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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DRS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
DMeets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
DOperates With 3-V to 5.5-V VCC Supply
DOperates Up To 250 kbit/s
DTwo Drivers and Two Receivers
DLow Standby Current...1 µA Typical
DExternal Capacitors ...4 × 0.1 µF
DAccepts 5-V Logic Input With 3.3-V Supply
DAlternative High-Speed Pin-Compatible
Device (1 Mbit/s)
− SNx5C3223
DApplications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
The MAX3223 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector. The charge pump and four small external capacitors allow operation from a single
3-V to 5.5-V supply. The device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs
driver output slew rate.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
SOIC (DW)
Tube of 25 MAX3223CDW
MAX3223C
SOIC (DW) Reel of 2000 MAX3223CDWR MAX3223C
−0°C to 70°C
SSOP (DB)
Tube of 70 MAX3223CDB
MA3223C
−0°C to 70°CSSOP (DB) Reel of 2000 MAX3223CDBR MA3223C
TSSOP (PW)
Tube of 70 MAX3223CPW
MA3223C
TSSOP (PW) Reel of 2000 MAX3223CPWR MA3223C
SOIC (DW)
Tube of 25 MAX3223IDW
MAX3223I
SOIC (DW) Reel of 2000 MAX3223IDWR MAX3223I
−40°C to 85°C
SSOP (DB)
Tube of 70 MAX3223IDB
MB3223I
−40°C to 85°CSSOP (DB) Reel of 2000 MAX3223IDBR MB3223I
TSSOP (PW)
Tube of 70 MAX3223IPW
MB3223I
TSSOP (PW)
Reel of 2000 MAX3223IPWR
MB3223I
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DB, DW, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
EN
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
ROUT2
FORCEOFF
VCC
GND
DOUT1
RIN1
ROUT1
FORCEON
DIN1
DIN2
INVALID
!"#$ % &'!!($ #% )'*+&#$ ,#$(
!,'&$% &!" $ %)(&&#$% )(! $-( $(!"% (.#% %$!'"($%
%$#,#!, /#!!#$0 !,'&$ )!&(%%1 ,(% $ (&(%%#!+0 &+',(
$(%$1 #++ )#!#"($(!%
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SLLS409K − JANUARY 2000 − REVISED MARCH 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description/ordering information (continued)
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF
is set low and EN is high, both drivers and receivers are shut off, and the supply current is reduced to 1 µA.
Disconnecting the serial port or turning off the peripheral drivers causes auto-powerdown to occur.
Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown enabled,
the device is activated automatically when a valid signal is applied to any receiver input. The INVALID output
is used to notify the user if an RS-232 signal is present at any receiver input. INVALID is high (valid data) if any
receiver input voltage is greater than 2.7 V or less than −2.7 V, or has been between −0.3 V and 0.3 V for less
than 3 0 µs. I N VALID is low (invalid data) if the receiver input voltage is between −0.3 V and 0.3 V for more than
30 µs. Refer to Figure 4 for receiver input levels.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DIN FORCEON FORCEOFF VALID RIN
RS-232 LEVEL
OUTPUT
DOUT DRIVER STATUS
X X L X Z Powered off
L H H X H
Normal operation with
HHH XL
Normal operation with
auto-powerdown disabled
L L H Yes H
Normal operation with
HLHYesL
Normal operation with
auto-powerdown enabled
L L H No Z
Powered off by
H L H No Z
Powered off by
auto-powerdown feature
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
INPUTS
OUTPUT
RIN EN VALID RIN
RS-232 LEVEL
OUTPUT
ROUT
L L X H
HLX L
XHX Z
Open L No H
H = high level, L = low level, X = irrelevant,
Z = high impedance (off), Open = input
disconnected or connected driver off
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logic diagram (positive logic)
DIN2 DOUT2
Auto-powerdown
RIN1
INVALID
ROUT1
DIN1 DOUT1
RIN2ROUT2
EN
FORCEON
FORCEOFF
13
12
20
14
1
15
10
17
8
11
16
9
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) −0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Positive output supply voltage range, V+ (see Note 1) −0.3 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Negative output supply voltage range, V− (see Note 1) 0.3 V to −7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage difference, V+ − V− (see Note 1) 13 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI: Driver, FORCEOFF, FORCEON, EN −0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver −25 V to 25 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO:Driver −13.2 V to 13.2 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Receiver, INVALID −0.3 V to VCC + 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Notes 2 and 3): DB package 70°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . .
