LATB T66B
Hyper Multi TOPLED®
Enhanced optical Power LED (HOP2000 / ATON®)
Vorläufige Daten / Preliminary Data
2003-07-18 1
Bes onde re Merkmale
Gehäusetyp: weißes P-LCC-4 Gehäuse;
Kontrasterhöhung durch schwarze Oberfläche
(RGB-Displays) und diffuses Harz
Besonderhei t des B aut eils: additive
Farbmischung durch unabhängige Ansteuerung
aller Chi ps
Wellenlänge: 617 nm (ambe r) ,
528 nm (true green), 470 nm (blau)
Abstrahlwinkel: Lambertscher Strahler (120°)
Technologie: InGaAlP (amber),
InGaN (true green, blau)
optischer Wirkungsgra d: 24 lm/W (amber),
13 lm/W (true green), 3 lm/W (blau)
Gruppierungsparameter: Lichtstärke,
Wellenlänge
Verarbeitungsmethode: für alle
SMT-Bestücktechniken gee ignet
Lötmethode: IR Reflow Löten und
Wellenlöten (TTW)
Vorbehandlung: nach JEDEC Level 2
Gurtung: 8 mm Gurt mit 2000/Rolle , ø180 mm
oder 8000/Rolle, ø330 mm
ESD-Festigkeit: ESD-sicher bis 2 kV nach
EOS/ESD-5.1-1993
Anwendungen
Anzeigen im Innen- und Außenbereich
(z.B. im Ver k ehr sbereich; Laufschr if t anzeigen)
Leuchtdiodenchips getrennt ansteuerbar
Vollfarbdisplays bzw. RGB-Displays
Hinterleuchtung (LCD, Displays,
Werbebeleuchtung, Allgem ei nbeleuchtung)
Einkopplung in Lichtleiter
Features
package: whi te P- LC C-4 package;
higher contrast by a black surface
(RGB-Displays) and dif fused resin
feature of the device: additive mixture of color
stimuli by independent driving of each chip
wavelength: 617 nm (amber),
528 nm (true g ree n), 470 nm (blue)
viewing angle: Lambertian Emitter ( 120 °)
technology: InGaAlP (a mb e r),
InGaN (true green, blue)
optical efficiency: 24 lm/W (amber ),
13 lm /W (tru e green), 3 lm/W (blue)
grouping parameter: luminous intensit y,
wavelength
assembly methods: suitabl e for all
SMT assembly method s
soldering meth ods: IR reflow soldering and
TTW soldering
preconditioning: acc. to JEDEC Level 2
taping: 8 mm tape with 2000/r eel, ø180 mm
or 8000/reel, ø330 mm
ESD-wi t h st and voltage: up to 2 kV acc. to
EOS/ESD-5.1-1993
Applications
indoor and outdoor displays (e.g. displays for
traffic; light wr iting display s)
LED chips can be controlled separately
full color displays, RGB-Displays
backlighting (LCD, displays, illu mi nated
advertising, general lighting)
coupling into light guides
2003-07-18 2
LATB T66B
Anm.: -78 gesamter Farbbereich, Lieferung in Einzelgruppen (siehe Seite 5)
Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe. Einzelne Gruppen sind
nicht erhältlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Gruppe pro Farbe enthalten.
Dimmverhältnis im Gleichstrom-Betrieb max. 5:1 für amber
Note: -78 Total color tolerance range, delivery in single groups (please see page 5)
The standard shipping format for serial types includes a family group. Individual groups are not
available.
No packing unit / tape ever contains more than one luminous intensity group per color.
