DATA SHEET GaAs INTEGRATED CIRCUIT 2 NU CG E 21 79 D M PG2408TB 0.05 to 3.0 GHz SPDT SWITCH DESCRIPTION The PG2408TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch for 2.4 GHz wireless LAN, mobile phone and other L, S-band applications. This device operates with dual control switching voltages of 2.5 to 5.3 V. This device can operate at frequencies from 0.05 to 3.0 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package (SC-88/SOT-363 type), and is suitable for high-density surface mounting. T I e FEATURES : Vcont (H) = 3.0 V TYP. : Vcont (L) = 0 V TYP. * Low insertion loss nt : * Switch control voltage : Lins = 0.40 dB TYP. @ f = 1.0 GHz : Lins = 0.50 dB TYP. @ f = 2.5 GHz : ISL = 27 dB TYP. @ f = 1.0 GHz O p N * High isolation : ISL = 18 dB TYP. @ f = 2.5 GHz : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz lac em * Handling power * High-density surface mounting : 6-pin super minimold package (SC-88/SOT-363 type) (2.0 x 1.25 x 0.9 mm) APPLICATIONS * L, S-band digital cellular or cordless telephone * W-LAN, WLL and BluetoothTM etc. SC ORDERING INFORMATION PG2408TB-E4-A Package 6-pin super minimold (SC-88/SOT-363 type) (Pb-Free) Marking G5P Supplying Form * Embossed tape 8 mm wide * Pin 4, 5, 6 face the perforation side of the tape * Qty 3 kpcs/reel -In PG2408TB-E4 Order Number Re Part Number Remark To order evaluation samples, please contact your nearby sales office. ro p D D I Part number for sample order: PG2408TB-A Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an Renesas Electronics sales representative for availability and additional information. Document No. PG10770EJ01V0DS (1st edition) Date Published July 2009 NS PG2408TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM 2 3 6 1 5 2 4 RF1 Vcont1 6 RFC GND 3 Vcont2 RF2 SW TRUTH TABLE ON Path Vcont1 RFC-RF1 Low RFC-RF2 High Pin No. Pin Name 6 1 1 RF1 2 GND 5 5 2 4 4 3 Vcont2 High Low Symbol Switch Control Voltage Ratings Vcont Storage Temperature dBm TA -45 to +85 C Tstg Note Vcont1 - Vcont2 6.0 V V +33.0 lac em Operating Ambient Temperature Note Pin O p N Input Power +6.0 Unit nt : Parameter T I e ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) -55 to +150 C RECOMMENDED OPERATING RANGE (TA = +25C, unless otherwise specified) SC Parameter Symbol MIN. TYP. MAX. Unit f 0.05 - 3.0 GHz Vcont (H) 2.5 3.0 5.3 V Vcont (L) -0.2 0 0.2 V Vcont (H), Vcont (L)Note -0.1 0 0.1 V Switch Control Voltage (H) Switch Control Voltage (L) -In Control Voltage Difference Re Operating Frequency D D I Note Vcont (H) = Vcont1 (H) - Vcont2 (H) ro p Vcont (L) = Vcont1 (L) - Vcont2 (L) 2 Data Sheet PG10770EJ01V0DS 3 2 G5P 1 (Bottom View) NU CG E 21 79 D M (Top View) (Top View) RF2 4 Vcont2 5 RFC 6 Vcont1 PG2408TB Symbol Insertion Loss 1 Lins1 Insertion Loss 2 Lins2 Insertion Loss 3 Lins3 Insertion Loss 4 Lins4 Insertion Loss 5 Lins5 Isolation 1 ISL1 Isolation 2 ISL2 Isolation 3 ISL3 Isolation 4 ISL4 Isolation 5 ISL5 RLin1 Input Return Loss 2 RLin2 RLout1 Output Return Loss 2 RLout2 0.1 dB Loss Compression MAX. Unit - 0.40 0.55 dB f = 0.5 to 1.0 GHz - 0.40 0.55 dB f = 1.0 to 2.0 GHz - 0.48 0.63 dB f = 2.0 to 2.5 GHz - 0.50 0.65 dB - 