MC14060BCPG - ON Semiconductor - Datasheet.Directory

June, 2011 − Rev. 8

1Publication Order Number:

MC14060B/D

MC14060B

14-Bit Binary Counter and

Oscillator

The MC14060B is a 14−stage binary ripple counter with an on−chip

oscillator buffer. The oscillator configuration allows design of either

RC or crystal oscillator circuits. Also included on the chip is a reset

function which places all outputs into the zero state and disables the

oscillator. A negative transition on Clock will advance the counter to

the next state. Schmitt trigger action on the input line permits very

slow input rise and fall times. Applications include time delay circuits,

counter controls, and frequency dividing circuits.

This device contains protection circuitry to guard against damage due

to high static voltages or electric fields. However, precautions must be

taken to avoid applications of any voltage higher than maximum rated

voltages to this high−impedance circuit. For proper operation, Vin and

Vout should be constrained to the range VSS v (Vin or Vout) v VDD.

Unused inputs must always be tied to an appropriate logic voltage

level (e.g., either VSS or VDD). Unused outputs must be left open.

Features

•Fully Static Operation

•Diode Protection on All Inputs

•Supply Voltage Range = 3.0 V to 18 V

•Capable of Driving Two Low−power TTL Loads or One

Low−power Schottky TTL Load Over the Rated Temperature

Range

•Buffered Outputs Available from Stages 4 Through 10 and

12 Through 14

•Common Reset Line

•Pin−for−Pin Replacement for CD4060B

•These Devices are Pb−Free and are RoHS Compliant

MAXIMUM RATINGS (Voltages Referenced to VSS)

Symbol Parameter Value Unit

VDD DC Supply Voltage Range −0.5 to +18.0 V

Vin,

Vout

Input or Output Voltage Range

(DC or Transient)

−0.5 to VDD

+0.5

V

Iin,

Iout

Input or Output Current

(DC or Transient) per Pin

±10 mA

PDPower Dissipation, per Package

(Note 1)

500 mW

TAAmbient Temperature Range −55 to +125 °C

Tstg Storage Temperature Range −65 to +150 °C

TLLead Temperature (8 Second Soldering) 260 °C

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

1. Temperature Derating: Plastic “P and D/DW” Packages: –7.0 mW/°C from

65°C To 125°C.

http://onsemi.com

See detailed ordering and shipping information in the package

dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

MARKING

DIAGRAMS

PDIP−16

P SUFFIX

CASE 648

MC14060BCP

AWLYYWWG

SOIC−16

D SUFFIX

CASE 751B

TSSOP−16

DT SUFFIX

CASE 948F

14060BG

AWLYWW

SOEIAJ−16

F SUFFIX

CASE 966

MC14060B

ALYWG

16

1

16

1

16

14

060B

ALYW G

G

1

16

A = Assembly Location

WL, L = Wafer Lot

YY, Y = Year

WW, W = Work Week

G or G= Pb−Free Package

(Note: Microdot may be in either location)

MC14060B

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2

Figure 1. Pin Assignment

13

14

15

16

9

10

11

125

4

3

2

1

8

7

6

RESET

Q9

Q8

Q10

VDD

OUT 2

OUT 1

CLOCK

Q6

Q13

Q12

VSS

Q4

Q7

Q5

Q14

Table 1. Truth Table

Clock Reset Output State

H

L

H

No Change

Advance to Next State

All Outputs are Low

X = Don’t Care

Figure 2. Logic Diagram

OUT 2

OUT 1

CLOCK

RESET

12

11

10

9Q4 Q5 Q12 Q13 Q14

57123

CQ

R

CQ

R

CQ

R

CQ

R

CQ

R

CQ

R

CQ

Q6 = PIN 4

Q7 = PIN 6

Q8 = PIN 14

Q9 = PIN 13

Q10 = PIN 15 VDD = PIN 16

VSS = PIN 8

ORDERING INFORMATION

Device Package Shipping†

MC14060BCPG PDIP−16

(Pb−Free)

500 Units / Rail

MC14060BDG SOIC−16

(Pb−Free)

48 Units / Rail

MC14060BDR2G SOIC−16

(Pb−Free)

2500 / Tape & Reel

MC14060BDTR2G TSSOP−16* 2500 / Tape & Reel

MC14060BFELG SOEIAJ−16

(Pb−Free)

2000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*This package is inherently Pb−Free.

