Datashee
t
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
1/20
TSZ02201-0E2E0H500130-1-1
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CAN Transceiver for Automotive
BD41040FJ-C
General Description
BD41040FJ-C is a transceiver LSI for CAN
communication (Fully ISO 11898-2 and ISO 11898-5
compliant).
It is equipped with circuitry that functions as transmitter
and receiver, necessary for High-speed CAN
communication (up to 1Mbps)
Features
AEC-Q100 Compliant (Note 1)
Transmission rate of 40kbps to 1Mbps
Power saving mode correspondence
SPLIT voltage output for stabilizing recessive bus
level
Undervoltage detection on pin VCC
Thermally protected
TXD dominant time-out function
(In normal mode)
CAN bus dominant time-out function
(In standby mode)
(Note 1) Grade1
Application
CAN communication for Automotive networks.
Typical Application Circuit
Figure 1. Typical Application Circuit
Key Specifications
Operating Voltage Range: 4.75V to 5.25V
VCC Pin Absolute Maximum Rating: -0.3V to +7V
CANH,CANL,SPLIT Pin Absolute Maximum
Rating: -27V to +40V
Package W(Typ) x D(Typ) x H(Max)
SOP-J8 4.90mm x 6.00mm x 1.65mm
SOP-J8
BD41040FJ
2/20
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Pin Configuration
Figure 2. Pin Configuration
Pin Descriptions Table 1. Pin Description
Pin No.
Pin Name
Function
1
TXD
Transmission data input pin with pull-up resistance(“LOW” Active mode)
2
GND
Ground
3
VCC
Power supply pin
4
RXD
Receive data output pin
5
SPLIT
Common-mode stabilization output pin
6
CANL
LOW-level CAN bus line
7
CANH
HIGH-level CAN bus line
8
STB
Standby mode control input.
HIGH : Standby mode, LOW : Normal mode. (with pull-up resistance)
Block Diagram
Figure 3. Block Diagram(s)
TXD
GND
VCC
RXD
STB
CANH
CANL
SPLIT
1
2
3
45
6
7
8
SOP-J8
(Top View)
BD41040FJ
3/20
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Description of Blocks
1. Mode of Operation
BD41040FJ-C operates on Power-OFF mode, Standby mode or Normal mode depending on the logic state of STB pin and
voltage of VCC (see Figure 4 for the state transition of each mode of operation)
Figure 4. State Transition Chart
(1) Power-OFF Mode
The Power OFF mode is the state in which the transceiver function is turned off due to an abnormal drop in VCC. In
this mode, the IC cannot receive the Wake-up signal from CAN bus.
(2) Standby Mode
The Standby Mode is the state in which electric power is saved by turning off all circuits except those with Receiver
Standby, Wake up Filter and Dominate Time-Out functions. RXD will output the wake up signal from CAN bus.
(3) Normal Mode
The Normal mode is the state in which the transceiver is available for normal CAN communication. It transmits and
receives data via the bus lines CANH and CANL. In this mode, TXD can transmit data to the CAN bus and RXD can
receive data from the CAN bus. In addition, SPLIT outputs the voltage of VCC/2.
