SCLS143D - DECEMBER 1982 - REVISED JULY 2003 D D Wide Operating Voltage Range of 2 V to 6 V Outputs Can Drive Up To 10 LSTTL Loads Low Power Consumption, 80-A Max ICC Typical tpd = 13 ns 4-mA Output Drive at 5 V Low Input Current of 1 A Max Dual 4-Bit Binary Counters With Individual Clocks Direct Clear for Each 4-Bit Counter Can Significantly Improve System Densities by Reducing Counter Package Count by 50 Percent SN54HC393 . . . J OR W PACKAGE SN74HC393 . . . D, DB, N, NS, OR PW PACKAGE (TOP VIEW) 1CLK 1CLR 1QA 1QB 1QC 1QD GND 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 2CLK 2CLR 2QA 2QB 2QC 2QD SN54HC393 . . . FK PACKAGE (TOP VIEW) 1CLR 1CLK NC VCC 2CLK D D D D D D D description/ordering information The 'HC393 devices contain eight flip-flops and additional gating to implement two individual 4-bit counters in a single package. These devices comprise two independent 4-bit binary counters, each having a clear (CLR) and a clock (CLK) input. N-bit binary counters can be implemented with each package, providing the capability of divide by 256. The 'HC393 devices have parallel outputs from each counter stage so that any submultiple of the input count frequency is available for system timing signals. 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 2CLR NC 2QA NC 2QB 1QD GND NC 2QD 2QC 1QA NC 1QB NC 1QC NC - No internal connection ORDERING INFORMATION PACKAGE TA PDIP - N SN74HC393N Tube of 50 SN74HC393D Reel of 2500 SN74HC393DR Reel of 250 SN74HC393DT SOP - NS Reel of 2000 SN74HC393NSR HC393 SSOP - DB Reel of 2000 SN74HC393DBR HC393 Tube of 90 SN74HC393PW Reel of 2000 SN74HC393PWR Reel of 250 SN74HC393PWT CDIP - J Tube of 25 SNJ54HC393J SNJ54HC393J CFP - W Tube of 150 SNJ54HC393W SNJ54HC393W LCCC - FK Tube of 55 SNJ54HC393FK TSSOP - PW -55C -55 C to 125 125C C TOP-SIDE MARKING Tube of 25 SOIC - D -40C -40 C to 85 85C C ORDERABLE PART NUMBER SN74HC393N HC393 HC393 SNJ54HC393FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) %(#"! "%' /01 '' %$$! $ $!$( #'$!! *$,!$ $() '' *$ %(#"! %(#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SCLS143D - DECEMBER 1982 - REVISED JULY 2003 FUNCTION TABLE COUNT SEQUENCE (each counter) OUTPUTS COUNT QD QC QB QA 0 L L L L 1 L L L H 2 L L H L 3 L L H H 4 L H L L 5 L H L H 6 L H H L 7 L H H H 8 H L L L H 9 H L L 10 H L H L 11 H L H H 12 H H L L 13 H H L H 14 H H H L 15 H H H H logic diagram, each counter (positive logic) R CLR QA CLK T R QB T R QC T R QD T 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SCLS143D - DECEMBER 1982 - REVISED JULY 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Package thermal impedance, JA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86C/W DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54HC393 VCC VIH Supply voltage High-level input voltage VCC = 2 V VCC = 4.5 V VCC = 6 V VCC = 2 V VIL VI VO t/v Low-level input voltage MIN NOM MAX 2 5 6 MIN NOM MAX 2 5 6 1.5 1.5 3.15 3.15 4.2 4.2 VCC = 4.5 V VCC = 6 V Input voltage 0 Output voltage 0 Input transition rise/fall time SN74HC393 VCC = 2 V VCC = 4.5 V VCC = 6 V 0.5 1.35 1.35 1.8 1.8 0 0 V V 0.5 VCC VCC UNIT VCC VCC 1000 1000 500 500 400 400 V V V ns TA Operating free-air temperature -55 125 -40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from induced grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device; however, functionally, the CLK inputs are not ensured while in the shift, count, or toggle operating modes. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SCLS143D - DECEMBER 1982 - REVISED JULY 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -20 A VOH VI = VIH or VIL IOH = -4 mA IOH = -5.2 mA IOL = 20 A VOL VI = VIH or VIL IOL = 4 mA IOL = 5.2 mA II ICC VI = VCC or 0 VI = VCC or 0, Ci IO = 0 VCC MIN TA = 25C TYP MAX SN54HC393 MIN MAX SN74HC393 MIN 2V 1.9 1.998 1.9 1.9 4.5 V 4.4 4.499 4.4 4.4 6V 5.9 5.999 5.9 5.9 4.5 V 3.98 4.3 3.7 3.84 6V 5.48 5.8 5.2 MAX UNIT V 5.34 2V 0.002 0.1 0.1 0.1 4.5 V 0.001 0.1 0.1 0.1 6V 0.001 0.1 0.1 0.1 4.5 V 0.17 0.26 0.4 0.33 6V 0.15 0.26 0.4 0.33 6V 0.1 100 1000 1000 nA 8 160 80 A 3 10 10 10 pF 6V 2 V to 6 V V timing requirements over recommended operating free-air temperature range (unless otherwise noted) VCC fclock Clock frequency CLK high or low tw Pulse duration CLR high tsu 4 Setup time, CLR inactive POST OFFICE