HERMETIC, NUMERIC AND HEXADECIMAL DISPLAYS FOR MILITARY APPLICATIONS HEWLETT PACKARD Uy HIGH EFFICIENCY RED Low Power HDSP-078X/078XTXV/078XTXVB High Brightness HDSP-079X/079XTXV/079XTXVB YELLOW HDSP-088X/O88XTXV/088XTXVB High Performance GREEN HDSP-098X/098XTXV/O98XTXVB Features CONFORM TO MIL-D-87157, QUALITY LEVEL A TEST TABLES * TRUE HERMETIC PACKAGE FOR HIGH EFFICIENCY RED AND YELLOWI1) TXV AND TXVB VERSIONS AVAILABLE THREE CHARACTER OPTIONS Numeric, Hexadecimal, Over Range THREE COLORS High Efficiency Red, Yellow, High Performance Green 4x7 DOT MATRIX CHARACTER HIGH EFFICIENCY RED, YELLOW, AND HIGH PERFORMANCE GREEN TWO HIGH EFFICIENCY RED OPTIONS Low Power, High Brightness PERFORMANCE GUARANTEED OVER TEMPERATURE HIGH TEMPERATURE STABILIZED * GOLD PLATED LEADS MEMORY LATCH/DECODER/DRIVER TTL Compatible CATEGORIZED FOR LUMINOUS INTENSITY Description These solid state displays have a 74mm (0.29inch) dot matrix character and an onboard IC with data memory latch/decoder and LED drivers in a glass/ceramic package The hermetic HDSP-078X,-079X/-088X displays utilize a solder glass frit seal. The HDSP-098X displays utilize an epoxy glass-to-ceramic seal. All packages conform to the hermeticity requirements of MIL-D-87157, the general spe- cification for LED displays. These displays are designed for use in military and aerospace applications. The numeric devices decode positive BCD logic into characters "0-9", a " sign. decimal point, and a test pattern. The hexadecimal devices decode positive BCD logic into 16 characters, "0-9, A-F. Aninputis provided on the hexadecimal devices to blank the display (all LEDs off) without losing the contents of the memory. The over range device displays +1" and right hand decimal point and is typically driven via external switching transistors. Note: 1. The HDSP-098X high performance green displays are epoxy sealed and conform to MiL-D-87157 hermeticity requirements. Devices Part Number Front HDSP- Color Description View 0781/0781TXV/0781TXVB Numeric, Right Hand DP A 0782/0782TXV/0782TXVB High-Efficiency Red Numeric, Left Hand DP B 0783/0783TXV/0783TXVB Low Power Over Range +1 Cc 0784/0784T XV/0784TXVB Hexadecimal D 0791/0791 TXV/0791TXVB Numeric, Right Hand DP A 0792/0792TXV/0792TXVB High-Efficiency Red Numeric, Left Hand DP B 0783/0783T XV/0783TXVB High Brightness Over Range +1 Cc 0794/0794TXV/0794TXVB Hexadecimal D 0881/0881 TXV/0881TXVB Numeric, Right Hand DP A 0882/0882T XV/0882TXVB Yellow Numeric, Left Hand DP B 0883/0883T XV/0883TXVB Over Range +1 Cc 0884/0884 TXV/0884TXVB Hexadecimal D 0981/0981 T XV/0981TXVB Numeric, Right Hand DP A 0982/0982TXV/0982TXVB High Performance Numeric, Left Hand DP B 0983/0983T XV/0983TXVB Green Over Range +1 c 0984/0984T XV/0984TXVB Hexadecimal D 4-281 a Q i< Za a raPackage Dimensions FRONT VIEW A FRONT VIEW B FRONT VIEWO 10.2 MAX 10.2 MAX 10.2 MAX FUNCTION ~ (9400) (0400) 7 be (0.400) jp... F HEXA- NUMERIC ? 