SN54HC04...JORWPACKAGE
SN74HC04...D,DB,N,NS,ORPWPACKAGE
(TOP VIEW)
1A
VCC
114
1Y 6A
213
2A 6Y
312
2Y 5A
411
3A 5Y
510
3Y 4A
6 9
GND 4Y
78
SN54HC04...FKPACKAGE
(TOP VIEW)
NC Nointernalconnection–
4
5
6
7
18
17
16
15
6Y
NC
5A
NC
5Y
14
2A
NC
2Y
NC
3A 8
120
219
NC
VCC
1A
6A
1Y
3
13
912
4A
3Y
4Y
GND
NC
10 11
SN54HC04, SN74HC04
www.ti.com
SCLS078E –DECEMBER 1982–REVISED OCTOBER 2010
HEX INVERTERS
Check for Samples: SN54HC04, SN74HC04
1FEATURES
• Wide Operating Voltage Range of 2 V to 6 V
• Outputs Can Drive Up To 10 LSTTL Loads
• Low Power Consumption, 20-mA Max ICC
• Typical tpd = 8 ns
• ±4-mA Output Drive at 5 V
• Low Input Current of 1 mA Max
DESCRIPTION/ORDERING INFORMATION
The ’HC04 devices contain six independent inverters. They perform the Boolean function Y = A in positive logic.
ORDERING INFORMATION
TAPACKAGE(1) ODERABLE PART NUMBER TOP-SIDE MARKING
PDIP – N Reel of 1000 SN74HC04N SN74HC04N
Reel of 1000 SN74HC04DE4
SOIC – D Reel of 2500 SN74HC04DRG3 HC04
Tube of 250 SN74HC04DT
SN74HC04NSR
SOP – NS Reel of 2000 HC04
–40°C to 85°C SN74HC04NSRG4
SN74HC04DBR
SSOP – DB Reel of 2000 HC04
SN74HC04DBRE4
Tube of 90 SN74HC04PW
TSSOP – PW Reel of 2000 SN74HC04PWR HC04
Tube of 250 SN74HC04PWT
CDIP – J Reel of 1000 SNJ54HC04J
–55°C to 125°C CFP – W Reel of 900 SNJ54HC04W
LCCC –FK Reel of 2200 SNJ54HC04FK
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1982–2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
AY
SN54HC04, SN74HC04
SCLS078E –DECEMBER 1982–REVISED OCTOBER 2010
www.ti.com
Table 1. FUNCTION TABLE
(EACH INVERTER)
INPUT OUTPUT
A Y
H L
L H
LOGIC DIAGRAM (POSITIVE LOGIC)
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage range –0.5 7 V
IIK Input clamp current(2) VI< 0 or VI> VCC ±20 mA
IOK Output clamp current(2) VO< 0 ±20 mA
IOContinuous output current VO= 0 to VCC ±25 mA
Continuous current through VCCor GND ±50 mA
D package 86
N package 80
qJA Package thermal impedance(3) °C/W
NS package 76
PW package 113
Tstg Storage temperature range –60 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
SN54HC04 SN74HC04 UNIT
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V
VCC = 6 V 4.2 4.2
VCC = 2 V 0.5 0.5
VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VCC = 6 V 1.8 1.8
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
Δt/Δv Input transition rise or fall rate VCC = 4.5 V 500 500 ns
VCC = 6 V 400 400
TAOperating free-air temperature –55 125 –40 85 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2Submit Documentation Feedback Copyright © 1982–2010, Texas Instruments Incorporated
Product Folder Link(s): SN54HC04, SN74HC04
SN54HC04, SN74HC04
www.ti.com
SCLS078E –DECEMBER 1982–REVISED OCTOBER 2010
Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
TA= 25°C SN54HC04 SN74HC04
PARAMETER TEST CONDITIONS VCC UNIT
MIN TYP MAX MIN MAX MIN MAX
2 V 1.9 1.998 1.9 1.9
IOH = –20 mA 4.5 V 4.4 4.499 4.4 4.4
VI= VIH or
VOH 6 V 5.9 5.999 5.9 5.9 V
VIL IOH = –4 mA 4.5 V 3.98 4.3 3.7 3.84
IOH = –5.2 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
IOL = 20 mA 4.5 V 0.001 0.1 0.1 0.1
VI= VIH or
VOL 6 V 0.001 0.1 0.1 0.1 V
VIL IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33
IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33
IIVI= VCC or 0 6 V ±0.1 ±100 ±1000 ±1000 nA
ICC VI= VCC or 0, IO= 0 6 V 2 40 20 mA
Ci2 V to 6 V 3 10 10 10 pF
Switching Characteristics
over operating free-air temperature range, CL= 50 pF (unless otherwise noted) (see Figure 1)
TA= 25°C SN54HC04 SN74HC04
FROM TO
PARAMETER VCC UNIT
(INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX
2 V 45 95 125 120
tpd A Y 4.5 V 9 19 29 24 ns
6 V 8 16 25 20
2 V 38 75 110 95
ttY 4.5 V 8 15 22 19 ns
6 V 6 13 19 16
Operating Characteristics
TA= 25°C PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per inverter No load 20 pF
Copyright © 1982–2010, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): SN54HC04, SN74HC04
NOTES: A. C includesprobeandtest-fixturecapacitance.
