Dual-Channel Digital Isolators, 5 kV
Data Sheet ADuM2210/ADuM2211
Rev. D
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FEATURES
High isolation voltage: 5000 V rms
Enhanced system-level ESD performance per IEC 61000-4-x
Low power operation
5 V operation
1.6 mA per channel maximum at 0 Mbps to 2 Mbps
3.7 mA per channel maximum at 10 Mbps
3 V operation
1.4 mA per channel maximum at 0 Mbps to 2 Mbps
2.4 mA per channel maximum at 10 Mbps
Bidirectional communication
3 V/5 V level translation
High temperature operation: 125°C
Default low output
High data rate: dc to 10 Mbps (NRZ)
Precise timing characteristics
3 ns maximum pulse width distortion
3 ns maximum channel-to-channel matching
High common-mode transient immunity: >25 kV/μs
16-lead SOIC wide body package version (RW-16)
16-lead SOIC wide body enhanced creepage version (RI-16)
Safety and regulatory approvals (RI-16 package)
UL recognition: 5000 V rms for 1 minute per UL 1577
CSA Component Acceptance Notice #5A
IEC 60601-1: 250 V rms (reinforced)
IEC 60950-1: 400 V rms (reinforced)
VDE Certificate of Conformity
DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
VIORM = 846 V peak
Qualified for automotive applications
APPLICATIONS
General-purpose, high voltage, multichannel isolation
Medical equipment
Power supplies
RS-232/RS-422/RS-485 transceiver isolation
Hybrid electric vehicles, battery monitor, and motor drive
GENERAL DESCRIPTION
The ADuM221x1 are 2-channel digital isolators based on Analog
Devices, Inc., iCoupler® technology. Combining high speed CMOS
and monolithic air core transformer technology, these isolation
components provide outstanding performance characteristics that
are superior to alternatives such as optocoupler devices.
By avoiding the use of LEDs and photodiodes, iCoupler devices
remove the design difficulties commonly associated with opto
FUNCTIONAL BLOCK DIAGRAMS
1
2
3
4
5
6
7
8
GND
1
NC
V
DD1
V
IA
V
IB
NC
GND
1
NC
GND
2
NC
V
DD2
V
OA
V
OB
NC
NC
GND
2
NC = NO CONNECT
ADuM2210
16
15
14
13
12
11
10
9
ENCODE
ENCODE
DECODE
DECODE
PIN 1
INDICATOR
09233-001
Figure 1. ADuM2210
1
2
3
4
5
6
7
8
GND
1
NC
V
DD1
V
OA
V
IB
NC
GND
1
NC
GND
2
NC
V
DD2
V
IA
V
OB
NC
NC
GND
2
NC = NO CONNECT
ADuM2211
16
15
14
13
12
11
10
9
DECODE
ENCODE
ENCODE
DECODE
PIN 1
INDICATOR
09233-002
Figure 2. ADuM2211
couplers. Typical optocoupler concerns regarding uncertain current
transfer ratios, nonlinear transfer functions, and temperature
and lifetime effects are eliminated with the simple iCoupler digital
interfaces and stable performance characteristics. The need for
external drivers and other discrete components is eliminated with
these iCoupler products. Furthermore, iCoupler devices run at
one-tenth to one-sixth the power of optocouplers at comparable
signal data rates.
The ADuM221x isolators provide two independent isolation
channels in a variety of channel configurations and data rates
(see the Ordering Guide). They operate with the supply voltage
of either side ranging from 3.0 V to 5.5 V, providing compatibility
with lower voltage systems as well as enabling voltage translation
functionality across the isolation barrier. The ADuM2210W and
ADuM2211W are automotive grade versions.
Similar to the ADuM320x isolators, the ADuM221x isolators
contain various circuit and layout enhancements to provide
increased capability relative to system-level IEC 61000-4-x
testing (ESD, burst, and surge). The precise capability in these
tests for either the ADuM320x or ADuM221x products is strongly
determined by the design and layout of the user’s board or module.
For more information, see the AN-793 Application Note,
ESD/Latch-Up Considerations with iCoupler Isolation Product.
1 Protected by U.S. Patents 5,952,849; 6,873,065; 6,903,578; and 7,075,329. Other patents pending.
ADuM2210/ADuM2211 Data Sheet
Rev. D | Page 2 of 20
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagrams ............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Electrical Characteristics—5 V Operation................................ 3
Electrical Characteristics—3 V Operation................................ 4
Electrical Characteristics—Mixed 5 V/3 V Operation............ 5
Electrical Characteristics—Mixed 3 V/5 V Operation............ 6
Package Characteristics ............................................................... 7
Regulatory Information ............................................................... 7
Insulation and Safety-Related Specifications ............................ 7
DIN V VDE V 0884-10 (VDE V 0884-10) Insulation
Characteristics .............................................................................. 8
Recommended Operating Conditions .......................................8
Absolute Maximum Ratings ............................................................9
ESD Caution...................................................................................9
Pin Configurations and Function Descriptions ......................... 10
Typical Performance Characteristics ........................................... 12
Applications Information .............................................................. 13
PCB Layout ................................................................................. 13
Propagation Delay-Related Parameters ................................... 13
DC Correctness and Magnetic Field Immunity ..................... 13
Power Consumption .................................................................. 14
Insulation Lifetime ..................................................................... 15
Outline Dimensions ....................................................................... 16
Ordering Guide .......................................................................... 17
Automotive Products ................................................................. 17
REVISION HISTORY
8/12—Rev. C to Rev. D
Changes to Table 4 and Table 6 ....................................................... 4
Changes to Table 7 and Table 9 ....................................................... 5
Changes to Table 10 and Table 12 .................................................. 6
Updated Outline Dimensions ....................................................... 16
Changes to Ordering Guide .......................................................... 17
6/12—Rev. B to Rev. C
Changes to Features Section, Applications Section, and
General Description Section ........................................................... 1
Changes to Table 1; Added Table 2 and Table 3, Renumbered
Sequentially ....................................................................................... 3
Changes to Table 4; Added Table 5 and Table 6 ........................... 4
Changed Electrical Characteristics—Mixed 5 V/3 V or 3 V/5 V
Operation Section to Electrical Characteristics—Mixed 5 V/3 V
Operation Section ............................................................................. 5
Changes to Table 7; Added Table 8 and Table 9 ........................... 5
Added Electrical Characteristics—Mixed 3 V/5 V Operation,
Section, Table 10, Table 11, and Table 12 ...................................... 6
Changes to Table 19 ........................................................................ 12
Changes to Ordering Guide .......................................................... 20
Added Automotive Products Section........................................... 20
2/12—Rev. A to Rev. B
Created Hyperlink for Safety and Regulatory Approvals
Entry in Features Section ................................................................. 1
Change to PCB Layout Section ..................................................... 16
Updated Outline Dimensions ....................................................... 19
8/11—Rev. 0 to Rev. A
Added 16-Lead SOIC_IC Package ................................... Universal
Changes to Features Section ............................................................ 1
Changes to Table 5 and Table 6..................................................... 10
Changes to Endnote 1, Table 8...................................................... 11
Updated Outline Dimensions ....................................................... 19
Changes to Ordering Guide .......................................................... 20
9/10—Revision 0: Initial Version
Data Sheet ADuM2210/ADuM2211
Rev. D | Page 3 of 20
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS—5 V OPERATION
All voltages are relative to their respective ground. 4.5 V ≤ VDD1 ≤ 5.5 V, 4.5 V ≤ VDD2 ≤ 5.5 V. All minimum/maximum specifications
apply over the entire recommended operation range, −40°C ≤ TA ≤ 125°C, unless otherwise noted. All typical specifications are at TA =
25°C, VDD1 = VDD2 = 5 V.
