RCL e3 Vishay Draloric Long Side Termination Thick Film Chip Resistors FEATURES Enhanced power rating Long side terminations Pure tin solder contacts on Ni barrier layer, provides compatibility with lead (Pb)-free and lead containing soldering processes Compliant to RoHS Directive 2002/95/EC Halogen-free according to IEC 61249-2-21 definition AEC-Q200 qualified STANDARD ELECTRICAL SPECIFICATIONS SIZE MODEL RCL0612 e3 RCL1218 e3 RCL1225 e3 INCH METRIC 0612 RR 1632M 1218 RR 3246M 1225 RR 3263M RATED DISSIPATION P70 W LIMITING ELEMENT VOLTAGE Umax. AC/DC V 0.5 75 1.0 2.0 (1) TEMPERATURE COEFFICIENT ppm/K TOLERANCE % 100 1 RESISTANCE RANGE SERIES E24; E96 1R0 to 1M 200 5 100 1 200 E24 E24; E96 1R0 to 2.2M 200 5 100 1 200 E24 E24; E96 1R0 to 1M 200 5 E24 Notes These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Marking: See datasheet "Surface Mount Resistor Marking" (document number 20020). Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material. (1) Specified power rating requires dedicated mounting conditions to achieve the required thermal resistance. TECHNICAL SPECIFICATIONS DESCRIPTION UNIT RCL0612 RCL1218 RCL1225 W 0.5 1.0 2.0 (3) Limiting Element Voltage Umax. AC/DC V 75 200 200 Insulation Voltage Uins (1 min) V > 100 > 300 > 300 Insulation Resistance Category Temperature Range C Weight mg Rated Dissipation P70 (2) > 109 - 55 to + 155 11 29.5 55 Notes (2) The power dissipation on the resistors generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 C is not exceeded. (3) Specified power rating requires dedicated mounting conditions to achieve the required thermal resistance. Document Number: 20046 Revision: 14-Jun-11 For technical questions, contact: thickfilmchip@vishay.com www.vishay.com 269 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCL e3 Long Side Termination Thick Film Chip Resistors Vishay Draloric PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: RCL061210K0FKEA R C L 0 MODEL/SIZE RCL0612 RCL1218 RCL1225 6 1 2 1 RESISTANCE R = Decimal K = Thousand M = Million 0000 = Jumper 0 K 0 TOLERANCE F=1% J=5% Z = Jumper F K E A 0 0 TCR K = 100 ppm/K N = 200 ppm/K 0 = Jumper PACKAGING EA EB EC EK EG SPECIAL Up to 2 digits 00 = Standard PRODUCT DESCRIPTION: RCL0612 100 10K 1 % ET1 e3 RCL0612 100 10K 1% ET1 e3 MODEL RCL0612 RCL1218 RCL1225 TCR RESISTANCE TOLERANCE PACKAGING LEAD (Pb)-FREE 100 ppm/K 200 ppm/K 10R = 10 10K = 10 k 1M = 1 M 0R0 = Jumper 1% 5% ET1 ET5 ET6 ET9 E67 e3 = Pure tin termination finish PACKAGING MODEL PAPER TAPE ON REEL ACC. TO IEC 60286-3, TYPE I UNIT QUANTITY RCL0612 PART NUMBER BLISTER TAPE ON REEL ACC. TO IEC 60286-3, TYPE II PRODUCT DESC. 180 mm/7" 5000 EA ET1 285 mm/11.25" 10 000 EB ET5 330 mm/13" 20 000 EC ET6 QUANTITY PART NUMBER PRODUCT DESC. RCL1218 180 mm/7" 4000 EK ET9 RCL1225 180 mm/7" 2000 EG E67 DIMENSIONS in millimeters T2 L a H l b W T1 SIZE SOLDER PAD DIMENSIONS DIMENSIONS REFLOW SOLDERING WAVE SOLDERING INCH METRIC L W H T1 T2 a b l a b l 0612 1632 1.6 0.2 3.2 0.2 0.55 0.1 0.35 0.15 0.25 0.15 0.6 3.2 1.0 1.1 3.2 1.0 1218 3246 4.6 0.15 0.55 0.05 0.45 0.2 0.4 0.2 1.1 4.9 1.9 1.25 4.8 1.9 1225 3263 6.3 0.2 0.75 0.15 0.8 0.2 0.4 0.2 1.9 7.6 1.2 1.9 7.6 1.2 www.vishay.com 270 3.2 + 0.10 - 0.20 3.2 0.2 For technical questions, contact: thickfilmchip@vishay.com Document Number: 20046 Revision: 14-Jun-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCL e3 Long Side Termination Thick Film Chip Resistors Vishay Draloric Pulse Load Pmax. (W) FUNCTIONAL PERFORMANCE Single Pulse 1000 1225 1218 0612 100 10 1 0.1 0.01 10-6 10-5 10-4 10-3 10-2 10-1 1 10 100 Pulse Duration t i (s) Maximum pulse load, single pulse; applicable if P 0 and n < 1000 and U Umax.; for permissible resistance change equivalent to 8000 h operation Continuous Pulse Load Pmax. (W) Continuous Pulse 1000 1225 1218 0612 100 10 1 0.1 0.01 10-6 10-5 10-4 10-3 10-2 10-1 1 10 100 Pulse Duration t i (s) Maximum pulse load, continuous pulses; applicable if P P (amb) and U Umax.; for permissible resistance change equivalent to 8000 h operation Pulse Voltage U max. (V) Pulse Voltage 800 1225, 1218 700 600 500 400 0612 300 200 100 0 -6 10 