Dimming range for direct current mode max. 5:1 for amber
Typ
Type
Emissions-
farbe
Color of
Emission
Farbe der
Lichtaustritts-
fläche
Color of the
Light Emitting
Area
Lichtstärke
Luminous Intensity
IF = 20 mA
IV (mcd)
amber true green blue
LATB T66B amber
true green
blue
colorless diffused
and
black painted
package surface
180 ...450 180 ...450 45 ... 112
Bestell - Information
Ordering Information
Typ
Type Bestellnummer
Ordering Code
LATB T66B-ST-1+ST-78+PQ-1
LATB T66B-ST-1+ST-7+PQ-1
LATB T66B-ST-1+ST-8+PQ-1
LATB T66B-ST-1+TU-78+QR-1
Q65110A0152
Q65110A0181
Q65110A0182
Q65110A0697
LATB T66B
2003-07-18 3
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter Symbol
Symbol Werte
Values Einheit
Unit
LA LT LB
Betriebstemperatur
Operating temperature range Top 40 + 100 °C
Lagertemperatur
Storage temperature range Tstg 40 + 100 °C
Sperrschichttemperatur
Junction temperature Tj+ 125 + 125 + 110 °C
Durchlassstrom
Forward current IF50 20 20 mA
Stoßstrom
Surge current
tp = 10 µs, D = 0.005
IFM 100 400 300 mA
Sperrspannung1)
Reverse voltage VR12 5 5 V
Leistungsaufnahme
Power consumption Ptot 130 85 85 mW
Wärmewiderstand
Thermal resistance
Sperrschicht/Umgebung 1 chip on
Junction/ambient 3 chips on
Sperrschicht/Lötpad 1 chip on
Junction/solder point 3 chips on
Montage auf PC-Board FR 4 (Padgröße 16 mm 2)
mounted on PC board FR 4 (pad size 16 mm 2)
Rth JA
Rth JA
Rth JS
Rth JS
480
770
260
420
530
820
290
470
530
820
290
470
K/W
K/W
K/W
K/W
1) für kurzzeitigen Betrieb geeignet / suita ble f or s hort te rm application
2003-07-18 4
LATB T66B
Kennwerte (TA = 25 °C)
Characteristics
Bezeichnung
Parameter Symbol
Symbol Werte
Values Einheit
Unit
LA LT LB
Wellenlänge des emittierten Lichtes (typ.)
Wavelength at peak emission
IF = 20 mA
λpeak 628 523 465 nm
Dominantwellenlänge 1) (typ.)
Dominant wavelength
IF = 20 mA
λdom 617
2/+7 528
± 9 470
± 6 nm
Spektrale Bandbreite bei 50 % Irel max (typ.)
Spectral bandwidth at 50 % Irel max
IF = 20 mA
∆λ 16 33 25 nm
Abstrahlwinkel bei 50 % IV (Vollwinkel) (typ.)
Viewing angle at 50 % IV
2ϕ120 120 120 Grad
deg.
Durchlassspannung 2) (min.)
Forward voltage (typ.)
IF = 20 mA (max.)
VF
VF
VF
2.0
2.4 3.5
4.1 3.6
4.1
V
V
V
Sperrstrom (t yp . )
Reverse current (max.)
VR = 12 V (amber); VR = 5 V (true green / blue)
IR
IR
0.01
10 0.01
10 0.01
10 µA
µA
Temperaturkoeffizient von λpeak (typ.)
Temperature coefficient of λpeak
IF =20 mA; 10°C T 100°C
TCλpeak 0.13 0.04 0.05 nm/K
Temperaturkoeffizient von λdom (typ.)
Temperature coefficient of λdom
IF = 20 mA; 10°C T 100°C
TCλdom 0.06 0.03 0.04 nm/K
Temperaturkoeffizient von VF(typ.)
Temperature coefficient of VF
IF = 20 mA; 10°C T 100°C
TCV 1.8 3.6 3.1 mV/K
Optischer Wirkungsgrad (typ.)
Optical efficiency
IF = 20 mA
ηopt 24 13 3 lm/W
1) Wellenlängen werden m it einer St romeinprägedauer von 25 ms und einer Genauigkeit von ±1 nm ermittelt.
Wavelengths are tested at a current puls e duration of 25 ms and a tole rance of ±1 nm.
2) Spannungswerte w erden mit einer St romeinprägedauer von 1 ms und ein er Genauigkeit von ±0,1 V ermittelt.
