SERIES PAD DESIGNATIONS

(with respect to die center)

PAD PAD Name X Axis (µm) Y Axis (µm)

A0 Address 0 -1364.0 1589.6

A1 Address 1 -1648.4 1589.6

A2 Address 2 -1816.4 1589.6

A3 Address 3 -2013.6 1515.6

A4 Address 4 -2013.6 1337.6

A5 Address 5 -2013.6 1129.6

A6 Address 6 -2013.6 -831.2

A7 Address 7 -2013.6 -1022.0

NC No Connect -2013.6 -1361.6

VSSD Digital Ground -1893.6 -1588.0

VSSA Analog Ground -357.6 -1588.0

SP+ Speaker Output + -17.2 -1512.8

SP- Speaker Output - 412.4 -1512.8

VCCA Analog Power Supply 780.0 -1552.4

MIC Microphone Input 992.0 -1590.0

MIC REF Microphone Reference 1169.2 -1590.0

AGC Automatic Gain Control 1978.4 -1590.0

ANA IN Analog Input 2005.6 -1196.4

ANA OUT Analog Output 1991.2 -995.2

PLAYL Level-Activated Playback 2014.4 1224.4

PLAYE Edge-Activated Playback 2014.4 1392.8

RECLED Record LED Output 2012.4 1587.6

XCLK External Clock 1581.5 1589.6

REC Record 752.8 1589.6

VCCD Digital Power Supply -48.0 1545.2

ISD1100 SERIES

- 30 -

13. ORDERING INFORMATION

Product Number Descriptor Key

When ordering ISD1100 series devices, please refer to the following valid part numbers.

10-Second 12-Second Die / Package

Product P/N Ordering P/N Product P/N Ordering P/N

Die ISD1110X I1110X ISD1112X I1112X

PDIP ISD1110P I1110P ISD1112P I1112P

SOIC ISD1110S I1110S ISD1112S I1112S

For the latest product information, access Winbond’s worldwide website at

http://www.winbond-usa.com

ISD11

Package Type:

ISD1100 Series

Duration:

10 = 10 seconds

12 = 12 seconds

P = 28-Lead 600mil Plastic Dual Inline

S = 28-Lead 300mil Small Outline

X = Die

Special Temperature Field:

Blank = Commercial Packaged (0˚C to +70˚)

or Commercial Die (0˚C to +50˚)

Package (PDIP)

(SOIC)

ISD1100 SERIES

Publication Release Date: April 21, 2005

- 31 - Revision 1.1

14. VERSION HISTORY

VERSION DATE DESCRIPTION

0 Before 2004 Initial issue

1.0 March 2004 Reformat the document.

Add footnote to Filter Passband in Tables 1, 8 & 10.

Revise Functional Description Example section.

Revise die info.

Revise ordering information.

1.1 Apr 2005 Revise the disclaim section.

ISD1100 SERIES

- 32 -

Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.

No. 4, Creation Rd. III 2727 North First Street, San Jose, 27F, 299 Yan An W. Rd. Shanghai,

Science-Based Industrial Park, CA 95134, U.S.A. 200336 China

Hsinchu, Taiwan TEL: 1-408-9436666 TEL: 86-21-62365999

TEL: 886-3-5770066 FAX: 1-408-5441797 FAX: 86-21-62356998

FAX: 886-3-5665577 http://www.winbond-usa.com/

http://www.winbond.com.tw/

Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd.

9F, No. 480, Pueiguang Rd. 7F Daini-ueno BLDG. 3-7-18 Unit 9-15, 22F, Millennium City,

Neihu District Shinyokohama Kohokuku, No. 378 Kwun Tong Rd.,

Taipei, 114 Taiwan Yokohama, 222-0033 Kowloon, Hong Kong

TEL: 886-2-81777168 TEL: 81-45-4781881 TEL: 852-27513100

FAX: 886-2-87153579 FAX: 81-45-4781800 FAX: 852-27552064

Please note that all data and specifications are subject to change without notice.

All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.

This product incorporates SuperFlash® technology licensed From SST.

Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment

intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation

instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or

sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could

result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur.

Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully

indemnify Winbond for any damages resulting from such improper use or sales.

The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no

representation or warranties with respect to the accuracy or completeness of the contents of this publication and

reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice.

No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this

publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability

whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or

infringement of any Intellectual property.

The contents of this document are provided “AS IS”, and Winbond assumes no liability whatsoever and disclaims any

express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual

property. In no event, shall Winbond be liable for any damages whatsoever (including, without limitation, damages for

loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this

documents, even if Winbond has been advised of the possibility of such damages.

Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only

and Winbond makes no representation or warranty that such applications shall be suitable for the use specified.

The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in

the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates

SuperFlash®.

Information contained in this ISD® ChipCorder® datasheet supersedes all data for the ISD ChipCorder products

published by ISD® prior to August, 1998.

This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder®

product specifications. In the event any inconsistencies exist between the information in this and other product

documentation, or in the event that other product documentation contains information in addition to the information in

this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is

subject to change without notice.

Winbond Electronics Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All other trademarks

are properties of their respective owners.