Vishay Siliconix
SiP12501
Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
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1
Boost Converter for Single/Double AA Cell or NiMH Battery for
White LED Applications
DESCRIPTION
SiP12501 is a boost converter IC for single or double cell
NiMH or Alkaline battery pack, which can drive white LEDs
connected in parallel to provide backlight in hand-held
devices. Designed with an internal low threshold power
MOSFET, it is capable of starting up with a low battery
voltage of 0.65 V. For best efficiency performance, the
SiP12501 is designed to operate in PWM mode with 600 kHz
switching. The voltage-mode PWM design is internally
compensated, reducing the external parts count. It accepts
input voltages from 0.65 V to 3.3 V, regulates output current
of up to 60 mA from a 0.9 V input. The LED current can be
adjusted externally for its brightness control. SiP12501
features low shutdown current of under 1 µA, internal power
MOS, thermal shutdown protection and antiringing control.
SiP12501 is available in a lead (Pb)-free 6 pin, PowerPAK
MLP33 package and is specified to operate over the
industrial temperature range of - 40 °C to 85 °C.
FEATURES
Voltage mode control with internal frequency
compensation
0.65 V to 3.3 V input voltage range
Low startup voltage: 0.65 V
PWM control with 600 kHz fixed switching frequency
Analog control of LED intensity
Power supply from output voltage
Regulated output current
Integrated UVLO and soft-start
Logic controlled shutdown (< 1 µA)
High efficiency: typical 75 %
Internal power MOS
Antiringing switch to minimize EMI
Thermal shutdown
Minimum external components
PowerPAK® MLP33-6 package
APPLICATIONS
White LED backlighting
Handheld devices
Digital cameras
Portable applications
LCD bias supplies
TYPICAL APPLICATION CIRCUIT
XSHD LX
SiP12501
VOUT
VIN
FBGND
1
5
6
4
2
3
10 µ H
XSHD
10 µF
VIN
4.7 µF
MBR0520
15 Ω 15 Ω 15 Ω 15 Ω
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Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
Vishay Siliconix
SiP12501
Notes:
a. Derate 20 mW/°C above 70 °C.
b. Device mounted with all leads soldered or welded to PC board.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Notes:
a. Full = - 40 °C to 85 °C.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum (- 40 °C to 85 °C).
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. Minimum Operating Voltage is determined by the battery’s capability to provide energy as it is deeply discharged.
ABSOLUTE MAXIMUM RATINGS (all voltages referenced to GND = 0 V)
Parameter Limit Unit
Input Voltage, VIN - 0.3 to 6
V
LX Voltage - 0.3 to VOUT + 0.5
Output Voltage, VOUT - 0.3 to 6
XSHD Voltage - 0.3 to VIN + 0.5
FB Voltage - 0.3 to 6
Maximum Junction Temperature 150
°CStorage Temperature - 55 to 150
Operating Junction Temperature 125
Power DissipationaPowerPAK MLP33-6 (TA = 70 °C)a1100 mW
Thermal ResistancebPowerPAK MLP33-6 50 °C/W
RECOMMENDED OPERATING RANGE (all voltages referenced to GND = 0 V)
Parameter Limit Unit
Input Voltage, VIN 0.65 to 3.3
V
Output Voltage, VOUT 3.5 to 5
XSHD Voltage 0 to VIN
LX Voltage 0 to VOUT + 0.5 V
FB Voltage 0 to 5
Operating Temperature Range - 40 to 85 °C
SPECIFICATIONSa
Parameter Symbol
Test Conditions Unless Specified
VIN = 1.2 V, VOUT = 3.9 V, TA = 25 °C
Temp.a
Limits
Unit Min.b Typ.cMax.b
Minimum Start-Up Voltage VSTART ILOAD = 1 mA Full 0.65 0.85
V
Minimum Operating VoltagedVHOLD XSHD = VIN Full 0.55
Feedback Voltage VFB
0.291 0.3 0.309
Full 0.282 0.318
Feedback Input Current IFB VFB = 0.3 V 1nA
Maximum PWM Duty Cycle MAXDTY 80 87 %
PWM Switching Frequency fOSC Full 425 600 775 kHz
Quiescent Current IQVFB = 0.4 V Full 200 300
µA
Stand-By Current ISTB XSHD = 0 V, not including switch leakage Full 1
NMOS Switch Leakage ILEAK LX = 5 V 12
Full 10
NMOS Switch On Resistance RDS(on) VOUT = 3.3 V 0.24 Ω
XSHD Input High Level VXSHDH
0.8 V VIN 0.9 V Full 0.55
V
0.9 V< VIN 2 V Full 0.8
2 V < VIN 5 V Full 1.2
XSHD Input Low Level VXSHDL Full 0.2
Thermal Shutdown TSHD 160 °C
Thermal Shutdown Hysteresis THYST 20
Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
www.vishay.com
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Vishay Siliconix
SiP12501
PIN CONFIGURATION AND TRUTH TABLE
PIN FUNCTIONS
XSHD (Pin 1)
XSHD is the logic controlled shutdown input pin. When
XSHD is low, the IC is shutdown and an antiringing switch is
connected between LX and VIN. When XSHD is high, the IC
is working in normal operation.
