SN54HCT32, SN74HCT32 QUADRUPLE 2-INPUT POSITIVE-OR GATES SCLS064E - NOVEMBER 1988 - REVISED AUGUST 2003 D D D Operating Voltage Range of 4.5 V to 5.5 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 20-A Max ICC D D D D Typical tpd = 13 ns 4-mA Output Drive at 5 V Low Input Current of 1 A Max Inputs Are TTL-Voltage Compatible SN54HCT32 . . . FK PACKAGE (TOP VIEW) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y 1Y NC 2A NC 2B 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 4A NC 4Y NC 3B 2Y GND NC 3Y 3A 1A 1B 1Y 2A 2B 2Y GND 1B 1A NC VCC 4B SN54HCT32 . . . J OR W PACKAGE SN74HCT32 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) NC - No internal connection description/ordering information The 'HCT32 devices contain four independent 2-input OR gates. They perform the Boolean function A B in positive logic. Y A * B or Y + ) + ORDERING INFORMATION PACKAGE TA PDIP - N SN74HCT32N Tube of 50 SN74HCT32D Reel of 2500 SN74HCT32DR Reel of 250 SN74HCT32DT SOP - NS Reel of 2000 SN74HCT32NSR HCT32 SSOP - DB Reel of 2000 SN74HCT32DBR HT32 Tube of 90 SN74HCT32PW Reel of 2000 SN74HCT32PWR TSSOP - PW -55 C to 125 -55C 125C C TOP-SIDE MARKING Tube of 25 SOIC - D -40C -40 C to 85 85C C ORDERABLE PART NUMBER SN74HCT32N HCT32 HT32 Reel of 250 SN74HCT32PWT CDIP - J Tube of 25 SNJ54HCT32J SNJ54HCT32J CFP - W Tube of 150 SNJ54HCT32W SNJ54HCT32W LCCC - FK Tube of 55 SNJ54HCT32FK SNJ54HCT32FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54HCT32, SN74HCT32 QUADRUPLE 2-INPUT POSITIVE-OR GATES SCLS064E - NOVEMBER 1988 - REVISED AUGUST 2003 FUNCTION TABLE (each gate) INPUTS B OUTPUT Y H X H X H H L L L A logic diagram (positive logic) A Y B absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54HCT32 NOM MAX MIN NOM MAX 4.5 5 5.5 4.5 5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO t/v Output voltage 0 High-level input voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V SN74HCT32 MIN 2 2 0.8 Input transition rise/fall time VCC VCC 500 0 0 UNIT V V 0.8 V VCC VCC V 500 ns V TA Operating free-air temperature -55 125 -40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54HCT32, SN74HCT32 QUADRUPLE 2-INPUT POSITIVE-OR GATES SCLS064E - NOVEMBER 1988 - REVISED AUGUST 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH VI = VIH or VIL IOH = -20 A IOH = -4 mA 4.5 V VOL VI = VIH or VIL IOL = 20 A IOL = 4 mA 4.5 V II ICC VI = VCC or 0 VI = VCC or 0, ICC MIN MIN MAX SN74HCT32 MIN 4.4 4.499 4.4 4.4 4.3 3.7 3.84 5.5 V 4.5 V to 5.5 V MAX UNIT V 0.001 0.1 0.1 0.1 0.17 0.26 0.4 0.33 0.1 100 1000 1000 nA 2 40 20 A 1.4 2.4 3 2.9 mA 3 10 10 10 pF 5.5 V Ci SN54HCT32 3.98 5.5 V IO = 0 One input at 0.5 V or 2.4 V, Other inputs at 0 or VCC TA = 25C TYP MAX V This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd A or B Y tt Y VCC MIN TA = 25C TYP MAX SN54HCT32 MIN MAX SN74HCT32 MIN MAX 4.5 V 15 24 35 30 5.5 V 13 22 32 27 4.5 V 9 15 22 19 5.5 V 8 14 20 17 UNIT ns ns operating characteristics, TA = 25C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per gate No load TYP 20 UNIT pF PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN54HCT32, SN74HCT32 QUADRUPLE 2-INPUT POSITIVE-OR GATES SCLS064E - NOVEMBER 1988 - REVISED AUGUST 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test 3V Test Point Input 1.3 V 1.3 V 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT 1.3 V 10% tPHL 90% 90% tr Input 1.3 V 0.3 V 2.7 V tPHL 3V 2.7 V 1.3 V 0.3 V 0 V tr Out-of-Phase Output 90% tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES VOH 1.3 V 10% V OL tf tPLH 1.3 V 10% tf 1.3 V 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HCT32D ACTIVE SOIC D 14 SN74HCT32DBLE OBSOLETE SSOP DB 14 SN74HCT32DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32DTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HCT32NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74HCT32NSR ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32PWLE OBSOLETE TSSOP PW 14 SN74HCT32PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32PWT ACTIVE TSSOP PW 14 250 CU NIPDAU Level-1-260C-UNLIM 50 Green (RoHS & no Sb/Br) TBD TBD Addendum-Page 1 Green (RoHS & Lead/Ball Finish CU NIPDAU Call TI Call TI MSL Peak Temp (3) Level-1-260C-UNLIM Call TI Call TI PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HCT32PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT32PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) no Sb/Br) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HCT32DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74HCT32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HCT32DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HCT32DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HCT32NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74HCT32PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HCT32PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HCT32DBR SSOP DB 14 2000 367.0 367.0 38.0 SN74HCT32DR SOIC D 14 2500 367.0 367.0 38.0 SN74HCT32DR SOIC D 14 2500 333.2 345.9 28.6 SN74HCT32DT SOIC D 14 250 367.0 367.0 38.0 SN74HCT32NSR SO NS 14 2000 367.0 367.0 38.0 SN74HCT32PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74HCT32PWT TSSOP PW 14 250 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. 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