Table 1.
Parameter Symbol
S-Grade T-Grade
Unit Test Conditions Min Typ Max Min Typ Max
SWITCHING SPECIFICATIONS
Pulse Width PW 1000 100 ns Within PWD limit
Data Rate 1 10 Mbps Within PWD limit
Propagation Delay t
PHL
, t
PLH
20 150 20 50 ns 50% input to 50% output
Pulse Width Distortion PWD 40 3 ns |t
PLH
− t
PHL
|
Change vs. Temperature
5
ps/°C
Propagation Delay Skew t
PSK
100 15 ns Between any two units
Channel Matching
Codirectional t
PSKCD
50 3 ns
Opposing-Direction t
PSKOD
50 17 ns
Table 2.
Parameter Symbol
2 Mbps: S-Grade 10 Mbps: T-Grade
Unit Test Conditions Min Typ Max Min Typ Max
SUPPLY CURRENT No load
ADuM2210 I
1.3 1.7 3.5 4.6 mA
I
1.0 1.6 1.7 2.8 mA
ADuM2211 I
1.1 1.5 2.6 3.4 mA
IDD2 1.3 1.8 3.1 4.0 mA
Table 3.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold V
IH
0.7V
DDX
V
Logic Low Input Threshold V
IL
0.3V
DDX
V
Logic High Output Voltages V
OH
V
DDX
− 0.1 5.0 V I
Ox
= −20 µA, V
Ix
= V
IxH
V
DDX
− 0.5 4.8 V I
Ox
= −4 mA, V
Ix
= V
IxH
Logic Low Output Voltages V
OL
0.0 0.1 V I
Ox
= 20 µA, V
Ix
= V
IxL
0.04 0.1 V I
Ox
= 400 µA, V
Ix
= V
IxL
0.2 0.4 V I
Ox
= 4 mA, V
Ix
= V
IxL
Input Current per Channel
II
−10
+0.01
+10
µA
0 V ≤ VIX ≤ VDDX
Supply Current per Channel
Quiescent Input Supply Current I
DDI (Q)
0.4 0.8 mA
Quiescent Output Supply Current I
DDO (Q)
0.5 0.6 mA
Dynamic Input Supply Current I
DDI (D)
0.19 mA/Mbps
Dynamic Output Supply Current I
DDO (D)
0.05 mA/Mbps
AC SPECIFICATIONS
Output Rise/Fall Time t
R
/t
F
ADuM221x S-Grade 10 ns 10% to 90%
ADuM221x T-Grade 2.5 ns 10% to 90%
Common-Mode Transient Immunity
1
|CM| 25 35 kV/µs VIx=VDDX, VCM=1000 V, transient
magnitude = 800 V
Refresh Period T
r
1.6 µs
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining Vo > 0.8 VDDLX. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
ADuM2210/ADuM2211 Data Sheet
Rev. D | Page 4 of 20
ELECTRICAL CHARACTERISTICS—3 V OPERATION
All voltages are relative to their respective ground. 3.0 V ≤ VDD1 ≤ 3.6 V, 3.0 V ≤ VDD2 ≤ 3.6 V. All minimum/maximum specifications apply
over the entire recommended operation range, −40°C ≤ TA ≤ 125°C, unless otherwise noted. All typical specifications are at TA = 25°C,
VDD1 = VDD2 = 3.3 V.
Table 4.
Parameter Symbol
S-Grade T-Grade
Unit Test Conditions Min Typ Max Min Typ Max
SWITCHING SPECIFICATIONS
Pulse Width PW 1000 100 ns Within PWD limit
Data Rate 1 10 Mbps Within PWD limit
Propagation Delay tPHL, tPLH 20 150 20 60 ns 50% input to 50% output
Pulse Width Distortion
PWD
|tPLH − tPHL|
S and T Grades 40 3 ns
W Grade 40 4 ns
Change vs. Temperature 5 ps/°C
Propagation Delay Skew tPSK 100 22 ns Between any two units
Channel Matching
Codirectional tPSKCD 50 3 ns
Opposing-Direction t
PSKOD
50 22 ns
Table 5.