VCC ≤ V
UVOFF
STB = LOW
and
TXD = HIGH
and
VCC ＞VUVSTB
VCC ＞VUVOFF
RXD
CAN bus data
CANH
TXD data
CANL
TXD data
SPLIT VCC/2
Normal mode
RXD
CAN bus data
CANH Pull down
CANL Pull down
SPLIT Hiz
Standby mode
STB = HIGH or
VCC ≤ VUVSTB
RXD
HIGH or Hiz
CANH Hiz
CANL Hiz
SPLIT Hiz
Power-off mode
Power-OFF mode
VCC > VUVOFF
VCC ≤ VUVOFF
STB = LOW
and
TXD = HIGH
and
VCC > VUVSTB
STB = HIGH or
VCC ≤ VUVSTB
BD41040FJ
4/20
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Absolute Maximum Ratings
Table 2. Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Supply Voltage on Pin VCC
VCC
-0.3 to +7.0
V
Voltage on Pin CANH, CANL,
SPLIT
VCANH,CANL,SPLIT
-27.0 to +40.0
V
Voltage on Pin TXD, RXD, STB
VTXD,RXD,STB
-0.3 to +7.0
V
Storage Temperature Range
Tstg
-55 to +150
°C
Junction Max Temperature
Tjmax
+150
°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
BD41040FJ
5/20
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Thermal Resistance (Note 2)
Table 3. Thermal Resistance
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 4)
2s2p(Note 5)
SOP-J8
Junction to Ambient
θJA
149.3
76.9
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
18
11
°C/W
(Note 2) Based on JESD51-2A(Still-Air)
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Table 4. 1 Layer Board
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70μm
Table 5. 4 Layers Board
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3mm x 76.2mm x 1.6mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70μm
74.2mm x 74.2mm
35μm
74.2mm x 74.2mm
70μm
Recommended Operating Conditions
Table 6. Recommended Operating Conditions
Parameter
Symbol
Typical Values
Unit
Conditions
Min
Typ
Max
Supply Voltage Range
VCC
4.75
5
5.25
V
Operating Temperature Range
Topr
-40
+25
+125
°C
Capacitance of Pin SPLIT(Note 6)
CSPLIT
1
4.7
100
nF
(Note 6) Please set the capacity of the condenser not to surpass a range of the value of standard in consideration of temperature characteristics, dc-bias
properties.
BD41040FJ
6/20
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Electrical Characteristics
(Note 7)The following specifications are 4.75V≤VCC≤5.25V, conditions of -40°C≤Topr≤125°C
(Note 8)The Typ level is VCC=5V, Topr=25°C unless otherwise specified.
Table 7. Electrical Characteristics (VCC)
Parameter
Symbol
Typical Values
Unit
Conditions
Min
Typ
Max
Operating Current 1
ICCSTB
-
8
15
μA
Standby; STB=HIGH
Operating Current 2
ICCREC
-
5
7.5
mA
Normal, Recessive;
STB = LOW,
TXD = HIGH, RLOAD = 60Ω
Operating Current 3
ICCDOM
-
45
65
mA
Normal, Dominant;
STB = LOW,
TXD = LOW, RLOAD = 60Ω
Under Voltage Detection Voltage 1
VUVSTB
3.50
-
4.75
V
To Standby
Under Voltage Detection Voltage 2
VUVOFF
1.30
-
2.95
V
To Bus Hi-z
Table 8. Electrical Characteristics (STB)
Parameter
Symbol
Typical Values
Unit
Conditions
Min
Typ
Max
HIGH Level Input Voltage
VIH_STB
0.7 x
VCC
-
VCC+
0.3
V
LOW Level Input Voltage
VIL_STB
-0.3
-
+0.3 x
VCC
V
HIGH Level Input Current
IIH_STB
-1
-
+1
μA
STB = VCC
LOW Level Input Current
IIL_STB