Voltage s are tested at a current pulse du rat ion of 1 ms and a tolerance of ±0.1 V.
LATB T66B
2003-07-18 5
Helligkeitswerte werden mit einer Stromeinprägedauer von 25 ms und einer Genauigkeit von ±11 % ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of ±11 %.
1) Wellenlängengruppen / Wavelength groups
Gruppe
Group true green Einheit
Unit
min. max.
7 519 528 nm
8 528 537 nm
Lichtgruppe
Luminous
Intensity
Group
Lichtstärke
Luminous
Intensity
IV (mcd)
Lichtstrom
Luminous
Flux
ΦV (mlm)
Lichtstärke
Luminous
Intensity
IV (mcd)
Lichtstrom
Luminous
Flux
ΦV (ml m )
Lichtstärke
Luminous
Intensity
IV (mcd)
Lichtstrom
Luminous
Flux
ΦV (mlm)
amber true green blue
S+S+P
S+S+Q
S+T+P
S+T+Q
S+T+R
S+U+P
S+U+Q
S+U+R
T+S+P
T+S+Q
T+T+P
T+T+Q
T+T+R
T+U+P
T+U+Q
T+U+R
180 ... 280
180 ... 280
180 ... 280
180 ... 280
180 ... 280
180 ... 280
180 ... 280
180 ... 280
280 ... 450
280 ... 450
280 ... 450
280 ... 450
280 ... 450
280 ... 450
280 ... 450
280 ... 450
680 (typ.)
680 (typ.)
680 (typ.)
680 (typ.)
680 (typ.)
680 (typ.)
680 (typ.)
680 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
180 ... 280
180 ... 280
280 ... 450
280 ... 450
280 ... 450
450 ... 710
450 ... 710
450 ... 710
180 ... 280
180 ... 280
280 ... 450
280 ... 450
280 ... 450
450 ... 710
450 ... 710
450 ... 710
680 (typ.)
680 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1700 (typ.)
1700 (typ.)
1700 (typ.)
680 (typ.)
680 (typ.)
1075 (typ.)
1075 (typ.)
1075 (typ.)
1700 (typ.)
1700 (typ.)
1700 (typ.)
45 ... 71
71 ... 112
45 ... 71
71 ... 112
112 ... 180
45 ... 71
71 ... 112
112 ... 180
45 ... 71
71 ... 112
45 ... 71
71 ... 112
112 ... 180
45 ... 71
71 ... 112
112 ... 180
95 (typ.)
270 (typ.)
95 (typ.)
270 (typ.)
430 (typ.)
95 (typ.)
270 (typ.)
430 (typ.)
95 (typ.)
270 (typ.)
95 (typ.)
270 (typ.)
430 (typ.)
95 (typ.)
270 (typ.)
430 (typ.)