Parameter Symbol
2 Mbps: S-Grade
10 Mbps: T-Grade
Unit Test Conditions Min Typ Max Min Typ Max
SUPPLY CURRENT
No load
ADuM2210 IDD1 0.8 1.3 2.0 3.2 mA
I
DD2
0.7 1.0 1.1 1.7 mA
ADuM2211 I
DD1
0.7 1.3 1.5 2.1 mA
IDD2 0.8 1.6 1.9 2.4 mA
Table 6.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold V
IH
0.7V
DDX
V
Logic Low Input Threshold V
IL
0.3V
DDX
V
Logic High Output Voltages VOH VDDX − 0.1 3.0 V IOx = −20 µA, VIx = VIxH
V
DDX
− 0.5 2.8 V I
Ox
= −4 mA, V
Ix
= V
IxH
Logic Low Output Voltages VOL 0.0 0.1 V IOx = 20 µA, VIx = VIxL
0.04 0.1 V I
Ox
= 400 µA, V
Ix
= V
IxL
S and T Grades 0.2 0.42 V I
Ox
= 4 mA, V
Ix
= V
IxL
W Grade 0.2 0.42 V IOx = 2 mA, VIx = VIxL
Input Current per Channel
II
−10
+0.01
+10
µA
0 V ≤ VIX ≤ VDDX
Supply Current per Channel
Quiescent Input Supply Current I
DDI (Q)
0.3 0.5 mA
Quiescent Output Supply Current I
DDO (Q)
0.3 0.5 mA
Dynamic Input Supply Current IDDI (D) 0.10 mA/Mbps
Dynamic Output Supply Current I
DDO (D)
0.03 mA/Mbps
AC SPECIFICATIONS
Output Rise/Fall Time t
R
/t
F
ADuM221x S-Grade 10 ns 10% to 90%
ADuM221x T-Grade 3 ns 10% to 90%
Common-Mode Transient Immunity1 |CM| 25 35 kV/µs VIx=VDDX, VCM=1000 V,
transient magnitude = 800 V
Refresh Period
Tr
1.8
µs
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining Vo > 0.8 VDDLX. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Data Sheet ADuM2210/ADuM2211
Rev. D | Page 5 of 20
ELECTRICAL CHARACTERISTICS—MIXED 5 V/3 V OPERATION
All voltages are relative to their respective ground. 4.5 V ≤ VDD1 ≤ 5.5 V, 3.0 V ≤ VDD2 ≤ 3.6 V. All minimum/maximum specifications
apply over the entire recommended operation range, −40°C ≤ TA ≤ 125°C, unless otherwise noted. All typical specifications are at TA =
25°C,VDD1 = 5 V, V DD2 = 3.3 V.
Table 7.
Parameter Symbol
S-Grade T-Grade
Unit Test Conditions Min Typ Max Min Typ Max
SWITCHING SPECIFICATIONS
Pulse Width PW 1000 100 ns Within PWD limit
Data Rate 1 10 Mbps Within PWD limit
Propagation Delay tPHL, tPLH 15 150 15 55 ns 50% input to 50% output
Pulse Width Distortion
PWD
40
3
ns
|tPLH − tPHL|
S and T Grades 40 3 Ns
W Grade 40 4 ns
Change vs. Temperature 5 ps/°C
Propagation Delay Skew tPSK 50 22 ns Between any two units
Channel Matching
Codirectional tPSKCD 50 3 ns
Opposing-Direction t
PSKOD
50 22 ns
Table 8.
Parameter Symbol
2 Mbps: S-Grade 10 Mbps: T-Grade
Unit Test Conditions Min Typ Max Min Typ Max
SUPPLY CURRENT No load
ADuM2210 I
DD1
1.3 1.7 3.5 4.6 mA
I
DD2
0.7 1.0 1.1 1.7 mA
ADuM2211 IDD1 1.1 1.5 2.6 3.4 mA
I
DD2
0.8 1.6 1.9 2.4 mA
Table 9.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold VIH 0.7VDDX V
Logic Low Input Threshold V
IL
0.3V
DDX
V
Logic High Output Voltages V
OH
V
DDX
− 0.1 V
DDX
V I
Ox
= −20 µA, V
Ix
= V
IxH
VDDX − 0.5 VDDX − 0.2 V IOx = −4 mA, VIx = VIxH
Logic Low Output Voltages V
OL
0.0 0.1 V I
Ox
= 20 µA, V
Ix
= V
IxL
0.04 0.1 V IOx = 400 µA, VIx = VIxL
S and T Grades 0.2 0.42 V I
Ox
= 4 mA, V
Ix
= V
IxL
W Grade
0.2
0.42
V
IOx = 2 mA, VIx = VIxL
Input Current per Channel II −10 +0.01 +10 µA 0 V ≤ VIX ≤ VDDX
Supply Current per Channel
Quiescent Input Supply Current I
DDI (Q)
0.4 0.8 mA
Quiescent Output Supply Current IDDO (Q) 0.3 0.5 mA
Dynamic Input Supply Current
IDDI (D)
0.19
mA/Mbps
Dynamic Output Supply Current IDDO (D) 0.03 mA/Mbps
AC SPECIFICATIONS
Output Rise/Fall Time tR/tF
ADuM221x S-Grade
10
ns
10% to 90%
ADuM221x T-Grade 3 ns 10% to 90%
Common-Mode Transient Immunity
1
|CM| 25 35 kV/µs VIx=VDDX, VCM=1000 V,
transient magnitude = 800 V
Refresh Period Tr 1.6 µs
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining Vo > 0.8 VDDLX. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
ADuM2210/ADuM2211 Data Sheet
Rev. D | Page 6 of 20
ELECTRICAL CHARACTERISTICS—MIXED 3 V/5 V OPERATION
All voltages are relative to their respective ground. 3.0 V ≤ VDD1 ≤ 3.6 V, 4.5 V ≤ VDD2 ≤ 5.5 V. All minimum/maximum specifications
apply over the entire recommended operation range, −40°C ≤ TA ≤ 125°C, unless otherwise noted. All typical specifications are at TA =
25°C, VDD1 = 3.3 V, V DD2 = 5 V.
Table 10.
