ADPA9002-EVALZ User Guide
UG-1637
One Technology Way • P. O. Box 9106 • Norwood, MA 02062-9106, U.S.A. • Tel: 781.329.4700 • Fax: 781.461.3113 • www.analog.com
Evaluating the GaAs, pHEMT, MMIC, Single Positive Supply, DC to 10 GHz
Power Amplifier
PLEASE SEE THE LAST PAGE FOR AN IMPORTANT
WARNING AND LEGAL TERMS AND CONDITIONS. Rev. A | Page 1 of 6
FEATURES
Dual-layer Rogers 4350 evaluation board with heat sink
End launch, 2.9 mm, RF connectors
Through calibration path
EVALUATION KIT CONTENTS
ADPA9002-EVALZ evaluation board
EQUIPMENT NEEDED
RF signal generator
RF spectrum analyzer
RF network analyzer
12 V and 1 A power supply
−2 V and 100 mA power supply
GENERAL DESCRIPTION
The ADPA9002-EVALZ consists of a dual-layer printed circuit
board (PCB) fabricated from 10 mil thick, Rogers 4350B,
copper clad mounted to an aluminum heat sink. The heat sink
assists in providing thermal relief to the ADPA9002 as well as
mechanical support to the PCB. Mounting holes on the heat
sink allow attachment to larger heat sinks for improved thermal
management. The RFIN and RFOUT ports on the ADPA9002-
EVAL Z are populated with 2.9 mm, female, coaxial connectors
(J1 and J2) and the corresponding RF traces have a 50 Ω
characteristic impedance. The ADPA9002-EVALZ is populated
with components suitable for use over the entire −40°C to
+85°C operating temperature range of the ADPA9002. To
calibrate board trace losses, a through calibration path is
provided between the J5 and J6 connectors. J5 and J6 must be
populated with RF connectors to use the through calibration
path. Refer to Table 2 and Figure 3 for the through calibration
path performance.
The device ground path and gate control voltage are accessed
through the 4-pin headers, J3 and J4 (see Table 1 for header
connections).
The RF traces on the ADPA9002-E VA L Z are 50 Ω, grounded
coplanar waveguide. The package ground leads and the exposed
pad connect directly to the ground plane. Multiple vias connect the
top and bottom ground planes with particular focus on the area
directly beneath the ground paddle to provide adequate
electrical conduction and thermal conduction to the heat sink.
The power supply decoupling capacitors on the ADPA9002-
EVAL Z represent the configuration that was used to characterize
and qualify the device. A scope can be used to reduce the
number of capacitors, but the scope varies from system to
system. It is recommended to first remove or combine the
largest capacitors that are farthest from the ADPA9002 when
modifying the capacitor configurations.
For full details on the ADPA9002, see the ADPA9002 data sheet,
which must be consulted in conjunction with this user guide
when using the ADPA9002-EVA LZ.
UG-1637 ADPA9002-EVALZ User Guide
Rev. A | Page 2 of 6
TABLE OF CONTENTS
Features .............................................................................................. 1
Evaluation Kit Contents ................................................................... 1
Equipment Needed ........................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Evaluation Board Photographs ....................................................... 3
Operating the ADPA9002-EVALZ ................................................. 4
Power-Up ........................................................................................4
Power-Down ..................................................................................4
Evaluation Board Schematic and Artwork .....................................5
Ordering Information .......................................................................6
Bill of Materials ..............................................................................6
REVISION HISTORY
7/2020—Rev. 0 to Rev. A
Changed Operating the ADPA7006-EVALZ Section Heading to
Operating the ADPA9002-EVALZ ................................................. 4
10/2019—Revision 0: Initial Version
ADPA9002-EVALZ User Guide UG-1637
Rev. A | Page 3 of 6
EVALUATION BOARD PHOTOGRAPHS
21494-001
Figure 1. ADPA9002-EVALZ Primary Side
21494-002
Figure 2. ADPA9002-EVALZ Secondary Side
UG-1637 ADPA9002-EVALZ User Guide
Rev. A | Page 4 of 6
OPERATING THE ADPA9002-EVALZ
The ADPA9002 operates in either self biased mode or externally
biased mode. Ground the VGG1 pin through the J4 headers to
operate in self biased mode. To operate in externally biased mode,
adjust the VGG1 voltage through the J4 headers to be from −2 V
to +0.5 V to set the desired quiescent current (IDQ).
