Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
E
1
R
2
J
3
3
4
G
5
E
6
Y
7
J
8
1
9
0
10
2
11
V
12
Thick Film
Chip Resistors
Product Code Size, Power Rating
1GE : 0201
2GE : 0402
3GE : 0603
6GE : 0805
8GE : 1206
14 : 1210
12 : 1812
12Z : 2010
1T : 2512
0.05 W
0.063 W
0.1 W
0.125 W
0.25 W
0.25 W
0.5 W
0.5 W
1W
Power R.
Marking
Code
Y
]
Nil
Marking
Value Marking on
black side
No marking
Resistance Tolerance
Code
J
0
Tolerance
±
5%
Jumper
The first two digits are significant figures of resistance and
the third one denotes number of zeros following. Decimal
Point is expressed by R as 4.7 = 4R7.
Jumper is expressed by R00.
Resistance Value
Type : inches
Thick Film Chip Resistors
Thick Film Chip Resistors
0201, 0402, 0603, 0805, 1206,
1210, 1812, 2010, 2512
Type: ERJ 1G, 2G, 3G, 6G, 8G, 14,
12, 12Z, 1T
nFeatures
lSmall size and lightweight
lHigh reliability
Approved under the QS-9000 system
lReference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A
nExplanation of Part Numbers
Metal glaze thick film resistive element and three layers of electrodes
(Only 14, 12, 12Z, 1T type)
Punched (Paper) Taping
Embossed Taping
Packaging
(Only 3G, 6G, 8G type)
Code
V
U
(Only 2G, 3G, 6G type)
X
BBulk case
Punched (Paper) Taping
2 mm pitch, 10000 pcs.
Punched (Paper) Taping
2 mm pitch, 20000 pcs.
(Only 2G, 3G type)
2 mm pitch, 15000 pcs.
Y
(Only 1G type)
(Only 2G type)
C
Punched (Paper) Taping
Packaging Specifications
] When partly omitted, all the rest P/N factors should be moved up respectively.
lCompatible with placement machines
Taping and bulk case packaging available
lApproved under the ISO 9001 system
lSuitable for both reflow and flow soldering
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
ERJ1G 0.60±0.03 0.30±0.03 0.12±0.05 0.15±0.05 0.25±0.05 0.15 g
(0201)
ERJ2G 1.00±0.05 0.50±0.05 0.20±0.10 0.25±0.05 0.35±0.05 0.8 g
(0402)
ERJ3G 1.60±0.15 0.80+0.15 0.30±0.20 0.30±0.15 0.45±0.10 2g
(0603) Ð0.05
ERJ6G 2.00±0.20 1.25±0.10 0.40±0.20 0.40±0.20 0.60±0.10 4g
(0805)
ERJ8G 3.20+0.05 1.60+0.05 0.50±0.20 0.50±0.20 0.60±0.10 10 g
(1206)
ERJ14 3.20±0.20 2.50±0.20 0.50±0.20 0.50±0.20 0.60±0.10 16 g
(1210)
ERJ12 4.50±0.20 3.20±0.20 0.50±0.20 0.50±0.20 0.60±0.10 27 g
(1812)
ERJ12Z 5.00±0.20 2.50±0.20 0.60±0.20 0.60±0.20 0.60±0.10 27 g
(2010)
ERJ1T 6.40±0.20 3.20±0.20 0.65±0.20 0.60±0.20 0.60±0.10 45 g
(2512)
nConstruction nDimensions in mm (not to scale)
Thick Film Chip Resistors
nRatings
a
b
t
W
L
Ö
Type
(inches)
Power Rating
at 70 ¡C
(W)
Limiting Element
Voltage (Maximum
RCWV)
(1)
(V)
Maximum Overload
Voltage(2)
(V)
Resistance
Tolerance(%)
Standard
Resistance Values
min. max.
Resistance Range
(W)T.C.R.