Parameter Symbol
S-Grade T-Grade
Unit Test Conditions Min Typ Max Min Typ Max
SWITCHING SPECIFICATIONS
Pulse Width PW 1000 100 ns Within PWD limit
Data Rate 1 10 Mbps Within PWD limit
Propagation Delay tPHL, tPLH 15 150 15 55 ns 50% input to 50% output
Pulse Width Distortion
PWD
40
3
ns
|tPLH − tPHL|
S and T Grades 40 3 ns
W Grade 40 4 ns
Change vs. Temperature 5 ps/°C
Propagation Delay Skew tPSK 50 22 ns Between any two units
Channel Matching
Codirectional tPSKCD 50 3 ns
Opposing-Direction t
PSKOD
50 22 ns
Table 11.
Parameter Symbol
2 Mbps: S-Grade
10 Mbps: T-Grade
Unit Test Conditions Min Typ Max Min Typ Max
SUPPLY CURRENT
No load
ADuM2210 IDD1 0.8 1.3 2.0 3.2 mA
I
DD2
1.0 1.6 1.7 2.8 mA
ADuM2211 I
DD1
0.7 1.3 1.5 2.1 mA
IDD2 1.3 1.8 3.1 4.0 mA
Table 12.
Parameter Symbol Min Typ Max Unit Test Conditions
DC SPECIFICATIONS
Logic High Input Threshold VIH 0.7VDDX V
Logic Low Input Threshold
VIL
0.3VDDX
V
Logic High Output Voltages VOH VDDX − 0.1 VDDX V IOx = −20 µA, VIx = VIxH
V
DDX
− 0.5 V
DDX
− 0.2 V I
Ox
= −4 mA, V
Ix
= V
IxH
Logic Low Output Voltages V
OL
0.0 0.1 V I
Ox
= 20 µA, V
Ix
= V
IxL
0.04 0.1 V IOx = 400 µA, VIx = VIxL
S and T Grades 0.2 0.42 V I
Ox
= 4 mA, V
Ix
= V
IxL
W Grade 0.2 0.42 V I
Ox
= 2 mA, V
Ix
= V
IxL
Input Current per Channel I
I
−10 +0.01 +10 µA 0 V ≤ V
IX
≤ V
DDX
Supply Current per Channel
Quiescent Input Supply Current IDDI (Q) 0.3 0.5 mA
Quiescent Output Supply Current I
DDO (Q)
0.5 0.6 mA
Dynamic Input Supply Current I
DDI (D)
0.10 mA/Mbps
Dynamic Output Supply Current IDDO (D) 0.05 mA/Mbps
AC SPECIFICATIONS
Output Rise/Fall Time t
R
/t
F
ADuM221x S-Grade 10 ns 10% to 90%
ADuM221x T-Grade 2.5
Common-Mode Transient Immunity1
|CM|
25
35
kV/µs
V
Ix
=V
DDX
, V
CM
=1000 V,
transient magnitude = 800 V
Refresh Period T
r
1.8 µs
1 |CM| is the maximum common-mode voltage slew rate that can be sustained while maintaining Vo > 0.8 VDDLX. The common-mode voltage slew rates apply to both
rising and falling common-mode voltage edges.
Data Sheet ADuM2210/ADuM2211
Rev. D | Page 7 of 20
PACKAGE CHARACTERISTICS
Table 13.
Parameter Symbol Min Typ Max Unit Test Conditions
Resistance (Input-to-Output)1
RI-O
1012
Ω
Capacitance (Input-to-Output)
1
C
I-O
2.2 pF f = 1 MHz
Input Capacitance
2
C
I
4.0 pF
IC Junction-to-Case Thermal Resistance, Side 1 θ
JCI
33 °C/W Thermocouple located at
center of package underside
IC Junction-to-Case Thermal Resistance, Side 2 θ
JCO
28 °C/W
1 Device considered a 2-terminal device: Pin 1 through Pin 8 are shorted together and Pin 9 through Pin 16 are shorted together.
2 Input capacitance is from any input data pin to ground.
REGULATORY INFORMATION
The ADuM221x are approved by the organizations listed in Table 14. Refer to Table 19 and the Insulation Lifetime section for details
regarding recommended maximum working voltages for specific cross-isolation waveforms and insulation levels.
Table 14.
UL
CSA
VDE
Recognized under 1577 Component
Recognition Program1
Approved under CSA Component
Acceptance Notice #5A
Certified according to DIN V VDE V 0884-10 (VDE V
0884-10): 2006-122
Single Protection
5000 V rms Isolation Voltage
Basic insulation per CSA 60950-1-07 and IEC
60950-1, 600 V rms (848 V peak) maximum
working voltage
Reinforced insulation, 846 V peak
RW-16 package:
Reinforced insulation per CSA 60950-1-07
and IEC 60950-1, 380 V rms (537 V peak)
maximum working voltage; reinforced
insulation per IEC 60601-1 125 V rms
(176 V peak) maximum working voltage
RI-16 package:
Reinforced insulation per CSA 60950-1-07
and IEC 60950-1, 400 V rms (565 V peak)
maximum working voltage; reinforced
insulation per IEC 60601-1 250 V rms
(353 V peak) maximum working voltage
File E214100 File 205078 File 2471900
4880-0001
1 In accordance with UL1577, each ADuM221x is proof tested by applying an insulation test voltage ≥ 6000 V rms for 1 second (current leakage detection limit = 10 µA).
2 In accordance with DIN V VDE V 0884-10, each ADuM221x is proof tested by applying an insulation test voltage ≥1590 V peak for 1 sec (partial discharge detection
limit = 5 pC). The * marking branded on the component designates DIN V VDE V 0884-10 approval.
INSULATION AND SAFETY-RELATED SPECIFICATIONS
Table 15.