MC14060B

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3

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)

ÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎ

Characteristic

ÎÎÎ

VDD

Vdc

ÎÎÎÎÎÎ

− 55°C

ÎÎÎÎÎÎÎÎ

25°C

ÎÎÎÎÎÎ

125°C

ÎÎ

Unit

ÎÎÎÎ

Min

ÎÎÎ

Max

ÎÎÎ

Min

ÎÎÎÎ

Typ

(Note 2)

ÎÎÎ

Max

ÎÎÎ

Min

ÎÎÎÎ

Max

ÎÎÎÎ

VOL

ÎÎÎÎÎÎÎÎÎÎ

Output Voltage “0” Level

Vin = VDD or 0

ÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎ

0.05

ÎÎÎ

−

ÎÎÎÎ

0

ÎÎÎ

0.05

ÎÎÎ

−

ÎÎÎÎ

0.05

ÎÎ

V

ÎÎÎÎ

VOH

ÎÎÎÎÎÎÎÎÎÎ

Vin = 0 or VDD “1” Level

ÎÎÎ

5.0

10

15

ÎÎÎÎ

4.95

9.95

14.95

ÎÎÎ

−

ÎÎÎ

4.95

9.95

14.95

ÎÎÎÎ

5.0

10

15

ÎÎÎ

−

ÎÎÎ

4.95

9.95

14.95

ÎÎÎÎ

−

ÎÎ

V

ÎÎÎÎ

VIL

ÎÎÎÎÎÎÎÎÎÎ

Input Voltage “0” Level

(VO = 4.5 or 0.5 V)

(VO = 9.0 or 1.0 V)

(VO = 13.5 or 1.5 V)

(VO = 0.5 or 4.5 V) “1” Level

(VO = 1.0 or 9.0 V)

(VO = 1.5 or 13.5 V)

ÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎ

1.5

3.0

4.0

ÎÎÎ

−

ÎÎÎÎ

2.25

4.50

6.75

ÎÎÎ

1.5

3.0

4.0

ÎÎÎ

−

ÎÎÎÎ

1.5

3.0

4.0

ÎÎ

V

ÎÎÎÎ

VIH

ÎÎÎ

5.0

10

15

ÎÎÎÎ

3.5

7.0

11.0

ÎÎÎ

−

ÎÎÎ

3.5

7.0

11.0

ÎÎÎÎ

2.75

5.50

8.25

ÎÎÎ

−

ÎÎÎ

3.5

7.0

11.0

ÎÎÎÎ

−

ÎÎ

V

ÎÎÎÎ

VIL

ÎÎÎÎÎÎÎÎÎÎ

Input Voltage “0” Level

(VO = 4.5 Vdc) (For Input 11

(VO = 9.0 Vdc) and Output 10)

(VO = 13.5 Vdc)

(VO = 0.5 Vdc) “1” Level

(VO = 1.0 Vdc)

(VO = 1.5 Vdc)

ÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎ

1.0

2.0

2.5

ÎÎÎ

−

ÎÎÎÎ

2.25

4.50

6.75

ÎÎÎ

1.0

2.0

2.5

ÎÎÎ

−

ÎÎÎÎ

1.0

2.0

2.5

ÎÎ

Vdc

ÎÎÎÎ

VIH

ÎÎÎ

5.0

10

15

ÎÎÎÎ

4.0

8.0

12.5

ÎÎÎ

−

ÎÎÎ

4.0

8.0

12.5

ÎÎÎÎ

2.75

5.50

8.25

ÎÎÎ

−

ÎÎÎ

4.0

8.0

12.5

ÎÎÎÎ

−

ÎÎ

Vdc

ÎÎÎÎ

IOH

ÎÎÎÎÎÎÎÎÎÎ

Output Drive Current

(VOH = 2.5 V) (Except Source

(VOH = 4.6 V) Pins 9 and 10)

(VOH = 9.5 V)

(VOH = 13.5 V)

(VOL = 0.4 V) Sink

(VOL = 0.5 V)

(VOL = 1.5 V)