´10-6/¡C
(ppm/¡C)
Jumper
1G
2G á 3G
6Gá8Gá14á12á12Zá1T
Maximum Overload Current
1A
2A
4A
Rated Current
0.5 A
1 A
2 A
Dimensions (mm)
LWa b t
Weight
(1000 pcs.)
Type
(inches)
Ð0.20 Ð0.15
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12, 12Z
(1812,2010)
ERJ1T
(2512)
<10 W:
Ð100
to
+600
0.05
0.063
0.1
0.125
0.25
0.25
0.5
1
15
50
50
150
200
200
200
200
30
100
100
200
400
400
400
400
±5
±5
±5
±5
±5
±5
±5
±5
10
1
1
1
1
1
1
1
1 M
2.2 M
10 M
10 M
10 M
10 M
10 M
1 M
E24
E24
E24
E24
E24
E24
E24
E24
10 W
to
1MW:
±200
1MW<:
Ð400
to
+150
Protective coating
High purity alumina
substrate Termination (Inner)
Termination
(Between)
Resistive element Termination (Outer)
Power Derating Curve
with the right figure.
Ð40 Ð20 0 20 40 60 80 100 120 140 160
0
180Ð60
155 ¡C
70 ¡C
Ambient Temperature (¡C)
20
40
60
80
100
Rated Load (%)
Ð55 ¡C
3G, 6G, 8G
1G,2G,14,12,12Z,1T
125 ¡C
(1) Rated Continuous Working Voltage (RCWV) should be determined from RCWV= Power Rating ´ Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever is less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) should be determined from SOTV=2.5´Power Rating or max. Overload Voltage listed above
whichever is less.
For resistors operating in ambient temperature above
70 ¡C, power rating should be derated in accordance
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
ERJ1G 0.25 15000 pcs./reel (2 mm pitch)
(0201)
ERJ2G 0.35 10000 pcs./reel (2 mm pitch) 50000 pcs./case
(0402) 20000 pcs./reel (2 mm pitch)
ERJ3G 0.45 10000 pcs./reel (2 mm pitch) 25000 pcs./case
(0603) 5000 pcs./reel (4 mm pitch)]
ERJ6G 0.6 5000 pcs./reel (4 mm pitch)]10000 pcs./case
(0805)
ERJ8G 0.6 5000 pcs./reel (4 mm pitch)]
(1206)
ERJ14 0.6 5000 pcs./reel
(1210)
ERJ12,12Z
0.6 5000 pcs./reel
(1812,2010)
ERJ1T 0.6 4000 pcs./reel
(2512)
180.0
Ð3.0
60 min. 13.0
±1.0
1G,2G,3G
6G,8G,14
12,12Z,1T
13.0
±1.0
15.4
±2.0
Thick Film Chip Resistors
lStandard Quantity
lTaping Reel
Type
fAfBfCW T
9.0
±1.0
11.4
±2.0
0
lBulk Case
f
B
W
T
f
A
f
C
Slider
Shutter
110
38
12
Dimensions
(mm)
(mm)
Punched (Paper) Taping Embossed Taping
(4 mm pitch) Bulk Case
Type
(inches)
Thickness
(mm)
1G
0.47
±0.05
2G
2.00
±0.10
0.52
±0.05
3G
0.70
±0.05
6G
4.00
±0.10
8G
14
2.80
±0.20
3.50
±0.20
8.00
±0.30
3.50
±0.05
12
3.50
±0.20
4.80
±0.20
12Z
2.80
±0.20
5.30
±0.20
12.00
±0.30
5.50
±0.05
1.75
±0.10
4.00
±0.10
1T
3.60
±0.20
6.90
±0.20
lPunched (Paper) Taping
FE
W
P1P2P0
T
A
B
Tape running direction
Chip component
Sprocket hole Compartment
f
D0
14
1 min.
12
12Z
2.00
±0.05
4.00
±0.10
1.50
+0.10
1.00
±0.10
1.5 min.