Parameter
Symbol
Value
Unit
Conditions
Rated Dielectric Insulation Voltage 5000 V rms 1-minute duration
Minimum External Air Gap L(I01) 8.0 min mm Distance measured from input terminals to output
terminals, shortest distance through air along the PCB
mounting plane, as an aid to PC board layout
Minimum External Tracking (Creepage) RW-16 Package L(I02) 7.7 min mm Measured from input terminals to output terminals,
shortest distance path along body
Minimum External Tracking (Creepage) RI-16 Package L(I02) 8.3 min mm Measured from input terminals to output terminals,
shortest distance path along body
Minimum Internal Gap (Internal Clearance) 0.017 min mm Insulation distance through insulation
Tracking Resistance (Comparative Tracking Index) CTI >175 V DIN IEC 112/VDE 0303 Part 1
Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1)
ADuM2210/ADuM2211 Data Sheet
Rev. D | Page 8 of 20
DIN V VDE V 0884-10 (VDE V 0884-10) INSULATION CHARACTERISTICS
These isolators are suitable for reinforced electrical isolation only within the safety limit data. Maintenance of the safety data is ensured
by means of protective circuits. Note that the asterisk (*) branded on packages denotes DIN V VDE V 0884-10 approval for 846 V peak
working voltage.
Table 16.
Description Conditions Symbol Characteristic Unit
Installation Classification per DIN VDE 0110
For Rated Mains Voltage ≤ 300 V rms I to IV
For Rated Mains Voltage ≤ 450 V rms I to II
For Rated Mains Voltage ≤ 600 V rms I to II
Climatic Classification 40/125/21
Pollution Degree (DIN VDE 0110, Table 1) 2
Maximum Working Insulation Voltage VIORM 846 V peak
Input-to-Output Test Voltage, Method B1 VIORM × 1.875 = VPR, 100% production test, tm = 1 sec,
partial discharge < 5 pC
VPR 1590 V peak
Input-to-Output Test Voltage, Method A VPR
After Environmental Tests Subgroup 1 VIORM × 1.6 = VPR, tm = 60 sec, partial discharge < 5 pC 1375 V peak
After Input and/or Safety Test Subgroup 2
and Subgroup 3
VIORM × 1.2 = VPR, tm = 60 sec, partial discharge < 5 pC 1018 V peak
Highest Allowable Overvoltage Transient overvoltage, tTR = 10 seconds VTR 6000 V peak
Safety-Limiting Values Maximum value allowed in the event of a failure;
see Figure 3
Case Temperature TS 150 °C
Side 1 Current IS1 265 mA
Side 2 Current IS2 335 mA
Insulation Resistance at TS VIO = 500 V RS >109 Ω
350
300
200
100
00 50 100 150 200
SAFETY-LIMITING CURRENT (mA)
CASE T E M P E RATURE (°C)
250
150
50
SIDE 1
SIDE 2
09233-003
Figure 3. Thermal Derating Curve, Dependence of Safety Limiting
Values with Case Temperature per DIN V VDE V 0884-10
RECOMMENDED OPERATING CONDITIONS
Table 17.
Parameter Symbol Min Max Unit
Operating Temperature TA −40 +125 °C
Supply Voltages1 V
DD1, VDD2 3.0 5.5 V
Input Signal Rise and Fall Times 1.0 ms
1 All voltages are relative to their respective ground.
Data Sheet ADuM2210/ADuM2211
Rev. D | Page 9 of 20
ABSOLUTE MAXIMUM RATINGS
Table 18.
Parameter Rating
Storage Temperature (T
ST
) −65°C to +150°C
Ambient Operating Temperature (TA)
−40°C to +125°C
Supply Voltage (V
DD1
, V
DD2
)
1
−0.5 V to +7.0 V
Input Voltage (V
IA
, V
IB
)
1, 2
−0.5 V to V
DDI
+ 0.5 V
Output Voltage (V
OA
, V
OB
)1, 2 −0.5 V to V
DDO
+ 0.5 V
Average Output Current per Pin3
Side 1 (I
O1
) −18 mA to +18 mA
Side 2 (I
O2
) −22 mA to +22 mA
Common-Mode Transients
4
−100 kV/µs to +100 kV/µs
1 All voltages are relative to their respective ground.
2 VDDI and VDDO refer to the supply voltages on the input and output sides of a
given channel, respectively. See the PCB Layout section.
3 See Figure 3 for maximum rated current values for various temperatures.
4 Refers to common-mode transients across the insulation barrier. Common-
mode transients exceeding the Absolute Maximum Rating can cause latch-
up or permanent damage.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Table 19. Maximum Continuous Working Voltage1
Parameter Max Unit Constraint
AC Voltage, Bipolar Waveform 565 V peak
50-year minimum lifetime
AC Voltage, Unipolar Waveform 1130 V peak
50-year minimum lifetime
DC Voltage 1130 V peak
50-year minimum lifetime
1 Refers to continuous voltage magnitude imposed across the isolation barrier. See the Insulation Lifetime section for more details.
Table 20. ADuM2210 Truth Table (Positive Logic)
V
IA
Input V
IB
Input V
DD1
State V
DD2
State V
OA
Output V
OB
Output Notes
H H Powered Powered H H
L L Powered Powered L L
H L Powered Powered H L
L H Powered Powered L H
X X Unpowered Powered L L Outputs return to the input state within
1 µs of V
DDI
power restoration.
X X Powered Unpowered Indeterminate Indeterminate Outputs return to the input state within
1 µs of V
DDO
power restoration.
Table 21. ADuM2211 Truth Table (Positive Logic)
V
IA
Input V
IB
Input V
DD1
State V
DD2
State V
OA
Output V
OB
Output Notes
H H Powered Powered H H
L L Powered Powered L L
H L Powered Powered H L
L H Powered Powered L H
X X Unpowered Powered Indeterminate L Outputs return to the input state within
1 µs of V
DDI
power restoration.
X X Powered Unpowered L Indeterminate Outputs return to the input state within
1 µs of V
DDO
power restoration.
ADuM2210/ADuM2211 Data Sheet
Rev. D | Page 10 of 20
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
GND
11
NC
2
V
DD1 3
V
IA 4
GND
2
16
NC
15
V
DD2
14
V
OA
13
V
IB 5
V
OB
12
NC
6
NC
11
GND
17
NC
10
NC
8
GND
2
9
NC = NO CONNECT
NOTES:
1. P IN 1 AND PIN 7 ARE INT E RNALLY CONNECTED, AND
CONNE CTING BO TH TO GND
1
IS RECOMMENDED.
2. P IN 9 AND PIN 16 ARE INTERNAL
LY CONNECTED, AND
CONNE CTING BO TH TO GND
2
IS RECOMMENDED.
