© Semiconductor Components Industries, LLC, 2004
January, 2021 Rev. 2
1Publication Order Number:
NC7SZ373/D
TinyLogic UHS D-Type
Latch with 3-STATE Output
NC7SZ373
Description
The NC7SZ373 is a single positive edgetriggered Dtype CMOS
Lach with 3STATE output from ON Semiconductors Ultra High
Speed Series of TinyLogic in the space saving SC70 6lead package.
The device is fabricated with advanced CMOS technology to achieve
ultra high speed with high output drive while maintaining low static
power dissipation over a very broad VCC operating range. The device
is specified to operate over the 1.65 V to 5.5 V VCC range. The inputs
and output are high impedance when VCC is 0 V. Inputs tolerate
voltages up to 5.5 V independent of VCC operating voltage. The latch
appears transparent to the data when Latch Enable (LE) is HIGH.
When LE is LOW, the data that meets the setup time is latched. The
output tolerates voltages above VCC in the 3STATE condition.
Features
Space Saving SC88 6Lead Package
Ultra Small MicroPak Leadless Package
Ultra High Speed: tPD = 2.6 ns Typ into 50 pF at 5 V VCC
High Output Drive: ±24 mA at 3 V VCC
Broad VCC Operating Range: 1.65 V to 5.5 V
Matches the Performance of LCX when Operated at 3.3 V VCC
Power Down High Impedance Inputs / Output
Overvoltage Tolerant Inputs Facilitate 5 V to 3 V Translation
Patented Noise / EMI Reduction Circuitry Implemented
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
D
IEEC / IEC
Q
LE
OE See detailed ordering, marking and shipping information in the
package dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
www.onsemi.com
SC88
CASE 419B02
SIP6 1.45x1.0
CASE 127EB
D4KK
XYZ
D4, Z73 = Specific Device Code
KK = 2Digit Lot Run Traceability Code
XY = 2Digit Date Code Format
Z = Assembly Plant Code
M = Date Code*
G= PbFree Package
Pin 1
G
G
Z73M
1
6
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
NC7SZ373
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2
Connection Diagrams
Figure 2. SC88 (Top View)
(Top View) AAA
Pin One
LE 1 6 OE
GND 2 5 VCC
D 3 4 Q
LE OE
GND VCC
DQ
1
2
3
6
5
4
Figure 3. Pin 1 Orientation
Figure 4. MicroPak (Top Through View)
AAA = Product Code Top Mark see ordering code
NOTE: Orientation of Top Mark determines Pin One location.
Read the top product code mark left to right, Pin One
is the lower left pin (see diagram).
LE
DQ
PIN DESCRIPTIONS
Pin Name Description
D Data Input
CP Latch Enable Input
OE Output Enable Input
QLatch Output
FUNCTION TABLE
Inputs Output
LE D OE Q
H L L L
H H L H
L X L Qn1
X X H Z
H = HIGH Logic Level X = Immaterial
L = LOW Logic Level Z = HIGH Impedance
Qn1 = Previous state prior to HIGHtoLOW transition of latch
enable
NC7SZ373
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3
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
VCC Supply Voltage 0.5 +6.5 V
VIN DC Input Voltage 0.5 +6.5 V
VOUT DC Output Voltage 0.5 +6.5 V