15 4 DECIMAL 0.06) ) } 4 we) Input 2 Input 2 14.5 14 744 Input 4 Input 4 (o.sa) (0.29) (0.29) - aa 56 56 135 input 8 Anput 8 (0.22) (0.224 t 1053) ' Decimal Blanking ' : paint control 5 oo 5 _ Latch Latch ' | i ! enable enable Ground Ground 3.0 (0.12) em ec Voc Input 1 input END VIEW Notes: 1. Dimensions in millimetres and (inches} 2. Unless otherwise specified, the tolerance on all dimensions is -.38 mm {.015") COLOR 15 3. Digit center line is .25 mat 01" CODE Ne SEATING (06) from package center line SEATING PLANE 3.4 4. Solder dipped leads LUMINOUS 16.2 PLANE , (135) 5, Color code for HDSP-088X/-098% series. INTENSITY (.600) \ ey CATEGORY ! f DATE CODE i 93+008TYP oe i ] 1. I 1 i | (0.032 0.003) yatye. . o||4 98 + 0.08 TYP. PINT KFY = (.0501 | (0.020 - 0.003) - Le = 2.50.13 TYP. f -| (0 100 + 0 008) 43 (17) tsetuP =} tHowo DATA INPUT H TABLE (LOW LEVEL DATA) \ scp oatall! ~ HEXA 1.8V Xp XX, | x, | NUMERIC DECIMAL ' ! Coad DATA INPUT ' ' ro (HIGH LEVEL DATA) Gad \ \ 4 ' | ENABLE \ | t M Hi ! INPUT : : + t i I L ! t + t 4 L te t HH i : ; ' le w L HW 4 1 I i i L He HH not | Figure 1. Timing Diagram : { a 1 t 4 i i | { HY t l 1 Vee 7 a t 4 1 i i i i ENABLE 5 H l Hu wot iBLANK} ' 1 : ' i ' H M4 t r BLANK} | j LOGIC 8r] x! Hi : H L ao | 1m x2 , . : | INPUT 2 e] x ; LATCH MATRIX H i 4 4 t IBLANK} | - 1X8 memory DECODER 1 ' 7 ft Ht HY He vi ' IBLANK} | pp'?! 4d pp : ON Yop L DECIMAL PTI? | | OFF Vpp 1 LOAD DATA Vpork ' t ENABLE LATCH DATA vpocH DISPLAY ON Vy oh oP BLANKING!3! 8 DISPLAY OFF Vy oH BLANKING!?! LED Notes CONTROL 4 e] MATRIX | Leo 1H Loge High; L - Logic Low. With the enable input at logic high DRIVER MATRIX changes in BCO input logic levels have rio effect upan display memory, displayed character, or DP. 2. The decimat point mput, OP, pertains only to the numeric displays 3. The blanking control input, 8, pertains only to the hexadecimal thsplays. Blanking mput has no eflect upon display memory GROUND a Figure 2. Logic Block Diagram 4-282Absolute Maximum Ratings Description Symbol Min. Max. Unit Storage temperature, ambient HDSP-078X/-079X/-088X + -65 +125 a ne S C HDSP-098X -55 +100 Operating temperature, ambient!'! | Ta -55 +100 C Supply voltage?! | Voc -0.5 +7.0 pe | Voltage applied to input logic, dp and enable pins Vii Vor, VE -0.5 Voc ee. oe ed a Voltage applied to blanking input!?! Vr 0.5 Voc Maximum solder temperature at 1.59 mm (0.062 inch) : 260 Cc below seating plane: t . 5 seconds Recommended Operating Conditions Description Symbol Min. Nom. Max. Unit Supply Voltage _ _ Ve | 4.5 5.0 5.5 Vv Operating temperature, ambient ! Ty -55 +100 C Enable Pulse Width ts 100 nsec Time data must be held before positive transition of enable line trove 50 nsec Time data must be held after positive transition of enable line thorn 50 nsec Enable pulse rise time tan of 1.0 msec Optical Characteristics at Ta = 25C, Vcc = 5.0V Device Description Symbol Min. Typ. Max. Unit Lamina ntensty erED | 05 | v0 wed HDSP-078X Series Peak Wavelength APEAK 635 nm Dominant Wavelengthi5! Ad 626 nm tamaugimengiyperteO | oo | 620 sed HDSP-079X Series Peak Wavelength APEAK 635 am Dominant Wavelength.5. Ad 626 am Cymingas Imiengyy per LED |, is | aso wes HDSP-088X Series Peak Wavelength APEAK 583 nm Dominant Wavelength!5: Ad 585 nm Luminous Intensity per LED ly 298 1100 ucd 3.4 HDSP-098x (Digit Average)!3.4) Series Peak Wavelength APEAK 568 nm Dominant Wavelength Ag 574 nm Notes 1 The nominal thermal resistance of a display mounted in a socket that is soldered onto a printed circuit board is Rdua - 50C/W/device The device package thermal resistance is Ray pin > 15C/Widevice. The thermal resistance device pin-to-ambient through the PC board should not exceed 35 C/W/device for operation at Ta = + 