ADuM2210
TOP VIEW
(No t t o Scal e)
09233-004
Figure 4. ADuM2210 Pin Configuration
Table 22. ADuM2210 Pin Function Descriptions
Pin No. Mnemonic
Description
1 GND
1
Ground 1. Ground reference for Isolator Side 1.
2 NC No internal connection.
3 V
DD1
Supply Voltage for Isolator Side 1, 3.0 V to 5.5 V.
4
VIA
Logic Input A.
5 V
IB
Logic Input B.
6 NC No internal connection.
7 GND
1
Ground 1. Ground reference for Isolator Side 1.
8 NC No internal connection.
9
GND2
Ground 2. Ground reference for Isolator Side 2.
10 NC No internal connection.
11 NC No internal connection.
12 V
OB
Logic Output B.
13 V
OA
Logic Output A.
14 V
DD2
Supply Voltage for Isolator Side 2, 3.0 V to 5.5 V.
15 NC No internal connection.
16 GND
2
Ground 2. Ground reference for Isolator Side 2.
Data Sheet ADuM2210/ADuM2211
Rev. D | Page 11 of 20
GND
11
NC
2
V
DD1 3
V
OA 4
GND
2
16
NC
15
V
DD2
14
V
IA
13
V
IB 5
V
OB
12
NC
6
NC
11
GND
17
NC
10
NC
8
GND
2
9
NC = NO CONNECT
NOTES:
1. P IN 1 AND PIN 7 ARE INT E RNALLY CONNECTED, AND
CONNE CTING BO TH TO GND
1
IS RECOMMENDED.
2. P IN 9 AND PIN 16 ARE INTERNALLY CONNECTED, AND
CONNE CTING BO TH TO GND
2
IS RECOMMENDED.
ADuM2211
TOP VIEW
(No t t o Scal e)
09233-005
Figure 5. ADuM2211 Pin Configuration
Table 23. ADuM2211 Pin Function Descriptions
Pin No. Mnemonic Description
1
GND1
Ground 1. Ground reference for Isolator Side 1.
2 NC No internal connection.
3 V
DD1
Supply Voltage for Isolator Side 1, 3.0 V to 5.5 V.
4 V
OA
Logic Output A.
5 V
IB
Logic Input B.
6 NC No internal connection.
7 GND
1
Ground 1. Ground reference for Isolator Side 1.
8 NC No internal connection.
9 GND
2
Ground 2. Ground reference for Isolator Side 2.
10 NC No internal connection.
11 NC No internal connection.
12
VOB
Logic Output B.
13 V
IA
Logic Input A.
14 V
DD2
Supply Voltage for Isolator Side 2, 3.0 V to 5.5 V.
15 NC No internal connection.
16 GND
2
Ground 2. Ground reference for Isolator Side 2.
ADuM2210/ADuM2211 Data Sheet
Rev. D | Page 12 of 20
TYPICAL PERFORMANCE CHARACTERISTICS
DATA RATE (M bp s)
CURRENT /CHANNEL ( mA)
0
0
6
2
8
10
10 20 30
5V
3V
4
09233-006
Figure 6. Typical Input Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (No Output Load)
DATA RATE (M bp s)
CURRENT /CHANNEL ( mA)
0
0
3
2
1
4
10 20 30
5V
3V
09233-007
Figure 7. Typical Output Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (No Output Load)
DATA RATE (M bp s)
CURRENT /CHANNEL ( mA)
0
0
3
2
1
4
10 20 30
5V
3V
09233-008
Figure 8. Typical Output Supply Current per Channel vs. Data Rate
for 5 V and 3 V Operation (15 pF Output Load)
DATA RATE (M bp s)
CURRENT ( mA)
0
0
15
10
5
20
10 20 30
5V
3V
09233-009
Figure 9. Typical ADuM2210 VDD1 Supply Current vs. Data Rate
for 5 V and 3 V Operation
DATA RATE (M bp s)
CURRENT ( mA)
0
0
3
2
1
4
10 20 30
5V
3V
09233-010
Figure 10. Typical ADuM2210 VDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
DATA RATE (M bp s)
CURRENT ( mA)
0
0
6
2
8
10
10 20 30
5V
3V
4
09233-011
Figure 11. Typical ADuM2211 VDD1 or VDD2 Supply Current vs. Data Rate
for 5 V and 3 V Operation
Data Sheet ADuM2210/ADuM2211
Rev. D | Page 13 of 20
APPLICATIONS INFORMATION
PCB LAYOUT
The ADuM221x digital isolator requires no external interface
circuitry for the logic interfaces. Power supply bypassing is
strongly recommended at the input and output supply pins (see
Figure 12). Bypass capacitors are most conveniently connected
between Pin 1 and Pin 3 for VDD1 and between Pin 14 and
Pin 16 for VDD2. The capacitor value should be between 0.01 μF
and 0.1 μF. The total lead length between both ends of the
capacitor and the input power supply pin should not exceed
20 mm. Bypassing between Pin 3 and Pin 7 and between Pin 9
and Pin 14 should be considered unless the ground pair on each
package side is connected close to the package.
GND
1
NC
V
DD1
V
IA
/V
OA
GND
2
NC
V
DD2
V
OA
/V
IA
V
IB
V
OB
NC NC
GND
1
NC
NC GND
2
09233-012
Figure 12. Recommended Printed Circuit Board Layout
In applications involving high common-mode transients, care
should be taken to ensure that board coupling across the
isolation barrier is minimized. Furthermore, the board layout
should be designed such that any coupling that does occur
equally affects all pins on a given component side. Failure to
ensure this could cause voltage differentials between pins
exceeding the device’s Absolute Maximum Ratings, thereby
leading to latch-up or permanent damage.
See the AN-1109 Application Note for board layout guidelines.
PROPAGATION DELAY-RELATED PARAMETERS
Propagation delay is a parameter that describes the length of
time it takes for a logic signal to propagate through a compo-
nent. The propagation delay to a logic low output can differ
from the propagation delay to logic high.
