Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
R
2
J
3
3
4
G
5
E
6
Y
7
J
8
1
9
0
10
2
11
V
12
Thick Film
Chip Resistors
Product Code Size, Power Rating
XGN: 01005
1GE : 0201
2GE : 0402
3GE : 0603
6GE : 0805
8GE : 1206
14 : 1210
12 : 1812
12Z : 2010
1T : 2512
0.031 W
0.05 W
0.1 W
0.1 W
0.125 W
0.25 W
0.5 W
0.75 W
0.75 W
1W
Power R.
Marking
Code
Y
✽Nil
Marking
Value Marking on
black side
No marking
Resistance Tolerance
Code
J
0
Tolerance
±5%
Jumper
The first two digits are significant figures of resistance and
the third one denotes number of zeros following.
Decimal Point is expressed by R as 4.7 = 4R7.
Jumper is expressed by R00.
Resistance Value
Packaging Methods
Code
Y
C
X
V
U
Packaging Type
Pressed Carrier Taping
2mmpitch, 20000 pcs.
Pressed Carrier Taping
2mmpitch, 15000 pcs.
Punched Carrier Taping
2mmpitch, 10000 pcs.
Punched Carrier Taping
4mmpitch
Embossed CarrierTaping
4mmpitch
ERJXGN
ERJ1GE
ERJ2GE
ERJ3GE
ERJ6GE
ERJ8GE
ERJ14
ERJ12
ERJ12Z
ERJ1T
Type : inches
Thick Film Chip Resistors
01005, 0201, 0402, 0603, 0805,
1206, 1210, 1812, 2010, 2512
Type: ERJ XG, 1G, 2G, 3G, 6G, 8G,
14, 12, 12Z, 1T
■Features
● Small size and lightweight
● High reliability
Metal glaze thick fi lm resistive element and three layers of electrodes
● Compatible with placement machines
Taping packaging available
● Suitable for both refl ow and fl ow sol der ing
● Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134B
■Explanation of Part Numbers
● ERJXGN, 1GE, 2GE, 3GE, 6GE, 8GE, 14, 12, 12Z, 1T Series, ±5 % type
✽ When omitted, the rest of the P/N factors shall be moved up respectively.
(Only XGN, 1GN, 2GE type)
Jul. 2008
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Thick Film Chip Resistors
Protective coating
Alumina substrate Electrode (Inner)
Electrode
(Between)
Thick film
resistive element Electrode (Outer)
–40 –20 0 20 40 60 80 100 120 140 160
0
180–60
155 °C
70 °C
Ambient Temperature (°C)
20
40
60
80
100
Rated Load (%)
–55 °C
2G, 3G, 6G, 8G,
14, 12, 12Z, 1T
XG, 1G
125 °C
a
b
t
W
L
■Construction ■Dimensions in mm (not to scale)
Type
(inches)
Dimensions (mm)
Mass (Weight)
(g/1000 pcs.)
LWa b t
ERJXG
(01005) 0.40±0.02 0.20±0.02 0.10±0.03 0.10±0.03 0.13±0.02 0.04
ERJ1G
(0201) 0.60±0.03 0.30±0.03 0.10±0.05 0.15±0.05 0.23±0.03 0.15
ERJ2G
(0402) 1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05 0.8
ERJ3G
(0603) 1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2
ERJ6G
(0805) 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4
ERJ8G
(1206) 3.20+0.05 1.60+0.05 0.50±0.20 0.50±0.20 0.60±0.10 10
ERJ14
(1210) 3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16
ERJ12
(1812) 4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27
ERJ12Z
(2010) 5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27
ERJ1T
(2512) 6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45
–0.05
–0.15
–0.20
Type
(inches)
Power Rating
at 70 °C (W)
Limiting Element
Voltage (Maximum
RCWV)(1) (V)
Maximum Overload
Voltage(2)
(V)
Resistance
Tolerance
(%)
Resistance
Range
()
T.C.R.
[10–6/°C
(ppm/°C)]
Category Temperature
Range (Operating
Temperature Range)
(°C)
ERJXG
(01005) 0.031 15 30 ±5 4.7 to 1 M (E24)
<10 : –100 to +600
10 to 100 : ±300
100 < : ±200
–55 to +125
ERJ1G
(0201) 0.05 25 50 ±5 1 to 10 M (E24)
<10 :
–100 to +600
10 to 1 M:
±200
1 M<:
–400 to +150
–55 to +125
ERJ2G
(0402) 0.1 50 100 ±5 1 to 10 M (E24) –55 to +155
ERJ3G
(0603) 0.1 75 150 ±5 1 to 10 M (E24) –55 to +155
ERJ6G
(0805) 0.125 150 200 ±5 1 to 10 M (E24) –55 to +155
ERJ8G
(1206) 0.25 200 400 ±5 1 to 10 M (E24) –55 to +155
ERJ14
(1210) 0.5 200 400 ±5 1 to 10 M (E24) –55 to +155
ERJ12
(1812) 0.75 200 500 ±5 1 to 10 M (E24) –55 to +155
ERJ12Z
(2010) 0.75 200 500 ±5 1 to 10 M (E24) –55 to +155
ERJ1T
(2512) 1200500±51 to 1 M (E24) –55 to +155
Type
(inches) Rated Current
(A)
Maximum Over load Current
(A)
ERJXG (01005) 0.5 1
ERJ1G (0201)
ERJ2G (0402) 12
ERJ3G (0603)
ERJ6G (0805)
24
ERJ8G (1206)
ERJ14 (1210)
ERJ12 (1812)
ERJ12Z (2010)
ERJ1T (2512)
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the fi gure below.
