© 2005 Microchip Technology Inc. DS80212C-page 1
PIC16F818/819
The PIC16F818/819 Rev. B0 parts you have received
conform functionally to the Device Data Sheet
(DS39598E), except for the anomalies described
below.
All of the issues listed here will be addressed in future
revisions of the PIC16F818/819 silicon.
The following silicon errata apply only to
PIC16F818/819 devices with these Device/Revision
IDs:
Part Number Device ID Revision ID
PIC16F818 00 0100 110 00101
PIC16F819 00 0100 111 00101
Note: Non-TSL and TSL devices have the same
Device and Revision IDs.
PIC16F818/819 Rev. B0 Silicon Errata Sheet
PIC16F818/819
DS80212C-page 2 © 2005 Microchip Technology Inc.
1. Module: Internal RC Oscillator IOFS bit
The device data sheet states when an INTOSC
frequency is selected (125, 250, 500 kHz, 1, 2, 4,
8 MHz), the frequency will be stable when the
IOFS bit becomes set (IOFS = 1) at 4 ms. The
following applies for applications relying on time
dependent code.
Under the following conditions, any of the INTOSC
frequencies may not be stable when IOFS
becomes set (IOFS = 1). Devices may vary from
one to the next and may take as long as 60 ms to
become stable.
1. Wake from Sleep, internal RC oscillator is
selected via the Configuration Word and the
IRCF bits are configured for an INTOSC
frequency.
2. POR is executed, internal RC oscillator is
selected via the Configuration Word and the
IRCF bits are configured for an INTOSC
frequency.
3. The INTRC (31.25 kHz) is clocking the device
and a switch to an INTOSC frequency is
executed via modification of the IRCF bits.
Work around
Implement the following software delay shown in
Example 1 after an INTOSC frequency has been
enabled and before any frequency dependent appli-
cation code is executed. This routine will delay
application execution approximately 2K-150K T
CY
(instruction cycles are dependent upon the INTOSC
frequency) to ensure a stable INTOSC frequency.
Date Codes that pertain to this issue:
All date codes.
EXAMPLE 1: DELAY ROUTINE
Note: This issue applies to TSL and non-TSL
devices.
DlyVarH equ <define address based on application requirements>
DlyVarL equ <define address based on application requirements>
;Load the delay variable DlyVarH with the following value for the selected frequency:
;125kHz 0x0300
;250kHz 0x0600
;500kHz 0x0C00
;1MHz 0x1900
;2MHz 0x3100
;4MHz 0x6200
delay ;insure the correct data memory bank is selected
; for access of data variables
CLRF DlyVarL ;initialize low delay variable
MOVLW 0x62 ;initialize high delay variable
MOVWF DlyVarH
dly_loop
DECFSZ DlyVarL,f ;decrement low variable
GOTO dly_loop
DECFSZ DlyVarH,f ;decrement high variable
GOTO dly_loop
RETURN ;delay done
© 2005 Microchip Technology Inc. DS80212C-page 3
PIC16F818/819
2. Module: Internal RC Oscillator
When any one of the seven INTOSC frequencies
is enabled by the following conditions, it is possible
for the oscillator to overshoot the selected
frequency.:
1. A clock switch from INTRC (31 kHz) to an
INTOSC (125 kHz-8 MHz) frequency via the
IRCF bits (OSCCON register).
2. Exit from Sleep mode with the IRCF bits
already configured for an INTOSC frequency.
If the selected frequency is 8 MHz, then the
Voltage versus Frequency specification of the
device may be violated.
Work around
When it is required for the application to run at
8 MHz, it is recommended that the application
does not start executing code at 8 MHz until the
60ms firmware delay (see issue 1) has completed.
During the 60 ms settling period, the application
can execute code up to 4 MHz. Upon completion
of the 60 ms firmware delay, the 8 MHz can be
selected via the IRCF bits.
Date Codes that pertain to this issue:
All date codes.
3. Module: PORTB Pull-ups
When RBPU = 0 (OPTION register), the PORTB
weak pull-ups will not be disabled by the input
functions of the SSP and/or CCP (Capture mode)
module as indicated by the RB1:RB5 I/O block
diagrams in Section 5.0 “I/O Ports”.
Work around
1. If the SSP and/or CCP (Capture mode) module
is enabled, do not enable the PORTB weak
pull-ups and use external pull-up resistors.
OR
2. If the SSP and/or CCP (Capture mode) module
and PORTB pull-ups are enabled, then evalu-
ate the functionality of the SSP (I2C™/SPI™)
or CCP (Capture mode) module to ensure
proper operation within your application.
Date Codes that pertain to this issue:
All date codes.
4. Module: PORTB
A delay of 1 TOSC will occur if an instruction that
modifies the contents of PORTB simultaneously
occurs when any of the following modules (if
enabled) executes an operation that effects the
signals on their respective PORTB I/O pins.
CCP Module:
PWM Mode (CCP1CON<3:0> = 11xx)
When CCP1CON<5:4> bits = 10, the PWM output
signal will be delayed by 1 T
OSC when an
instruction to modify the contents of PORTB is
executed.
SSP Module:
SPI Slave Modes (SSPCON<3:0> = 0100 and 0101)
Clock signal is derived from an external source.
Transmission of data (SDO pin) will be delayed by
1T
OSC when an instruction to modify the contents
of PORTB is executed. Reception of data is not
affected.
Work around
None
Date Codes that pertain to this issue:
All date codes.
5. Module: PORTB Interrupts
When the PORTB interrupt-on-change feature and
a PORTB peripheral are enabled simultaneously,
the PORTB peripheral input signal’s rising and
falling edges will trigger an interrupt-on-change
event. This is due to the interrupt-on-change
feature not being disabled on the respective pin for
that peripheral when it is enabled.
The affected pins and peripheral signals on
PORTB are RB4: SCK and SCL, RB5: SS and
RB6: T1CKI. The functionality of T1OSI (RB7) and
T1OSO (RB6) is not affected by this issue.
Work around
None.
PIC16F818/819
DS80212C-page 4 © 2005 Microchip Technology Inc.
Clarifications/Corrections to the Data
Sheet
In the Device Data Sheet (DS39598E), the following
clarifications and corrections should be noted.
None.
© 2005 Microchip Technology Inc. DS80212C-page 5
PIC16F818/819
REVISION HISTORY
Rev A Document (09/2004)
First revision of this document, silicon issues 1 (Internal
RC Accuracy), 2 (Internal RC Oscillator IOFS bit) and
3 (PORTB Pull-ups) and Data Sheet Clarification issue
1 (Timer1 Oscillator and In-Circuit Serial Programming).
Rev B Document (10/2004)
Removed silicon issue 1 (Internal RC Oscillator Accu-
racy), amended silicon issue 2 – now issue 1 (Internal
RC Oscillator IOFS bit), added new issue 2 (Internal
RC Oscillator), added silicon issue 4 (PORTB).
Removed Data Sheet Clarification issue 1 (Timer1
Oscillator and In-Circuit Serial Programming).
Rev C Document (6/2005)
Added silicon issue 5 (PORTB Interrupts).
PIC16F818/819
DS80212C-page 6 © 2005 Microchip Technology Inc.
NOTES:
© 2005 Microchip Technology Inc. DS80212C-page 7
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© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro
®
8-bit MCUs, KEELOQ
®
code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS80212C-page 8 © 2005 Microchip Technology Inc.
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