1T
lEmbossed Taping
Type
ABWFEP
1
Dimensions
(mm)
Type
P2P0fD0tfD1
Dimensions
(mm)
0
FE
W
f
D
1
P
1
P
2
P
0
t
A
B
Tape running direction
Chip component
Sprocket hole Compartment
f
D
0
Type
ABWFE
1G
0.38
±0.05
0.68
±0.05
2G
0.70
±0.05
1.20
±0.05
3G
1.10
±0.10
1.90
±0.10
6G
1.65
±0.15
2.50
±0.20
8G
2.00
±0.15
3.60
±0.20
8.00
±0.20
3.50
±0.05
1.75
±0.10
Dimensions
(mm)
Type
P1P2P0fD0T
2.00
±0.05
4.00
±0.10
1.50
+0.10
0.84
±0.05
Dimensions
(mm)
0
nPackaging Specifications
] Please consult us if resistors other than shown above are needed.
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.
Whenever a doubt about safety arises from this product, please inform us immediately for technical consultation without fail.
ERJ1G(0201) 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35
ERJ2G(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERJ3G(0603) 0.7 to 0.9 2 to 2.2 0.8 to 1
ERJ6G(0805) 1 to 1.4 3.2 to 3.8 0.9 to 1.4
2 to 2.4 4.4 to 5 1.2 to 1.8
ERJ14(1210) 2 to 2.4 4.4 to 5 1.8 to 2.8
ERJ12(1812) 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5
ERJ12Z(2010) 3.6 to 4 6.2 to 7 1.8 to 2.8
ERJ1T(2512) 5 to 5.4 7.6 to 8.6 2.3 to 3.5
Thick Film Chip Resistors
nRecommended Land Pattern
Chip Resistor
c
a
b
Type
(inches)
Dimensions (mm)
abc
nRecommended Soldering Conditions
Recommendations and precautions are described below.
Preheating
Peak
Heating
Temperature
Time
lRecommended soldering conditions for reflow
Temperature Time
Preheating 140 ¡C to 160 ¡C 60 s to 120 s
Main heating Above 200 ¡C 30 s to 40 s
Peak 235 ± 5 ¡C max. 10 s
Temperature Time
Preheating 150 ¡C to 180 ¡C 60 s to 120 s
Main heating Above 230 ¡C 30 s to 40 s
Peak max. 260 ¡C max. 10 s
lRecommended soldering conditions for flow
Temperature Time Temperature Time
Preheating 140 ¡C to 160 ¡C 60 s to 120 s 150 ¡C to 180 ¡C 60 s to 120 s
Soldering 245±5 ¡C 20 s to 30 s max. 260 ¡C max. 10 s
In case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be 0.7 to 0.8 times the width of chip the resistor. In case of reflow soldering,
ERJ8G(1206)
solder amount can be adjusted, therefore the land width should be set to 1.0 to 1.3 times chip resistor width (W).
áReflow soldering should be a maximum of two times
áPlease contact us for additional information when
used in conditions other than those specified.
every type of printed circuit board for solderability, before
actual use.
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
For soldering For lead-free soldering
Safety Precautions
confirmation test with the resistors actually mounted on the board.
When a load of more than the rated power is applied under load condition at steady state, it may
Never exceed the specified rated power.
2. Chlorine type or other highly-reactive flux is not recommended. Residue could affect performance or reliability of
the resistors.
impair performance and/or reliability of the resistor.
3. When using a soldering iron, never let the tip of the iron touch the body of the chip resistor. When using a
soldering iron with a tip at a high temperature, solder for as short time as possible (no more than three seconds
and up to 350 ¡C).
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (pliers or tweezers) as it may
damage the protective coating of the resistor and may affect its performance.
1. If transient load (heavy load in a short time) like pulse is to be applied, carry out an evaluation and
áPlease measure the temperature of terminations and study