IIK DC Input Diode Current VIN < 0 V 50 mA
IOK DC Output Diode Current VOUT < 0 V 50 mA
IOUT DC Output Source / Sink Current ±50 mA
ICC / IGND DC VCC / GND Current ±50 mA
TSTG Storage Temperature Range 65 +150 °C
TJJunction Temperature under Bias 150 °C
TLJunction Lead Temperature (Soldering, 10 Seconds) 260 °C
PDPower Dissipation in Still Air SC88 332 mW
MicroPak 812
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Max Unit
VCC Supply Voltage Operating 1.65 5.5 V
Supply Voltage Data Retention 1.5 5.5
VIN Input Voltage 0 5.5 V
VOUT Output Voltage Active State 0 VCC V
3STATE 0 5.5 V
tr, tfInput Rise and Fall Time VCC = 1.8 V, 2.5 V ±0.2 V 0 20 ns/V
VCC = 3.3 V ±0.3 V 0 10
VCC = 5.5 V ±0.5 V 0 5
TAOperating Temperature 40 +85 °C
qJA Thermal Resistance SC88 377 °C/W
MicroPak 154
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
NC7SZ373
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4
DC ELECTICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = 40 to +85°C
Unit
Min Typ Max Min Max
VIH HIGH Level Control
Input Voltage
1.65 to 1.95 0.65 VCC 0.65 VCC V
2.3 to 5.5 0.7 VCC 0.7 VCC
VIL LOW Level Control
Input Voltage
1.65 to 1.95 0.35 VCC 0.35 VCC V
2.3 to 5.5 0.3 VCC 0.3 VCC
VOH HIGH Level Control
Output Voltage
1.65 VIN = VIH
or VIL
IOH = 100 mA 1.55 1.65 1.55 V
1.8 1.7 1.8 1.7
2.3 2.2 2.3 2.2
3.0 2.9 3.0 2.9
4.5 4.4 4.5 4.4
1.65 IOH = 4 mA 1.24 1.52 1.29
2.3 IOH = 8 mA 1.9 2.15 1.9
3.0 IOH = 16 mA 2.4 2.8 2.4
3.0 IOH = 24 mA 2.3 2.68 2.3
4.5 IOH = 32 mA 3.8 4.2 3.8
VOL LOW Level Control
Output Voltage
1.65 VIN = VIH
or VIL
IOL = 100 mA0.0 0.08 0.0 V
1.8 0.0 0.1 0.1
2.3 0.0 0.1 0.1
3.0 0.0 0.1 0.1
4.5 0.0 0.1 0.1
1.65 IOL = 4 mA 0.08 0.24 0.24
2.3 IOL = 8 mA 0.10 0.3 0.3
3.0 IOL = 16 mA 0.15 0.4 0.4
3.0 IOL = 24 mA 0.22 0.55 0.55
4.5 IOL = 32 mA 0.22 0.55 0.55
IIN Input Leakage
Current
1.65 to 5.5 0 VIN 5.5 V ±0.1 ±1.0 mA
IOZ 3STATE Output
Leakage
1.65 to 5.5 VIN = VIL or VIH
0 VOUT 5.5 V
±0.5 ±5.0 mA
IOFF Power Off Leakage
Current
0.0 VIN or VOUT = 5.5 V 1.0 10 mA
ICC Quiescent Supply
Current
1.65 to 5.5 VIN = 5.5 V, GND 1.0 10 mA
NC7SZ373
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5
AC ELECTRICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = 40 to +85°C
Min Typ Max Min Max Unit
tPLH
tPHL
Propagation Delay
D to Q
1.65 CL = 15 pF, RD = 1 MW,
S1 = Open
(Figures 5, 7)
9.0 15.0 16.0 ns
1.8 6.1 10.0 10.5
2.5 ±0.2 3.6 6.5 6.8
3.3 ±0.3 2.7 4.6 5.0
5.0 ±0.5 2.0 3.4 3.7
3.3 ±0.3 CL = 50 pF, RD = 500 W
S1 = Open
(Figures 5, 7)
3.3 5.5 6.2
5.0 ±0.5 2.6 4.3 4.8
tPLH
tPHL
Propagation Delay
LE to Q
1.65 CL = 15 pF, RD = 1 MW,
S1 = Open
(Figures 5, 7)
9.0 1.45 15.0 ns
1.8 6.0 9.6 10.0
2.5 ±0.2 3.5 6.1 6.6
3.3 ±0.3 2.6 4.4 4.8
5.0 ±0.5 2.0 3.2 3.5
3.3 ±0.3 CL = 50 pF, RD = 500 W,
S1 = Open
(Figures 5, 8)
3.3 5.3 6.2
5.0 ±0.5 2.6 4.2 4.6
tPZL
tPZH
Output Enable Time 1.65 CL = 50 pF, VI = 2 x VCC,