Gruppenbezeichnung auf Etikett
Group Name on Label
Beispiel: T-1+S-7+P-1
Example: T-1+S-7+P-1
Lichtgruppe
Luminous
Intensity
Group
(amber)
Wellenlänge
(keine
Gruppierung)
Wavelength
(no grouping)
(amber)
Lichtgruppe
Luminous
Intensity
Group
(true green)
Wellenlänge
Wavelength
(true green)
Lichtgruppe
Luminous
Intensity
Group
(blue)
Wellenlänge
(keine
Gruppierung)
Wavelength
(no grouping)
(blue)
T1S7P1
2003-07-18 6
LATB T66B
Relative spektrale Emission Irel = f (λ), TA = 25 °C, IF = 20 mA
Relative Spectral Emission
V(λ) = spektrale Augenempfindlichkeit
Standard eye response curve
Abstrahlcharakteristik Irel = f (ϕ)
Radiation Characteristic
0
350 nm
λ
OHL01452
I
20
40
60
80
%
100
rel
blue
400 450 500 550 600 650 700
true green
λ
V
amber
0
0.2
0.4
1.0
0.8
0.6
ϕ
1.0 0.8 0.6 0.4
10˚20˚40˚ 30˚
OHL01660
50˚
60˚
70˚
80˚
90˚
100˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
LATB T66B
2003-07-18 7
Durchlassstrom IF = f (VF)
Forward Current
TA = 25 °C
Durchlassstrom IF = f (VF)
Forward Current
TA = 25 °C
Relative Lichtstärke IV/IV(20 mA) = f (IF)
Relative Luminous Intensity
TA = 25 °C
Relative Lichtstärke IV/IV(25 °C) = f (TA)
Relative Luminous Intensity
IF = 20 mA
OHL00590
10-2
10-1
100
101
F
V
102
F
I
mA
2.3
1.3 1.5 1.7 1.9 2.1 V 2.5
OHL01481
I
F
3.5232.5 5V4.54
V
F
5
mA
102
10-1
5
100
5
101
true green
blue
V
V (20 mA)
10
-1 0
10 10
12
10
mA
OHL01473
F
I
II
55
true green
blue
1
10
-2
-3
10
10
5
-1
0
5
10
5
10
amber
OHL01477
0
-40 ˚C
T
(25 ˚C)
I
V
I
V
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
2.0
-20 0 20 40 60 100
amber
true green,
blue
LATB T66B
2003-07-18 8
Dominante Wellenlänge λdom = f (IF)
Dominant Wavelength
LB, TA = 25 °C
Dominante Wellenlänge λdom = f (IF)
Dominant Wavelength
LT, TA = 25 °C
I
OHL105
467
dom
λ
0mA
nm
20 40 60 80
468
469
470
471
472
473
474
blue
f
I
510
dom
λ
0 mA
nm
20 40 60 80
515
520
525
530
535
540
550
f
true green
LATB T66B
2003-07-18 9
Maximal zulässiger Durchlassstrom IF = f (T)
Max. Permissible Forward Current
1 chip on
Maximal zulässiger Durchlassstrom IF = f (T)
Max. Permissible Forward Current
1 chip on
Maximal zulässiger Durchlassstrom IF = f (T)
Max. Permissible Forward Current
3 chips on
Maximal zulässiger Durchlassstrom IF = f (T)
Max. Permissible Forward Current
3 chips on
OHL00926
0020 40 60 80 ˚C 100
mA
F
I
T
temp. ambient
T
A
A
amber
blue
10
20
30
40
50
60
true green
OHL00927
0020 40 60 80 ˚C 100
mA
F
I
T
temp. solder point
T
S
S
amber
blue
10
20
30
40
50
60
true green
OHL00928
0020 40 60 80 ˚C100
mA
F
I
T
temp. ambient
T
A
A
amber
blue
10
20
30
40
50
60
true green
OHL00929
0020 40 60 80 ˚C 100
mA
F
I
T
temp. solder point
T
S
S
amber
blue
10
20
30
40
50
60
true green
LATB T66B
2003-07-18 10
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
amber (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
amber (3 Chips on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
amber (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
amber (3 Chips on)
OHL00193
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
OHL01605
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
OHL01604
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
OHL01606
F
I
0
0.02
0.04
0.06
0.08
0.10
0.12
A
p
t
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
0.005
0.05
0.5
s
LATB T66B
2003-07-18 11
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
true green (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
true green (3 Chips on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
true green (1Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
true green (3 Chips on)
OHL11400
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.45
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
OHL00930
10-5
p
t
F
I
10-4 10-3 10-2 10-1 100101
0
A
2
10s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.20
OHL11401
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
D
t
P
T
=
T
P
t
I
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.05
0.10
0.15
0.20
OHL00931
10-5
p
t
F
I
10-4 10-3 10-2 10-1 100101
0
A
2
10s
Dt
P
T
=
T
P
tI
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.005
0.010
0.015
0.020
0.025
0.030
0.035
0.045
LATB T66B
2003-07-18 12
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
blue (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 25 °C
blue (3 Chips on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
blue (1 Chip on)
Zulässige Impulsbelastbarkeit IF = f (tp)
Permissible Pulse Handling Capability
Duty cycle D = parameter, TA= 85 °C
blue (3 Chips on)
OHL11405
10
-5
p
t
F
I
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0
A
2
10s
Dt
P
T
=
T
P
tI
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.05
0.10
0.15
0.20
0.25
0.35
OHL11406
10-5
p
t
F
I
10-4 10-3 10-2 10-1 100101
0
A
2
10s
Dt
P
T
=
T
P
tI
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.02
0.04
0.06
0.08
0.10
0.14
OHL00934
10-5
p
t
F
I
10-4 10-3 10-2 10-1 100101
0
A
2
10s
Dt
P
T
=
T
P
tI
F
0.01
0.05
0.2
0.1
0.005
0.02
0.5
D
=
0.050
0.100
LATB T66B
2003-07-18 13
Die Farbkoordinaten des Mischlichtes können innerhalb des mit a) gekennzeichneten Bereichs des Farbdreiecks
erwartet w erden.Der Unbuntpunkt (x = 0,33, y = 0,33) ist mit + geke nnz eichnet.