ÎÎÎ

5.0

10

15

ÎÎÎÎ

–3.0

–0.64

–1.6

– 4.2

ÎÎÎ

−

ÎÎÎ

–2.4

–0.51

–1.3

–3.4

ÎÎÎÎ

–4.2

–0.88

–2.25

–8.8

ÎÎÎ

−

ÎÎÎ

– 1.7

– 0.36

– 0.9

– 2.4

ÎÎÎÎ

−

ÎÎ

mA

ÎÎÎÎ

IOL

ÎÎÎ

5.0

10

15

ÎÎÎÎ

0.64

1.6

4.2

ÎÎÎ

−

ÎÎÎ

0.51

1.3

3.4

ÎÎÎÎ

0.88

2.25

8.8

ÎÎÎ

−

ÎÎÎ

0.36

0.9

2.4

ÎÎÎÎ

−

ÎÎ

mA

ÎÎÎÎ

Iin

ÎÎÎÎÎÎÎÎÎÎ

Input Current

ÎÎÎ

15

ÎÎÎÎ

−

ÎÎÎ

± 0.1

ÎÎÎ

−

ÎÎÎÎ

±0.00001

ÎÎÎ

± 0.1

ÎÎÎ

−

ÎÎÎÎ

± 1.0

ÎÎ

mA

ÎÎÎÎ

Cin

ÎÎÎÎÎÎÎÎÎÎ

Input Capacitance (Vin = 0)

ÎÎÎ

−

ÎÎÎÎ

−

ÎÎÎ

−

ÎÎÎ

−

ÎÎÎÎ

5.0

ÎÎÎ

7.5

ÎÎÎ

−

ÎÎÎÎ

−

ÎÎ

pF

ÎÎÎÎ

IDD

ÎÎÎÎÎÎÎÎÎÎ

Quiescent Current

(Per Package)

ÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎ

5.0

10

20

ÎÎÎ

−

ÎÎÎÎ

0.005

0.010

0.015

ÎÎÎ

5.0

10

20

ÎÎÎ

−

ÎÎÎÎ

150

300

600

ÎÎ

mA

ÎÎÎÎ

IT

ÎÎÎÎÎÎÎÎÎÎ

Total Supply Current (Notes 3, 4)

(Dynamic plus Quiescent,

Per Package)

(CL = 50 pF on all outputs,

all buffers switching)

ÎÎÎ

5.0

10

15

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

IT = (0.25 mA/kHz) f + IDD

IT = (0.54 mA/kHz) f + IDD

IT = (0.85 mA/kHz) f + IDD

ÎÎ

mA

2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

3. The formulas given are for the typical characteristics only at 25°C.

4. To calculate total supply current at loads other than 50 pF: IT(CL) = IT(50 pF) + (CL − 50) Vfk

where: IT is in mA (per package), CL in pF, V = (VDD − VSS) in volts, f in kHz is input frequency, and k = 0.002.

MC14060B

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4

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

SWITCHING CHARACTERISTICS (CL = 50 pF, TA = 25°C)

ÎÎÎÎÎ

Symbol

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Characteristic

ÎÎÎÎ

VDD

Vdc

ÎÎÎÎ

Min

ÎÎÎÎ

Typ

(Note 5)

ÎÎÎÎ

Max

ÎÎÎ

Unit

ÎÎÎÎÎ

tTLH

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Rise Time (Counter Outputs)

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

40

25

20

ÎÎÎÎ

200

100

80

ÎÎÎ

ns

ÎÎÎÎÎ

tTHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Output Fall Time (Counter Outputs)

