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Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=250uA 20 - - V
ΔBVDSS/ΔTjBreakdown Voltage Temperature Coefficient Reference to 25℃, ID=1mA - 0.1 - V/℃
RDS(ON) Static Drain-Source On-Resistance VGS=4.5V, ID=6A - - 30 mΩ
VGS=2.5V, ID=5.2A - - 45 mΩ
VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 0.5 - - V
gfs Forward Transconductance VDS=10V, ID=6A - 15.6 - S
IDSS Drain-Source Leakage Current (Tj=25oC) VDS=20V, VGS=0V - - 1 uA
Drain-Source Leakage Current (Tj=70oC) VDS=20V ,VGS=0V - - 25 uA
IGSS Gate-Source Leakage VGS=--
nA
QgTotal Gate Charge2ID=6A - 12.5 - nC
Qgs Gate-Source Charge VDS=20V - 1 - nC
Qgd Gate-Drain ("Miller") Charge VGS=5V - 6.5 - nC
td(on) Turn-on Delay Time2VDS=10V - 7 - ns
trRise Time ID=1A - 14.5 - ns
td(off) Turn-off Delay Time RG=3.3Ω,VGS=5V - 19 - ns
tfFall Time RD=10Ω-12-ns
Ciss Input Capacitance VGS=0V - 355 - pF
Coss Output Capacitance VDS=20V - 190 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 85 - pF
Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
VSD Forward On Voltage2Tj=25℃, IS=1.7A, VGS=0V - - 1.2 V
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse width <300us , duty cycle <2%.
3.Surface mounted on 1 in2 copper pad of FR4 board ; 135℃/W when mounted on min. copper pad.
AP9926M
± 12V±100