1) Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß
2) Tested with pulses tp = 300 :s, duty cycle # 2% – Gemessen mit Impulsen tp = 300 :s, Schaltverhältnis # 2%
401.11.2003
4
3
2
1
3
±0.1
6.5
±0.2
0.7
3.25 2.3
7
±0.3
1.65
3.5
±0.2
BSP 40 ... BSP 43 Switching Transistors
NPN Surface mount Si-Epitaxial PlanarTransistors
Si-Epitaxial PlanarTransistoren für die Oberflächenmontage NPN
Power dissipation – Verlustleistung 1.3 W
Plastic case SOT-223
Kunststoffgehäuse
Weight approx. – Gewicht ca. 0.04 g
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
Dimensions / Maße in mm
1 = B 2, 4 = C 3 = E
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
Maximum ratings (TA = 25/C) Grenzwerte (TA = 25/C)
BSP 40
BSP 41
BSP 42
BSP 43
Collector-Emitter-voltage B open VCE0 60 V 80 V
Collector-Base-voltage E open VCB0 70 V 90 V
Emitter-Base-voltage C open VEB0 5 V
Power dissipation – Verlustleistung Ptot 1.3 W 1)
Collector current – Kollektorstrom (dc) IC1 A
Peak Collector current – Kollektor-Spitzenstrom ICM 2 A
Peak Base current – Basis-Spitzenstrom IBM 200 mA
Junction temperature – Sperrschichttemperatur Tj150/C
Storage temperature – Lagerungstemperatur TS- 65…+ 150/C
Characteristics (Tj = 25/C) Kennwerte (Tj = 25/C)
Min. Typ. Max.
Collector-Base cutoff current – Kollektorreststrom
IE = 0, VCB = 60 V ICB0 100 nA
IE = 0, VCB = 60 V, Tj = 150/CI
CB0 50 :A
Emitter-Base cutoff current – Emitterreststrom
IC = 0, VEB = 5 V IEB0 100 nA
Collector saturation volt. – Kollektor-Sättigungsspg. 2)
IC = 150 mA, IB = 15 mA VCEsat 250 mV
IC = 500 mA, IB = 50 mA VCEsat 500 mV
1) Tested with pulses tp = 300 :s, duty cycle # 2% – Gemessen mit Impulsen tp = 300 :s, Schaltverhältnis # 2%
2) Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluß
5
01.11.2003
Switching Transistors BSP 40 ... BSP 43
Characteristics (Tj = 25/C) Kennwerte (Tj = 25/C)
Min. Typ. Max.
Base saturation voltage – Basis-Sättigungsspannung 1)
IC = 150 mA, IB = 15 mA VBEsat 1 V
IC = 500 mA, IB = 50 mA VBEsat 1.2 V
DC current gain – Kollektor-Basis-Stromverhältnis 1)
- VCE = 5 V, - IC = 100 :A
BSP 40
BSP 42
hFE 10
- VCE = 5 V, - IC = 100 mA hFE 40 120
- VCE = 5 V, - IC = 500 mA hFE 30
- VCE = 5 V, - IC = 100 :A
BSP 41
BSP 43
hFE 30
- VCE = 5 V, - IC = 100 mA hFE 100 300
- VCE = 5 V, - IC = 500 mA hFE 50
Gain-Bandwidth Product – Transitfrequenz
VCE = 5 V, IC = 10 mA, f = 100 MHz fT100 MHz
Thermal resistance – Wärmewiderstand
junction to ambient air – Sperrschicht zu umgebender Luft RthA 93 K/W 2)
junction to soldering point – Sperrschicht zu Lötpad RthS 12 K/W
Recommended complementary PNP transistors
Empfohlene komplementäre PNP-Transistoren BSP 30, BSP 31, BSP 32, BSP 33