Thin Film Chip Resistor
M55342/08 RM2010
04/09/08
PERFORMANCE
MECHANICAL
“Specifications subject to change without notice.”“Specifications subject to change without notice.”
Resistance Range 100 - 1M
Tolerances 0.1%, 1%, 2%, 5%
Maximum Power 800 mW
Maximum Voltage 150 Volts
WWResistance Range 100 - 1M
Tolerances 0.1%, 1%, 2%, 5%
Maximum Power 800 mW
Maximum Voltage 150 Volts
WW
PART NUMBERING
M55342 H 08 B 100DR-TRM55342 H 08 B 100D R - TR
TEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppmTEMPERATURE CHARACTERISTIC: E: ± 25ppm H: ± 50ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342PERFORMANCE SPECIFICATION MIL-PRF-55342
TERMINATION MATERIALS: B: Solderable wraparound W: Gold wire bondableTERMINATION MATERIALS: B: Solderable wraparound W: Gold wire bondable
SIZE CODE: /08 = RM2010SIZE CODE: /08 = RM2010
RESISTANCEAND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
RESISTANCEAND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ERPRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% T: Space Level C: Non - ER
A: 0.1%
B: 0.1% K
C: 0.1% M
W
W
W
A: 0.1%
B: 0.1% K
C: 0.1% M
W
W
W
PACKAGING CODE: TR = Tape & Reel W= Waffle PackPACKAGING CODE: TR = Tape & Reel W= Waffle Pack
2470 Fox Hill Road, State College, PA 16803-17972470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401Toll Free 1-800-458-3401
www.resistor.comwww.resistor.com
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
TESTS
TCR (-55 to +125 C) in ppm/ C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
°°
TESTS
TCR (-55 to +125 C) in ppm/ C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
°°
E
±25
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
±0.1%
E
±25
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
±0.1%
H
±50
±0.25%
±0.25%
±0.1%
±0.25%
±0.4%
±0.5%
±0.2%
H
±50
±0.25%
±0.25%
±0.1%
±0.25%
±0.4%
±0.5%
±0.2%
CHARACTERISTICS*
StateoftheArt,Inc.
PROTECTIVE
ENCAPSULANT
PROTECTIVE
ENCAPSULANT
WRAPAROUND
TERMINATIONS
PRETINNED
WRAPAROUND
TERMINATIONS
PRETINNED
99.6% ALUMINA CHIP99.6% ALUMINA CHIP
PRECISION
THIN FILM
RESISTOR
PRECISION
THIN FILM
RESISTOR
LIFE TEST POWER DERATING
TEMPERATURE RISE (°C)
POWER DISSIPATION
POWER DISSIPATION (WATTS)
fiber epoxy board
ceramic board
CURRENT NOISE
D: 1%
E: 1% K
F: 1% M
W
W
W
D: 1%
E: 1% K
F: 1% M
W
W
W
G: 2%
H: 2% K
T: 2% M
W
W
W
G: 2%
H: 2% K
T: 2% M
W
W
W
J: 5%
K: 5% K
L: 5% M
W
W
W
J: 5%
K: 5% K
L: 5% M
W
W
W
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
.252
.100
.154
.049
INCHES MILLIMETERSINCHES MILLIMETERS
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.202 (.191 - .218)
.094 (.093 - .103)
.025 (.015 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
.202 (.191 - .218)
.094 (.093 - .103)
.025 (.015 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
5.13 (4.85 - 5.54)
2.38 (2.36 - 2.62)
0.64 (0.38 - 0.84)
0.51 (0.38 - 0.64)
0.48 (0.38 - 0.64)
4.17 (4.06 - 4.27)
5.13 (4.85 - 5.54)
2.38 (2.36 - 2.62)
0.64 (0.38 - 0.84)
0.51 (0.38 - 0.64)
0.48 (0.38 - 0.64)
4.17 (4.06 - 4.27)
