KE C SEMICONDUCTOR KIA7805AF ~ TECHNICAL DATA KIA7824AF BIPOLAR LINEAR INTEGRATED CIRCUIT THREE TERMINAL POSITIVE VOLTAGE REGULATORS oV, 6V, 8V, 9V, 1OV, 12V, 15V, 18V, 20V, 24V. FEATURES * Suitable for C-MOS, TTL, the Other Digital IC's Power Supply. * Internal Thermal Overload Protection. + Internal Short Circuit Current Limiting. * Output Current in Excess of 1A. * Satisfies IEC-65 Specification. (International Electronical Commission). * Package is DPAK. g Es MILLIMETERS 6.60+40.2 6.10+0.2 5.00.2 1.1040.2 2.7040.2 2.3040.1 1.00 MAX 2.3040.2 0.89+0.1 2.0040.20 0.5040.10 0.9140.10 0.9040.1 1.00+0.10 0.95 MAX vole] ef} meds) mals lo] al ol) > 1. INPUT 2. COMMON MAXIMUM RATINGS (Ta=25C) 3. OUTPUT CHARACTERISTIC SYMBOL] RATING | UNIT KIA7805AF ~ ieout Vol KIA78154F y mPa NOMSES TETATSISAF~ N 40 DPAK KTIA7824AF Power Dissipation (Tc=25T) Pp 12 W Power Dissipation | KIA7805AF~ (Without Heatsink) | KIA7824AF Po 1s w Operating Junction Temperature Tj -30~ 150 Cc Storage Temperature Tstg -59~ 150 Cc 2000. 12. 9 Revision No : 1 KEC 1/19KIA7805AF ~ KIA7824AF EQUIVALENT CIRCUIT R17 4 1) INPUT : e N ~ R22 ff N es ait) LQti-t q Qis _ oo {ars +{arz L \ i S = 4 a {* Mat fo Q1 17 oO 3 2f R12 3) OUTPUT Zi-& = fe (2) COMMON (GND) 2000. 12. 9 Revision No : 1 KEC 2/19KIA7805AF ~ KIA7824AF KIA7805AF ELECTRICAL CHARACTERISTICS (Viw=l0V, Iovr=500mA, 0 RR=20 log =!(dB) Vin 8 2 s-- @ 0 [ y! Fy NOISE METE] 2000. 12. 9 Revision No : 1 KEC 13/19KIA7805AF ~ KIA7824AF APPLICATION (1) VOLTAGE BOOST REGULATOR CIRCUIT (a) Voltage boost by use of zener diode Vin , , OVouT fx, KIA78xxAF tc, gL Ls abt 0 we TS oO oO aa 11 > Vout (IC) Dn ~ ORI V. Z 7 +11 25mA 77 77 Vout = Vout (ic) t+ Vz (b) Voltage boost by use of resistor Vin O ? , OVouT te, KIA78xxAF o gL Li ths " ze TS 78 Oo Ip q nN BS UL 717 R2 Vout = Your(ic) (1+ RI )+R2-1g (c) Adjustable output regulator Vin , t t OVoutT KIA78xxAF | gt 3 ii 2 - S S _ KIA4558P/S X > & UL UL R2 Vout = Vour(ic) (1+ ) R1 2000. 12. 9 Revision No : 1 KEC 14/19KIA7805AF ~ KIA7824AF (2) CURRENT BOOST REGULATOR VIN \ KIA78xxAF | O Vout 0.33uF | | 0.1uF + 10uF PRECAUTIONS ON APPLICATION (1) In regard to GND, be careful not to apply a negative voltage to the input/ output terminal. Further, special care is necessary in case of a voltage boost application. (2) When a surge voltage exceeding maximum rating is applied to the input terminal or when a voltage in excess of the input terminal voltage is applied to the output terminal, the circuit may be destroyed. Specially, in the latter case, great care is necessary Further, if the input terminal shorts to GND in a state of normal operation, the output terminal voltage becomes higher than the input voltage (GND potential), and the electric charge of a chemical capacitor connected to the output terminal flows into the input side, which may cause the destruction of circuit. In these cases, take such steps as a zener diode and a general silicon diode are connected to the circuit, as shown in the following figure. Output surge and input short protecting LO diode. i Vin O4 KIA78xxAF Nour SERIES Vz, Input surge _~ protecting Vz > Vin diode. (3) When the input voltage is too high, the power dissipation of three terminal regulator increase because of series regulator, so that the junction temperature rises. In such a case, it is recommended to reduce the power dissipation by inserting the power limiting resistor Rsp in the input terminal, and to reduce the junction temperature as a result. 2000. 12. 9 Revision No : 1 KEC 15/19KIA7805AF ~ KIA7824AF Rsp VIN VINO KIA78xxAF Vout SERIES Ip lout The power dissipation Pp of IC is expressed in the following equation. Pp = (Viw-Vour) + Tour + Vin + Is If Vin is reduced below the lowest voltage necessary for the IC, the parasitic oscillation will be caused according to circumstances. In determining the resistance value of Rsp, design with margin should be made by making reference to the following equation. VIN ~ Vin Rsp < Iovr + Is (4) Connect the input terminal and GND, and the output terminal and GND, by capacitor respectively. The capacitances should be determined experimentally because they depend on printed patterns. In particular, adequate investigation should be made so that there is no problem even at time of high or low temperature. (5) Installation of IC for power supply For obtaining high reliability on the heat sink design of the regulator IC, it is generally required to derate more than 20% of maximum junction temperature (T; MAX.) Further, full consideration should be given to the installation of IC to the heat sink. 2000. 12. 9 Revision No : 1 KEC 16/19KIA7805AF ~ KIA7824AF (6) IEC (International Electronical Commission)-65 Specification. (a) IEC (International Electronical Commission)-65 is the standard, parts testing method, machinery and tolls (used in connecting main power directly and indirectly) Which are used at home and general building. The purpose of the above standard is not to breaking out the risk which is related to an electric shock, a heating, a fire and the damage of surrounding parts in the case of normal or abnormal operating. (b) In case temperature is limited by temperature overheating prevention device, fuse or the operation of fuse resistor One must calculate the temperature of PCB substrate in 2 minute. ATS = 4 es 5 o 2 4 > & : g z S D> 2 > o n KIA7805AF 5 AVo=2% OF OUTPUT A. | THERMAL RESISTANCE co VOLTAGE Zz Te=25C J-C | J-A oO o 5 12 10.4] 96.1] -/ Bo a (KIA7800AF Series) 3S = | A \ > > ~200ma 5 1 _To = IN 9 - & g | WITHOUT HEAT \ 3 4 SINK \ A oo a 0 A 0 50 100 150 = 0 40 80 120 160 200 4 JUNCTION TEMPERATURE Tj (C) a AMBIENT TEMPERATURE Ta (C) Zour f 0.5 [Wry =10V =200mA 0.3 Ho 0.1 0.05 OUTPUT IMPEDANCE Zour () 0.03 100 1k 10k 100k FREQUENCY f (Hz) 2000. 12. 9 Revision No : 1 KEC 19/19