100C. 2. Voitage values are with respect to device ground. pin 6 3. These displays are categorized for luminous intensity with the intensity category designated by a letter code located on the back of the display package. Case temperature of the device immediately prior to the light measurement is equal to 25C 4-283 ieee) ae eed za! rar Eom}Electrical Characteristics; (1, - -ssc to +100) Description Symbol Test Conditions Min. | Typ.7] | Max. Unit Supply HDSP-078X Series loc Voc =5.5V 78 105 Current HDSP-079X/-088X/ Characters 5. or B 120 175 mA -098X Series displayed Power HDSP-078X Series PT Vcc 75.5 V 390 573 Dissipation HDSP-079X/-088X/ Characters 5. or B" 690 963 mw -098X Series displayed Logic, Enable and Blanking Vit 0.8 Vv Low-Level Input Voltage w-Lev put oltag Veo - 4.5 V Logic, Enable High-Level ViH 2.0 Vv Input Voltage Blanking High Voltage; VBH 23 Vv Display Blanked Logic and Enable hit Vec =55V -1.6 mA Low-Level Input Current Blanking Low-Level Input Current iBL Vii = O4V -10 pA Logic, Enable and Blanking WH Voc =55V +40 pA High-Level Input Current ViH=2.4V Weight 1.0 gm Leak Rate 5 x 108| cc/sec. Notes 4, The luminous intensity at a specific operating ambient temperature, ty(Ta) may be approximated from the following expotential equation. ly(Ta > by(25C) elkiTa 26Ci) Device K HDSP-078X Series HOSP-079X Series HDSP-088X Seres HDSP-098X Series 0.0131C 0012" C oaaC Operational Considerations ELECTRICAL These devices use a modified 4 x 7 dot matrix of light emitting diodes to display decimal/hexadecimal numeric information. The high efficiency red and yellow displays use GaAsP/GaP LEDs and the high performance green displays use GaP/GaP LEDs. The LEDs are driven by constant current drivers, BCD information is accepted by the display memory when the enabie line is at logic low and the data is latched when the enable is at logic high. Using the enable pulse width and data setup and hold times listed in the Recommended Operating Conditions allows data to be clocked into an array of displays at 6.7 MHz rate. The decimal point input is active low true and this data ts latched into the display memory in the same fashion as the BCD data. The decimal point LED js driven by the on- board IC. The blanking control input on the hexadecimal displays blanks turns off: the displayed information without disturbing the contents of display memory. The display 1s blanked at a minimum threshold level of 2.0 volts. When blanked, the display standby power is nominally 250 mW at Ta = 25C The ESD susceptibility of the IC devices is Class A of MiL- STD-883 or Class 2 of DOD-STO-1686 and DOD-HDBK- 263. 5. The dominant wavelength, Ag, is derived from the CIE Chromaticity Diagram and is that single wavelength which de- fines the color of the device. 6 The HDSP-088X and HDSP-098X series devices are categor- ized as to dominant wavelength with the category disignated by a number on the back side of the display package 7. Alltypical values at Vcc = 5.0 V and Tag = 25C MECHANICAL These displays are hermetically sealed for use in environ- ments that require a high reliability device. These displays are designed and tested to meet a helium leak rate of 5 x 108 cc/sec. These displays may be mounted by soldering directly to a printed circuit board or insertion into a socket. The lead-to- lead pin