-15
-
-1
μA
VSTB = 0V
Table 9. Electrical Characteristics (TXD)
Parameter
Symbol
Typical Values
Unit
Conditions
Min
Typ
Max
HIGH Level Input Voltage
VIH_TXD
0.7 x
VCC
-
VCC+
0.3
V
LOW Level Input Voltage
VIL_TXD
-0.3
-
+0.3 x
VCC
V
HIGH Level Input Current
IIH_TXD
-5
-
+5
μA
TXD = VCC
LOW Level Input Current
IIL_TXD
-260
-150
-30
μA
VTXD = 0V
Table 10. Electrical Characteristics (RXD)
Parameter
Symbol
Typical Values
Unit
Conditions
Min
Typ
Max
Normal Mode Time Output HIGH
Current
IOH_RXD
-8
-
-1
mA
RXD = VCC-0.4V
Normal Mode Time Output LOW
Current
IOL_RXD
1
-
12
mA
VRXD = 0.4V
Table 11. Electrical Characteristics (SPLIT)
Parameter
Symbol
Typical Values
Unit
Conditions
Min
Typ
Max
Output Voltage 1
VILN_SPLIT
0.3 x
VCC
-
0.7 x
VCC
V
ILOAD = -500µA
Output Voltage 2
VILP_SPLIT
0.3 x
VCC
-
0.7 x
VCC
V
ILOAD = 500µA
Output Voltage 3
VRL_SPLIT
0.45 x
VCC
-
0.55 x
VCC
V
RLOAD = 1MΩ
Leakage Current 1
IIL_SPLIT
-5
-
+5
μA
VSPLIT = -27V
Leakage Current 2
IIH_SPLIT
-5
-
+5
μA
VSPLIT = 40V
BD41040FJ
7/20
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Electrical Characteristics - continued
Table 12. Electrical Characteristics (CANH, CANL)
Parameter
Symbol
Typical Values
Unit
Conditions
Min
Typ
Max
Common Voltage Range
VCM_CAN
-12
+2.5
+12
V
CANH Dominant Output Voltage
VDOM_CANH
2.75
3.50
4.50
V
RLOAD = 45Ω to 65Ω
CANL Dominant Output Voltage
VDOM_CANL
0.50
1.50
2.25
V
RLOAD = 45Ω to 65Ω
CANH - CANL Dominant Output
Voltage
VDOM_DIFF
1.5
-
3.0
V
RLOAD = 60Ω
CANH + CANL
Output Waveform Symmetry
VAC_SYM
0.9 x
VCC
-
1.1 x
VCC
V
RLOAD = 60Ω,CSPLIT = 4.7nF,
fTXD = 250kHz
CANH + CANL – VCC
Dominant Output Voltage
VDOM_SYM
-400
-
+400
mV
RLOAD = 60Ω
CANH Recessive Output Voltage
VREC_CANH
2.0
0.5 x
VCC
3.0
V
No Load
CANL Recessive Output Voltage
VREC_CANL
2.0
0.5 x
VCC
3.0
V
No Load
CANH - CANL Recessive Output
Voltage 1
VREC_DIFF1
-50
-
+50
mV
No Load
CANH - CANL Recessive Output
Voltage 2
VREC_DIFF2
-120
-
+12
mV
RLOAD = 60Ω
CANH Dominant Output Current
IDOM_CANH
-100
-
-
mA
VCANH = 0V
CANL Dominant Output Current
IDOM_CANL
-
-
100
mA
VCANL = 5V
CANH Recessive Output Current
IREC_CANH
-5
-
+5
mA
VCANH = -27V to +40V
CANL Recessive Output Current
IREC_CANL
-5
-
+5
mA
VCANL = -27V to +40V
CANH Standby Output Voltage
VSTB_CANH
-0.1
-
+0.1
V
No Load
CANL Standby Output Voltage
VSTB_CANL
-0.1
-
+0.1
V
No Load
CANH Leakage Current
IOFF_CANH
-3
-
+3
µA
VCC = 0V, VCANH = 5V
CANL Leakage Current
IOFF_CANL
-3
-
+3
µA
VCC = 0V, VCANL = 5V
CANH Input Impedance
RI_CANH
5
15
28
kΩ
CANL Input Impedance
RI_CANL
5
15
28
kΩ
CANH, CANL Input Impedance
Offset
RI_OFFSET
-3
-
+3
%
CANH, CANL
Differential Input Impedance
RI_DIFF
10
30
52
kΩ
CANH – CANL Normal Mode Time
Receiver Detection Voltage
VRX_NRM
500
-
900
mV
CANH – CANL Normal Mode Time
Receiver Detection Voltage
Hysteresis
VRX_NRM_HYS
100
-
300
mV
CANH – CANL Standby Mode
Time Receiver Detection Voltage
VRX_STB
400
-
1150
mV
BD41040FJ
8/20
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Electrical Characteristics – continued