VIN (Pin 2)
VIN is the pin connected to battery input voltage. The IC gets
its start-up bias from VIN at the beginning. Once VOUT
exceeds VIN, bias will come from VOUT. Thus, once started,
operation is completely independent from VIN. Operation is
only limited by the output voltage level and the battery’s
internal series resistance.
VOUT (Pin 3)
VOUT is the output of the boost converter and also the power
source for the IC.
FB (Pin 4)
FB is the feedback voltage pin, it senses the LED current
through the ballast resistor, the difference between it and the
internal 0.3 V reference is amplified by the error amplifier.
GND (Pin 5)
GND is the pin for signal and power ground.
LX (Pin 6)
LX is the pin of the drain for internal power MOS. LX is also
connected to inductor and Schottky diode. If the inductor
current falls to zero, or XSHD is low, an internal antiringing
switch is connected from LX to VIN to minimize EMI.
2
3
6
5
4
1
PowerPAK MLP33-6
Top View
VIN
XSHD
GND
LX
VOUT FB
ORDERING INFORMATION
Part Number Temperature Range Marking
SiP12501DMP-T1-E3 - 40 °C to 85 °C 2501
PIN DESCRIPTION
Pin Number Name Function
1 XSDH Logic controlled shutdown input, XSHD = high: normal operation, XSHD = low: shutdown
2VIN Battery input voltage
3VOUT Output of the boost converter and power source for the IC
4 FB Feedback pin
5 GND Signal and power ground
6 LX Switch pin
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Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
Vishay Siliconix
SiP12501
FUNCTIONAL BLOCK DIAGRAM
DETAILED OPERATION
SiP12501 is a 600 kHz boost converter IC, packaged in 6 pin
MLP33, for white LED applications. With start-up from low
battery input voltage of 0.65 V, this device features fixed
frequency voltage mode PWM control with internal frequency
compensation. With its low rDS(on) internal power MOSFET,
this device maintains high efficiency over a wide range of
load current.
Low Voltage Start-Up
SiP12501 is designed to start-up at input voltage of typically
0.65 V. In the beginning, VOUT is lower than VIN because of
the voltage drop of the Schottky diode, the device uses VIN
as the power source for the start-up circuit and uses current
limit with fixed off-time to control the increase of the output
voltage. Once VOUT exceeds VIN, the device uses VOUT as
the power source. When VOUT exceeds 1.89 V, the device
switches to soft-start.
Soft-Start
During soft-start, the loop compensation guarantees the slow
increase of the output voltage and inrush current, so that no
large voltage overshoot and inrush current occur when the
soft-start is ended.
PWM operation
After soft-start, the device works in PWM operation with a
fixed frequency of 600 kHz.
Thermal Shutdown Protection
If the temperature of the device is above 160 °C, the device
will turn off the internal power MOSFET and wait until the
temperature drops below 140 °C, then the device goes into
the soft-start process again and finally the system recovers.