INPUT (
V
Ix
)
OUTPUT (V
Ox
)
t
PLH
t
PHL
50%
50%
09233-013
Figure 13. Propagation Delay Parameters
Pulse width distortion is the maximum difference between
these two propagation delay values and is an indication of how
accurately the input signal’s timing is preserved.
Channel-to-channel matching refers to the maximum amount
the propagation delay differs among channels within a single
ADuM221x component.
Propagation delay skew refers to the maximum amount the
propagation delay differs among multiple ADuM221x
components operated under the same conditions.
DC CORRECTNESS AND MAGNETIC FIELD
IMMUNITY
Positive and negative logic transitions at the isolator input cause
narrow (~1 ns) pulses to be sent via the transformer to the
decoder. The decoder is bistable and is, therefore, either set or
reset by the pulses, indicating input logic transitions. In the
absence of logic transitions at the input for more than ~1 μs, a
periodic set of refresh pulses indicative of the correct input state
is sent to ensure dc correctness at the output. If the decoder
receives no internal pulses for more than approximately 5 μs,
the input side is assumed to be without power or nonfunctional;
in which case, the isolator output is forced to a default state (see
Table 20 and Table 21) by the watchdog timer circuit.
The limitation on the ADuM221x magnetic field immunity is
set by the condition in which induced voltage in the transformer
receiving coil is large enough to either falsely set or reset the
decoder. The following analysis defines the conditions under which
this can occur. The 3 V operating condition of the ADuM221x
is examined because it represents the most susceptible mode of
operation.
The pulses at the transformer output have an amplitude greater
than 1.0 V. The decoder has a sensing threshold at about 0.5 V,
therefore establishing a 0.5 V margin in which induced voltages
can be tolerated. The voltage induced across the receiving coil is
given by
V = (−dβ/dt)Σπrn2; n = 1, 2,…, N
where:
β is the magnetic flux density (gauss).
N is the number of turns in the receiving coil.
rn is the radius of the nth turn in the receiving coil (cm).
Given the geometry of the receiving coil in the ADuM221x and
an imposed requirement that the induced voltage be at most
50% of the 0.5 V margin at the decoder, a maximum allowable
magnetic field is calculated as shown in Figure 14.
MAGNE TIC FIE LD FRE QUENCY ( Hz )
100
MAXIMUM ALLOWABLE MAGNETIC FLUX
DENSITY (kgauss)
0.001 1M
10
0.01
1k 10k 10M
0.1
1
100M100k
09233-014
Figure 14. Maximum Allowable External Magnetic Flux Density
ADuM2210/ADuM2211 Data Sheet
Rev. D | Page 14 of 20
For example, at a magnetic field frequency of 1 MHz, the
maximum allowable magnetic field of 0.2 kgauss induces a
voltage of 0.25 V at the receiving coil. This is about 50% of the
sensing threshold and does not cause a faulty output transition.
Similarly, if such an event were to occur during a transmitted
pulse (and was of the worst-case polarity), it would reduce the
received pulse from >1.0 V to 0.75 V—still well above the 0.5 V
sensing threshold of the decoder.
The preceding magnetic flux density values correspond to
specific current magnitudes at given distances away from the
ADuM221x transformers. Figure 15 expresses these allowable
current magnitudes as a function of frequency for selected
distances. As can be seen, the ADuM221x is immune and can
be affected only by extremely large currents operated at high
frequency and very close to the component. For the 1 MHz
example noted previously, one would have to place a 0.5 kA
current 5 mm away from the ADuM221x to affect operation
of the component.
MAG NE TIC FI E LD FRE QUENCY ( Hz )
MAXIMUM ALL OWABLE CURRE NT (kA)
1000
100
10
1
0.1
0.011k 10k 100M100k 1M 10M
DIS TANCE = 5mm
DIS TANCE = 1m
DIS TANCE = 100mm
09233-015
Figure 15. Maximum Allowable Current
for Various Current-to-ADuM221x Spacings
Note that at combinations of strong magnetic field and high
frequency, any loops formed by printed circuit board traces can
induce sufficiently large error voltages to trigger the thresholds
of succeeding circuitry. Care should be taken in the layout of
such traces to avoid this possibility.
POWER CONSUMPTION
The supply current at a given channel of the ADuM221x
isolator is a function of the supply voltage, the channel’s data
rate, and the channel’s output load.
For each input channel, the supply current is given by
IDDI = IDDI (Q) f ≤ 0.5fr
IDDI = IDDI (D) × (2f − fr) + IDDI (Q) f > 0.5fr
For each output channel, the supply current is given by
IDDO = IDDO (Q) f ≤ 0.5fr
IDDO = (IDDO (D) + (0.5 × 10−3) × CL × VDDO) × (2f − fr) + IDDO (Q)
f > 0.5fr
where:
IDDI (D), IDDO (D) are the input and output dynamic supply currents
per channel (mA/Mbps).
CL is the output load capacitance (pF).
VDDO is the output supply voltage (V).
f is the input logic signal frequency (MHz, half of the input data
rate, NRZ signaling).
fr is the input stage refresh rate (Mbps).
IDDI (Q), IDDO (Q) are the specified input and output quiescent
supply currents (mA).
To calculate the total IDD1 and IDD2, the supply currents for
each input and output channel corresponding to IDD1 and IDD2
are calculated and totaled. Figure 6 and Figure 7 provide per-
channel supply currents as a function of data rate for an
unloaded output condition. Figure 8 provides per-channel
supply current as a function of data rate for a 15 pF output
condition. Figure 9 through Figure 11 provide total IDD1 and IDD2
as a function of data rate for ADuM2210/ADuM2211 channel
configurations.
Data Sheet ADuM2210/ADuM2211
Rev. D | Page 15 of 20
INSULATION LIFETIME
All insulation structures eventually break down when subjected
to voltage stress over a sufficiently long period. The rate of
insulation degradation is dependent on the characteristics of the
voltage waveform applied across the insulation. In addition to
the testing performed by the regulatory agencies, Analog
Devices carries out an extensive set of evaluations to determine
the lifetime of the insulation structure within the ADuM221x.
Analog Devices performs accelerated life testing using voltage
levels higher than the rated continuous working voltage. Accel-
eration factors for several operating conditions are determined.
