DT1240-04LP
Document number: DS36312 Rev. 2 - 2
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www.diodes.com September 2013
© Diodes Incorporated
DT1240-04LP
ADVANCE INFORMATIO ADVANCED INFORMATION
4 CHANNEL LOW CAPACITANCE TVS DIODE AR RAY
Features & Applications
Clamping Voltage: 9V at 10A 100ns, TLP
9.4V at 5.5A 8μs/20μs
IEC 61000-4-2 (ESD): Air — ±16kV, Contact — ±14kV
IEC 61000-4-5 (Lightning): ±5.5A (8/20µs)
4 Channels of ESD protection
Low Channel Input Capacitance of 0.55pF Typical
TLP Dynamic Resistance: 0.25Ω
Typically Used for High Speed Ports such as USB 2.0, USB 3.0
DVI, HDMI, Ethernet Port, IEEE, MDDI, PCI Express, SATA/
eSATA
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Mechanical Data
Case: U-DFN2510-10
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper leadframe (Lead Free Plating).
Solderable per MIL-STD-202, Method 208
Weight: 0.038 grams (approximate)
Ordering Information (Note 4)
Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Re el
DT1240-04LP-7 Standard BC7 7 8 3,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year 2013 2014 2015 2016 2017 2018
Code A B C D E F
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
Pin # Description
1, 2, 4, 5 I/O
6, 7, 9, 10 No Connection
3, 8 Vss
Pin Description (Top View) Device Schematic
BC7 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)
12345
10 9 8 7 6
Pin 1 Pin 2
3,8
Pin 5
Pin 4
TF2 YM
BC7
e4
DT1240-04LP
Document number: DS36312 Rev. 2 - 2
2 of 5
www.diodes.com September 2013
© Diodes Incorporated
DT1240-04LP
ADVANCE INFORMATIO ADVANCED INFORMATION
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic Symbol Value Unit Conditions
Peak Pulse Current, per IEC 61000-4-5 IPP 5.5 A
I/O to VSS, 8/20µs
Peak Pulse Power, per IEC 61000-4-5 PPP 60 W
I/O to VSS, 8/20µs
Operating Voltage (DC) VDC 6 V I/O to VSS
ESD Protection – Contact Discharge, per IEC 61000-4-2 VESD_Contact ±14 kV
I/O to VSS
ESD Protection – Air Discharge, per IEC 61000-4-2 VESD_Air ±16 kV
I/O to VSS
Operating Temperature TOP -55 to +85 °C —
Storage Temperature TSTG -55 to +150 °C —
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation Typical (Note 5) PD 350 mW
Thermal Resistance, Junction to Ambient Typical (Note 5) RJA 360 °C/W
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic S
y
mbol Min T
yp
Max Unit Test Conditions
Reverse Working Voltage VRWM — — 5.5 V
IR=1mA, , I/O to VSS
Reverse Current IR — — 0.5 μAVR = 5V, I/O to VSS
Reverse Breakdown Voltage VBR 6 — —V IR = 1mA, I/O to VSS
Forward Clamping Voltage VF -1.0 -0.85 — V IF = -15mA, I/O to VSS
Holding Voltage VH 5.5 — —V —
Reverse Clamping Voltage (Note 6) VC —9.4 11 V IPP = 5.5A, I/O to VSS, 8/20µs
Trigger Voltage VTRIG —— 9.5 V —
ESD Clamping Voltage VESD —9 — V TLP, 10A, tp = 100 ns, I/O to VSS
Dynamic Reverse Resistance RDIF-R —0.25 —Ω TLP, 10A, tp = 100 ns, I/O to VSS
Dynamic Forward Resistance RDIF-F —0.25 — Ω TLP, 10A, tp = 100 ns, VSS to I/O
Channel Input Capacitance (Note7) CI/O —0.55 0.65 pF
VI/O = 2.5V, VSS = 0V, f = 1MHz
Delta CI/O C
I/OMA
X
-CI/OMIN —0.04 — pF
CI/OMA
X
-CI/OMIN
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Clamping voltage value is based on an 8x20µs peak pulse current (Ipp) waveform.