BOX 655303 TA = 25C MIN MAX SN54HC393 MIN MAX SN74HC393 MIN MAX 2V 6 4.2 5 4.5 V 31 21 25 6V 36 25 28 2V 80 120 100 4.5 V 16 24 20 6V 14 20 18 2V 80 120 100 4.5 V 16 24 20 6V 14 20 18 2V 25 25 25 4.5 V 5 5 5 6V 5 5 5 * DALLAS, TEXAS 75265 UNIT MHz ns ns SCLS143D - DECEMBER 1982 - REVISED JULY 2003 switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) TA = 25C TYP MAX SN54HC393 SN74HC393 PARAMETER FROM (INPUT) TO (OUTPUT) VCC 2V 6 10 4.2 5 fmax CLK QA 4.5 V 31 50 21 25 6V 36 60 25 28 QA QB tpd CLK QC QD tPHL tt CLR Any Any MIN MIN MAX MIN MAX UNIT MHz 2V 50 120 180 150 4.5 V 15 24 36 30 6V 13 20 31 26 2V 72 190 285 240 4.5 V 22 38 57 47 6V 18 32 48 40 2V 91 240 360 300 4.5 V 28 48 72 60 6V 22 41 61 51 2V 100 290 430 360 4.5 V 32 58 87 72 6V 24 50 74 62 2V 45 165 250 205 4.5 V 17 33 49 41 6V 14 28 42 35 2V 28 75 110 95 4.5 V 8 15 22 19 6V 6 13 19 16 ns ns ns operating characteristics, TA = 25C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per counter POST OFFICE BOX 655303 No load * DALLAS, TEXAS 75265 TYP 40 UNIT pF 5 SCLS143D - DECEMBER 1982 - REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test VCC High-Level Pulse Test Point 50% 50% 0V tw CL = 50 pF (see Note A) VCC Low-Level Pulse 50% 50% 0V LOAD CIRCUIT VOLTAGE WAVEFORMS PULSE DURATIONS Input VCC 50% 50% 0V tPLH Reference Input VCC 50% In-Phase Output 0V tsu Data Input 50% 10% 90% tr tPHL VCC 50% 10% 0 V 90% 90% tr th 90% 50% 10% tPHL Out-of-Phase Output 90% VOLTAGE WAVEFORMS SETUP AND HOLD AND INPUT RISE AND FALL TIMES tPLH 50% 10% tf tf VOH 50% 10% VOL tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns. C. For clock inputs, fmax is measured when the input duty cycle is 50%. D. The outputs are measured one at a time with one input transition per measurement. E. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE LCCC FK 20 1 TBD Call TI Call TI 8410001CA ACTIVE CDIP J 14 1 TBD Call TI Call TI Call TI 8410001DA ACTIVE CFP W 14 1 TBD Call TI JM38510/66309BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type M38510/66309BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type A42 N / A for Pkg Type SN54HC393J ACTIVE CDIP J 14 1 TBD SN74HC393D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DBR ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393DTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 25 Pb-Free (RoHS) SN74HC393N ACTIVE PDIP N 14 OBSOLETE PDIP N 14 SN74HC393NE4 ACTIVE PDIP N 14 TBD 25 Pb-Free (RoHS) Addendum-Page 1 CU NIPDAU N / A for Pkg Type Call TI Samples (Requires Login) 84100012A SN74HC393N3 (3) Call TI CU NIPDAU N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 25-Jan-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393NSRE4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393NSRG4 ACTIVE SO NS 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393PWT ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HC393PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54HC393FK ACTIVE LCCC FK 20 1 TBD SNJ54HC393J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type SNJ54HC393W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type POST-PLATE N / A for Pkg Type The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 2 Samples (Requires Login) SN74HC393NSR (1) (3) PACKAGE OPTION ADDENDUM www.ti.com 25-Jan-2012 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54HC393, SN74HC393 : * Catalog: SN74HC393 * Military: SN54HC393 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74HC393DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74HC393DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC393DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC393DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SN74HC393NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1 SN74HC393PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74HC393PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74HC393DBR SSOP DB 14 2000 367.0 367.0 38.0 SN74HC393DR SOIC D 14 2500 333.2 345.9 28.6 SN74HC393DR SOIC D 14 2500 367.0 367.0 38.0 SN74HC393DT SOIC D 14 250 367.0 367.0 38.0 SN74HC393NSR SO NS 14 2000 367.0 367.0 38.0 SN74HC393PWR TSSOP PW 14 2000 367.0 367.0 35.0 SN74HC393PWT TSSOP PW 14 250 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. 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