SFH 5440
SFH 5441
Schmitt-Trigger IC im Smart DIL Gehäuse
Schmitt-Trigger IC in Smart DIL Package
Lead (Pb) Free Product - RoHS Compliant
2007-09-18 1
Wesentliche Merkmale
• SFH 5440: Ausgang active low
• SFH 5441: Ausgang active high
• Gegurtet lieferbar
• Geeignet für Anwendungen im Bereich von
400 nm bis 1100 nm
Anwendungen
• Optischer Schalter
•Pulsformer
•Zähler
Typ
Type
Bestellnummer
Ordering Code
Gehäuse
Package
SFH 5440 Q65110A1212 Smart-DIL Gehäuse, GND-Kennzeichnung:
breiter Anschluß
Smart-DIL package, GND marking: broad lead
SFH 5441 Q65110A2641
Features
• SFH 5440: Output active low
• SFH 5441: Output active high
• Available on tape and reel
• Suitable for applications from 400 nm to
1100 nm
Applications
• Optical threshold switch
•Pulseformer
• Counter
2007-09-18 2
SFH 5440, SFH 5441
Zur Stabilisierung der Versorgung wird ein Stützkondensator (angeschlossen zwischen VCC und GND) von typ. 0.1 µF
empfohlen.
A bypass capacitor, 0.1 µF typical, connected between VCC and GND is recommended in order to stabilize power supply
line.
Grenzwerte (TA = 25 °C)
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Lagertemperatur
Storage temperature range
Tstg – 40 … + 100 °C
Betriebstemperatur
Operating temperature range
Top – 40 … + 85 °C
Versorgungsspannung
Supply voltage
VCC – 0.5 … + 20 V
Ausgangsspannung
Output voltage
VO– 0.5 … + 20 V
Ausgangsstrom
Output current
IO50 mA
Verlustleistung
Power dissipation
Ptot 175 mW
Empfohlener Arbeitsbereich
Recommended Operating Conditions
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Versorgungsspannung
Supply voltage
VCC 4 … 18 V
Ausgangsstrom
Output current
IO< 16 mA
Kennwerte (TA = 25 °C, VCC = 5 V)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Ausgangsspannung „high“
Output voltage “high”
IO = 0
VOH VCC (> 4.0) V
Ausgangsspannung „low“
Output voltage “low”
IO = 16 mA
VOL 0.15 (< 0.4) V
SFH 5440, SFH 5441
2007-09-18 3
Stromaufnahme, E = 0
Supply current
VCC = 5 V
VCC = 18 V
ICC 3.3 (< 5)
5.0
mA
Schaltschwelle, λ = 950 nm
Threshold “ON“
SFH 5440: “H” → “L”
SFH 5441: “L” → “H”
Ee, ON 170 (< 320) µW/cm2
Hysterese
Hysteresis
Ee, OFF/Ee, ON 0.6
(0.5 … 0.9)
–
Halbwinkel
Half angle
ϕ±60 Grad
degr.
Anstiegszeit 10% bis 90%
Rise time 10% to 90%
RL = 280 Ω, Ee = 600 µW/cm2, λ = 950 nm
tr 100 ns
Abfallzeit 90% bis 10%
Fall time 90% to 10%
RL = 280 Ω, Ee = 600 µW/cm2, λ = 950 nm
tf 100 ns
Ausgangsverzögerungszeit
Propagation delay time “H” → “L”
RL = 280 Ω, Ee = 600 µW/cm2, λ = 950 nm
tPHL 5 (< 15) µs
Ausgangsverzögerungszeit
Propagation delay time “L” → “H”
RL = 280 Ω, Ee = 600 µW/cm2, λ = 950 nm
tPLH 5 (< 15) µs
Kennwerte (TA = 25 °C, VCC = 5 V)
Characteristics (cont’d)
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
2007-09-18 4
SFH 5440, SFH 5441
Figure 1 Block Diagram
Figure 2 Test Circuit for Switching and Response Time
Figure 3 Switching Time Definitions
OHF00518
-
+
Voltage
Regulator
CC
V
OUT
GND
+
-
Regulator
Voltage
GND
OUT
CC
V
Ω
10 k
Ω
10 k
SFH 5441 (Active “High”) SFH 5440 (Active “Low”)
OHF00520
CC
V
OUT
GND
R
= 47 Ω
Input
L
R
= 280 Ω
µF
C
= 0.1
CC
V
OUT
GND
= 5 V
SFH 5440
SFH 5441
OHF00519
PHL
t tPLH
50%
t
ftr
50%
90%
10%
Input
Output Output
Input
t
PHL
50%
PLH
t
tr f
t
10%
50%
90%
SFH 5441 (Active “High”)
SFH 5440 (Active “Low”)
SFH 5440, SFH 5441
2007-09-18 5
Relative Threshold
Ee, ON/Ee, ON (Vcc = 5 V) = f (VCC)
Output Voltage
V
OL
=
f
(
I
OUT
,
V
CC
)
OHF00507
0.5 0 5 10 15 20
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.5
V
E
V
CC
e, ON
E
e, ON_5 V
OHF00512
0010
20 30 40 50mA
5 V
OUT
I
0.5
1
1.5
2
2.5
3
3.5
OL
V
V
10 V
15 V
20 V
Supply Current
ICC = f (VCC)
Supply Current vs. Ambient
Temperature ICC = f (TA, VCC)
OHF00510
00 5 10 15 20
V
1
2
3
4
mA
6
CC
I
V
CC
OHF00514
0
-25
1
2
3
4
mA
6
CC
I
A
T
0 25 50 75 100˚C
CC
V
= 5 V
5
= 10 V
CC
V
= 20 V
V
CC
= 15 V
V
CC
Total Power Dissipation
Ptot = f (TA)
OHF01322
00
tot
P
A
T
20 40 60 80 ˚C 100
20
40
60
80
100
120
140
160
200
mW
2007-09-18 6
SFH 5440, SFH 5441
Maßzeichnung
Package Outlines
Maße in mm (inch) / Dimensions in mm (inch).
Empfohlenes Lötpaddesign
Recommended Solderpad Design
OHF02393
1.8 2.4
1.3
1.8
Padgeometrie für
verbesserte Wärmeableitung
heat dissipation
Paddesign for improved
1
0.3
SFH 5440, SFH 5441
2007-09-18 7
Lötbedingungen Vorbehandlung nach JEDEC Level 4
Soldering Conditions Preconditioning acc. to JEDEC Level 4
Reflow Lötprofil für bleifreies Löten (nach J-STD-020C)
Reflow Soldering Profile for lead free soldering (acc. to J-STD-020C)
Published by
OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
www.osram-os.com
© All Rights Reserved.
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.
1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.
2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
OHLA0687
0
0
T
t
˚C
s
120 s max
50
100
150
200
250
300
Ramp Up
100 s max
50 100 150 200 250 300
Ramp Down
6 K/s (max)
3 K/s (max)
25 ˚C
30 s max
260 ˚C
+0 ˚C
-5 ˚C
245 ˚C
±5 ˚C
240 ˚C
255 ˚C
217 ˚C
Maximum Solder Profile
Recommended Solder Profile
235 ˚C
-0 ˚C
+5 ˚C
Minimum Solder Profile
10 s min
min. condition for IR Reflow Soldering:
solder point temperature ≥ 235 °C for at least 10 sec.