10- 5 10- 4 10- 3 10- 2 10- 1 1 10 Pulse Duration t i (s) Maximum pulse voltage, single and continuous pulses; applicable if P Pmax.; for permissible resistance change equivalent to 8000 h operation Document Number: 20046 Revision: 14-Jun-11 For technical questions, contact: thickfilmchip@vishay.com www.vishay.com 271 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCL e3 Vishay Draloric Long Side Termination Thick Film Chip Resistors Fraction of Rated Dissipation P70 in % Derating 100 50 0 - 50 0 50 100 150 70 Ambient Temperature amb in C TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (R) STABILITY CLASS 2 OR BETTER Stability for product types: 1 to 2.2 M RCL e3 4.5 - Resistance - 4.7 - Voltage proof U = 1.4 x Uins; 60 s 4.13 - Short time overload U = 2.5 x P 70 x R 2 x Umax.; Duration acc. to style 4.17.2 58 (Td) 1% 5% No flashover or breakdown 0.25 % R + 0.05) 0.5 % R + 0.05) Solder bath method; Sn60Pb40 non activated flux; (235 5) C (2 0.2) s Good tinning ( 95 % covered); no visible damage Solder bath method; Sn96.5Ag3Cu0.5 non-activated flux; (245 5) C (3 0.3) s Good tinning ( 95 % covered); no visible damage Solderability - Temperature coefficient (20/- 55/20) C and (20/125/20) C 4.32 21 (Uu3) Shear (adhesion) 45N No visible damage 21 (Uu1) Substrate bending Depth 2 mm; 3 times No visible damage, no open circuit in bent position 4.33 4.8.4.2 4.19 14 (Na) www.vishay.com 272 Rapid change of temperature 100 ppm/K 200 ppm/K (0.25 % R + 0.05 ) 30 min at - 55 C; 30 min at 125 C 5 cycles (0.25 % R + 0.05 ) (0.5 % R + 0.05 ) 1000 cycles (1 % R + 0.05 ) (1 % R + 0.05 ) For technical questions, contact: thickfilmchip@vishay.com Document Number: 20046 Revision: 14-Jun-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RCL e3 Long Side Termination Thick Film Chip Resistors Vishay Draloric TEST PROCEDURES AND REQUIREMENTS EN 60115-1 CLAUSE IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE (R) STABILITY CLASS 2 OR BETTER Stability for product types: 1 to 2.2 M RCL e3 4.23 4.23.2 2 (Ba) Climatic sequence: Dry heat 4.23.3 30 (Db) Damp heat, cyclic 4.23.4 4.23.5 1 (Aa) 13 (M) Cold Low air pressure 4.23.6 30 (Db) Damp heat, cyclic 4.23.7 - DC load 4.25.1 - Endurance at 70 C 4.18.2 58 (Td) Resistance to soldering heat 4.35 - Flamability, needle flame test 4.24 78 (Cab) Damp heat, steady state 4.25.3 - Endurance at upper category temperature 4.40 - Electrostatic discharge (Human Body Model) 4.29 45 (XA) Component solvent resistance 4.30 45 (XA) Solvent resistance of marking 4.22 6 (Fc) Vibration, endurance by sweeping 4.37 - Periodic electric overload 4.27 - Single pulse high voltage overload, 10 s/700 s 125 C; 16 h 55 C; 90 % RH; 24 h; 1 cycle - 55 C; 2 h 1 kPa; (25 10) C; 1 h 55 C; 90 % RH; 24 h; 5 cycles U = P 70 x R U = P 70 x R Umax.; 1.5 h on; 0.5 h off; 70 C; 1000 h 70 C; 8000 h Solder bath method (260 5) C; (10 1) s IEC 60695-11-5; 10 s (40 2) C; (93 3) % RH; 56 days 155 C, 1000 h IEC 61340-3-1 3 pos. + 3 neg. discharges; ESD voltage: 1000 V Isopropyl alcohol; 50 C; method 2 Isopropyl alcohol; 50 C; method 1, toothbrush f = 10 Hz to 2000 Hz; x, y, z 1.5 mm; A 200 m/s2; 10 sweeps per axis U = 15 x P 70 x R 2 x Umax.; 0.1 s on; 2.5 s off; 1000 cycles U = 10 x P 70 x R 2 x Umax.; 10 pulses (1 % R + 0.05 ) (2 % R + 0.1 ) (0.5 % R + 0.05 ) (1 % R + 0.05 ) (2 % R + 0.1 ) (4 % R + 0.1 ) (0.25 % R + 0.05 ) (0.5 % R + 0.05 ) No burning after 30 s (1 % R + 0.05 ) (1 % R + 0.05 ) (2 % R + 0.1 ) (1 % R + 0.05 ) No visible damage Marking legible, no visible damage (0.25 % R + 0.05 ) (0.5 % R + 0.05 ) (1 % R + 0.05 ) (1 % R + 0.05 ) All tests are carried out in accordance with the following specifications: EN 60115-1, generic specification EN 140400, sectional specification EN 140401-802, detail specification IEC 60068-2-x environmental test procedures Packaging of components is done in paper or blister tapes according to IEC 60286-3 Document Number: 20046 Revision: 14-Jun-11 For technical questions, contact: thickfilmchip@vishay.com www.vishay.com 273 This document is subject to change without notice. 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