IR-Lumineszenzdiode (950 nm) im TO-46-Gehause Infrared Emitter (950 nm) in TO-46 Package Lead (Pb) Free Product - RoHS Compliant SFH 4811 SFH 4813 SFH 4811 SFH 4813 Wesentliche Merkmale Features * Hergestellt im Schmelzepitaxieverfahren * Kathode galvanisch mit dem Gehauseboden verbunden * Hohe Zuverlassigkeit * Gute spektrale Anpassung an Si-Fotoempfanger * Hermetisch dichtes Metallgehause * * * * * Anwendungen Applications * Lichtschranken fur Gleich- und Wechsellichtbetrieb * IR-Geratefernsteuerungen * Sensorik * Lichtgitter * * * * Fabricated in a liquid phase epitaxy process Cathode is electrically connected to the case High reliability Matches all Si-Photodetectors Hermetically sealed package Photointerrupters IR remote control Sensor technology Light curtains Typ Type Bestellnummer Ordering Code Gehause Package SFH 4811 Q62702P5300 SFH 4813 Q62702P5301 TO-46-Metallgehause, Glaslinse, hermetisch dicht, Anschlusse im 2.54-mm-Raster (1/10'') TO-46-metal-package, glass lens, hermetically sealed, solder tabs lead spacing 2.54 mm (1/10'') 2008-01-31 1 SFH 4811, SFH 4813 Grenzwerte (TC = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Durchlastrom Forward current IF 300 mA Stostrom, tp = 10 s, D = 0 Surge current IFSM 3 A Verlustleistung Power dissipation Ptot 470 mW Warmewiderstand Thermal resistance RthJA RthJC 450 160 K/W K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms peak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA, tp = 20 ms 55 nm 5 35 Grad deg. Aktive Chipflache Active chip area A 0.09 mm2 Abmessungen der aktiven Chipflache Dimensions of the active chip area LxB LxW 0.3 x 0.3 mm Kennwerte (TA = 25 C) Characteristics Abstrahlwinkel Half angle SFH 4811 SFH 4813 2008-01-31 2 SFH 4811, SFH 4813 Kennwerte (TA = 25 C) (cont'd) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Abstand Chipoberflache bis Linsenscheitel Distance chip front to lens top SFH 4811 SFH 4813 H H 4.7 2.6 mm mm 0.5 s Co 25 pF VF VF VF 1.30 ( 1.5) 1.90 ( 2.5) 2.30 ( 3.0) V V V Sperrstrom Reverse current VR = 5 V IR 0.01 ( 1) A Gesamtstrahlungsflu Total radiant flux IF = 100 mA, tp = 20 ms e 8 mW Temperaturkoeffizient von Ie bzw. e, IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA TCI - 0.55 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV - 1.5 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.3 nm/K Schaltzeiten, Ie von 10% auf 90% und von 90% auf tr, tf 10%, bei IF = 100 mA, RL = 50 Switching times, Ie from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Kapazitat Capacitance VR = 0 V, f = 1 MHz Durchlaspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s IF = 1.5 A, tp = 100 s 2008-01-31 3 SFH 4811, SFH 4813 Gruppierung der Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Grouping of Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit SFH 4811 SFH 4813 Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s 2008-01-31 4 Ie min. Ie typ. 25 40 2.5 4.5 mW/sr mW/sr Ie typ. 250 30 mW/sr SFH 4811, SFH 4813 Radiant Intensity Ie/Ie (100 mA) = f (IF) Single pulse, tp = 20 s Relative Spectral Emission Irel = f () OHRD1938 100 OHR01037 10 2 OHR00486 350 F mA 300 e (100 mA) % rel e Max. Permissible Forward Current IF = f (TA, TC) 80 250 10 1 60 R thJC = 160 K/W 200 150 40 10 R thJA = 450 K/W 0 100 20 50 0 880 920 960 1000 nm 1060 Forward Current IF = f (VF) Single pulse, tp = 20 s F 10 -1 10 -2 10 -1 10 0 OHR01041 10 4 OHR00860 tp F mA 5 D= tp T D = 0.005 typ. 10 1 Permissible Pulse Handling Capability IF = f (), TC = 25 C, RthJC = 160 K/W, duty cycle D = parameter 10 1 A 10 0 A F F T max. 0.01 0.02 10 3 5 10 -1 0.1 0.05 0.2 0.5 10 -2 1 1.5 2008-01-31 2 2.5 3 3.5 4 V 4.5 VF DC 10 2 -5 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 s 10 2 tp 5 0 0 20 40 60 80 C 100 TA , TC SFH 4811, SFH 4813 Radiation Characteristics, SFH 4811 Irel = f () 40 30 20 10 0 OHR01178 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 Radiation Characteristics, SFH 4813 Irel = f () 40 30 20 10 0 OHR01186 1.0 50 0.8 60 0.6 70 0.4 80 0.2 0 90 100 2008-01-31 1.0 0.8 0.6 0.4 0 20 40 60 80 6 100 120 SFH 4811, SFH 4813 Mazeichnung Package Outlines SFH 4811 o4.8 (0.189) o4.6 (0.181) 1 o5.6 (0.220) o5.3 (0.209) 2.54 (0.100) spacing o0.43 (0.017) 6.2 (0.244) 5.4 (0.213) Chip position (1.1 (0.043)) 2 0.9 ) 43 0.35 (0.014) max. 20 (0.787) 18 (0.709) 1.1 5.2 (0.205) 4.9 (0.193) .0 (0 0.9 1.1 (0 .04 .03 3) 5) (0 ) 35 .0 (0 GEMY6049 (0 (0 .043 .03 ) 5) 0.35 (0.014) max. 20 (0.787) 18 (0.709) 3.8 (0.150) 3.5 (0.138) Mae in mm (inch) / Dimensions in mm (inch). 2008-01-31 7 2.54 (0.100) spacing 2 0.9 1.1 3) .04 ) (0 .035 (0 0.9 1 1.1 o0.43 (0.017) Chip position (1.1 (0.043)) o4.8 (0.189) o4.6 (0.181) SFH 4813 o5.6 (0.220) o5.3 (0.209) GEMY6050 SFH 4811, SFH 4813 Lotbedingungen Soldering Conditions Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2008-01-31 8