Table 13. Electrical Characteristics (Timing)
Parameter
Symbol
Typical Values
Unit
Conditions
Min
Typ
Max
delay time from TXD to Bus
Dominant
tTXD_DOM
-
-
140
ns
TXD-DOM; RLOAD = 60Ω,
CLOAD = 100pF
delay time from TXD to Bus
Recessive
tTXD_REC
-
-
140
ns
TXD-REC; RLOAD = 60Ω,
CLOAD = 100pF
delay time from Bus Dominant to
RXD
tDOM_RXD
-
-
140
ns
DOM-RXD
delay time from Bus Recessive to
RXD
tREC_RXD
-
-
140
ns
REC-RXD
propagation delay from TXD to
RXD fall
tTXD_RXD_F
60
-
220
ns
TXD-RXD
Bus Dominant;
RLOAD = 60Ω, CLOAD = 100pF
propagation delay from TXD to
RXD rise
tTXD_RXD_R
60
-
220
ns
TXD-RXD
Bus Recessive;
RLOAD = 60Ω, CLOAD = 100pF
Bus Wake-up Time
tBUS_WK
0.5
-
5
µs
VDIFF = 1.15V to 5.0V
Standby to Normal Mode
tSTB_NRM
7
-
47
µs
TXD Dominant Time-out
tDOM_TON
0.8
-
16
ms
In Normal Mode
Bus Dominant Time-out
tDOM_TOS
0.8
-
16
ms
In Standby Mode
Timing Chart
Figure 5. Standby Mode Function
1.15V
0.3VCC V
TBUS_WK
CANH
CANL
CANH-
CANL
RXD
tBUS_WK
0.3VCC V
1.15V
BD41040FJ
9/20
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Timing Chart - continued
Figure 6. Normal Mode Function
Figure 7. Transition from Standby Mode to Normal Mode
0.5VCC V
0.5VCC V
TSTB_NRM
In Standby mode In Normal mode
STB
CANH
CANL
SPLIT
Operating
mode
tSTB_NRM
0.5VCC V
0.5VCC V
0.5VCC V
TTXD_DOM
TDOM_RXD
TTXD_RXD_F
0.9V
0.5V
0.3VCC V
0.7VCC V
TTXD_REC
TREC_RXD
TTXD_RXD_R
TXD
CANH
CANL
CANH-
CANL
RXD
tTXD_RXD_F
tDOM_RXD
tTXD_DOM
tTXD_REC
tREC_RXD
tTXD_RXD_R
0.7VCC V
0.3VCC V
0.9V
0.5VCC V
0.5V
BD41040FJ
10/20
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Application Information
1. Fail Safe Function
(1) Thermal Shut Down
Thermal shut down is a function to automatically stop output to the CAN bus during an abnormal heat generation
overrun. When the junction temperature of the IC becomes higher than a sensed temperature (Typ 170°C), CAN
bus changes to the Recessive state. When the junction temperature of the IC is less than the detection release
temperature(Typ 155°C), the thermal shut down function is cancelled by setting TXD HIGH.
Attention: The sensed temperature reaches 150°C to 190°C, and the hysteresis temperature is 5°C to 30 °C. The
sensed temperature/hysteresis temperature is not inspected for shipped samples. In addition, please avoid system
designs that operate near the absolute maximum ratings as the temperature protective circuits activate when the
limits are exceeded.
Figure 8. Thermal Shutdown Operating
Tj > TSD judgment
temperature
↓
Thermal shut down is effective
Tj < TSD release
temperature
Tj < TSD release
temperature
& TXD = HIGH
↓
Thermal shut down release
TXD
CANH
CANL
CANH-
CANL
RXD
BD41040FJ
11/20
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(2) TXD Dominant Time-out
TXD dominant time-out is a function to automatically stop the output to CAN bus when TXD is set LOW during
Normal mode. If TXD dominant time-out is enabled, CAN bus changes to the Recessive state. The TXD dominant
time-out is released by setting TXD to HIGH.