POWER-UP
The biasing sequence to use for self biased operation during
power-up is as follows:
1. Connect all device GND pins to dc ground and RF ground.
2. Set the drain voltage to 12 V through the RFOUT/VDD pin.
3. Apply the RF signal through the RFIN port.
The biasing sequence to use for externally biased operation
during power-up is as follows:
1. Connect all device GND pins to dc ground and RF ground.
2. Set the gate voltage to −2 V through the VGG1 pin.
3. Set the RFOUT/VDD voltage to 12 V.
4. Gradually adjust the VGG1 voltage to achieve the IDQ.
5. Apply the RF signal through the RFIN port.
POWER-DOWN
The biasing sequence to use for self biased operation during
power-down is as follows:
1. Turn off the RF signal.
2. Set the RFOUT/VDD voltage to 0 V.
The biasing sequence to use for externally biased operation
during power-down is as follows:
1. Turn off the RF signal.
2. Decrease the VGG1 voltage to −2 V to achieve a typical IDQ
of 0 mA.
3. Set the RFOUT/VDD voltage to 0 V.
4. Set the VGG1 pin voltage t o 0 V.
Table 1. J3 and J4 Header Connections to ADPA9002
Connector
Header
ADPA9002 Pin
J3 1, 2, 3, 4 Not connected
J4 2, 4 GND
J4 1, 3 VGG1
Table 2. Insertion Loss of Through Calibration Path
Frequency (GHz) Insertion Loss (dB)
0.01 0.00
0.160 −0.07
1 −0.24
2 −0.36
3 −0.48
4 −0.45
5 −0.5
6 −0.55
7 −0.61
8 −0.64
9
−0.65
10 −0.65
Figure 3. Insertion Loss and Return Loss of Through Calibration Path
ADPA9002-EVALZ User Guide UG-1637
Rev. A | Page 5 of 6
EVALUATION BOARD SCHEMATIC AND ARTWORK
THRO UGH CALI BRATIO N
4
C6 DNI
DNI
DNIDNI
DNI
ADPA9002ACGZN
J1 RFIN
26
22
C5
10000pF
5
J6
14
R1
0Ω
+
C2
C9
4.7µF
U1
VGG1
11
12
PAD
10 31
2
CNTL
25
3
32
6
21
28
1
C7
10000pF C8
10000pF
J3
3
C11
4.7µF
4
23
18
1
2
7
8
24
J2
C10
4.7µF
J5
C3
100pF
C1
100pF
C4
100pF
9
13
15
16
RFOUT
17
27
29
30
19
20
AGND
AGND AGND
AGND
AGND
AGND
AGNDAGNDAGND
AGNDAGND
AGND
AGND
AGND AGND
AGND
AGND
PAD
GND
NIC
ACG1
ACG2
NIC
NIC
NIC
GND
GND
NIC
GND
RFOUT/VDD
GND
NIC
NIC
GND
GND
ACG3
NIC
VGG1
NIC
NIC
NIC
GND
GND
NIC
GND
RFIN
GND
NIC
NIC
GND
4
2 1
J4
3
AGND
21494-004
Figure 4. ADPA9002-EVALZ Schematic
600-01711-00-1
CTNL
GND
VGG
RFIN
THRU
CAL
GND
C11
+
C4
C2C6
C8
C3
C7
C1
C10
+
+
C9
C5
J1 J2
R1
J3
J4
U1
J6J5
21494-005
Figure 5. ADPA9002-EVALZ Assembly Drawing (J3, J5, and J6 Not Installed)
UG-1637 ADPA9002-EVALZ User Guide
Rev. A | Page 6 of 6
ORDERING INFORMATION
BILL OF MATERIALS
Table 3.
Reference Designator Description Manufacturer Part Number
C1, C3, C4 Ceramic capacitors, 100 pF Johanson Dialectrics 500R07N101JV4T
C2, C6 Ceramic capacitors, not installed Not applicable Not applicable
C9, C10, C11 Tantalum capacitors, 4.7 μF AVX TAJA475K020RNJ
C5, C7, C8 Ceramic capacitors, multilayer, X8R, 10000 pF Murata GRM155R71H103KA88D
J1, J2 Connectors, 2.9 mm, jack edge SRI Connector Gage Co. 25-146-1000-92
J3 Connector, PCB header, vertical, dual row, 4-position, 2 mm pitch,
not installed
Molex 87759-0414
J4 Connector, PCB header, vertical, dual-row, 4-position, 2 mm pitch Molex 87759-0414
J5, J6 Connectors, 2.9 mm, jack edge, not installed SRI Connector Gage Co. 25-146-1000-92
R1 Resistor, 0402, surface-mount device (SMD) chip jumper, 0 Ω Panasonic ERJ-2GEJ104X
U1 Gallium arsenide (GaAs), pseudomorphic high electron
mobility transistor (pHEMT), monolithic microwave integrated
circuit (MMIC), dc to 10 GHz, power amplifier
Analog Devices, Inc. ADPA9002ACGZN
Not Applicable Aluminum heatsink, 0.75 in × 1.9 in Not applicable Not applicable
ESD Caution
ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection
circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality.