RU, RD = 500 W,
S1 = GND for tPZH
S1 = VI for tPZL
(Figures 5, 8)
9.0 13.5 14.6 ns
1.8 6.0 9.0 9.5
2.5 ±0.2 3.7 6.0 6.6
3.3 ±0.3 2.8 5.0 5.3
5.0 ±0.5 2.2 3.7 3.9
tPLZ
tPHZ
Output Disable Time 1.65 CL = 50 pF, VI = 2 x VCC,
RU, RD = 500 W,
S1 = GND for tPHZ
S1 = VI for tPLZ
(Figures 5, 8)
7.7 12.0 13.0 ns
1.8 5.1 8.0 8.5
2.5 ±0.2 3.5 6.0 6.3
3.3 ±0.3 2.8 4.5 4.7
5.0 ±0.5 2.3 3.7 3.9
tSSetup Time, D to LE 2.5 ±0.2 CL = 50 pF, RD = 500 W,
S1 = Open
(Figures 5, 9)
2.0 ns
3.3 ±0.3 1.5
5.0 ±0.5 1.5
tHHold Time, D to LE 2.5 ±0.2 CL = 50 pF, RD = 500 W,
S1 = Open
(Figures 5, 9)
1.5 ns
3.3 ±0.3 1.5
5.0 ±0.5 1.5
tWPulse Width, LE 2.5 ±0.2 CL = 50 pF, RD = 500 W,
S1 = Open
(Figures 5, 9)
3.0 ns
3.3 ±0.3 3.0
5.0 ±0.5 3.0
NC7SZ373
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6
CAPACITANCE (TA = +25°C, f = 1 MHz)
Symbol Parameter Condition Typ Max Units
CIN Input Capacitance VCC = Open, VIN = 0 V or VCC 3pF
COUT Output Capacitance VCC = 3.3 V, VIN = 0 V or VCC 4pF
CPD Power Dissipation Capacitance
(Note 2)
VCC = 3.3 V
VCC = 5.0 V
14
17
pF
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. (See Figure 6)
CPD is related to ICCD dynamic operating current by the expression: ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
AC Loading and Waveforms
CL includes load and stray capacitance
Input PRR = 1.0 MHz, tW = 500 ns.
Figure 5. AC Test Circuit
D Input = AC Waveform; tr = tf = 1.8 ns;
D Input PRR = 10 MHz; Duty Cycle = 50%.
A
VCC
Figure 6. ICCD Test Circuit
VCC
CLRD
OE
OUTPUT
Figure 7. AC Waveforms
LE Input
D
LE
D Input
OE
Q Output
Figure 8. AC Waveforms
RU
VIN
OPEN
GND
Q
Figure 9. AC Waveforms
NC7SZ373
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7
ORDERING INFORMATION
Device Top Mark Packages Shipping
NC7SZ373P6X Z73 6Lead SC70, EIAJ SC88, 1.25 mm Wide 3000 / Tape & Reel
NC7SZ373L6X D4 6Lead MicroPak, 1.00 mm Wide 5000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SIP6 1.45X1.0
CASE 127EB
ISSUE O
DATE 31 AUG 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13590G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
SIP6 1.45X1.0
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
SC88/SC706/SOT363
CASE 419B02
ISSUE Y
DATE 11 DEC 2012
SCALE 2:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
Cddd M
123
A1
A
c
654
E
b
6X
XXXMG
G
XXX = Specific Device Code
M = Date Code*
G= PbFree Package
GENERIC
MARKING DIAGRAM*
1
6
STYLES ON PAGE 2
1
DIM MIN NOM MAX
MILLIMETERS
A−−− −−− 1.10
A1 0.00 −−− 0.10
ddd
b0.15 0.20 0.25
C0.08 0.15 0.22
D1.80 2.00 2.20
−−− −−− 0.043
0.000 −−− 0.004
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
MIN NOM MAX
INCHES
0.10 0.004
E1 1.15 1.25 1.35
e0.65 BSC
L0.26 0.36 0.46
2.00 2.10 2.20
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.078 0.082 0.086
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.65
0.66
6X
DIMENSIONS: MILLIMETERS
0.30
PITCH
2.50
6X
RECOMMENDED
TOP VIEW
