The power dissipation PD of IC is expressed in the following equation.
PD = (VIN'-VOUT) IOUT + VIN' IB
If VIN' is reduced below the lowest voltage necessary for the IC, the parasitic oscillation will be caused according to circumstances.
In determining the resistance value of RSD, design with margin should be made by making reference to the following equation.
VIN - VIN'
RSD < IOUT + IB
(4) Connect the input terminal and GND, and the output terminal and GND, by capacitor respectively.
The capacitances should be determined experimentally because they depend on printed patterns. In particular,
adequate investigation should be made so that there is no problem even at time of high or low temperature.
(5) Installation of IC for power supply
For obtaining high reliability on the heat sink design of the regulator IC, it is generally required to derate more than 20%
of maximum junction temperature (TjMAX.) Further, full consideration should be given to the installation of IC to the heat sink.
(6) IEC (International Electronical Commission)-65 Specification.
(a) IEC (International Electronical Commission)-65 is the standard, parts testing method, machinery and tolls (used in connecting main
power directly and indirectly) Which are used at home and general building. The purpose of the above standard is not to breaking out the
risk which is related to an electric shock, a heating, a fire and the damage of surrounding parts in the case of normal or abnormal operating.
(b) In case temperature is limited by temperature overheating prevention device, fuse or the operation of fuse resistor
One must calculate the temperature of PCB substrate in 2 minute.
T 110 regulated
T=T(The PCB substrate temperature in 2 minute)
-Ta(Ambient temperature)
(c) Graph
As the territory of the deviant line appear by the heat, as the
area is wider, T(The PCB substrate temperature in 2 minute)
is becoming high.