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

50

30

20

ÎÎÎÎ

200

100

80

ÎÎÎ

ns

ÎÎÎÎÎ

tPLH

tPHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Propagation Delay Time

Clock to Q4

Clock to Q14

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

415

175

125

ÎÎÎÎ

740

300

200

ÎÎÎ

ns

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

1.5

0.7

0.4

ÎÎÎÎ

2.7

1.3

1.0

ÎÎÎ

ms

ÎÎÎÎÎ

twH

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Clock Pulse Width

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

100

40

30

ÎÎÎÎ

65

30

20

ÎÎÎÎ

−

ÎÎÎ

ns

ÎÎÎÎÎ

ff

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Clock Pulse Frequency

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

5

14

17

ÎÎÎÎ

3.5

8

12

ÎÎÎ

MHz

ÎÎÎÎÎ

tTLH

tTHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Clock Rise and Fall Time

ÎÎÎÎ

5.0

10

15

ÎÎÎÎÎÎÎÎÎÎ

No Limit

ÎÎÎ

ns

ÎÎÎÎÎ

tw

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Reset Pulse Width

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

120

60

40

ÎÎÎÎ

40

15

10

ÎÎÎÎ

−

ÎÎÎ

ns

ÎÎÎÎÎ

tPHL

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Propagation Delay Time

Reset to On

ÎÎÎÎ

5.0

10

15

ÎÎÎÎ

−

ÎÎÎÎ

170

80

60

ÎÎÎÎ

350

160

100

ÎÎÎ

ns

5. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

Figure 1. Power Dissipation Test Circuit

and Waveform

Figure 2. Switching Time Test Circuit

and Waveforms

PULSE

GENERATOR

ID

VDD

500 mF 0.01 mF

CLOCK

NC

Q4

Q5

Qn

R

OUT1

OUT2

VSS CL

CL

20 ns 20 ns

CLOCK

90%

50%

10%

50% DUTY CYCLE

VDD

VSS

PULSE

GENERATOR

VDD

CLOCK

NC

Q4

Q5

Qn

R

OUT1

OUT2

VSS CL

CL

20 ns20 ns

CLOCK

Q

tTLH tTHL

tPLH tPHL

tWH

90%

50%

10%

90%

50%

10%

MC14060B

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5

Figure 3. Oscillator Circuit Using RC Configuration

11

RESET

RSCtc

Rtc

10OUT 1 9OUT 2

f[1

2.3 RtcCtc

if 1 kHz ≤ f ≤ 100 kHz

and 2Rtc < RS < 10Rtc

(f in Hz, R in ohms, C in farads)

The formula may vary for other frequencies. Recommended

maximum value for the resistors in 1 MW.

TYPICAL RC OSCILLATOR CHARACTERISTICS

Figure 4. RC Oscillator Stability Figure 5. RC Oscillator Frequency as a

Function of RTC and C

- 8.0

-12

-16

- 4.0

0

4.0

8.0

1251007550250-25-55

TA, AMBIENT TEMPERATURE (°C)

FREQUENCY DEVIATION (%)

VDD = 15 V

1.0 V

5.0 V

RTC = 56 kW

C = 1000 pF

RS=0, f=10.15kHz @ VDD=10, TA=25°C

RS=120 kW, f=7.8kHz @ VDD=10V, TA=25°C

f, OSCILLATOR FREQUENCY (kHz)

100

50

20

10

5

2

1

0.5

0.2

0.1

1.0 k 10 k 100 k 1.0 M

RTC, RESISTANCE (OHMS)

0.0001 0.001 0.01 0.1

C, CAPACITANCE (mF)

VDD = 10 V

f AS A FUNCTION

OF RTC

(C = 1000 pF)

(RS ≈2RTC)

f AS A FUNCTION

OF C

(RTC = 56 kW)

(RS = 120 k)

Figure 6. Typical Crystal Oscillator Circuit

CLOCK

11

RESET 9OUT 210OUT 1

18M

RO

CSCT

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Table 2. Typical Data for Crystal Oscillator Circuit

ÎÎÎÎÎÎÎÎÎÎ

Characteristic

ÎÎÎÎ

500 kHz

Circuit

ÎÎÎ

32 kHz

Circuit

ÎÎ

Unit

ÎÎÎÎÎÎÎÎÎÎ

Crystal Characteristics

Resonant Frequency

Equivalent Resistance, RS

ÎÎÎÎ

500

1.0

ÎÎÎ

32

6.2

ÎÎ

kHz

kW

ÎÎÎÎÎÎÎÎÎÎ

External Resistor/Capacitor Values

RO

CT

CS

ÎÎÎÎ

47

82

20

ÎÎÎ

750

82

20

ÎÎ

kW

pF

ÎÎÎÎÎÎÎÎÎÎ

Frequency Stability

Frequency Changes as a

Function of VDD (TA = 25°C)