During thermal shutdown, the output voltage drops below
1.89 V minus UVLO hysteresis, start-up will be triggered to
keep the output voltage above 1.89 V.
Antiringing Control
The antiringing control circuitry prevents high frequency
ringing of the LX pin as the inductor current goes to zero by
damping the resonant circuit formed by L and CLX
(capacitance on LX pin). When the IC is shutdown, this
antiringing switch is also turned on.
APPLICATION INFORMATION
White LED Brightness Control
The current of white LED can be adjusted by a PWM signal
on XSHD or by a variable dc voltage to control its brightness.
(see Figure 1.) As control voltage VCTRL increases, the
voltage drop on R2 increases and the voltage drop on R1
decreases. Thus, the LED current decreases. The selection
of R2 and R3 will make the current from VCTRL much smaller
than LED current and much larger than the FB pin bias
current.
Compensation
Thermal Shutdown
Reference and Soft-Start Oscillator
Start-Up
Driver
-
+
Antiringing SW
PWM+
-
E/A
VOUT VIN
GND
LX
FB
XSHD
FB
XSHD LX
SiP12501
V
OUT
V
IN
XSHD
1
5
6
4
2
3
10 µ H
XSHD
10 µ F
V
IN
4.7 µ F
MBR0520
R1
15 Ω 15 Ω 15 Ω 15 Ω
R3
3.9 kΩ
V
CTRL
R2
1 kΩ
I
LED
0.3 V
15 Ω
0.3 V
CTRL
15 Ω
R2
R3
-
Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
www.vishay.com
5
Vishay Siliconix
SiP12501
TYPICAL CHARACTERISTICS
Maximum PWM Duty Cycle vs. Temperature
Feedback Voltage vs. Temperature
80
81
82
83
84
85
86
87
88
89
90
-50-30-101030507090
Temperature (°C)
elcyC ytuD %
-4
-3
-2
-1
0
1
2
3
4
-50 -30 -10 10 30 50 70 90
)%(
y
car
uccA ega
t
l
oV
kc
ab
dee
F
VOUT = 3.9 V
Temperature (°C)
Supply Current vs. Temperature
Shutdown Threshold vs. Temperature
0.140
0.142
0.144
0.146
0.148
0.150
0.152
0.154
0.156
0.158
0.160
-50 -30 -10 10 30 50 70 90
)Am( tmerruC ylppuS
Temperature (°C)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
-50 -30 -10 10 30 50 70 90
Temperature (°C)
)V(
dl
o
hs
er
h
T
nw
o
d
tu
h
S
VIN = 5 V
VIN = 2 V
VIN = 0.8 V
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Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
Vishay Siliconix
SiP12501
TYPICAL WAVEFORMS
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?73192.
Figure 2. PWM Dimming Control
200 Hz 50 % Duty Cycle PWM Signal on XSHD Pin
Figure 4. Switching Waveforms: VLX, VOUT and VFB
VIN = 0.8 V, L = 10 µH, COUT = 4.7 µF, Four LEDs in Parallel
V
XSHD
0.5 V/div
V
OUT
1 V/div
V
FB
0.2 V/div
1 ms/div V
IN = 0.8 V
Fo
u
r LED
s
in
se
ri
es
0.5 µ s/div
V
LX
2 V/div
V
OUT
50 mV/div
ac coupled
V
FB
20 mV/div
ac coupled
Figure 3. Startup
VIN = VXSHD = 0 V to 0.8 V
100 ms/div
V
IN
0.5 V/div
V
OUT
2 V/div
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÇÇ
ÇÇ
C0.08
Cbbb MA A
Cddd M
7
4
9
9
8
6
11
7
8
5
Cccc//
NX
Detail C
A1
A
Caaa2 X
Caaa 2 X
Pin 1
Mark
1L2
E
B
AD
L2
NxK
E2
E2/2
D2/2
(ND-1) x e
D2
N-1
Bottom View
See Detail B
N
See Detail A
Detail D
Detail C
A1
R
R2
L
e
12
Exposed
Pad
(Optional)
Side View
A2
A3
NX b CSeating
Plane
Detail D
TopView4 x Q
5
10
Datum A or B Datum A or B
NX R1
L2
pin Tip
5
pin Tip
e
Odd pin/Side
Detail B
Even pin/Side
e
e/2
L
NX R1
Detail A Edge of Plastic Body
Exposed Metalized Feature
This Feature Applies To
Both Ends of The Package
Exposed Slug/Heat Sink
L2
L1
B
0.17 min
0.17
0.30
Package Information
Vishay Siliconix
Document Number: 72820
28-Jan-04
www.vishay.com
1
PowerPAKr MLP33-6, 8 and 10 (POWER IC ONLY)
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2. All dimensions are in millimeters. All angels are in degrees.