7. CI/O1=CPIN1+CPIN10, CI/O2=CPIN2+CPIN9, CI/O3=CPIN4+CPIN7, CI/O4=CPIN5+CPIN6
0 25 50 75 100 125 150 175 200
100
75
50
25
0
T , AMBIENT TEMPERATURE (°C)
Figure 1 Pulse Derating Curve
A
P
EAK
P
U
LSE DE
R
ATIN
G
IN %
O
F
PEAK POWER OR CURRENT
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
-60 -40 -20 0 20 40 60 80 100 120 140 160
T, °C)
Figure 2 BV, Trigger Voltage, Holding Voltage
vs. Ambient Temperature
A
AMBIENT TEMPERATURE (
B
R
EAKD
O
WN V
O
LTA
G
E, T
R
I
G
G
E
R
V
O
LTA
G
E,
HOLDING VOLTAGE (V)
BV
V
TRIG
V
H
DT1240-04LP
Document number: DS36312 Rev. 2 - 2
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www.diodes.com September 2013
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DT1240-04LP
ADVANCE INFORMATIO ADVANCED INFORMATION
5.0
6.0
7.0
8.0
9.0
10.0
11.0
23 45 6 7
CURRENT FROM I/O TO V (A)
Figure 3 Clamping Voltage Characteristic
SS
V, (V)
C
C
LA
M
P
I
N
G
V
O
L
T
A
G
E
IEC61000 - 4- 5
(Lighting)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
123 4567
IEC61000 - 4- 5
(Lighting)
CURRENT FROM TO V (A)
Figure 4 Forward Voltage Characteristic
SS
I/O
V,
F
F
O
R
WA
R
D V
O
L
T
A
G
E (V
)
0
2
4
6
8
10
12
-40-30-20-10 0 1020304050607080
t, TIME ( s)
Figure 5
Waveform of Clamping Voltage,
Current vs.Time (8/20us, I/O to Vss)
CLAMPIN
G
V
O
LTA
G
E CU
R
R
ENT (V, A)
Voltage
Ampere
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
V (V)
I/O
INPUT VOLTAGE
Figure 6 Input Capacitance vs. Input Voltage
C
(pF)
I/O
IN
P
U
T
C
A
P
A
C
I
T
AN
C
E
f=1MHz
0
1
2
3
4
5
6
7
8
9
10
0246810
VOLTAGE FROM I/O to V (V)
Figure 7 Current vs. Voltage
SS
C
U
R
R
EN
T
F
R
O
M I/
O
to V (A)
SS
DT1240-04LP
Document number: DS36312 Rev. 2 - 2
4 of 5
www.diodes.com September 2013
© Diodes Incorporated
DT1240-04LP
ADVANCE INFORMATIO ADVANCED INFORMATION
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
U-DFN2510-10
Dim Min Max Typ
A 0.545 0.605 0.575
A1 0 0.05 0.03
A3 - - 0.13
b 0.15 0.25 0.20
b1 035 0.45 0.40
D 2.450 2.575 2.500
e - - 0.50
E 0.950 1.075 1.000
L 0.325 0.425 0.375
Z - - 0.150
All Dimensions in mm
Dimensions Value
(in mm)
C 0.500
X 0.250
X1 0.450
X2 2.250
Y 0.625
Y1 0.575
Y2 0.700
Y3 1.400
X2
Y3
Y
X
Y2
Y1
X1
C
Z
b1
R0.125
R0.075
D
E
eb
L
A
A1
A3
Seating Plane
DT1240-04LP
Document number: DS36312 Rev. 2 - 2
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© Diodes Incorporated
DT1240-04LP
ADVANCE INFORMATIO ADVANCED INFORMATION
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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