VDD Change from 5.0 V to 10 V

VDD Change from 10 V to 15 V

Frequency Change as a Function of

Temperature (VDD = 10 V)

TA Change from − 55°C to

+25°C Complete Oscillator (Note 6)

TA Change from + 25°C to

+ 125°C Complete Oscillator

(Note 6)

ÎÎÎÎ

+6.0

+2.0

+100

–160

ÎÎÎ

+2.0

+120

–560

ÎÎ

ppm

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

6. Complete oscillator includes crystal, capacitors, and resistors.

MC14060B

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6

PACKAGE DIMENSIONS

PDIP−16

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648−08

ISSUE T

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS

WHEN FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE

MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

−A−

B

FC

S

H

GD

J

L

M

16 PL

SEATING

18

916

K

PLANE

−T−

M

A

M

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A0.740 0.770 18.80 19.55

B0.250 0.270 6.35 6.85

C0.145 0.175 3.69 4.44

D0.015 0.021 0.39 0.53

F0.040 0.70 1.02 1.77

G0.100 BSC 2.54 BSC

H0.050 BSC 1.27 BSC

J0.008 0.015 0.21 0.38

K0.110 0.130 2.80 3.30

L0.295 0.305 7.50 7.74

M0 10 0 10

S0.020 0.040 0.51 1.01

____

MC14060B

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7

PACKAGE DIMENSIONS

SOIC−16

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751B−05

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL CONDITION.

18

16 9

SEATING

PLANE

F

J

M

RX 45_

G

8 PLP

−B−

−A−

M

0.25 (0.010) B S

−T−

D

K

C

16 PL

S

B

M

0.25 (0.010) A S

T

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A9.80 10.00 0.386 0.393

B3.80 4.00 0.150 0.157

C1.35 1.75 0.054 0.068

D0.35 0.49 0.014 0.019

F0.40 1.25 0.016 0.049

G1.27 BSC 0.050 BSC

J0.19 0.25 0.008 0.009

K0.10 0.25 0.004 0.009

M0 7 0 7

P5.80 6.20 0.229 0.244

R0.25 0.50 0.010 0.019

____

6.40

16X

0.58

16X 1.12

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

16

89

8X

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

MC14060B

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8

PACKAGE DIMENSIONS

TSSOP−16

DT SUFFIX

PLASTIC TSSOP PACKAGE

CASE 948F−01

ISSUE B

7.06

16X

0.36 16X

1.26

0.65

DIMENSIONS: MILLIMETERS

1

PITCH

ÇÇÇ

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.18 0.28 0.007 0.011

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH. PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

SECTION N−N

SEATING

PLANE

IDENT.

PIN 1

18

16 9

DETAIL E

J

J1

B

C

D

A

K

K1

H

G

ÉÉÉ

DETAIL E

F

M

L

2X L/2

−U−

S

U0.15 (0.006) T

S

U0.15 (0.006) T

S

U

M

0.10 (0.004) V S

T

0.10 (0.004)

−T−

−V−

−W−

0.25 (0.010)

16X REFK

N

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

MC14060B

http://onsemi.com

9

PACKAGE DIMENSIONS

SOEIAJ−16

F SUFFIX

PLASTIC EIAJ SOIC PACKAGE

CASE 966−01

ISSUE A

HE

A1

DIM MIN MAX MIN MAX

INCHES

--- 2.05 --- 0.081

MILLIMETERS

0.05 0.20 0.002 0.008

0.35 0.50 0.014 0.020

0.10 0.20 0.007 0.011

9.90 10.50 0.390 0.413

5.10 5.45 0.201 0.215

1.27 BSC 0.050 BSC

7.40 8.20 0.291 0.323

0.50 0.85 0.020 0.033

1.10 1.50 0.043 0.059

0

0.70 0.90 0.028 0.035

--- 0.78 --- 0.031

A1

HE

Q1

LE

_10 _0

_10 _

LE

Q1

_

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE

MOLD FLASH OR PROTRUSIONS AND ARE

MEASURED AT THE PARTING LINE. MOLD FLASH

OR PROTRUSIONS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

M

L

DETAIL P

VIEW P

c

A

b

e

M

0.13 (0.005) 0.10 (0.004)

1

16 9

8

D

Z

E

A

b

c

D

E

e

L

M

Z

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