0.56 0.70 dB 24 27 - dB f = 0.5 to 1.0 GHz 24 27 - dB f = 1.0 to 2.0 GHz 16 19 - dB f = 2.0 to 2.5 GHz 15 18 - dB 14 17 - dB 15 20 - dB 15 20 - dB 15 20 - dB 15 20 - dB +27.0 +29.0 - dBm - +29.0 - dBm - +60 - dBm f = 0.05 to 0.5 GHz Note 1 f = 2.5 to 3.0 GHz f = 0.05 to 0.5 GHz Note 1 f = 2.5 to 3.0 GHz f = 0.05 to 0.5 GHz Note 1 f = 0.5 to 3.0 GHz f = 0.05 to 0.5 GHz Note 1 f = 0.5 to 3.0 GHz f = 2.0/2.5 GHz f = 0.5 to 3.0 GHz O p N Input Power Pin (0.1 dB) Note 2 TYP. nt : Output Return Loss 1 MIN. T I e Input Return Loss 1 Test Conditions Input 3rd Order Intercept Point IIP3 f = 0.5 to 3.0 GHz, 2 tone, 2 Parameter NU CG E 21 79 D M ELECTRICAL CHARACTERISTICS (TA = +25C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Switch Control Current Switch Control Speed lac em 5 MHz spicing Icont No RF input - 0.3 20 A tSW 50% CTL to 90/10% RF - 50 500 ns SC Notes 1. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. ro p D D I -In Re Caution It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF for frequencies above 0.5 GHz, and 1 000pF for frequencies above 0.5 GHz. Data Sheet PG10770EJ01V0DS 3 PG2408TB EVALUATION CIRCUIT 1 Vcont1 RF1 6 2 C1 NU CG E 21 79 D M C2 2 RFC 5 C1 Note 3 Vcont2 RF2 C1 4 C2 Note C1 : 0.05 to 0.5 GHz : 0.5 to 3.0 GHz 1 000 pF 56 pF T I e C2 : 1 000 pF O p N APPLICATION INFORMATION C1 nt : The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. lac em Switch C1 LESD C1 * LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. * The value may be tailored to provide specific electrical responses. SC * The RF ground connections should be kept as short as possible and connected to directly to a good RF ground ro p D D I -In Re for best performance. 4 Data Sheet PG10770EJ01V0DS PG2408TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD 2 NU CG E 21 79 D M Vcont1 Vc1 RF1 OUT 1 C2 C 1 IN C C1 2 C1 G5P RFC C1 C1 C 1 T I e C2 lac em Vc2 OUT 2 O p N nt : C2 RF2 SC 6pin SMM SPDT SW Vcont2 C1 Values f = 0.05 to 0.5 GHz 1 000 pF f = 0.5 to 3.0 GHz 56 pF 1 000 pF ro p D D I C2 Test Conditions -In Symbol Re USING THE NEC EVALUATION BOARD Data Sheet PG10770EJ01V0DS 5 PG2408TB TYPICAL CHARACTERISTICS (TA = +25C, DC blocking capacitors = 56 pF, unless otherwise specified) RFC-RF1/RF2 ISOLATION vs. FREQUENCY nt N :C U G2 E 17 D 9M RFC-RF1/RF2 INSERTION LOSS vs. FREQUENCY 0 Vcont (H) = 3.0 V -0.2 -5 Isolation ISL (dB) Insertion Loss Lins (dB) Vcont (H) = 3.0 V -0.3 -0.4 2 -0.1 -10 -15 -20 -25 -30 -0.5 -35 -0.6 0.0 0.5 1.0 2.5 2.0 1.5 -40 0.0 3.0 -10 0.5 1.0 2.0 1.5 SC Frequency f (GHz) lac em O p N Input Return Loss RLin (dB) -5 2.5 -15 -20 -25 5 4 ro p 3 2 -0.6 Icont 1 -0.7 2.5 3.0 3.5 4.0 4.5 1.5 2.0 2.5 3.0 0 f = 2.5 GHz Lins -0.5 1.0 RFC-RF1/RF2 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) 0 5.0 -5 Isolation ISL (dB) -In -0.4 D D I Insertion Loss Lins (dB) -0.3 0.5 Frequency f (GHz) 6 f = 2.5 GHz Icont: No RF Input Vcont (H) = 3.0 V -10 -30 0.0 3.0 Switch Control Current Icont (A) Re -0.2 -10 -15 -20 -25 -30 -35 -40 2.0 2.5 3.0 3.5 4.0 4.5 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. 