The color c oordinates of th e mixed light can be expected w it hin the area of the c olor t riangle marke d a).
The achromatic point (x = 0.33, y = 0.33) is marked +.
OHA02290
+
520 530 540 550
560
570
580590
600
610
620
630
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
a)
amber
blue
true green
2003-07-18 14
LATB T66B
Maßzeichnung
Package Outlines
Maße werden wi e fo lgt angegeben: m m (inch) / Dimen sio ns are s pecified as follo w s: m m (inc h).
Gewicht / Approx. weight: 35 mg
14
23
Package marking
GPLY6900
2.6 (0.102)
2.1 (0.083)
2.3 (0.091)
3.0 (0.118)
0.8 (0.031)
0.6 (0.024)
3.0 (0.118)
3.4 (0.134)
(2.4 (0.094))
3.3 (0.130)
3.7 (0.146)
0.5 (0.020)
1.1 (0.043)
0.1 (0.004) typ
4˚±1
0.18 (0.007) 0.4 (0.016)
0.6 (0.024)
1.7 (0.067)
2.1 (0.083)
0.9 (0.035)
0.7 (0.028)
C
A
C
C
Circuit Diagram
1 Cathode Amber (A)
2 Anod e A, T, B
3 Cathode Blue (B)
4 Cathode True Green (T)
LATB T66B
2003-07-18 15
Lötbedingungen Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil (nach IPC 9501)
IR Reflow Soldering Profile (acc. to IPC 9501)
OHLY0597
0
050 100 150 200 250
50
100
150
200
250
300
T
t
˚C
s
240-245 ˚C
10-40 s
183 ˚C
120 to 180 s
Defined for Preconditioning: up to 6 K/s
Ramp-down rate up to 6 K/s
Ramp-up rate up to 6 K/s
Defined for Preconditioning: 2-3 K/s
2003-07-18 16
LATB T66B
Wellenlöten (TTW) (nach CECC 00802)
TTW Soldering (acc. to CECC 00802)
OHLY0598
0
050 100 150 200 250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s 2 K/s
ca 200 K/s
CC... 130100
2 K/s Zwangskühlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
LATB T66B
2003-07-18 17
Empfohlenes Lötpaddesign IR Reflow Löten
Recommended Solder Pad IR Reflow Soldering
Maße werden wi e fo lgt angegeben: m m (inch) / Dimen sio ns are s pecified as follo w s: m m (inc h).
OHLPY439
Padgeometrie für
verbesserte Wärmeableitung
improved heat dissipation
Paddesign for
Lötstoplack
Solder resist
1.1 (0.043)
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
3.3 (0.130)
0.5 (0.020)
7.5 (0.295)
0.4 (0.016)
Cathode marking
Kathoden Markierung / Cu Fläche / 12 mm per pad
2
Cu-area
_
<
3.3 (0.130)
2003-07-18 18
LATB T66B
Empfohlenes Lötpaddesign Wellenlöten (TTW)
Recommended Solder Pad TTW Soldering
Maße werden wi e fo lgt angegeben: m m (inch) / Dimen sio ns are s pecified as follo w s: m m (inc h).