(1) Rated Continuous Working Voltage (RCWV) shall be de ter mined from RCWV=Power Rating Re sis tance Values, or Limiting Element Voltage
(max. RCWV) list ed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be de ter mined from SOTV=2.5Power Rating or max. Over load Volt age list ed above
which ev er less.
■Ratings
<For Resistor>
<For Jumper>
Jul. 2008
Thick Film Chip Resistors
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
φB
W
T
φA
φC
TT TA
P0
P2
P1
P1
φD0
φD1(Only Emboss)
B
F
W
E
(2 mm pitch)
● Taping Reel
■Packaging Methods (Taping)
● Standard Quantity
● Carrier Tape
Type Kind of Taping Pitch (P1)Quantity
ERJXG Pressed Carrier Taping 2 mm
20000 pcs./reel
ERJ1G 15000 pcs./reel
ERJ2G
Punched Carrier Taping
10000 pcs./reel
ERJ3G
4 mm 5000 pcs./reel
ERJ6G
ERJ8G
ERJ14
Embossed Carrier Taping
ERJ12
ERJ12Z
ERJ1T 4000 pcs./reel
(Unit : mm)
Type φAφBφCWT
ERJXG
180.0+0 60 min. 13.0±1.0
9.0±1.0 11.4 ±1.0
ERJ1G
ERJ2G
ERJ3G
ERJ6G
ERJ8G
ERJ14
ERJ12
13.0±1.0 15.4±2.0
ERJ12Z
ERJ1T
(Unit : mm)
–3.0
Type A B W F E P1P2P0φD0TφD1
ERJXG 0.24±0.03 0.45±0.03
8.00±0.20
3.50±0.05
1.75±0.10
2.00±0.10
2.00±0.05 4.00±0.10 1.50+0.10
0.31±0.05 –
ERJ1G 0.38±0.05 0.68±0.05 0.42±0.05 –
ERJ2G 0.67±0.05 1.17±0.05 0.52±0.05 –
ERJ3G 1.10±0.10 1.90±0.10
4.00±0.10
0.70±0.05 –
ERJ6G 1.65±0.15 2.50±0.20
0.84±0.05 –
ERJ8G 2.00±0.15 3.60±0.20 –
ERJ14 2.80±0.20 3.50±0.20 8.00±0.30
1.00±0.10
1.0+0.10
ERJ12 3.50±0.20 4.80±0.20
12.00±0.30
5.50±0.20 1.5 min.
ERJ12Z 2.80±0.20 5.30±0.20
ERJ1T 3.60±0.20 6.90±0.20
−0
−0
Pressed Carrier Punched Carrier Embossed Carrier
Feb. 2006
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Thick Film Chip Resistors
Chip Resistor
c
a
b
Preheating
Peak
Heating
Temperature
Time
Type
(inches)
Dimensions (mm)
abc
ERJXG(01005) 0.15 to 0.20 0.5 to 0.7 0.20 to 0.25
ERJ1G (0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35
ERJ2G(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERJ3G (0603) 0.7 to 0.9 2 to 2.2 0.8 to 1
ERJ6G (0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4
ERJ8G (1206) 2 to 2.4 4.4 to 5 1.2 to 1.8
ERJ14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8
ERJ12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5
ERJ12Z(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8
ERJ1T(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
For soldering For lead-free soldering
Temperature Time Temperature Time
Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s
Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s
■Recommended Land Pattern
In case of fl ow soldering, the land width must be smaller than the Chip Resistor width to control the sol der amount properly.
Generally, the land width should be 0.7 to 0.8 times (W) of the width of chip resistor. In case of refl ow soldering, solder
amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
●Recommended soldering conditions for fl ow
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Thick Film Chip Resistors (here af ter called the
resistors) so as not to damage their electrodes and protective coatings.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity fl ux. Otherwise, the residue may impair the resistors' per for mance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, fi nish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amount of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Oth er wise, the re sis tors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avo id exce ss ive be nding of printed circuit boards in order to protect the resistors from abnormal stress.
Feb. 2006
– ER3 –
Safety Precautions
(Common precautions for Fixed Resistors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifi cations described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Be fore use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant damage, such as damage to
vehicles (au to mo bile, train, vessel), traffi c lights, medical equipment, aerospace equipment, elec tric heating
ap pli anc es, com bus tion/gas equipment, rotating equipment, and disaster/crime prevention equip ment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and stan dard use in general elec tron ic
equipment (e.g. AV equipment, home electric ap pli anc es, offi ce equipment, information and com mu ni ca tion
equipment)
• These products are not intended for use in the following special conditions. Be fore using the products, care ful ly
check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. S ea li n g o r c o ating of these products or a printed circuit board on which these products are mounted, with resin
or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will not
affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating com po nents. Do not mount or place heat-generating com po nents or
infl ammables, such as vinyl-coated wires, near these products .
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
• Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the
performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave
water res i dues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your
company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °
C and a relative humidity of 45 % to 85 %.
Even within the above guarantee periods, do not store these products in the fol low ing conditions. Otherwise, their
elec tri cal performance and/or solderability may be deteriorated, and the packaging materials (e.g. tap ing ma te ri als)
may be de formed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Oct. 2007