6 3.0 -5 RFC-RF1/RF2 INSERTION LOSS, Icont vs. SWITCH CONTROL VOLTAGE (H) -0.8 2.0 2.5 0 Vcont (H) = 3.0 V -30 0.0 2.0 RFC-RF1/RF2 OUTPUT RETURN LOSS vs. FREQUENCY Output Return Loss RLout (dB) 0 -25 1.5 T I e RFC-RF1/RF2 INPUT RETURN LOSS vs. FREQUENCY -20 1.0 Frequency f (GHz) Frequency f (GHz) -15 0.5 Data Sheet PG10770EJ01V0DS 5.0 PG2408TB RFC-RF1/RF2 OUTPUT RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2 INPUT RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 0 -25 -30 -35 -40 -45 2.5 3.5 3.0 4.0 4.5 -15 -20 -25 -30 -35 -40 -45 -50 2.0 5.0 2.5 3.0 3.5 4.0 4.5 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) RFC-RF1/RF2 Pin (0.1 dB) vs. SWITCH CONTROL VOLTAGE (H) RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER 5.0 0 36 T I e f = 2.5 GHz -0.5 34 32 26 24 2.0 2.5 3.0 3.5 4.0 lac em 28 O p N 30 4.5 5.0 f = 2.5 GHz Vcont (H) = 3.0 V Lins 6 5 -1.0 4 -1.5 3 -2.0 2 1 -2.5 Icont -3.0 15 Switch Control Voltage (H) Vcont (H) (V) 20 25 30 0 35 Input Power Pin (dBm) RFC-RF1/RF2 Pin (0.1 dB) vs. FREQUENCY SC 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) -50 2.0 -10 2 -20 -5 Switch Control Current Icont (A) Output Return Loss RLout (dB) -15 Insertion Loss Lins (dB) Input Return Loss RLin (dB) -10 f = 2.5 GHz nt N :C U G2 E 17 D 9M f = 2.5 GHz -5 38 34 32 Vcont (H) = 3.0 V -In 30 Re DC blocking capacitors: f = 0.5 to 3.0 GHz 56 pF f < 0.5 GHz 1 000 pF 36 28 D D I 26 ro p 24 22 20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PG10770EJ01V0DS 7 PG2408TB MOUNTING PAD LAYOUT DIMENSIONS NU CG E 21 79 D M 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 1.9 0.8 2 0.4 0.65 0.65 T I e Remark The mounting pad layout in this document is for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder nt : lac em ro p D D I -In Re SC O p N bridge and so on, in order to optimize the design. 8 Data Sheet PG10770EJ01V0DS PG2408TB PACKAGE DIMENSIONS NU CG E 21 79 D M 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 2 2.10.1 0.2+0.1 -0.05 0.65 0.65 1.3 2.0+0.15 -0.20 1.250.1 0.15+0.1 -0.05 nt : lac em ro p D D I -In Re SC O p N 0 to 0.1 T I e 0.7 0.90.1 0.1 MIN. Data Sheet PG10770EJ01V0DS 9 PG2408TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering NU CG E 21 79 D M methods and conditions other than those recommended below, contact your nearby sales office. Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less 2 Soldering Method IR260 WS260 Preheating temperature (package surface temperature) : 120C or below : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below T I e Partial Heating Maximum number of flow processes nt : lac em ro p D D I -In Re SC O p N Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PG10770EJ01V0DS HS350 PG2408TB GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. NU CG E 21 79 D M Caution * Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 2 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. * Do not burn, destroy, cut, crush, or chemically dissolve the product. ro p D D I -In nt : lac em Re SC O p N T I e * Do not lick the product or in any way allow it to enter the mouth. NOTICE 4. 5. 6. 7. 8. 9. 11. 12. 2 Re SC 10. I en N t: U CG E 21 79 D M 3. em 2. 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