DW package 58°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 83°C/W. . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature, TJ 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
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recommended operating conditions (see Note 4 and Figure 6)
MIN NOM MAX UNIT
Supply voltage
VCC = 3.3 V 3 3.3 3.6
V
Supply voltage VCC = 5 V 4.5 5 5.5 V
VIH
Driver and control high-level input voltage
DIN, EN, FORCEOFF,
VCC = 3.3 V 2
V
VIH Driver and control high-level input voltage
DIN, EN, FORCEOFF,
FORCEON VCC = 5 V 2.4 V
VIL Driver and control low-level input voltage DIN, EN, FORCEOFF, FORCEON 0.8 V
VI
Driver and control input voltage DIN, EN, FORCEOFF, FORCEON 0 5.5
V
VIReceiver input voltage −25 25 V
TA
Operating free-air temperature
MAX3223C 0 70
°C
T
A
Operating free-air temperature
MAX3223I −40 85 °
C
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
IIInput leakage
current EN, FORCEOFF,
FORCEON ±0.01 ±1µA
Auto-powerdown
disabled
VCC = 3.3 V or 5 V,
No load,
FORCEOFF and
FORCEON at VCC 0.3 1 mA
I
CC
Supply current Powered off VCC = 3.3 V or 5 V,
TA = 25
°
C
No load, FORCEOFF at GND 1 10
ICC
Supply current
Auto-powerdown
enabled
TA = 25°C
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded 1 10 µA
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
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DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VOH High-level output voltage DOUT at RL = 3 kΩ to GND 5 5.4 V
VOL Low-level output voltage DOUT at RL = 3 kΩ to GND −5 −5.4 V
IIH High-level input current VI = VCC ±0.01 ±1µA
IIL Low-level input current VI at GND ±0.01 ±1µA
IOS
Short-circuit output current‡
VCC = 3.6 V, VO = 0 V ±35 ±60
mA
IOS Short-circuit output current
‡
VCC = 5.5 V, VO = 0 V ±35 ±60 mA
roOutput resistance VCC, V+, and V− = 0 V, VO = ±2 V 300 10M Ω
Ioff
Output leakage current
FORCEOFF = GND
VO = ±12 V, VCC = 3 V to 3.6 V ±25
µA
I
off
Output leakage current
FORCEOFF = GND
VO = ±10 V, VCC = 4.5 V to 5.5 V ±25 µ
A
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
Maximum data rate CL = 1000 pF,
One DOUT switching, RL = 3 kΩ,
See Figure 1 250 kbit/s
tsk(p) Pulse skew§CL = 150 pF to 2500 pF,
See Figure 2 RL = 3 kΩ to 7 kΩ,100 ns
SR(tr)
Slew rate, transition region
VCC = 3.3 V
,CL = 150 pF to 1000 pF 6 30
V/µs
SR(tr)
Slew rate, transition region
(See Figure 1)
VCC = 3.3 V
,
RL = 3 kΩ to 7 kΩCL = 150 pF to 2500 pF 4 30
V/
µ
s
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
§Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
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6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
VOH High-level output voltage IOH = −1 mA VCC−0.6 VCC−0.1 V
VOL Low-level output voltage IOL = 1.6 mA 0.4 V
VIT+
Positive-going input threshold voltage
VCC = 3.3 V 1.6 2.4
V
VIT+ Positive-going input threshold voltage VCC = 5 V 1.9 2.4 V
VIT−
Negative-going input threshold voltage
VCC = 3.3 V 0.6 1.1
V
VIT− Negative-going input threshold voltage VCC = 5 V 0.8 1.4 V
Vhys Input hysteresis (VIT+ − VIT−) 0.5 V
Ioff Output leakage current EN = VCC ±0.05 ±10 µA
riInput resistance VI = ±3 V to ±25 V 3 5 7 kΩ
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
PARAMETER TEST CONDITIONS MIN TYP†MAX UNIT
tPLH Propagation delay time, low- to high-level output CL= 150 pF, See Figure 3 150 ns
tPHL Propagation delay time, high- to low-level output CL= 150 pF, See Figure 3 150 ns
ten Output enable time CL= 150 pF,
See Figure 4 RL = 3 kΩ,200 ns
tdis Output disable time CL= 150 pF,
See Figure 4 RL = 3 kΩ,200 ns
tsk(p) Pulse skew‡See Figure 3 50 ns
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
‡Pulse skew is defined as |tPLH − tPHL| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ±0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ±0.5 V.
