State of the Art, Inc. PROTECTIVE ENCAPSULANT Thin Film Chip Resistor M55342/08 RM2010 PRECISION THIN FILM RESISTOR 99.6% ALUMINA CHIP WRAPAROUND TERMINATIONS PRETINNED PERFORMANCE CURRENT NOISE CHARACTERISTICS* H E TESTS TCR (-55 to +125 C) in ppm/C Thermal Shock Low Temperature Operation Short-time Overload Resistance to Soldering Heat Moisture Resistance Life, 2,000 Hours High Temperature Exposure 50 0.25% 0.25% 0.1% 0.25% 0.4% 0.5% 0.2% 25 0.1% 0.1% 0.1% 0.2% 0.2% 0.5% 0.1% POWER DISSIPATION TEMPERATURE RISE (C) 100W - 1MW 0.1%, 1%, 2%, 5% 800 mW 150 Volts Resistance Range Tolerances Maximum Power Maximum Voltage fiber epoxy board ceramic board POWER DISSIPATION (WATTS) POWER DERATING LIFE TEST *Maximum allowable change per MIL-PRF-55342, typical change is 10% of these values. PART NUMBERING M55342 H 08 B 100D R - TR PACKAGING CODE: TR = Tape & Reel W= Waffle Pack PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER RESISTANCE AND TOLERANCE CODE: Three significant digits, with a letter indicating the decimal location, the tolerance, and the value range. TERMINATION MATERIALS: B: Solderable wraparound A: 0.1% W D: 1% W G: 2% W J: 5% W B: 0.1% K W E: 1% K W H: 2% K W K: 5% K W C: 0.1% M W F: 1% M W T: 2% M W L: 5% M W W: Gold wire bondable SIZE CODE: /08 = RM2010 TEMPERATURE CHARACTERISTIC: E: 25ppm H: 50ppm PERFORMANCE SPECIFICATION MIL-PRF-55342 MECHANICAL INCHES Length Width Thickness Top Term Bottom Term Gap Approx. Weight .202 (.191 - .218) .094 (.093 - .103) .025 (.015 - .033) .020 (.015 - .025) .019 (.015 - .025) .164 (.160 - .168) .0323 grams .252 MILLIMETERS 5.13 2.38 0.64 0.51 0.48 4.17 (4.85 - 5.54) (2.36 - 2.62) (0.38 - 0.84) (0.38 - 0.64) (0.38 - 0.64) (4.06 - 4.27) MINIMUM RECOMMENDED MOUNTING PADS (INCHES) .100 .154 .049 2470 Fox Hill Road, State College, PA 16803-1797 Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401 "Specifications subject to change without notice." www.resistor.com 04/09/08