3. N is the total number of pins.
4. The pin #1 identifier and pin numbering convention shall conform to JESD 95-1 SPP-012. Details of pin #1 identifier is located within the
zone indicated. The pin #1 identifier is marked.
5. Dimension b applies to metallized pin and is measured between 0.15 mm and 0.20 mm from the pin tip.
6. ND refers to the maximum number of pins on the D side.
7. Depopulation of pins is allowed and will be called out on the individual variation.
8. Coplanarity applies to the exposed heat sink slug as well as the pins.
9. Profile tolerance (aaa) will be applicable only to the plastic body and not to the metallized features (such as the pin tips and tie bars.)
Metallized features may protrude a maximum of L2 from the plastic body profile.
10. L1 max is not called out, the metallized feature will extend to the exposed pad. Thus, the 0.17-mm gap does not apply.
11. The corner will be sharp unless otherwise specified with radius dimensions.
Package Information
Vishay Siliconix
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Document Number: 72820
28-Jan-04
PowerPAKr MLP33-6, 8, 10
N = 6 PITCH: 0.95 mm
N = 8 PITCH: 0.65 mm
N = 10 PITCH: 0.50 mm
MILLIMETERS* INCHES
Dim Basic Min Nom Max Basic Min Nom Max Notes
A0.80 0.90 1.00 0.031 0.035 0.039 1, 2
A1 0.00 0.025 0.05 0.000 0.001 0.002 1, 2
A2 0.65 0.70 0.75 0.026 0.028 0.030 1, 2
A3 0.15 0.20 0.25 0.006 0.008 0.010 1, 2
aaa 0.10 0.004 1, 2
b-6 0.33 0.35 0.43 0.013 0.014 0.017 1, 2, 8
b-8 0.285 0.305 0.385 0.011 0.012 0.015 1, 2, 8
b-10 0.18 0.20 0.28 0.007 0.008 0.011 1, 2, 8
bbb 0.10 0.004 1, 2
ccc 0.10 0.004 1, 2
D3.00 0.118 1, 2, 8
D2 1.92 2.02 2.12 0.076 0.080 0.083 1, 2, 8
ddd 0.05 0.002 1, 2
E3.00 0.118 1, 2, 8
E2 1.10 1.20 1.30 0.043 0.047 0.051 1, 2, 8
e-6 0.95 0.037 1, 2
e-8 0.65 0.026 1, 2
e-10 0.50 0.020 1, 2
K0.20 0.008 5, 11
L0.20 0.29 0.45 0.008 0.011 0.018 1, 2, 8
L1-6 0.16 0.24 0.40 0.006 0.009 0.016 1, 2, 8
L1-8 0.16 0.24 0.40 0.006 0.009 0.016 1, 2, 8
L1-10 1, 2, 8
L2 0.125 0.005 5, 11
R Ref 0.15 0.006 1, 2, 8
R1 Ref-6 0.127 0.005 1, 2, 8
R1 Ref-8 0.15 0.006 1, 2, 8
R1 Ref-10 0.075 0.003 1, 2, 8
Q0_10_12_0_10_12_1, 2
* Use millimeters as the primary measurement.
ECN: S-40082—Rev. A, 02-Feb-04
DWG: 5925
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Revision: 12-Mar-12 1Document Number: 91000
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