Figure 9. TXD Dominant Time-out Operating
TXD dominant time-out
effective
TXD = HIGH
↓
TXD dominant time-out release
0.5VCC V
TDOM_TON
0.5V
TXD
CANH
CANL
CANH-
CANL
RXD
tDOM_TON
0.5VCC V
0.5V
BD41040FJ
12/20
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(3) CAN Bus Dominant Time-out
CAN Bus Dominant Time-out is a function to automatically stop the LOW output to RXD when CAN bus is set to
Dominant during Standby Mode. If CAN bus dominant time-out is enabled, RXD becomes HIGH. The CAN bus
dominant time-out is released by setting the CAN bus to Recessive.
Figure 10. RXD Dominant Time-out Operating
CAN bus dominant time-out
effective CAN bus = Recessive
↓
CAN bus dominant time-out release
1.15V
> TDOM_TOS
0.7VCC V
CANH
CANL
CANH-
CANL
RXD
> tDOM_TOS
0.7VCC V
1.15 V
BD41040FJ
13/20
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2. Application Example
Figure 11. Application Example
BD41040FJ
14/20
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3. Evaluation Circuit Diagram
(1) tTXD_DOM, tTXD_REC, tTXD_RXD_F, tTXD_RXD_R
(2) tDOM_RXD, tREC_RXD
(3) VAC_SYM
Figure 12. Evaluation Circuit Diagram
RXD
TXD
STB
CANH
SPLIT
CANL
BD41040FJ-C
(Transceiver)
VCC
GND
CANH
CANL
15pF
5V
100nF
47µF
RXD
TXD
STB
CANH
SPLIT
CANL
BD41040FJ-C
(Transceiver)
VCC
GND
CANH
CANL
Rload
=60Ω
Cload
=100pF
15pF
5V
100nF
47µF
RLOAD
=60Ω
CLOAD
=100pF
RXD
TXD
STB
CANH
SPLIT
CANL
BD41040FJ-C
(Transceiver)
VCC
GND
CANH
CANL
5V
100nF
47µF
Rload
=30Ω
Csplit
=4.7nF
Rload
=30Ω
RLOAD
= 30Ω
RLOAD
= 30Ω
CSPLIT
= 4.7nF
BD41040FJ
15/20
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TSZ02201-0E2E0H500130-1-2
I/O Equivalent Circuits
① TXD
④ RXD
⑧ STB
⑦ CANH
⑥ CANL
⑤ SPLIT
Figure 13. I/O Equivalent Circuits
STB
VCC
TXD
VCC
SPLIT
CANL
CANH
RXD
BD41040FJ
16/20
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Operational Note(s)
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately
but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
BD41040FJ
17/20
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
30.May.2016 Rev.003
TSZ02201-0E2E0H500130-1-2
Operational Note(s) – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 14. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
BD41040FJ
18/20
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
30.May.2016 Rev.003
TSZ02201-0E2E0H500130-1-2
Ordering Information
B
D
4
1
0
4
0
F
J
－
C
E 2
ROHM form name
Package
FJ: SOP-J8
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
Marking Diagrams
Package
Orderable Part Number
41040
SOP-J8
BD41040FJ-CE2
SOP-J8 (TOP VIEW)
4 1 0 4 0
Part Number Marking
LOT Number
1PIN MARK
BD41040FJ
19/20
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
30.May.2016 Rev.003
TSZ02201-0E2E0H500130-1-2
Physical Dimension, Tape and Reel Information
Package Name
SOP-J8
BD41040FJ
20/20
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
30.May.2016 Rev.003
TSZ02201-0E2E0H500130-1-2
Revision History
Date
Revision
Changes
20.Jan.2016
001
(Japanese only)
17.Feb.2016
002
New Release
30.May.2016
003
Notation change of Thermal resistance
“Footprints and Traces”
74.2mm2 (Square) ⇒ 74.2mm x 74.2mm
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.