These factors allow calculation of the time to failure at the actual
working voltage. The values shown in Table 19 summarize the
peak voltage for 50 years of service life for a bipolar ac operating
condition and the maximum CSA/VDE approved working volt-
ages. In many cases, the approved working voltage is higher than
a 50-year service life voltage. Operation at these high working
voltages can lead to shortened insulation life in some cases.
The insulation lifetime of the ADuM221x depends on the voltage
waveform type imposed across the isolation barrier. The iCoupler
insulation structure degrades at different rates, depending on
whether the waveform is bipolar ac, unipolar ac, or dc. Figure 16,
Figure 17, and Figure 18 illustrate these different isolation
voltage waveforms.
Bipolar ac voltage is the most stringent environment. The goal
of a 50-year operating lifetime under the ac bipolar condition
determines the Analog Devices recommended maximum
working voltage.
In the case of unipolar ac or dc voltage, the stress on the
insulation is significantly lower. This allows operation at higher
working voltages while still achieving a 50-year service life. The
working voltages listed in Table 19 can be applied while main-
taining the 50-year minimum lifetime, provided the voltage
conforms to either the unipolar ac or dc voltage cases. Any
cross-insulation voltage waveform that does not conform to
Figure 17 or Figure 18 should be treated as a bipolar ac
waveform and its peak voltage should be limited to the 50-year
lifetime voltage value listed in Table 19.
Note that the voltage presented in Figure 17 is shown as
sinusoidal for illustration purposes only. It is meant to represent
any voltage waveform varying between 0 V and some limiting
value. The limiting value can be positive or negative, but the
voltage cannot cross 0 V.
0V
RATED P E AK V OL TAG E
09233-016
Figure 16. Bipolar AC Waveform
0V
RATED P E AK V OL TAG E
09233-017
Figure 17. Unipolar AC Waveform
0V
RATED P E AK V OL TAG E
09233-018
Figure 18. DC Waveform
ADuM2210/ADuM2211 Data Sheet
Rev. D | Page 16 of 20
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONSARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-013-AA
10.50 (0.4134)
10.10 (0.3976)
0.30 (0.0118)
0.10 (0.0039)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
0.75(0.0295)
0.25(0.0098)
45°
1.27 (0.0500)
0.40 (0.0157)
COPLANARITY
0.10 0.33 (0.0130)
0.20 (0.0079)
0.51 (0.0201)
0.31 (0.0122)
SEATING
PLANE
8°
0°
16 9
8
1
1.27 (0.0500)
BSC
03-27-2007-B
Figure 19. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body (RW-16)
Dimensions shown in millimeters and (inches)
11-15-2011-A
16 9
81
SEATING
PLANE
COPLANARITY
0.1
1.27 B S C
12.85
12.75
12.65
7.60
7.50
7.40
2.64
2.54
2.44
1.01
0.76
0.51
0.30
0.20
0.10
10.51
10.31
10.11
0.46
0.36
2.44
2.24
PIN 1
MARK
1.93 REF
8°
0°
0.32
0.23
0.71
0.50
0.31 45°
0.25 BSC
GAGE
PLANE
COM P LI ANT TO JE DEC STANDARDS MS-0 13- AC
Figure 20. 16-Lead Standard Small Outline Package, with Increased Creepage [SOIC_IC]
Wide Body (RI-16-2)
Dimensions shown in millimeters
Data Sheet ADuM2210/ADuM2211
Rev. D | Page 17 of 20
ORDERING GUIDE
Model1, 2, 3
Number
of Inputs,
VDD1 Side
Number
of Inputs,
VDD2 Side
Maximum
Data Rate
(Mbps)
Maximum
Propagation
Delay, 5 V (ns)
Maximum
Pulse Width
Distortion (ns)
Temperature
Range Package Description
Package
Option
ADuM2210SRWZ 2 0 1 150 40 −40°C to +125°C 16-Lead SOIC_W RW-16
ADuM2210TRWZ 2 0 10 50 3 −40°C to +125°C 16-Lead SOIC_W RW-16
ADuM2210WSRWZ
2 0 1 150 40 −40°C to +125°C 16-Lead SOIC_W RW-16
ADuM2210WTRWZ 2 0 10 50 3 −40°C to +125°C 16-Lead SOIC_W RW-16
ADuM2210SRIZ 2 0 1 150 40 −40°C to +125°C 16-Lead SOIC_IC RI-16-2
ADuM2210TRIZ 2 0 10 50 3 −40°C to +125°C 16-Lead SOIC_IC RI-16-2
ADuM2211SRWZ 1 1 1 150 40 −40°C to +125°C 16-Lead SOIC_W RW-16
ADuM2211TRWZ 1 1 10 50 3 −40°C to +125°C 16-Lead SOIC_W RW-16
ADuM2211WSRWZ 1 1 1 150 40 −40°C to +125°C 16-Lead SOIC_W RW-16
ADuM2211WTRWZ 1 1 10 50 3 −40°C to +125°C 16-Lead SOIC_W RW-16
ADuM2211SRIZ 1 1 1 150 40 −40°C to +125°C 16-Lead SOIC_IC RI-16-2
ADuM2211TRIZ 1 1 10 50 3 −40°C to +125°C 16-Lead SOIC_IC RI-16-2
1 Z = RoHS Compliant Part.
2 Tape and reel is available. The addition of an -RL suffix designates a 13” (1,000 units) tape and reel option.
3 W = Qualified for Automotive Applications.
AUTOMOTIVE PRODUCTS
The ADuM2210W/ADuM2211W models are available with controlled manufacturing to support the quality and reliability requirements
of automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore,
designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for
use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and
to obtain the specific Automotive Reliability reports for these models.
ADuM2210/ADuM2211 Data Sheet
Rev. D | Page 18 of 20
NOTES
Data Sheet ADuM2210/ADuM2211
Rev. D | Page 19 of 20
NOTES
ADuM2210/ADuM2211 Data Sheet
Rev. D | Page 20 of 20
NOTES
©2010–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09233-0-8/12(D)