spacing is 2.54 mm (0.100 inch) and the lead row spacing is 15.24 mm (0.600 inch). These displays may be end stacked with 2.54 mm (0.100 inch) spacing between outside pins of adjacent displays. Sockets such as Augat 324-AG2D (3 digits) or Augat 508-AG8D (one digit, right angle mounting) may be used. The primary thermal path for power dissipation is through the device leads. Therefore, to insure reliable operation up to an ambient temperature of +100 C, it is important to maintain a base-to-ambient thermal resistance of less than 35C watt/device as measured on top of display pin 3. Post solder cleaning may be accomplished using water, Freon/alcohol mixtures formulated for vapor cleaning processing up to 2 minutes in vapors at boiling: or Freon/alcohot mixtures formulated for room temperature cleaning. Suggested solvents: Freon TF, Freon TE, Gene- solv DI-15, Genesolv DE-15. 4-284PRECONDITIONING These displays are 100% preconditioned by 24 hour stor- age at 125C, at 100C for the HDSP-098X Series. CONTRAST ENHANCEMENT These display devices are designed to provide an optimum ON/OFF contrast when placed behind an appropriate contrast enhancement filter. The following filters are suggested: HDSP-078X/-079X Paneigraphic Ruby Red 60 HER Chequers Red 112 HDSP-098X Panelgraphic Green 48 HP Green Chequers Green 107 Display Ambient Lighting Color Dim Moderate Bright HDSP-088X Paneigraphic Yellaw 27 Polaroid HNCP 37 Polaroid Gray HNCP10 Yellow Chequers Amber 107 3M Light Control Film HOYA Yellowish-Orange HLF-608-3Y Marks Gray MCP-0301-8-10 Panelgraphic Gray 10 Chequers Grey 105 Polaroid Gray HNCP10 HOYA Reddish-Orange HLF-608-5R Marks Gray MCP-0301-8-10 Marks Reddish-Orange MCP-0201-2-22 Polaroid Gray HNCP10 HOYA Yellow-Green HLF-608-1G Marks Yellow-Green MCP-0101-5-12 Over Range Display The over range devices display +1" and decimal! point. The character height and package configuration are the same as the numeric and hexadecimal devices. Character selection is obtained via external switching transistors and current limiting resistors. Absolute Maximum Ratings Description Symbol Min. | Max. | Unit Storage Temperature, Ts -65 +125 c Ambient Operating Temperature Ta -55 +100 C Ambient Forward Current, Each LED \F 0 | mA Reverse Voltage. Each LED Va 5 v Character Pin 1 2.3 4 8 i 1 x x 1 Q x x 1 1 x 1 x x Decimal Point xX xX 1 x Blank 0 0 0 0 Notes 0: Line switching transistor in Figure 7 cutott 1 Line switching transistor in Figure 7 saturated xX: don't care Package Dimensions FRONT VIEW C 10.2 MAX, 7 (o.4gg)\ A Pin Function 7 6 5 fi 1 1 Plus toy ais 2 Numeral One 74 48 : Sf 3 Numeral One fo2910.199 24" 2 A136 4 DP 4 a a! i 4.8 (53) 1 i 8 | [o19) 5 Open 5m Y 19 . 6 Open (0.075) or 33 P - | (0.13) } 7 Vec 723 4 8 Minus/Plus Note 1. Dimensions in millimetres and inches: I] Vec SOV NUMERAL ONE MINUS PLUS PLUS - | | | | | | 3 Ay Figura 3. Typical Driving Circuit 4-285 v = HT Pa x vv) ba DISPLAYSLuminous Intensity Per LED Digit Average: at Ta = 25C Recommended Operating Conditions vec = 5ov Device Test Conditions | Min. | Typ. | Units ; Forward Resistor Value Ip 28mA 65 140 acd Device Current Per HDSP-0783 | aa 620 | ued 5 LED. mA Ri | Rez | Rs HDSP-0883 [Ip 8 mA 215 |} 490 | ywcd HOSP-0783 aon ower 1300 | 200 | 300 | ' HDSP-0983 | tp - 8mA 298 | 1100 | ucd Brightness 8 360 | 47 | 68 HDSP-0883 8 