BAV756DW
Document number: DS30148 Rev. 9 - 2 1 of 3
www.diodes.com April 2008
© Diodes Incorporated
BAV756D
QUAD SURFACE MOUNT SWITCHING DIODE ARRAY
Features
• Fast Switching Speed
• Ultra-Small Surface Mount Package
• For General Purpose Switching Applications
• High Conductance
• One BAV70 Circuit and One BAW56 Circuit In One Package
• Easily Connected As Full Wave Bridge
• Lead Free/RoHS Compliant (Note 3)
• "Green" Device (Notes 4 and 5)
Mechanical Data
• Case: SOT-363
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagram
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.006 grams (approximate)
SOT-363
C
1
2
1
A
1
C
2
C
2
TOP VIEW Internal Schematic
TOP VIEW
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage VRM 100 V
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR 75 V
RMS Reverse Voltage VR(RMS) 53 V
Forward Continuous Current (Notes 1 and 2) IFM 300 mA
Average Rectified Output Current (Notes 1 and 2) IO 150 mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0s IFSM 2.0
1.0 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Notes 1 and 2) PD 200 mW
Power Dissipation TS = 60°C (Note 2) PD 300 mW
Thermal Resistance Junction to Ambient Air (Notes 1 and 2) RθJA 625 °C/W
Thermal Resistance Junction to Soldering Point (Note 2) RθJS 275 °C/W
Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 6) V(BR)R 75 ⎯ V IR = 2.5μA
Forward Voltage VF ⎯
0.715
0.855
1.0
1.25
V
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
Reverse Current (Note 6) IR ⎯
2.5
50
30
25
μA
μA
μA
nA
VR = 75V
VR = 75V, TJ = 150°C
VR = 25V, TJ = 150°C
VR = 20V
Total Capacitance CT ⎯ 2.0 pF VR = 0, f = 1.0MHz
Reverse Recovery Time trr ⎯ 4.0 ns IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100Ω
Notes: 1. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
2. One or more diodes loaded.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
6. Short duration pulse test used to minimize self-heating effect.
Please click here to visit our online spice models database.