PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 7604001EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type 7604001FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 7604001FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SN54194J OBSOLETE CDIP J 16 TBD Call TI Call TI Call TI SN54194J OBSOLETE CDIP J 16 TBD Call TI SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194AN ACTIVE PDIP N 16 CU NIPDAU N / A for Pkg Type 25 Addendum-Page 1 Pb-Free PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS194AN ACTIVE PDIP N 16 SN74LS194AN3 OBSOLETE PDIP N SN74LS194AN3 OBSOLETE PDIP N SN74LS194ANE4 ACTIVE PDIP N 16 SN74LS194ANE4 ACTIVE PDIP N 16 SN74S194N OBSOLETE PDIP N SN74S194N OBSOLETE PDIP N SN74S194N3 OBSOLETE PDIP Lead/Ball Finish MSL Peak Temp (3) (RoHS) 25 Pb-Free (RoHS) CU NIPDAU 16 TBD Call TI Call TI 16 TBD Call TI Call TI 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 16 TBD Call TI Call TI 16 TBD Call TI Call TI N 16 TBD Call TI Call TI Call TI Call TI TBD N / A for Pkg Type SN74S194N3 OBSOLETE PDIP N 16 SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS194ADR Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 6.5 10.3 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS194ADR SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type 7604001EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type 7604001FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 7604001FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type POST-PLATE N / A for Pkg Type JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SN54194J OBSOLETE CDIP J 16 TBD Call TI Call TI Call TI SN54194J OBSOLETE CDIP J 16 TBD Call TI SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LS194AN ACTIVE PDIP N 16 CU NIPDAU N / A for Pkg Type 25 Addendum-Page 1 Pb-Free PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LS194AN ACTIVE PDIP N 16 SN74LS194AN3 OBSOLETE PDIP N SN74LS194AN3 OBSOLETE PDIP N SN74LS194ANE4 ACTIVE PDIP N 16 SN74LS194ANE4 ACTIVE PDIP N 16 SN74S194N OBSOLETE PDIP N SN74S194N OBSOLETE PDIP N SN74S194N3 OBSOLETE PDIP Lead/Ball Finish MSL Peak Temp (3) (RoHS) 25 Pb-Free (RoHS) CU NIPDAU 16 TBD Call TI Call TI 16 TBD Call TI Call TI 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 16 TBD Call TI Call TI 16 TBD Call TI Call TI N 16 TBD Call TI Call TI Call TI Call TI TBD N / A for Pkg Type SN74S194N3 OBSOLETE PDIP N 16 SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 15-Oct-2009 reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74LS194ADR Package Package Pins Type Drawing SOIC D 16 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 6.5 10.3 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LS194ADR SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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