SIDE VIEW END VIEW
bbb H
B
SEATING
PLANE
DETAIL A E
A2 0.70 0.90 1.00 0.027 0.035 0.039
L2 0.15 BSC 0.006 BSC
aaa 0.15 0.006
bbb 0.30 0.012
ccc 0.10 0.004
A-B D
aaa C
2X 3 TIPS
D
E1
D
e
A
2X
aaa H D
2X
D
L
PLANE
DETAIL A
H
GAGE
L2
C
ccc C
A2
6X
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42985B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
SC88/SC706/SOT363
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
STYLE 3:
CANCELLED
STYLE 2:
CANCELLED
STYLE 4:
PIN 1. CATHODE
2. CATHODE
3. COLLECTOR
4. EMITTER
5. BASE
6. ANODE
STYLE 5:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 6:
PIN 1. ANODE 2
2. N/C
3. CATHODE 1
4. ANODE 1
5. N/C
6. CATHODE 2
STYLE 7:
PIN 1. SOURCE 2
2. DRAIN 2
3. GATE 1
4. SOURCE 1
5. DRAIN 1
6. GATE 2
STYLE 8:
CANCELLED
STYLE 11:
PIN 1. CATHODE 2
2. CATHODE 2
3. ANODE 1
4. CATHODE 1
5. CATHODE 1
6. ANODE 2
STYLE 9:
PIN 1. EMITTER 2
2. EMITTER 1
3. COLLECTOR 1
4. BASE 1
5. BASE 2
6. COLLECTOR 2
STYLE 10:
PIN 1. SOURCE 2
2. SOURCE 1
3. GATE 1
4. DRAIN 1
5. DRAIN 2
6. GATE 2
STYLE 12:
PIN 1. ANODE 2
2. ANODE 2
3. CATHODE 1
4. ANODE 1
5. ANODE 1
6. CATHODE 2
STYLE 13:
PIN 1. ANODE
2. N/C
3. COLLECTOR
4. EMITTER
5. BASE
6. CATHODE
STYLE 14:
PIN 1. VREF
2. GND
3. GND
4. IOUT
5. VEN
6. VCC
STYLE 15:
PIN 1. ANODE 1
2. ANODE 2
3. ANODE 3
4. CATHODE 3
5. CATHODE 2
6. CATHODE 1
STYLE 17:
PIN 1. BASE 1
2. EMITTER 1
3. COLLECTOR 2
4. BASE 2
5. EMITTER 2
6. COLLECTOR 1
STYLE 16:
PIN 1. BASE 1
2. EMITTER 2
3. COLLECTOR 2
4. BASE 2
5. EMITTER 1
6. COLLECTOR 1
STYLE 18:
PIN 1. VIN1
2. VCC
3. VOUT2
4. VIN2
5. GND
6. VOUT1
STYLE 19:
PIN 1. I OUT
2. GND
3. GND
4. V CC
5. V EN
6. V REF
STYLE 20:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 22:
PIN 1. D1 (i)
2. GND
3. D2 (i)
4. D2 (c)
5. VBUS
6. D1 (c)
STYLE 21:
PIN 1. ANODE 1
2. N/C
3. ANODE 2
4. CATHODE 2
5. N/C
6. CATHODE 1
STYLE 23:
PIN 1. Vn
2. CH1
3. Vp
4. N/C
5. CH2
6. N/C
STYLE 24:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
STYLE 25:
PIN 1. BASE 1
2. CATHODE
3. COLLECTOR 2
4. BASE 2
5. EMITTER
6. COLLECTOR 1
STYLE 26:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 27:
PIN 1. BASE 2
2. BASE 1
3. COLLECTOR 1
4. EMITTER 1
5. EMITTER 2
6. COLLECTOR 2
STYLE 28:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 29:
PIN 1. ANODE
2. ANODE
3. COLLECTOR
4. EMITTER
5. BASE/ANODE
6. CATHODE
SC88/SC706/SOT363
CASE 419B02
ISSUE Y
DATE 11 DEC 2012
STYLE 30:
PIN 1. SOURCE 1
2. DRAIN 2
3. DRAIN 2
4. SOURCE 2
5. GATE 1
6. DRAIN 1
Note: Please refer to datasheet for
style callout. If style type is not called
out in the datasheet refer to the device
datasheet pinout or pin assignment.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42985B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
SC88/SC706/SOT363
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
www.onsemi.com
1
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