360 | 36 | 56 . HDSP-0983 8 360 | 30 | 43 Electrical Characteristics +, = -s5c to .100) Device Description Symbol Test Condition Min. Typ. Max. | Units HDSP-0783 Power Dissipation je 28mA 72 (all LEDs iNluminated) Pr lr BMA ~ 234 2g2 | mW Forward Voltage v Ik 28mA | 1.6 y F per LED lp = 8mA 175 | 22 | HDSP-0883 Power Dissipation all LEDs Illuminated) Pr 237 | 262 | mw pt tp mA Forward Voltage per LED Ve 1.90 22 Vv HDSP-0983 Power Dissipation Pr Ip=8mA 243 282 mw (all LEDs illuminated) Forward Voltage per LED Ve 1.85 22 V High Reliability Testing PART MARKING SYSTEM Two standard reliability testing programs are available. The With Table | With Tables |, TXVB program is in conformance with Quality Level A Test Standard Product and il Ul, Ma and {Va Tables of MIL-D-87157 for hermetically sealed displays HOSP-078X HDSP-078XTXV HDSP-078XTXVB with 100% screening tests. A TXVB product is tested to Tables HDSP-079X HDSP-079XTXV HDSP-079XTXVB 1, Il, IHa, and iVa, A second program is an HP modification HDSP-088X HDSP-O88XTXV HDSP-OBBXTXVB to the full conformance program and offers the 100% HDSP-098x HDSP-098XTXV HDSP-098XxTXVB screening portion of Level A, Table I, and Group A, Table Il. 100% Screening TABLE |}. QUALITY LEVEL A OF MIL-D-87157 MIL-STD-750 Test Screen Method Conditions 1. Precap Visual 2072 | Interpreted by HP Procedure $956-7572-52 2. High Temperature Storage 1032 Ta = 125C, Time = 24 hoursl4] |__ j - oo : : an . 3. Temperature Cycling r 1051 Condition B, 10 Cycles, 15 Min. Dwell 4. Constant Acceleration 2006 10,000 G at Y orientation . Fine Leak 1071 Candition H 6. Gross Leak 1071 Condition C or KIS) 7. Interim Electrical/Optical Tests.2 | - Iv, lec, IBt, tH, fe. HEH, iL, and tH ] i Ta - 25C 8. Burn-in 1.4 1015 Condition Bat Vcc 5V and cycle through logic at 1 character per second | Ta 100C, t 160 hours 9 Finat Electrical Test ; _ Same as Step 7 10. Delta Determinations | Aly -20%. Mlcc = * 10 MA, Min + 10nA and AleH 13 yA 11. External Visual ! 2009 Notes: 1 MIL-STD-883 Test Method applies 2 Limits and conditions are per the electricaloptical characteristics 3. Burn-in for the over range display shall use Condition B al a nominal ip 8 MA per LED. with all LEDs dluminated for T 160 hours minimum 4. Ty = +100C for HDSP-098X Series 5. Fluid temperature = +100C for HDSP-098X Series. 4-286TABLE ll GROUP A ELECTRICAL TESTS MIL-D-87157 Test Parameters LTPD Subgroup 1 DC Electrical Tests at 25C |: lv, lec, tae, IBH, let, feH, fil, and lin and 5 visual function, Ta 25C Od Subgroup 2 DC Electrical Tests at High Same as Subgroup 1, except delete lv and visual 7 Temperaturei! function. Ta ~ +100C Subgroup 3 - ; DC Electrical Tests at Low Same as Subgroup 1, except delete ly and visual 7 Temperature!!! function. Ta ~ -55C L. Subgroup 4, 5, and 6 not applicable b> - ee je Subgroup 7 Optical and Functional Tests at 25C Satisfied by Subgroup 1 5 Subgroup 8 External Visual MIL-STD-883, Method 2009 7 Notes: t. Limits and conditions are per the electrical/optical characteristics. TABLE Ia eS GROUP B, CLASS A AND B OF MIL-D-87157 Z5 rei MIL-STD-750 Test Method Conditions Sample Size Subgroup 1 Resistance to Solvents 1022 4 Devices/ oo 0 Failures Internal Visual and Design 207517] 1 Device/ | ___Verification) | 0 Failures Subgroup 212.3] ! Solderability 2026 {Ts - 245C for 5 seconds LTPD = 