Legal Terms and Conditions
By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions
set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the Analog Devices Standard Terms and Conditions of Sale shall govern. Do not use the Evaluation Board until you
have read and agreed to the Agreement. Your use of the Evaluation Board shall signify your acceptance of the Agreement. This Agreement is made by and between you (“Customer”) and Analog Devices, Inc.
(“ADI”), with its principal place of business at One Technology Way, Norwood, MA 02062, USA. Subject to the terms and conditions of the Agreement, ADI hereby grants to Customer a free, limited, personal,
temporary, non-exclusive, non-sublicensable, non-transferable license to use the Evaluation Board FOR EVALUATION PURPOSES ONLY. Customer understands and agrees that the Evaluation Board is provided
for the sole and exclusive purpose referenced above, and agrees not to use the Evaluation Board for any other purpose. Furthermore, the license granted is expressly made subject to the following additional
limitations: Customer shall not (i) rent, lease, display, sell, transfer, assign, sublicense, or distribute the Evaluation Board; and (ii) permit any Third Party to access the Evaluation Board. As used herein, the term
“Third Party” includes any entity other than ADI, Customer, their employees, affiliates and in-house consultants. The Evaluation Board is NOT sold to Customer; all rights not expressly granted herein, including
ownership of the Evaluation Board, are reserved by ADI. CONFIDENTIALITY. This Agreement and the Evaluation Board shall all be considered the confidential and proprietary information of ADI. Customer may
not disclose or transfer any portion of the Evaluation Board to any other party for any reason. Upon discontinuation of use of the Evaluation Board or termination of this Agreement, Customer agrees to
promptly return the Evaluation Board to ADI. ADDITIONAL RESTRICTIONS. Customer may not disassemble, decompile or reverse engineer chips on the Evaluation Board. Customer shall inform ADI of any
occurred damages or any modifications or alterations it makes to the Evaluation Board, including but not limited to soldering or any other activity that affects the material content of the Evaluation Board.
Modifications to the Evaluation Board must comply with applicable law, including but not limited to the RoHS Directive. TERMINATION. ADI may terminate this Agreement at any time upon giving written notice
to Customer. Customer agrees to return to ADI the Evaluation Board at that time. LIMITATION OF LIABILITY. THE EVALUATION BOARD PROVIDED HEREUNDER IS PROVIDED “AS IS” AND ADI MAKES NO
WARRANTIES OR REPRESENTATIONS OF ANY KIND WITH RESPECT TO IT. ADI SPECIFICALLY DISCLAIMS ANY REPRESENTATIONS, ENDORSEMENTS, GUARANTEES, OR WARRANTIES, EXPRESS OR IMPLIED, RELATED
TO THE EVALUATION BOARD INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, TITLE, FITNESS FOR A PARTICULAR PURPOSE OR NONINFRINGEMENT OF INTELLECTUAL
PROPERTY RIGHTS. IN NO EVENT WILL ADI AND ITS LICENSORS BE LIABLE FOR ANY INCIDENTAL, SPECIAL, INDIRECT, OR CONSEQUENTIAL DAMAGES RESULTING FROM CUSTOMER’S POSSESSION OR USE OF
THE EVALUATION BOARD, INCLUDING BUT NOT LIMITED TO LOST PROFITS, DELAY COSTS, LABOR COSTS OR LOSS OF GOODWILL. ADI’S TOTAL LIABILITY FROM ANY AND ALL CAUSES SHALL BE LIMITED TO THE
AMOUNT OF ONE HUNDRED US DOLLARS ($100.00). EXPORT. Customer agrees that it will not directly or indirectly export the Evaluation Board to another country, and that it will comply with all applicable
United States federal laws and regulations relating to exports. GOVERNING LAW. This Agreement shall be governed by and construed in accordance with the substantive laws of the Commonwealth of
Massachusetts (excluding conflict of law rules). Any legal action regarding this Agreement will be heard in the state or federal courts having jurisdiction in Suffolk County, Massachusetts, and Customer hereby
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UG21494-7/20(A)