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DX series high-density I/O connectors with bellow con-
tacts are perfect for tomorrow's miniaturized electronic
devices. This new 1.27mm (0.050'') interconnect design
ensures positive locking, effortless coupling, terminal
protection and EMI reduction in a miniaturized and rug-
ged package. DX series offers you one of the most
varied and complete lines of High-Density connectors
in the world, i.e. IDC, Solder and with Co-axial contacts
for the plug and right angle dip, straight dip, IDC and
with Co-axial contacts for the receptacle. Available in
20, 28, 36, 50, 68, 80, 100 and 132 way.
General
1. 1.27mm (0.050'') contact spacing conserves valu-
able board space and permits ultra-high density
designs.
2. Bellow contacts create smooth and precise mating
and unmating.
3. Unique shell design assures first make/last break
grounding and overall noise protection.
4. IDC termination allows quick and low cost termina-
tion to AWG#28 &#30 wires.
5. Group IDC termination of 1.27mm pitch cable and
loose piece contacts is possible simply by replac-
ting the protector, allowing you to select a termina-
tion system meeting requirements, trial production
and mass production, for example.
6. Backshell and receptacle shell are made of die-
cast zinc alloy to reduce the penetration of exter-
nal EMI noise.
7. Easy to use 'One-Touch' and 'Screw' locking
mechanisms assure quick and easy 'positive' clo-
sures every time.
8. Termination method is available in IDC, Soldering,
Right Angle Dip, Straight Dip and SMT.
9. DX with 3 cavities and 2 cavities for Co-axial
contacts are newly introduced to meet the needs
of high speed data transmission.
10. Shielded Plug-in type for interface between 2 Units
available.
Features
Office Automation, Computers, Communications Equipment, Factory Automation, Home Automation and other
commercial applications needing high density interconnections.
Application
DX SERIES
HIGH-DENSITY I/O CONNECTORS