B. Phaserelationshipsbetweenwaveformswerechosenarbitrarily. Allinputpulsesaresuppliedbygeneratorshavingthefollowing
characteristics:PRR 1MHz,Z =50 ,t =6ns,t =6ns.
C. Theoutputsaremeasuredoneatatimewithoneinputtransitionpermeasurement.
D.t andt arethesameast .
L
O r f
PLH PHL pd
Ω≤
FromOutput
UnderTest
C =50pF
(seeNote A)
L
LOADCIRCUIT
Test
Point
VOLTAGEWAVEFORMS
INPUTRISE ANDFALL TIMES
Input 90%
90%
50% 50%
10% 10%
tf
tr
0V
VCC
VOLTAGEWAVEFORMS
PROPAGATIONDELAY ANDOUTPUTTRANSITIONTIMES
tPLH
tPLH
tPHL
tPHL
Input
In-Phase
Output
Out-of-Phase
Output
90%
90%
90%
50%
10% 10%
10%
50%
50%
50%
50%
tf
tf
tr
90%
10%
50%
tr
VCC
VOL
VOH
VOH
0V
VOL
SN54HC04, SN74HC04
SCLS078E –DECEMBER 1982–REVISED OCTOBER 2010
www.ti.com
PARAMETER MEASURMENT INFORMATION
Figure 1. Load Circuit and Voltage Waveforms
4Submit Documentation Feedback Copyright © 1982–2010, Texas Instruments Incorporated
Product Folder Link(s): SN54HC04, SN74HC04
PACKAGE OPTION ADDENDUM
www.ti.com 29-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-8409801VCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
5962-8409801VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
84098012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
8409801CA ACTIVE CDIP J 14 1 TBD Call TI Call TI
8409801DA ACTIVE CFP W 14 1 TBD Call TI Call TI
JM38510/65701B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/65701BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/65701BDA NRND CFP W 14 1 TBD A42 N / A for Pkg Type
M38510/65701B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
M38510/65701BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
M38510/65701BDA NRND CFP W 14 1 TBD A42 N / A for Pkg Type
SN54HC04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN74HC04D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04DBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04DRG3 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM
SN74HC04DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 29-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74HC04DT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04DTE4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04DTG4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC04N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74HC04NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74HC04NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04PW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74HC04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWT ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54HC04FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54HC04W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 29-Aug-2012
Addendum-Page 3
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC04, SN54HC04-SP, SN74HC04 :
•Catalog: SN74HC04, SN54HC04
•Automotive: SN74HC04-Q1, SN74HC04-Q1
•Military: SN54HC04
•Space: SN54HC04-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
PACKAGE OPTION ADDENDUM
www.ti.com 29-Aug-2012
Addendum-Page 4
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HC04DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HC04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC04DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC04DRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC04DT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HC04NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74HC04PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74HC04PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC04DBR SSOP DB 14 2000 367.0 367.0 38.0
SN74HC04DR SOIC D 14 2500 367.0 367.0 38.0
SN74HC04DR SOIC D 14 2500 333.2 345.9 28.6
SN74HC04DRG4 SOIC D 14 2500 367.0 367.0 38.0
SN74HC04DRG4 SOIC D 14 2500 333.2 345.9 28.6
SN74HC04DT SOIC D 14 250 367.0 367.0 38.0
SN74HC04NSR SO NS 14 2000 367.0 367.0 38.0
SN74HC04PWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74HC04PWT TSSOP PW 14 250 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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