Gurtung / Polarität und Lage Verpackungseinheit 2000/Rolle, ø180 mm
oder 8000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø180 mm
or 8000/reel, ø330 mm
Maße werden wi e fo lgt angegeben: m m (inch) / Dimen sio ns are s pecified as follo w s: m m (inc h).
OHAY0583
6.1 (0.240)
2.8 (0.110)
2 (0.079)
3 (0.118)
6 (0.236)
3.5 (0.138)
1.5 (0.059)
2 (0.079)
3.5 (0.138)1 (0.039)
8 (0.315)
2.8 (0.110) 0.5 (0.020)
7.5 (0.295)
Solder resist
Lötstoplack
PCB-direction
Bewegungsrichtung
der Platine
2 (0.079)
Padgeometrie für
improved heat dissipation
verbesserte Wärmeableitung
Paddesign for
2
Cu Fläche / > 12 mm per pad
Cu-area
OHAY0095
4 (0.157)
2.9 (0.114)
1.5 (0.059) 4 (0.157)
3.6 (0.142)
3.5 (0.138)
2 (0.079)
1.75 (0.069)
8 (0.315)
CA
CC
LATB T66B
2003-07-18 19
Revision History: 2003-07-18 Date of change
Previous Version: 2003-02-12
Page Subjects (major changes since last revision)
1 ESD-withstand voltage
2 ordering informaion
5 grouping informat ion
18 annotations 2002-07-23
3, 4 value (reverse voltage from 5 V to 12 V) 2002-09-18
3, 4 values: forward current, surge current, reverse voltage, power
consumption, thermal resistance, forward voltage 2002-12-17
7 new permissible forward cu rrent diagrams, TS (OHL01610 to OHL00927
and OHL01607 to OHL00929) 2002-12-17
11 amber: new pulse handling diagram, 25°C, 1 chip on (OHL01505 to
OHL00193) 2002-12-17
9 true green: new pulse handling diagrams, 25°C (OHL01583 to
OHL11400 and OHL01584 to OHL11401) 2002-12-17
9 true green: new pulse handling diagrams, 85°C (OHL01586 to
OHL00930 and OHL01575 to OHL00931) 2002-12-17
10 blue: new pu lse handli ng diagrams, 2 5°C (OHL01578 to O HL11405 and
OHL01579 to OHL11406) 2002-12-17
10 blue: new pu lse handli ng diagrams, 8 5°C (OHL01576 to O HL00932 and
OHL01577 to OHL00934) 2002-12-17
8 true green and blue: new dominant wavelength diagrams 2002-12-17
5 new luminous intensity groups 2003-02-11
2 new ordering code 2003-02-11
7 diagram forward current OHL00737 replaced by OHL00590 2003-02-12
2003-07-18 20
LATB T66B
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
© All Rights Reserved.
Attention please!
The inform at ion describes the type of co m ponent and sha ll not be c ons idered as assured charac te ris tics .
All typical data and graphs are basing on representative samples, but dont represent the production range. If requested,
e.g. because of technical improvements, these typ. data will be chang ed w ithout any further notice.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or download ed, please find the lat es t vers ion in the Internet .
Packing
Please use the recyc ling operat ors known t o you. We can also help y ou get in touch wit h your near est sales offic e.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 may only be us ed in life-supp ort dev ic es or sys t ems 2 with the express written approval of OSRAM OS.
1 A critical c omponent is a compone nt used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2 Life sup port device s or syst ems ar e int ended (a ) to b e imp lanted in t he hu man body , or ( b) to supp ort a nd/or main tain
and sust ain human life. If th ey fail , it is rea so nable to assum e th at the health of the user m ay be endange red.