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
AUTO-POWERDOWN SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER TEST CONDITIONS MIN MAX UNIT
VT+(valid) Receiver input threshold for
INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC 2.7 V
VT−(valid) Receiver input threshold for
INVALID high-level output voltage FORCEON = GND, FORCEOFF = VCC −2.7 V
VT(invalid) Receiver input threshold for
INVALID low-level output voltage FORCEON = GND, FORCEOFF = VCC −0.3 0.3 V
VOH INVALID high-level output voltage IOH = −1 mA,
FORCEOFF = VCC FORCEON = GND, VCC−0.6 V
VOL INVALID low-level output voltage IOL = 1.6 mA,
FORCEOFF = VCC FORCEON = GND, 0.4 V
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER TYP†UNIT
tvalid Propagation delay time, low- to high-level output 1µs
tinvalid Propagation delay time, high- to low-level output 30 µs
ten Supply enable time 100 µs
†All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
PARAMETER MEASUREMENT INFORMATION
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
−3 V
−3 V
3 V
3 V
0 V
3 V
1.5 V1.5 V
Output
Input
VOL
VOH
tTLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tTHL
CL
(see Note A)
SR(tr) +6V
tTHL or tTLH
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 1. Driver Slew Rate
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PARAMETER MEASUREMENT INFORMATION
50 Ω
TEST CIRCUIT VOLTAGE WAVEFORMS
0 V
3 V
Output
Input
VOL
VOH
tPLH
Generator
(see Note B) RL
3 V
FORCEOFF
RS-232
Output
tPHL
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z
O
= 50 Ω, 50% duty cycle, t
r
≤10 ns, t
f
≤ 10 ns.
50% 50%
1.5 V 1.5 V
Figure 2. Driver Pulse Skew
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
50%
50%
−3 V
3 V
1.5 V1.5 V
Output
Input
VOL
VOH
tPHL
Generator
(see Note B) tPLH
Output
EN
0 V
CL
(see Note A)
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
0 V
FORCEOFF
Figure 3. Receiver Propagation Delay Times
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
Generator
(see Note B)
3 V or 0 V
Output
VOL
VOH
tPHZ
(S1 at GND)
tPLZ
(S1 at VCC)
tPZL
(S1 at VCC)
1.5 V1.5 V
3 V
0 V
50%
0.3 V
Output
Input
50%
0.3 V
EN
FORCEON
3 V or 0 V RL
S1
VCC GND
CL
(see Note A)
Output
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: Z
O
= 50 Ω, 50% duty cycle, t
r
≤ 10 ns, t
f
≤ 10 ns.
tPHZ
(S1 at GND)
Figure 4. Receiver Enable and Disable Times
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
TEST CIRCUIT VOLTAGE WAVEFORMS
50 Ω
3 V
2.7 V
−2.7 V
INVALID
Output
Receiver
Input
tinvalid
Generator
(see Note B)
FORCEOFF
tvalid
ROUT
FORCEON
Auto-
powerdown INVALID
DOUT
0 V
0 V
−3 V
DIN
CL = 30 pF
(see Note A)
VCC
0 V
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ
2.7 V
−2.7 V
0.3 V
−0.3 V
0 V
Valid RS-232 Level, INVALID High
Indeterminate
Indeterminate
If Signal Remains Within This Region
for More Than 30 µs, INVALID Is Low†
Valid RS-232 Level, INVALID High
≈V+
0 V
≈V−
V+
VCC
ten
V−
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, Z
O
= 50 Ω, 50% duty cycle, t
r
≤ 10 ns, t
f
≤ 10 ns.
50% VCC 50% VCC
2.7 V
−2.7 V
0.3 V
0.3 V
Supply
Voltages
†Auto-powerdown disables drivers and reduces supply
current to 1 µA.
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
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SLLS409K − JANUARY 2000 − REVISED MARCH 2004
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
15
14
8
1
2
3
4
7
DIN1
FORCEOFF
FORCEON
13
DOUT1
20
17
16
19
18
ROUT1
5
6
+
−
C3
VCC
C2+
C1
C2
C1+
GND
V−
C1−
RIN1
C2−
+
−
CBYPASS
V+
+
−
+
−
DOUT2
VCC C1 C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
VCC vs CAPACITOR VALUES
EN
C4+
−
9
10
Auto-
powerdown
12
11
DIN2
INVALID
RIN2
ROUT2
†C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
†
= 0.1µF
5 kΩ
5 kΩ
Figure 6. Typical Operating Circuit and Capacitor Values
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3223CDB ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CDBE4 ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CDBG4 ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CDBR ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CDW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CDWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CDWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CDWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CPW ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CPWR ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223CPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDB ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDBE4 ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDBG4 ACTIVE SSOP DB 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDBR ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDW ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDWE4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX3223IDWG4 ACTIVE SOIC DW 20 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDWR ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IPW ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IPWR ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX3223IPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF MAX3223 :
•Enhanced Product: MAX3223-EP
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
NOTE: Qualified Version Definitions:
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX3223CDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
MAX3223CDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
MAX3223CPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
MAX3223IDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
MAX3223IDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
MAX3223IPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3223CDBR SSOP DB 20 2000 367.0 367.0 38.0
MAX3223CDWR SOIC DW 20 2000 367.0 367.0 45.0
MAX3223CPWR TSSOP PW 20 2000 367.0 367.0 38.0
MAX3223IDBR SSOP DB 20 2000 367.0 367.0 38.0
MAX3223IDWR SOIC DW 20 2000 367.0 367.0 45.0
MAX3223IPWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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