15 Subgroup 3 Thermal Shock : Temp. Cycle: 1051 Condition B1, 15 min. Dwell LTPD = 15 a yEEEOEeSeSS Moisture Resistancel4] 1021 | FinelLeak 1071 Condition H - GrossLeak 1074 Condition C or K/! Electrical/Optical Endpoints!5! _ lv, ec, Tet, 16H, FEL, IEH, fiL, lin and PO visual function. Ta 25C Subgroup 4 Operating Life Test (340 hrs.)I6] 1027 Ta = +100C at Voc = 5.0V and LTPD = 10 ! cycling through logic at 1 character | per second. _ ee | Electrical/Optical Endpoints|5) = ___| Same as Subgroup 3. Subgroup 5 Non-operating | Storage: Life 1032 Ta = +125C!7.8) LTPD 10 Test :340 hrs) _. ee Electrical/Optical Endpoints[5] _ Same as Subgroup 3 Notes: Visual inspection performed through the disptay window. 2. Whenever electrical/optical tests are not required as endpoints, electrical rejects may be used The LTPO applies to the number of leads inspected except in no case shall less than 3 displays be used to provide the number of leads required Initial conditioning is a 15 inward bend, one cycle. . Limits and conditions are per the electrical/optical characteristics Burn-in for the over range display shall use Condition B at a nominal Ip + 8 mA with '+ illuminated for t > 160 hours Equivalent to MIL-STD-883, Method 2014 Ty = +100C for HDSP-098X Series. . Fluid temperature = +100C for HDSP-098X Series. a ODNDHD 4-287TABLE IVa GROUP C, CLASS A AND B OF MIL-D-87157 MIL-STD-750 Sampie Test Method Conditions Size Subgroup 1 Physical Dimensions 2066 2 Devices/ _ ee ee oe _ _ a 0 Failures Subgroup 2l2.7.3] LTPD = 15 Lead Integrity 2004 Condition B2 Fine Leak 1071 | Condition H _ Gross Leak 1071 Condition C or KI0] Subgroup 3 7 Shock 2016 1500G, Time = 0.5 ms, 5 blows in LTPD = 15 each orientation X1, 1, Z1 | rf i Vibration, Variable Frequency 2056 - Constant Acceleration = ss || 2006S |: 10,000G at Yi orientation | External Visuai'4: ; ; 1010 or 1011 Electrical/Optical Endpoints : > I Iv. loc. te, IBH, TEL. IEH, tL. lin and vis- Po ee | ual Function, Ta = 25C | Subgroup 4[1.3) SaltAtmosphere 1041 _ yd. ee | ~LTPD-15 External Visuali4 1010 or 1011 Subgroup 5 Bond Strengthi5i 2037 Condition A LTPD = 20 iC =01 Po a _ 4 Subgroup 6 ' A~ 10 Operating Life Test 6 1026 Ta = +100C Electrical/Optical Endpoints.8! _ Same as Subgroup 3 Notes: \. Whenever electricaloptical tests are not required as endpoints, electrical rejects may be used 2. The LTPD applies to the number of leads inspected except in no case shall less than three displays be used to provide the number of ieads required Solderability samples shali not be used Visual requirements shall be as specified in MIL-STD-883, Methods 1010 or 1011. . Displays may be selected prior to seal. Ifa given inspection lot undergoing Group B inspection has been selected to satisfy Group C inspection requirements, the 340 hour life tests may be continued on test to 1000 hours (n order to satisfy ihe Group C Life Test requirements. In such cases, either the 340 hour endpoint measurements shall be made a basis for Group B lot acceptance or the 1000 hour endpoint measurement shall be used as the basis for both Group B and Group C acceptance. MiL-STD-883 test method applies. Limits and conditions are per the electrical/optical characteristics. Initial conditioning 1s a 15 inward bend, 3 cycles . Fluid temperature ~ +100C for HDSP-098X Series. DO pw oon oO 4-288